WO2008128949A3 - Verfahren zum herstellen eines verbundes mit zumindest einem nicht plattenförmigen bauteil - Google Patents

Verfahren zum herstellen eines verbundes mit zumindest einem nicht plattenförmigen bauteil Download PDF

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Publication number
WO2008128949A3
WO2008128949A3 PCT/EP2008/054633 EP2008054633W WO2008128949A3 WO 2008128949 A3 WO2008128949 A3 WO 2008128949A3 EP 2008054633 W EP2008054633 W EP 2008054633W WO 2008128949 A3 WO2008128949 A3 WO 2008128949A3
Authority
WO
WIPO (PCT)
Prior art keywords
composite
producing
component
flat
components
Prior art date
Application number
PCT/EP2008/054633
Other languages
English (en)
French (fr)
Other versions
WO2008128949A2 (de
Inventor
Claus Peter Kluge
Original Assignee
Ceramtec Ag
Claus Peter Kluge
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec Ag, Claus Peter Kluge filed Critical Ceramtec Ag
Priority to CN2008800217548A priority Critical patent/CN101687264B/zh
Priority to US12/596,855 priority patent/US20100206536A1/en
Priority to JP2010504634A priority patent/JP2010524698A/ja
Priority to EP08736303A priority patent/EP2142331A2/de
Publication of WO2008128949A2 publication Critical patent/WO2008128949A2/de
Publication of WO2008128949A3 publication Critical patent/WO2008128949A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0012—Brazing heat exchangers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zum Herstellen eines Verbundes aus wenigstens zwei mit Durchbrüchen oder Öffnungen versehenen Bauteilen aus Metall, insbesondere zum Herstellen von aus mindestens einem Verbund bestehenden Kühlers oder Kühlerelementen oder Wärmesenken, wobei die Bauteile unter Verwendung eines Fügemittels auf von Oberflächenseiten dieser Bauteile gebildeten Fügeflächen durch Erhitzen auf eine Prozesstemperatur zu dem Verbund miteinander verbunden werden. Um auch Verbünde mit komplizierten geometrischen Formen einfach herstellen zu können, wodurch deren Kühlleistung verstärkt ist, wird erfindungsgemäß vorgeschlagen, dass zumindest ein erstes Bauteil nicht plattenförmig ausgebildet wird und dieses erste Bauteil mit mindestens einem weiteren plattenförmigen oder nicht plattenförmigen zweiten Bauteil zu einem Verbund miteinander verbunden wird.
PCT/EP2008/054633 2007-04-24 2008-04-17 Verfahren zum herstellen eines verbundes mit zumindest einem nicht plattenförmigen bauteil WO2008128949A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800217548A CN101687264B (zh) 2007-04-24 2008-04-17 制造一种具有至少一个非板状构件的复合件的方法
US12/596,855 US20100206536A1 (en) 2007-04-24 2008-04-17 Method for producing a composite including at least one non-flat component
JP2010504634A JP2010524698A (ja) 2007-04-24 2008-04-17 少なくとも１つの非プレート状の構成要素を備えた複合体を製造する方法
EP08736303A EP2142331A2 (de) 2007-04-24 2008-04-17 Verfahren zum herstellen eines verbundes mit zumindest einem nicht plattenförmigen bauteil

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007019629.8 2007-04-24
DE102007019629 2007-04-24

Publications (2)

Publication Number Publication Date
WO2008128949A2 WO2008128949A2 (de) 2008-10-30
WO2008128949A3 true WO2008128949A3 (de) 2008-12-24

Family

ID=39777666

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/054633 WO2008128949A2 (de) 2007-04-24 2008-04-17 Verfahren zum herstellen eines verbundes mit zumindest einem nicht plattenförmigen bauteil

Country Status (7)

Country Link
US (1) US20100206536A1 (de)
EP (1) EP2142331A2 (de)
JP (1) JP2010524698A (de)
KR (1) KR20100017260A (de)
CN (1) CN101687264B (de)
DE (1) DE102008001228A1 (de)
WO (1) WO2008128949A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009025033A1 (de) 2009-06-10 2010-12-16 Behr Gmbh & Co. Kg Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung
US20140166257A1 (en) * 2012-12-19 2014-06-19 Diode-On Optoelectronics Limited Heat dissipation composite

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0351044A2 (de) * 1988-07-14 1990-01-17 Showa Aluminum Kabushiki Kaisha Herstellung von schweissbaren Rohren
EP1365204A1 (de) * 2001-01-29 2003-11-26 Zexel Valeo Climate Control Corporation Wärmetauscher

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US2594313A (en) * 1949-07-27 1952-04-29 Glidden Co Furnace brazing compositions
US3986899A (en) * 1974-06-07 1976-10-19 Scm Corporation Atomized copper brazing paste
US4294395A (en) * 1979-03-23 1981-10-13 Airco, Inc. Brazing process
JPS57122551A (en) * 1981-01-10 1982-07-30 Sumitomo Light Metal Ind Ltd Manufacture of heat sink for semiconductor device
JPS58137285A (ja) * 1982-02-10 1983-08-15 株式会社日立製作所 金属板付セラミック基板の製造法
JPS61263140A (ja) * 1985-05-16 1986-11-21 Sumitomo Light Metal Ind Ltd アルミニウム製放熱体の製造方法
US5798566A (en) * 1996-01-11 1998-08-25 Ngk Spark Plug Co., Ltd. Ceramic IC package base and ceramic cover
DE19801374C1 (de) * 1998-01-16 1999-03-11 Dbb Fuel Cell Engines Gmbh Verfahren zum Löten von metallischen mikrostrukturierten Blechen
JP3858484B2 (ja) * 1998-11-24 2006-12-13 松下電器産業株式会社 積層式熱交換器
WO2000076940A1 (en) * 1999-06-14 2000-12-21 Sumitomo Electric Industries, Ltd. Composite material and semiconductor device using the same
EP1315205A4 (de) * 2000-08-09 2009-04-01 Mitsubishi Materials Corp Leistungsmodul und leistungsmodul mit kühlkörper
JP2002261209A (ja) * 2001-03-02 2002-09-13 Fujikura Ltd ファン付きヒートシンク
JP4022055B2 (ja) * 2001-11-19 2007-12-12 日本電波工業株式会社 耐熱水晶振動子
US7107680B2 (en) * 2003-06-20 2006-09-19 Denso Corporation Manufacturing method of heat exchanger and structure thereof
US6992887B2 (en) * 2003-10-15 2006-01-31 Visteon Global Technologies, Inc. Liquid cooled semiconductor device
DE102004002841B3 (de) 2004-01-12 2005-05-04 Schulz-Harder, Jürgen, Dr.-Ing. Verfahren zum Herstellen von Plattenstapeln, insbesondere von aus Plattenstapeln bestehenden Kühlern oder Kühlerelementen
EP1555079B1 (de) * 2004-01-12 2008-07-23 Electrovac AG Verfahren zum Herstellen von aus Plattenstapeln bestehenden Kühlern oder Kühlerelementen, mit Fügemittel auf Innenflächen der Plattendurchbrüchen oder -öffnungen
WO2005098942A1 (ja) * 2004-04-05 2005-10-20 Mitsubishi Materials Corporation Ａi／ａiｎ接合体、パワーモジュール用基板及びパワーモジュール並びにａi／ａiｎ接合体の製造方法
US7364063B2 (en) * 2004-08-09 2008-04-29 Intel Corporation Thermally coupling an integrated heat spreader to a heat sink base
US7521789B1 (en) * 2004-12-18 2009-04-21 Rinehart Motion Systems, Llc Electrical assembly having heat sink protrusions
TWI449137B (zh) 2006-03-23 2014-08-11 Ceramtec Ag 構件或電路用的攜帶體
KR20100017314A (ko) * 2007-04-24 2010-02-16 세람텍 아게 비평판형 피가공재의 선택적인 표면 처리 방법
KR20100017414A (ko) * 2007-04-26 2010-02-16 세람텍 아게 구성 요소 또는 회로용 냉각 박스

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0351044A2 (de) * 1988-07-14 1990-01-17 Showa Aluminum Kabushiki Kaisha Herstellung von schweissbaren Rohren
EP1365204A1 (de) * 2001-01-29 2003-11-26 Zexel Valeo Climate Control Corporation Wärmetauscher

Also Published As

Publication number Publication date
US20100206536A1 (en) 2010-08-19
JP2010524698A (ja) 2010-07-22
CN101687264B (zh) 2012-11-28
EP2142331A2 (de) 2010-01-13
DE102008001228A1 (de) 2008-10-30
KR20100017260A (ko) 2010-02-16
CN101687264A (zh) 2010-03-31
WO2008128949A2 (de) 2008-10-30

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