ATE402496T1 - Streifenleitungsanordnung und verfahren zu ihrer herstellung - Google Patents

Streifenleitungsanordnung und verfahren zu ihrer herstellung

Info

Publication number
ATE402496T1
ATE402496T1 AT04809026T AT04809026T ATE402496T1 AT E402496 T1 ATE402496 T1 AT E402496T1 AT 04809026 T AT04809026 T AT 04809026T AT 04809026 T AT04809026 T AT 04809026T AT E402496 T1 ATE402496 T1 AT E402496T1
Authority
AT
Austria
Prior art keywords
layers
stripline
conducting
arrangement
adjacent
Prior art date
Application number
AT04809026T
Other languages
English (en)
Inventor
Patrik Rivas
Andreas Berndtsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Application granted granted Critical
Publication of ATE402496T1 publication Critical patent/ATE402496T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/043—Stacked PCBs with their backs attached to each other without electrical connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguide Aerials (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
AT04809026T 2004-12-01 2004-12-01 Streifenleitungsanordnung und verfahren zu ihrer herstellung ATE402496T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SE2004/001807 WO2006059934A1 (en) 2004-12-01 2004-12-01 A stripline arrangement and a method for production thereof

Publications (1)

Publication Number Publication Date
ATE402496T1 true ATE402496T1 (de) 2008-08-15

Family

ID=36565324

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04809026T ATE402496T1 (de) 2004-12-01 2004-12-01 Streifenleitungsanordnung und verfahren zu ihrer herstellung

Country Status (5)

Country Link
US (1) US20090009270A1 (de)
EP (1) EP1820235B1 (de)
AT (1) ATE402496T1 (de)
DE (1) DE602004015345D1 (de)
WO (1) WO2006059934A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8830127B2 (en) * 2010-11-18 2014-09-09 Casio Computer Co., Ltd Patch antenna and method of mounting the same
IT202100011000A1 (it) * 2021-04-30 2022-10-30 Commscope Italy Srl Stripline bias tee realizzato con capacita’ verso massa
CN114126209B (zh) * 2021-11-05 2023-12-01 中国电子科技集团公司第二十九研究所 一种基于垂直过孔的ltcc微波多层合路网络

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5870601A (ja) 1981-10-22 1983-04-27 Mitsubishi Electric Corp トリプレ−ト線路形マイクロ波回路
JPS60250699A (ja) * 1984-05-25 1985-12-11 富士通株式会社 高周波モジュ−ルの接続構造
DE3587607T2 (de) * 1984-12-19 1994-02-10 Martin Marietta Corp Zusammengestellte dielektrische mehrleiterübertragungsleitung.
US5469130A (en) * 1992-11-27 1995-11-21 Murata Mfg. Co., Ltd. High frequency parallel strip line cable comprising connector part and connector provided on substrate for connecting with connector part thereof
US5808529A (en) * 1996-07-12 1998-09-15 Storage Technology Corporation Printed circuit board layering configuration for very high bandwidth interconnect
JP3406830B2 (ja) * 1998-03-06 2003-05-19 京セラ株式会社 高周波用電子装置
US6593833B2 (en) * 2001-04-04 2003-07-15 Mcnc Tunable microwave components utilizing ferroelectric and ferromagnetic composite dielectrics and methods for making same
US6731189B2 (en) * 2002-06-27 2004-05-04 Raytheon Company Multilayer stripline radio frequency circuits and interconnection methods

Also Published As

Publication number Publication date
US20090009270A1 (en) 2009-01-08
EP1820235A1 (de) 2007-08-22
WO2006059934A1 (en) 2006-06-08
EP1820235B1 (de) 2008-07-23
DE602004015345D1 (de) 2008-09-04

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties