ATE46547T1 - Herstellung einer matten oberflaeche auf einer metallschicht. - Google Patents
Herstellung einer matten oberflaeche auf einer metallschicht.Info
- Publication number
- ATE46547T1 ATE46547T1 AT85900480T AT85900480T ATE46547T1 AT E46547 T1 ATE46547 T1 AT E46547T1 AT 85900480 T AT85900480 T AT 85900480T AT 85900480 T AT85900480 T AT 85900480T AT E46547 T1 ATE46547 T1 AT E46547T1
- Authority
- AT
- Austria
- Prior art keywords
- layer
- metal layer
- making
- matt finish
- matte surface
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/623—Porosity of the layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB838333752A GB8333752D0 (en) | 1983-12-19 | 1983-12-19 | Matte surface on metal layer |
EP85900480A EP0200732B1 (de) | 1983-12-19 | 1984-12-19 | Herstellung einer matten oberfläche auf einer metallschicht |
PCT/GB1984/000440 WO1985002870A1 (en) | 1983-12-19 | 1984-12-19 | Production of a matte surface om a metal layer |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE46547T1 true ATE46547T1 (de) | 1989-10-15 |
Family
ID=10553497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT85900480T ATE46547T1 (de) | 1983-12-19 | 1984-12-19 | Herstellung einer matten oberflaeche auf einer metallschicht. |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0200732B1 (de) |
JP (1) | JPS61500855A (de) |
KR (1) | KR850700144A (de) |
AT (1) | ATE46547T1 (de) |
AU (1) | AU578653B2 (de) |
DE (1) | DE3479822D1 (de) |
GB (1) | GB8333752D0 (de) |
WO (1) | WO1985002870A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE82333T1 (de) * | 1985-07-05 | 1992-11-15 | Mitsui Mining & Smelting Co | Kupferfolie, durch elektrolytische abscheidung hergestellt. |
AU579517B2 (en) * | 1986-06-20 | 1988-11-24 | Gould Inc. | Double matte finish copper foil |
JPH0634448B2 (ja) * | 1988-07-25 | 1994-05-02 | 株式会社日立製作所 | 多層プリント配線板及びその製造方法 |
CA2070046A1 (en) * | 1991-06-28 | 1992-12-29 | Richard J. Sadey | Metal foil with improved bonding to substrates and method for making said foil |
JP2762386B2 (ja) * | 1993-03-19 | 1998-06-04 | 三井金属鉱業株式会社 | 銅張り積層板およびプリント配線板 |
DE10354760A1 (de) * | 2003-11-21 | 2005-06-23 | Enthone Inc., West Haven | Verfahren zur Abscheidung von Nickel und Chrom(VI)freien metallischen Mattschichten |
JP4354271B2 (ja) * | 2003-12-26 | 2009-10-28 | 三井金属鉱業株式会社 | 褐色化表面処理銅箔及びその製造方法並びにその褐色化表面処理銅箔を用いたプラズマディスプレイの前面パネル用の電磁波遮蔽導電性メッシュ |
JP2011003383A (ja) * | 2009-06-18 | 2011-01-06 | Furukawa Battery Co Ltd:The | リチウム二次電池用負極の製造法及びリチウム二次電池 |
CN112601473B (zh) * | 2018-09-06 | 2023-02-03 | Ykk株式会社 | 紧固件部件 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE789715A (fr) * | 1971-10-08 | 1973-02-01 | Yates Industries | Traitement de feuilles de cuivre en plusieurs couches |
FR2313300A1 (fr) * | 1975-03-20 | 1976-12-31 | Otis Ascinter | Systeme de commande de moteur d'ascenseur |
JPS55140471A (en) * | 1979-04-14 | 1980-11-01 | Hitachi Ltd | Elevator controller |
WO1982002991A1 (en) * | 1981-02-26 | 1982-09-02 | Torday John | Treatment of copper foil |
-
1983
- 1983-12-19 GB GB838333752A patent/GB8333752D0/en active Pending
-
1984
- 1984-12-19 AT AT85900480T patent/ATE46547T1/de not_active IP Right Cessation
- 1984-12-19 AU AU37887/85A patent/AU578653B2/en not_active Withdrawn - After Issue
- 1984-12-19 WO PCT/GB1984/000440 patent/WO1985002870A1/en active IP Right Grant
- 1984-12-19 JP JP60500343A patent/JPS61500855A/ja active Pending
- 1984-12-19 EP EP85900480A patent/EP0200732B1/de not_active Expired
- 1984-12-19 KR KR1019850700176A patent/KR850700144A/ko not_active Application Discontinuation
- 1984-12-19 DE DE8585900480T patent/DE3479822D1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
WO1985002870A1 (en) | 1985-07-04 |
EP0200732B1 (de) | 1989-09-20 |
KR850700144A (ko) | 1985-10-25 |
AU3788785A (en) | 1985-07-12 |
DE3479822D1 (en) | 1989-10-26 |
AU578653B2 (en) | 1988-11-03 |
EP0200732A1 (de) | 1986-11-12 |
JPS61500855A (ja) | 1986-05-01 |
GB8333752D0 (en) | 1984-01-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3484570D1 (de) | Zusammengesetzte leiterplatte mit metallmusterlagen und verfahren zur herstellung. | |
ATE10073T1 (de) | Verfahren zur herstellung einer verbundfolie. | |
ATE50379T1 (de) | Verfahren zur herstellung koplanarer viellagenmetall-isolator-schichten auf einem substrat. | |
ATE157201T1 (de) | Verfahren zum herstellung von ableiter-elektrode einheiten für dünnerschichten generatoren, ableiter-elektrode einheiten und daraus hergestellte generatoren | |
DE69513459T2 (de) | Verfahren zur Herstellung einer Al-Ge Legierung mit einer WGe Polierstoppschicht | |
ATE23465T1 (de) | Mehrlagig beschichtete schneidwerkzeuge und verfahren zur herstellung. | |
ATE46547T1 (de) | Herstellung einer matten oberflaeche auf einer metallschicht. | |
DE3578401D1 (de) | Verfahren zur herstellung einer korrosionsbestaendigen vakuumhartloetschicht. | |
DE3581919D1 (de) | Verfahren zur herstellung von halbleiterbauelementen mit einer sauerstoff enthaltenden polykristallinen siliciumschicht. | |
ES8502575A1 (es) | Mejoras introducidas en el procedimiento de fabricacion de acumuladores. | |
DE3852510D1 (de) | Verfahren zur Herstellung einer leitenden oder supraleitenden dünnen Schicht. | |
DE3786958T2 (de) | Durch Elektrotauchlakierung aufgetragene Epoxydüberzüge mit kontrollierter Filmbildung. | |
EP0250195A3 (de) | Kupferfolie mit einer matten Oberfläche auf beiden Seiten | |
JPS56108876A (en) | Silver plated exterior decorative parts for watch and their manufacture | |
JPS53141369A (en) | Treatment of article with thermosetting resin | |
JPS5484932A (en) | Forming method of multi-layer construction | |
DE3484948D1 (de) | Herstellung einer schichtfolie mit einer metallischen oberflaeche. | |
DE3783575D1 (de) | Zwei- oder mehrschichtiges glas bauteil mit einer beschichtung aus metall oder einer metallverbindung und verfahren zu seiner herstellung. | |
DE69114615T2 (de) | Verfahren zur Herstellung einer dünnen Schicht auf der Faserstirnfläche. | |
DE68919834D1 (de) | Verfahren zur erhöhung der glasstärke durch herstellung einer keramischen schicht und so erhaltener gegenstand. | |
DE3887765D1 (de) | Verfahren zur Herstellung einer dicken supraleitenden Schicht. | |
JPS54148205A (en) | Manufacture of moving member | |
EP0119749A3 (de) | Plattiertes magnetisches Aufzeichnungsmaterial und Verfahren zu seiner Herstellung | |
GB1137960A (en) | Metal composite and electrolytic method of making same | |
JPS573239A (en) | Manufacture of information carrier |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |