ATE458388T1 - Verfahren und vorrichtung zum präzisen aufbringen von strukturen auf ein substrat - Google Patents

Verfahren und vorrichtung zum präzisen aufbringen von strukturen auf ein substrat

Info

Publication number
ATE458388T1
ATE458388T1 AT05736360T AT05736360T ATE458388T1 AT E458388 T1 ATE458388 T1 AT E458388T1 AT 05736360 T AT05736360 T AT 05736360T AT 05736360 T AT05736360 T AT 05736360T AT E458388 T1 ATE458388 T1 AT E458388T1
Authority
AT
Austria
Prior art keywords
substrate
provision
processing head
lighting
scanning
Prior art date
Application number
AT05736360T
Other languages
English (en)
Inventor
Marinus Evers
Peter Brior
Pau Cornelis Du
Original Assignee
Otb Solar Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otb Solar Bv filed Critical Otb Solar Bv
Application granted granted Critical
Publication of ATE458388T1 publication Critical patent/ATE458388T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/0015—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Electroluminescent Light Sources (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT05736360T 2004-04-23 2005-04-22 Verfahren und vorrichtung zum präzisen aufbringen von strukturen auf ein substrat ATE458388T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL1026013A NL1026013C2 (nl) 2004-04-23 2004-04-23 Werkwijze en inrichting voor het nauwkeurig aanbrengen van structuren op een substraat.
NL1026880A NL1026880C1 (nl) 2004-04-23 2004-08-19 Werkwijze en inrichting voor het nauwkeurig aanbrengen van structuren op een substraat.
PCT/NL2005/000298 WO2005104637A1 (en) 2004-04-23 2005-04-22 Method and apparatus for accurately applying structures to a substrate

Publications (1)

Publication Number Publication Date
ATE458388T1 true ATE458388T1 (de) 2010-03-15

Family

ID=34965607

Family Applications (2)

Application Number Title Priority Date Filing Date
AT10152312T ATE533340T1 (de) 2004-04-23 2005-04-22 Verfahren und vorrichtung zur akkuraten auftragung von strukturen auf ein substrat
AT05736360T ATE458388T1 (de) 2004-04-23 2005-04-22 Verfahren und vorrichtung zum präzisen aufbringen von strukturen auf ein substrat

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AT10152312T ATE533340T1 (de) 2004-04-23 2005-04-22 Verfahren und vorrichtung zur akkuraten auftragung von strukturen auf ein substrat

Country Status (11)

Country Link
US (1) US8231931B2 (de)
EP (2) EP1757175B1 (de)
JP (1) JP2007534170A (de)
KR (1) KR101157286B1 (de)
CN (2) CN102933038B (de)
AT (2) ATE533340T1 (de)
DE (1) DE602005019403D1 (de)
ES (1) ES2339572T3 (de)
NL (2) NL1026013C2 (de)
TW (2) TWI332811B (de)
WO (1) WO2005104637A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110148985A1 (en) * 2009-12-23 2011-06-23 Ulvac, Inc. Parallel motion system for industrial printing
CN102120387B (zh) * 2010-01-08 2013-05-08 广东正业科技股份有限公司 全印制电子及电路板喷墨打印设备
KR20140112605A (ko) * 2013-03-11 2014-09-24 삼성디스플레이 주식회사 유기 패턴 검사 방법
RU2740867C1 (ru) 2017-04-28 2021-01-21 АКТЕГА Шмид Рюнер АГ Способ и устройство для создания текстурированного покрытия

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3832176A (en) 1973-04-06 1974-08-27 Eastman Kodak Co Novel photoresist article and process for its use
US4674174A (en) 1984-10-17 1987-06-23 Kabushiki Kaisha Toshiba Method for forming a conductor pattern using lift-off
US5932012A (en) * 1995-06-23 1999-08-03 Hitachi Techno Engineering Co., Ltd. Paste applicator having positioning means
US6354700B1 (en) * 1997-02-21 2002-03-12 Ncr Corporation Two-stage printing process and apparatus for radiant energy cured ink
JP4003273B2 (ja) * 1998-01-19 2007-11-07 セイコーエプソン株式会社 パターン形成方法および基板製造装置
GB2350321A (en) * 1999-05-27 2000-11-29 Patterning Technologies Ltd Method of forming a masking or spacer pattern on a substrate using inkjet droplet deposition
US6165658A (en) 1999-07-06 2000-12-26 Creo Ltd. Nonlinear image distortion correction in printed circuit board manufacturing
JP2001337461A (ja) 2000-05-25 2001-12-07 Dainippon Screen Mfg Co Ltd 描画装置
EP1223615A1 (de) * 2001-01-10 2002-07-17 Eidgenössische Technische Hochschule Zürich Verfahren zur Herstellung einer Struktur unter Verwendung von Nanopartikeln
AU2002346740A1 (en) * 2001-06-01 2002-12-16 Litrex Corporation Interchangeable microdeposition head apparatus and method
US20020192577A1 (en) * 2001-06-15 2002-12-19 Bernard Fay Automated overlay metrology system
JP2003156853A (ja) * 2001-11-20 2003-05-30 Pentax Corp 露光装置および露光方法
ITUD20010220A1 (it) * 2001-12-27 2003-06-27 New System Srl Sistema per la realizzazione di una stratificazione di materiale elettronicamente interattivo
JP2004012902A (ja) * 2002-06-07 2004-01-15 Fuji Photo Film Co Ltd 描画装置及びこの描画装置を用いた描画方法
JP2004126181A (ja) 2002-10-02 2004-04-22 Fuji Photo Film Co Ltd 露光システム

Also Published As

Publication number Publication date
US8231931B2 (en) 2012-07-31
EP2178352A3 (de) 2010-09-08
ATE533340T1 (de) 2011-11-15
TW201038160A (en) 2010-10-16
TWI347811B (en) 2011-08-21
EP1757175A1 (de) 2007-02-28
EP2178352B1 (de) 2011-11-09
CN102933038B (zh) 2016-08-31
NL1026880C1 (nl) 2005-10-25
KR20070046026A (ko) 2007-05-02
DE602005019403D1 (de) 2010-04-01
CN1947479A (zh) 2007-04-11
CN1947479B (zh) 2013-04-03
US20080158282A1 (en) 2008-07-03
NL1026013C2 (nl) 2005-10-25
TWI332811B (en) 2010-11-01
TW200610465A (en) 2006-03-16
JP2007534170A (ja) 2007-11-22
KR101157286B1 (ko) 2012-06-15
WO2005104637A1 (en) 2005-11-03
ES2339572T3 (es) 2010-05-21
EP1757175B1 (de) 2010-02-17
CN102933038A (zh) 2013-02-13
EP2178352A2 (de) 2010-04-21

Similar Documents

Publication Publication Date Title
ATE294767T1 (de) Verfahren und vorrichtung zum bewegen und positionieren von glastafeln
DE602005024209D1 (de) Verfahren und Vorrichtung zum Weben von Geweben mit zwei brauchbaren Seiten
DE60331388D1 (de) Verfahren und Gerät zum Unterstützen einer biometrischen Registrierung, die auf einem Authentifizierungsserver ausgeführt wird
DE602004025548D1 (de) Vorrichtung und Verfahren zum Drucken von Biomolekülen auf ein Substrat unter Ausnutzung von elektrohydrodynamischen Effekten
DE602004005909D1 (de) Vorrichtung und Verfahren zum Steuern eines Fahrzeugs mit mehreren Betriebsarten
DE502005010010D1 (de) Verfahren und vorrichtung zum trocknen von lackierten fahrzeugkarosserien
ATE553407T1 (de) Vorrichtung und verfahren zum erzeugen eines bildes eines objektes
DE60317732D1 (de) Vorrichtung und Verfahren zum Aufbringen von Beschichtungsmaterial auf ein Substrat mit Ultraschall
DE602005013202D1 (de) Vorrichtung und verfahren zum stapeln von objekten
ATE458388T1 (de) Verfahren und vorrichtung zum präzisen aufbringen von strukturen auf ein substrat
ATE465521T1 (de) Verfahren zur beschichtung von nanostrukturierte elektroden
DE60322391D1 (de) Verfahren zum aufbringen einer haftgrundierung auf ein fenster
DE50001581D1 (de) Vorrichtung und verfahren zur qualitätskontrolle von auf ein substrat aufgebrachten mikrotröpfchen
ATE471366T1 (de) Mittel zur entfernung von wasser aus einem substrat, verfahren zur wasserentfernung und trocknungsverfahren damit
DE60329344D1 (de) Verfahren und Vorrichtung zum Herstellen von Metall-Schichten
ATE521465T1 (de) Verfahren und vorrichtung zum künstlichen altern von steinen
DE60312182D1 (de) Vorrichtung und verfahren zum untersuchen von auf ein substrat aufgedrucktem cream-lot
DE60320978D1 (de) Vorrichtung und verfahren zum aufstempeln von etiketten auf reifen
DE502005008582D1 (de) Vorrichtung und verfahren zum aufbringen von folie auf ein bauelement
DE112004002965A5 (de) Vorrichtung und Verfahren zum Ansteuern einer organischen Leuchtdiode
ATE494764T1 (de) Verfahren und vorrichtung zum ausrichten von substrat und druckschablone beim lotpastendruck
DE60316998D1 (de) Verfahren zur Erzeugung von Inspektionsdaten zum Drucken
DE50311732D1 (de) Verfahren und vorrichtung zum herstellen von hohlkörpern
DE60209635D1 (de) Verfahren und Vorrichtung zum Drucken von Grautönen mittels härtbarer Tinten
DE10344113A1 (de) Vorrichtung und Verfahren zum Verbinden von Wafern

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties