ATE472106T1 - Ic-testverfahren und vorrichtung - Google Patents

Ic-testverfahren und vorrichtung

Info

Publication number
ATE472106T1
ATE472106T1 AT06809583T AT06809583T ATE472106T1 AT E472106 T1 ATE472106 T1 AT E472106T1 AT 06809583 T AT06809583 T AT 06809583T AT 06809583 T AT06809583 T AT 06809583T AT E472106 T1 ATE472106 T1 AT E472106T1
Authority
AT
Austria
Prior art keywords
output
shift register
storage element
parallel
register storage
Prior art date
Application number
AT06809583T
Other languages
English (en)
Inventor
Tom Waayers
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE472106T1 publication Critical patent/ATE472106T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318536—Scan chain arrangements, e.g. connections, test bus, analog signals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318541—Scan latches or cell details
AT06809583T 2005-10-24 2006-10-12 Ic-testverfahren und vorrichtung ATE472106T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05109894 2005-10-24
PCT/IB2006/053756 WO2007049173A1 (en) 2005-10-24 2006-10-12 Ic testing methods and apparatus

Publications (1)

Publication Number Publication Date
ATE472106T1 true ATE472106T1 (de) 2010-07-15

Family

ID=37831751

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06809583T ATE472106T1 (de) 2005-10-24 2006-10-12 Ic-testverfahren und vorrichtung

Country Status (8)

Country Link
US (1) US7941719B2 (de)
EP (1) EP1943533B1 (de)
JP (1) JP4966974B2 (de)
CN (1) CN101297207B (de)
AT (1) ATE472106T1 (de)
DE (1) DE602006015082D1 (de)
TW (1) TW200732682A (de)
WO (1) WO2007049173A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602006012082D1 (de) 2005-10-24 2010-03-18 Nxp Bv Ic-testverfahren und vorrichtung
US8856601B2 (en) * 2009-08-25 2014-10-07 Texas Instruments Incorporated Scan compression architecture with bypassable scan chains for low test mode power
US8627159B2 (en) 2010-11-11 2014-01-07 Qualcomm Incorporated Feedback scan isolation and scan bypass architecture
CN102156259B (zh) * 2011-04-02 2013-07-03 北京大学深圳研究生院 一种集成电路的测试方法及一种集成电路
US9551747B2 (en) * 2014-12-12 2017-01-24 International Business Machines Corporation Inserting bypass structures at tap points to reduce latch dependency during scan testing
US9588176B1 (en) * 2015-01-30 2017-03-07 Altera Corporation Techniques for using scan storage circuits
CN105203946B (zh) * 2015-10-30 2018-05-18 中国科学院微电子研究所 一种嵌入式芯核测试壳装置及其设计方法
US9897653B2 (en) * 2016-03-16 2018-02-20 Stmicroelectronics (Grenoble 2) Sas Scan chain circuit supporting logic self test pattern injection during run time
US10310013B2 (en) * 2016-12-12 2019-06-04 Samsung Electronics Co., Ltd. Test mode isolation and power reduction in embedded core-based digital systems of integrated circuits (ICs) with multiple power domains
EP3428665B1 (de) * 2017-07-11 2020-03-25 Nxp B.V. Fehlererkennung in registern
US11320485B1 (en) * 2020-12-31 2022-05-03 Nxp Usa, Inc. Scan wrapper architecture for system-on-chip

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62242873A (ja) 1986-04-14 1987-10-23 Nec Corp 集積回路
US6304987B1 (en) * 1995-06-07 2001-10-16 Texas Instruments Incorporated Integrated test circuit
JP3983318B2 (ja) * 1995-05-31 2007-09-26 テキサス インスツルメンツ インコーポレイテツド 低オーバヘッド入力および出力境界走査セルを含む集積回路
US6560734B1 (en) * 1998-06-19 2003-05-06 Texas Instruments Incorporated IC with addressable test port
JP2001153928A (ja) 1999-11-26 2001-06-08 Nec Corp バウンダリスキャン回路
US6877122B2 (en) * 2001-12-21 2005-04-05 Texas Instruments Incorporated Link instruction register providing test control signals to core wrappers
US6925583B1 (en) * 2002-01-09 2005-08-02 Xilinx, Inc. Structure and method for writing from a JTAG device with microcontroller to a non-JTAG device
KR100505662B1 (ko) * 2002-12-30 2005-08-03 삼성전자주식회사 칩 사이즈를 감소시키는 스캔 테스트 회로를 구비한반도체 장치, 및 그 테스트 방법
JP4274806B2 (ja) * 2003-01-28 2009-06-10 株式会社リコー 半導体集積回路およびスキャンテスト法
EP1595156B1 (de) 2003-02-10 2006-11-29 Koninklijke Philips Electronics N.V. Testen von integrierten schaltungen
ATE403160T1 (de) * 2004-01-19 2008-08-15 Nxp Bv Testarchitektur und -verfahren
JP2007524947A (ja) * 2004-02-17 2007-08-30 アンスティテュ ナシオナル ポリテクニーク ド グレノーブル 集積回路のｉｐコアのテスト手段のリモート制御を行うことができる通信手段を備える集積回路チップ
TWI263058B (en) * 2004-12-29 2006-10-01 Ind Tech Res Inst Wrapper testing circuits and method thereof for system-on-a-chip
DE602006012082D1 (de) 2005-10-24 2010-03-18 Nxp Bv Ic-testverfahren und vorrichtung
DE602006013339D1 (de) 2005-10-24 2010-05-12 Nxp Bv Ic-testverfahren und vorrichtung

Also Published As

Publication number Publication date
WO2007049173A1 (en) 2007-05-03
US20080255780A1 (en) 2008-10-16
DE602006015082D1 (de) 2010-08-05
JP4966974B2 (ja) 2012-07-04
EP1943533B1 (de) 2010-06-23
JP2009512874A (ja) 2009-03-26
CN101297207A (zh) 2008-10-29
CN101297207B (zh) 2012-03-28
US7941719B2 (en) 2011-05-10
TW200732682A (en) 2007-09-01
EP1943533A1 (de) 2008-07-16

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