ATE442664T1 - Verfahren zum bonden einer halbleitervorrichtung auf eine elektrisch leitende platte - Google Patents

Verfahren zum bonden einer halbleitervorrichtung auf eine elektrisch leitende platte

Info

Publication number
ATE442664T1
ATE442664T1 AT02710237T AT02710237T ATE442664T1 AT E442664 T1 ATE442664 T1 AT E442664T1 AT 02710237 T AT02710237 T AT 02710237T AT 02710237 T AT02710237 T AT 02710237T AT E442664 T1 ATE442664 T1 AT E442664T1
Authority
AT
Austria
Prior art keywords
plate
gold
semiconductor device
conductive plate
bonding
Prior art date
Application number
AT02710237T
Other languages
English (en)
Inventor
Rijckevorsel Johannes Van
Eugene Vriezen
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE442664T1 publication Critical patent/ATE442664T1/de

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Classifications

    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2924/15747—Copper [Cu] as principal constituent

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
AT02710237T 2001-02-23 2002-02-06 Verfahren zum bonden einer halbleitervorrichtung auf eine elektrisch leitende platte ATE442664T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01200665 2001-02-23
PCT/IB2002/000373 WO2002067316A1 (en) 2001-02-23 2002-02-06 Method of bonding a semiconductor device to an electrically conductive plate

Publications (1)

Publication Number Publication Date
ATE442664T1 true ATE442664T1 (de) 2009-09-15

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Application Number Title Priority Date Filing Date
AT02710237T ATE442664T1 (de) 2001-02-23 2002-02-06 Verfahren zum bonden einer halbleitervorrichtung auf eine elektrisch leitende platte

Country Status (6)

Country Link
US (1) US6664134B2 (de)
EP (1) EP1366514B1 (de)
JP (1) JP4247323B2 (de)
AT (1) ATE442664T1 (de)
DE (1) DE60233642D1 (de)
WO (1) WO2002067316A1 (de)

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JP4053962B2 (ja) * 2003-10-15 2008-02-27 株式会社東芝 半導体装置
JP2006254185A (ja) * 2005-03-11 2006-09-21 Orion Denki Kk 節電機能を有する電子機器
US20090020876A1 (en) * 2007-07-20 2009-01-22 Hertel Thomas A High temperature packaging for semiconductor devices

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JP2004519847A (ja) 2004-07-02
DE60233642D1 (de) 2009-10-22
EP1366514B1 (de) 2009-09-09
WO2002067316A1 (en) 2002-08-29
JP4247323B2 (ja) 2009-04-02
EP1366514A1 (de) 2003-12-03
US6664134B2 (en) 2003-12-16

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