BE789715A - Traitement de feuilles de cuivre en plusieurs couches - Google Patents

Traitement de feuilles de cuivre en plusieurs couches

Info

Publication number
BE789715A
BE789715A BE789715DA BE789715A BE 789715 A BE789715 A BE 789715A BE 789715D A BE789715D A BE 789715DA BE 789715 A BE789715 A BE 789715A
Authority
BE
Belgium
Prior art keywords
copper sheet
layer copper
sheet treatment
treatment
layer
Prior art date
Application number
Other languages
English (en)
Inventor
A M Wolski
C B Yates
Original Assignee
Yates Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22691043&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BE789715(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Publication of BE789715A publication Critical patent/BE789715A/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D239/00—Heterocyclic compounds containing 1,3-diazine or hydrogenated 1,3-diazine rings
    • C07D239/02—Heterocyclic compounds containing 1,3-diazine or hydrogenated 1,3-diazine rings not condensed with other rings
    • C07D239/24—Heterocyclic compounds containing 1,3-diazine or hydrogenated 1,3-diazine rings not condensed with other rings having three or more double bonds between ring members or between ring members and non-ring members
    • C07D239/28—Heterocyclic compounds containing 1,3-diazine or hydrogenated 1,3-diazine rings not condensed with other rings having three or more double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, directly attached to ring carbon atoms
    • C07D239/46—Two or more oxygen, sulphur or nitrogen atoms
    • C07D239/52—Two oxygen atoms
    • C07D239/54—Two oxygen atoms as doubly bound oxygen atoms or as unsubstituted hydroxy radicals
    • C07D239/545—Two oxygen atoms as doubly bound oxygen atoms or as unsubstituted hydroxy radicals with other hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, directly attached to ring carbon atoms
    • C07D239/553—Two oxygen atoms as doubly bound oxygen atoms or as unsubstituted hydroxy radicals with other hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, directly attached to ring carbon atoms with halogen atoms or nitro radicals directly attached to ring carbon atoms, e.g. fluorouracil
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0004—Gaseous mixtures, e.g. polluted air
    • G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
    • G01N33/0011—Sample conditioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/936—Chemical deposition, e.g. electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12389—All metal or with adjacent metals having variation in thickness
    • Y10T428/12396—Discontinuous surface component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12472—Microscopic interfacial wave or roughness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12681—Ga-, In-, Tl- or Group VA metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Food Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
BE789715D 1971-10-08 Traitement de feuilles de cuivre en plusieurs couches BE789715A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US187923A US3918926A (en) 1971-10-08 1971-10-08 Plural copper-layer treatment of copper foil and article made thereby

Publications (1)

Publication Number Publication Date
BE789715A true BE789715A (fr) 1973-02-01

Family

ID=22691043

Family Applications (1)

Application Number Title Priority Date Filing Date
BE789715D BE789715A (fr) 1971-10-08 Traitement de feuilles de cuivre en plusieurs couches

Country Status (10)

Country Link
US (1) US3918926A (fr)
JP (2) JPS5338700B2 (fr)
BE (1) BE789715A (fr)
DE (1) DE2249796C3 (fr)
FR (1) FR2156030B1 (fr)
GB (1) GB1413494A (fr)
IT (1) IT966231B (fr)
LU (1) LU66249A1 (fr)
NL (1) NL158560B (fr)
SE (1) SE407242B (fr)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4061837A (en) * 1976-06-17 1977-12-06 Hutkin Irving J Plastic-metal composite and method of making the same
JPS54145965A (en) * 1978-05-08 1979-11-14 Nippon Mining Co Method of and apparatus for producing board for printed circuit
JPS5515216A (en) * 1978-07-20 1980-02-02 Mitsui Anakonda Dohaku Kk Printed circut copper foil and method of manufacturing same
US4376682A (en) * 1980-04-07 1983-03-15 Tdc Technology Development Corporation Method for producing smooth coherent metal chalconide films
US4357395A (en) * 1980-08-22 1982-11-02 General Electric Company Transfer lamination of vapor deposited foils, method and product
US4468293A (en) * 1982-03-05 1984-08-28 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US4431685A (en) * 1982-07-02 1984-02-14 International Business Machines Corporation Decreasing plated metal defects
US4515671A (en) * 1983-01-24 1985-05-07 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US4490218A (en) * 1983-11-07 1984-12-25 Olin Corporation Process and apparatus for producing surface treated metal foil
GB8333752D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Matte surface on metal layer
DE3447669A1 (de) * 1983-12-29 1985-07-18 Hitachi, Ltd., Tokio/Tokyo Verbundstruktur aus metall und kunstharz sowie verfahren zu deren herstellung
US4549940A (en) * 1984-04-23 1985-10-29 Karwan Steven J Method for surface treating copper foil
DE3427554A1 (de) * 1984-07-26 1986-02-06 Dornier System Gmbh, 7990 Friedrichshafen Verfahren zur erzeugung einer haftvermittelnden metallschicht
US4552627A (en) * 1984-11-13 1985-11-12 Olin Corporation Preparation for improving the adhesion properties of metal foils
US4551210A (en) * 1984-11-13 1985-11-05 Olin Corporation Dendritic treatment of metallic surfaces for improving adhesive bonding
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
US4549950A (en) * 1984-11-13 1985-10-29 Olin Corporation Systems for producing electroplated and/or treated metal foil
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
US4532014A (en) * 1984-11-13 1985-07-30 Olin Corporation Laser alignment system
JPS63103075A (ja) * 1986-10-14 1988-05-07 エドワ−ド　アドラ− マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品
US4692221A (en) * 1986-12-22 1987-09-08 Olin Corporation In-situ dendritic treatment of electrodeposited foil
US4927700A (en) * 1988-02-24 1990-05-22 Psi Star Copper etching process and product with controlled nitrous acid reaction
US4846918A (en) * 1988-02-24 1989-07-11 Psi Star Copper etching process and product with controlled nitrous acid reaction
US5057193A (en) * 1989-04-05 1991-10-15 Olin Corporation Anti-tarnish treatment of metal foil
US4961828A (en) * 1989-04-05 1990-10-09 Olin Corporation Treatment of metal foil
TW208110B (fr) * 1990-06-08 1993-06-21 Furukawa Circuit Foil Kk
US6042711A (en) * 1991-06-28 2000-03-28 Gould Electronics, Inc. Metal foil with improved peel strength and method for making said foil
JPH08222857A (ja) * 1995-02-16 1996-08-30 Mitsui Mining & Smelting Co Ltd 銅箔および該銅箔を内層回路用に用いた高密度多層プリント回路基板
US5679230A (en) * 1995-08-21 1997-10-21 Oak-Mitsui, Inc. Copper foil for printed circuit boards
US6270645B1 (en) 1997-09-26 2001-08-07 Circuit Foil Usa, Inc. Simplified process for production of roughened copper foil
US6060666A (en) * 1997-12-22 2000-05-09 Foil Technology Development Corporation Electrolytic layer applied to metallic foil to promote adhesion to a polymeric substrate
US6372113B2 (en) 1999-09-13 2002-04-16 Yates Foil Usa, Inc. Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same
US6342308B1 (en) * 1999-09-29 2002-01-29 Yates Foil Usa, Inc. Copper foil bonding treatment with improved bond strength and resistance to undercutting
US8987602B2 (en) * 2012-06-14 2015-03-24 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic support structure with cofabricated metal core
US9114356B2 (en) * 2012-09-20 2015-08-25 Clean Air Group, Inc. Fiberglass dielectric barrier ionization discharge device
KR101734840B1 (ko) * 2016-11-11 2017-05-15 일진머티리얼즈 주식회사 내굴곡성이 우수한 이차전지용 전해동박 및 그의 제조방법
CN110453246B (zh) * 2019-08-28 2021-03-23 中南大学 一种从铜电解液中原位合成铜砷合金的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2135873A (en) * 1934-11-22 1938-11-08 Bausch & Lomb Process of making metal reflectors
US2802897A (en) * 1952-07-18 1957-08-13 Gen Electric Insulated electrical conductors
GB757892A (en) * 1952-11-08 1956-09-26 Ferranti Ltd Improvements relating to the electrolytic production of copper foils
US3220897A (en) * 1961-02-13 1965-11-30 Esther S Conley Conducting element and method
US3293109A (en) * 1961-09-18 1966-12-20 Clevite Corp Conducting element having improved bonding characteristics and method
NL282244A (fr) * 1964-10-29
FR1569925A (fr) * 1968-04-17 1969-06-06

Also Published As

Publication number Publication date
US3918926A (en) 1975-11-11
JPS5217336A (en) 1977-02-09
NL7213582A (fr) 1973-04-10
GB1413494A (en) 1975-11-12
DE2249796B2 (de) 1980-06-26
DE2249796A1 (de) 1973-04-12
SE407242B (sv) 1979-03-19
JPS5338700B2 (fr) 1978-10-17
JPS4845466A (fr) 1973-06-29
JPS5339327B2 (fr) 1978-10-20
IT966231B (it) 1974-02-11
LU66249A1 (fr) 1973-01-23
FR2156030A1 (fr) 1973-05-25
NL158560B (nl) 1978-11-15
FR2156030B1 (fr) 1978-06-02
DE2249796C3 (de) 1982-11-11

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: YATES INDUSTRIES INC.

Effective date: 19911031