ATE46547T1 - Herstellung einer matten oberflaeche auf einer metallschicht. - Google Patents

Herstellung einer matten oberflaeche auf einer metallschicht.

Info

Publication number
ATE46547T1
ATE46547T1 AT85900480T AT85900480T ATE46547T1 AT E46547 T1 ATE46547 T1 AT E46547T1 AT 85900480 T AT85900480 T AT 85900480T AT 85900480 T AT85900480 T AT 85900480T AT E46547 T1 ATE46547 T1 AT E46547T1
Authority
AT
Austria
Prior art keywords
layer
metal layer
making
matt finish
matte surface
Prior art date
Application number
AT85900480T
Other languages
English (en)
Inventor
John Edwin Thorpe
Gursharan Singh Sarang
Original Assignee
M & T Laminates Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M & T Laminates Ltd filed Critical M & T Laminates Ltd
Application granted granted Critical
Publication of ATE46547T1 publication Critical patent/ATE46547T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Physical Vapour Deposition (AREA)
AT85900480T 1983-12-19 1984-12-19 Herstellung einer matten oberflaeche auf einer metallschicht. ATE46547T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB838333752A GB8333752D0 (en) 1983-12-19 1983-12-19 Matte surface on metal layer
EP85900480A EP0200732B1 (de) 1983-12-19 1984-12-19 Herstellung einer matten oberfläche auf einer metallschicht
PCT/GB1984/000440 WO1985002870A1 (en) 1983-12-19 1984-12-19 Production of a matte surface om a metal layer

Publications (1)

Publication Number Publication Date
ATE46547T1 true ATE46547T1 (de) 1989-10-15

Family

ID=10553497

Family Applications (1)

Application Number Title Priority Date Filing Date
AT85900480T ATE46547T1 (de) 1983-12-19 1984-12-19 Herstellung einer matten oberflaeche auf einer metallschicht.

Country Status (8)

Country Link
EP (1) EP0200732B1 (de)
JP (1) JPS61500855A (de)
KR (1) KR850700144A (de)
AT (1) ATE46547T1 (de)
AU (1) AU578653B2 (de)
DE (1) DE3479822D1 (de)
GB (1) GB8333752D0 (de)
WO (1) WO1985002870A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE82333T1 (de) * 1985-07-05 1992-11-15 Mitsui Mining & Smelting Co Kupferfolie, durch elektrolytische abscheidung hergestellt.
AU579517B2 (en) * 1986-06-20 1988-11-24 Gould Inc. Double matte finish copper foil
JPH0634448B2 (ja) * 1988-07-25 1994-05-02 株式会社日立製作所 多層プリント配線板及びその製造方法
CA2070046A1 (en) * 1991-06-28 1992-12-29 Richard J. Sadey Metal foil with improved bonding to substrates and method for making said foil
JP2762386B2 (ja) * 1993-03-19 1998-06-04 三井金属鉱業株式会社 銅張り積層板およびプリント配線板
DE10354760A1 (de) * 2003-11-21 2005-06-23 Enthone Inc., West Haven Verfahren zur Abscheidung von Nickel und Chrom(VI)freien metallischen Mattschichten
JP4354271B2 (ja) * 2003-12-26 2009-10-28 三井金属鉱業株式会社 褐色化表面処理銅箔及びその製造方法並びにその褐色化表面処理銅箔を用いたプラズマディスプレイの前面パネル用の電磁波遮蔽導電性メッシュ
JP2011003383A (ja) * 2009-06-18 2011-01-06 Furukawa Battery Co Ltd:The リチウム二次電池用負極の製造法及びリチウム二次電池
US12188131B2 (en) 2018-09-06 2025-01-07 Ykk Corporation Fastener member

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE789715A (fr) * 1971-10-08 1973-02-01 Yates Industries Traitement de feuilles de cuivre en plusieurs couches
FR2313300A1 (fr) * 1975-03-20 1976-12-31 Otis Ascinter Systeme de commande de moteur d'ascenseur
JPS55140471A (en) * 1979-04-14 1980-11-01 Hitachi Ltd Elevator controller
JPS58500149A (ja) * 1981-02-26 1983-01-20 エレクトロフオイルス　テクノロジ−　リミテイド 銅はくの処理方法

Also Published As

Publication number Publication date
AU3788785A (en) 1985-07-12
EP0200732A1 (de) 1986-11-12
WO1985002870A1 (en) 1985-07-04
AU578653B2 (en) 1988-11-03
GB8333752D0 (en) 1984-01-25
JPS61500855A (ja) 1986-05-01
EP0200732B1 (de) 1989-09-20
DE3479822D1 (en) 1989-10-26
KR850700144A (ko) 1985-10-25

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Legal Events

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