ATE468937T1 - Verfahren zur verbindung von werkstücken und mikrostrukturiertes bauteil - Google Patents

Verfahren zur verbindung von werkstücken und mikrostrukturiertes bauteil

Info

Publication number
ATE468937T1
ATE468937T1 AT06762406T AT06762406T ATE468937T1 AT E468937 T1 ATE468937 T1 AT E468937T1 AT 06762406 T AT06762406 T AT 06762406T AT 06762406 T AT06762406 T AT 06762406T AT E468937 T1 ATE468937 T1 AT E468937T1
Authority
AT
Austria
Prior art keywords
bonding
bonding layer
microstructured component
arrangement
connecting workpieces
Prior art date
Application number
AT06762406T
Other languages
English (en)
Inventor
Heinrich Meyer
Olaf Kurtz
Ralph Herber
Christian Madry
Johannes Etzkorn
Thomas Vago
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE468937T1 publication Critical patent/ATE468937T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/227—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded with ferrous layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/04—Fastening; Joining by brazing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laser Beam Processing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
AT06762406T 2005-07-07 2006-06-28 Verfahren zur verbindung von werkstücken und mikrostrukturiertes bauteil ATE468937T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005032115A DE102005032115A1 (de) 2005-07-07 2005-07-07 Verfahren zum Fügen von Werkstücken und mikrostrukturiertes Bauteil
PCT/EP2006/006534 WO2007006461A1 (en) 2005-07-07 2006-06-28 Method for bonding work pieces and micro-structured component

Publications (1)

Publication Number Publication Date
ATE468937T1 true ATE468937T1 (de) 2010-06-15

Family

ID=37037027

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06762406T ATE468937T1 (de) 2005-07-07 2006-06-28 Verfahren zur verbindung von werkstücken und mikrostrukturiertes bauteil

Country Status (8)

Country Link
US (1) US20080217381A1 (de)
EP (1) EP1910011B1 (de)
JP (1) JP5023059B2 (de)
KR (1) KR20080023249A (de)
CN (1) CN101218062B (de)
AT (1) ATE468937T1 (de)
DE (2) DE102005032115A1 (de)
WO (1) WO2007006461A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE417691T1 (de) * 2006-08-17 2009-01-15 Atotech Deutschland Gmbh Verfahren zum fügen von werkstücken aus edelstahl,nickel oder nickellegierungen unter verwendung einer aus einer nickel-phosphorus-legierung bestehenden fügeschicht ; verfahren zum herstellen eines mikrostrukturierten bauteils unter verwendung eines solchen verfahren
US8428222B2 (en) * 2007-04-20 2013-04-23 General Electric Company X-ray tube target and method of repairing a damaged x-ray tube target
US8116432B2 (en) * 2007-04-20 2012-02-14 General Electric Company X-ray tube target brazed emission layer
DE102007063040A1 (de) 2007-12-28 2009-07-23 Atotech Deutschland Gmbh Herstellung von Mikroreaktoren
DE102015215214A1 (de) * 2015-08-10 2016-09-08 Carl Zeiss Smt Gmbh Verfahren zur Bewerkstelligung einer metallischen Bauteilverbindung, sowie unter Anwendung desselben gefertigte Spiegelfassung für eine mikrolithografische Projektionsbelichtungsanlage
JP6780561B2 (ja) * 2017-03-29 2020-11-04 三菱マテリアル株式会社 接合体の製造方法、絶縁回路基板の製造方法、及び、接合体、絶縁回路基板
CN114012235A (zh) * 2021-11-02 2022-02-08 贵州永红航空机械有限责任公司 一种ta2材料微通道散热器的扩散焊方法
DE102022125342A1 (de) * 2022-09-30 2024-04-04 Ineratec Gmbh Reaktoren in Mikrostrukturbauweise

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU576032B2 (en) * 1984-12-06 1988-08-11 De Beers Industrial Diamond Division (Proprietary) Limited Brazing
JP2731040B2 (ja) * 1991-02-05 1998-03-25 三菱電機株式会社 半導体装置の製造方法
JPH05329663A (ja) * 1991-12-27 1993-12-14 Komatsu Ltd 抵抗拡散接合方法
JP2746066B2 (ja) * 1992-12-04 1998-04-28 住友金属工業株式会社 管棒材の拡散接合方法
JP3291827B2 (ja) * 1993-03-18 2002-06-17 株式会社日立製作所 羽根車及びディフューザ、並びにその製作方法
JPH08290213A (ja) * 1995-04-20 1996-11-05 Sumitomo Metal Ind Ltd 金属二重管の製造方法
JPH106037A (ja) * 1996-06-25 1998-01-13 Sumitomo Metal Ind Ltd 刃物用クラッド鋼板の製造方法
JP3243184B2 (ja) * 1996-07-12 2002-01-07 新日本製鐵株式会社 酸化雰囲気中で接合可能な液相拡散接合用合金箔
DE19708472C2 (de) * 1997-02-20 1999-02-18 Atotech Deutschland Gmbh Herstellverfahren für chemische Mikroreaktoren
JPH1180868A (ja) * 1997-07-17 1999-03-26 Daido Steel Co Ltd 超硬合金接合用合金およびその複合材
DE19801374C1 (de) * 1998-01-16 1999-03-11 Dbb Fuel Cell Engines Gmbh Verfahren zum Löten von metallischen mikrostrukturierten Blechen
US6071389A (en) * 1998-08-21 2000-06-06 Tosoh Smd, Inc. Diffusion bonded sputter target assembly and method of making
JP4268310B2 (ja) * 2000-03-30 2009-05-27 株式会社神戸製鋼所 耐硫化割れ性に優れた接合体およびその製造方法
JP3798219B2 (ja) * 2000-03-31 2006-07-19 株式会社神戸製鋼所 鉄基合金部材同士の接合体及び接合方法
US6672502B1 (en) * 2000-11-28 2004-01-06 The State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Method for making devices having intermetallic structures and intermetallic devices made thereby
JP2002361442A (ja) * 2001-06-05 2002-12-18 Daido Steel Co Ltd 鉄基金属材料の液相拡散接合方法及びその方法により接合した鉄基金属材料接合体
JP3458849B2 (ja) * 2001-08-03 2003-10-20 株式会社日立製作所 コバルト基合金およびこの合金を用いた弁，原子炉プラント
US6783871B2 (en) * 2002-04-05 2004-08-31 Agilent Technologies, Inc. Direct bond of steel at low temperatures
JP4115859B2 (ja) * 2003-02-28 2008-07-09 株式会社日立製作所 陽極接合方法および電子装置
US8225481B2 (en) * 2003-05-19 2012-07-24 Pratt & Whitney Rocketdyne, Inc. Diffusion bonded composite material and method therefor
TWI288979B (en) * 2006-02-23 2007-10-21 Arima Optoelectronics Corp Light emitting diode bonded with metal diffusion and manufacturing method thereof

Also Published As

Publication number Publication date
WO2007006461A8 (en) 2007-05-31
US20080217381A1 (en) 2008-09-11
JP5023059B2 (ja) 2012-09-12
WO2007006461A1 (en) 2007-01-18
KR20080023249A (ko) 2008-03-12
EP1910011A1 (de) 2008-04-16
JP2008544862A (ja) 2008-12-11
DE602006014547D1 (de) 2010-07-08
CN101218062A (zh) 2008-07-09
CN101218062B (zh) 2010-10-27
DE102005032115A1 (de) 2007-01-11
EP1910011B1 (de) 2010-05-26

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