ATE376707T1 - Verkapselung einer vorrichtung - Google Patents

Verkapselung einer vorrichtung

Info

Publication number
ATE376707T1
ATE376707T1 AT99933462T AT99933462T ATE376707T1 AT E376707 T1 ATE376707 T1 AT E376707T1 AT 99933462 T AT99933462 T AT 99933462T AT 99933462 T AT99933462 T AT 99933462T AT E376707 T1 ATE376707 T1 AT E376707T1
Authority
AT
Austria
Prior art keywords
encapsulation
package
contacting
disclosed
prevent
Prior art date
Application number
AT99933462T
Other languages
English (en)
Inventor
Ewald Karl Michael Guenther
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Application granted granted Critical
Publication of ATE376707T1 publication Critical patent/ATE376707T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8721—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photographic Developing Apparatuses (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Led Device Packages (AREA)
  • Casings For Electric Apparatus (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
AT99933462T 1999-07-09 1999-07-09 Verkapselung einer vorrichtung ATE376707T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG1999/000073 WO2001004963A1 (en) 1999-07-09 1999-07-09 Encapsulation of a device

Publications (1)

Publication Number Publication Date
ATE376707T1 true ATE376707T1 (de) 2007-11-15

Family

ID=20430226

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99933462T ATE376707T1 (de) 1999-07-09 1999-07-09 Verkapselung einer vorrichtung

Country Status (11)

Country Link
US (2) US6888237B1 (de)
EP (1) EP1119878B1 (de)
JP (1) JP2003504676A (de)
KR (1) KR20010106471A (de)
CN (1) CN1218407C (de)
AT (1) ATE376707T1 (de)
AU (1) AU4951299A (de)
CA (1) CA2342946A1 (de)
DE (1) DE69937407T2 (de)
TW (1) TW492165B (de)
WO (1) WO2001004963A1 (de)

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JP4950400B2 (ja) 1999-07-09 2012-06-13 インスティチュート オブ マテリアルズ リサーチ アンド エンジニアリング デバイスを封入するためのラミネート
US6174613B1 (en) * 1999-07-29 2001-01-16 Agilent Technologies, Inc. Method and apparatus for fabricating polymer-based electroluminescent displays
US7394153B2 (en) 1999-12-17 2008-07-01 Osram Opto Semiconductors Gmbh Encapsulation of electronic devices
US8344360B2 (en) * 1999-12-17 2013-01-01 Osram Opto Semiconductor Gmbh Organic electronic devices with an encapsulation
DE69935261T2 (de) 1999-12-17 2007-06-21 Osram Opto Semiconductors Gmbh Verbesserte kapselung organischer led-vorrichtungen
CN1204444C (zh) 1999-12-17 2005-06-01 奥斯兰姆奥普托半导体有限责任公司 改进的有机发光二极管器件
US6798954B2 (en) 2001-07-24 2004-09-28 3M Innovative Properties Company Packaged optical micro-mechanical device
US6771859B2 (en) 2001-07-24 2004-08-03 3M Innovative Properties Company Self-aligning optical micro-mechanical device package
US6834154B2 (en) 2001-07-24 2004-12-21 3M Innovative Properties Co. Tooling fixture for packaged optical micro-mechanical devices
GB2378564A (en) * 2001-08-07 2003-02-12 Cambridge Display Tech Ltd Flexible light emitting device with incompressible spacers
US6590157B2 (en) * 2001-09-21 2003-07-08 Eastman Kodak Company Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
US7026758B2 (en) 2001-09-28 2006-04-11 Osram Opto Semiconductors Gmbh Reinforcement of glass substrates in flexible devices
US7362046B2 (en) 2001-11-10 2008-04-22 Image Portal Limited Partial overlapping display tiles of organic light emitting device
KR100875097B1 (ko) * 2002-09-18 2008-12-19 삼성모바일디스플레이주식회사 광학 공진 효과를 이용한 유기 전계발광 소자
KR100563057B1 (ko) 2003-11-14 2006-03-24 삼성에스디아이 주식회사 초박형 유기 전계 발광 표시장치 및 그 제조방법
US20060058073A1 (en) * 2004-01-29 2006-03-16 Duck-Young Kim Portable cellular phone holder which has an electric charging ability
KR100608887B1 (ko) * 2004-05-03 2006-08-03 엘지전자 주식회사 일렉트로 루미네센스 패널 및 그 제조방법
DE102005036520A1 (de) * 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
KR100776240B1 (ko) * 2006-02-21 2007-11-16 엘지전자 주식회사 임프린트를 이용한 에칭방법과 그에 사용되는 스탬프
US7709940B2 (en) * 2006-04-24 2010-05-04 Spatial Photonics, Inc. Micro device encapsulation
TWI350409B (en) * 2006-07-06 2011-10-11 Nat Univ Chung Hsing Flexible and could be rolling-up area lights module and the method of producing thereof
DE102007004303A1 (de) * 2006-08-04 2008-02-07 Osram Opto Semiconductors Gmbh Dünnfilm-Halbleiterbauelement und Bauelement-Verbund
DE102007004304A1 (de) * 2007-01-29 2008-07-31 Osram Opto Semiconductors Gmbh Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips
CN100466167C (zh) * 2007-02-05 2009-03-04 友达光电股份有限公司 可挠性主动元件阵列基板的制造方法
KR100873080B1 (ko) * 2007-05-10 2008-12-09 삼성모바일디스플레이주식회사 유기 전계 발광표시장치
DE102008024517A1 (de) 2007-12-27 2009-07-02 Osram Opto Semiconductors Gmbh Strahlungsemittierender Körper und Verfahren zur Herstellung eines strahlungsemittierenden Körpers
DE102008049060B4 (de) * 2008-09-26 2018-11-22 Osram Oled Gmbh Organisches, optoelektronisches Bauteil und Herstellungsverfahren hierfür
DE102010018260A1 (de) * 2010-01-29 2011-08-04 OSRAM Opto Semiconductors GmbH, 93055 Beleuchtungsvorrichtung
CN103337596B (zh) * 2013-05-24 2017-06-06 四川虹视显示技术有限公司 一种有机发光二极管的封装结构及其制备方法
CN103325949A (zh) * 2013-05-24 2013-09-25 四川虹视显示技术有限公司 一种有机发光二极管封装结构及其制备方法
US9064873B2 (en) * 2013-07-30 2015-06-23 Taiwan Semiconductor Manufacturing Company Ltd. Singulated semiconductor structure
JP6414082B2 (ja) * 2013-12-25 2018-10-31 日本ゼオン株式会社 積層フィルム、及び、複合フィルムの製造方法

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Also Published As

Publication number Publication date
EP1119878A1 (de) 2001-08-01
AU4951299A (en) 2001-01-30
CN1218407C (zh) 2005-09-07
KR20010106471A (ko) 2001-11-29
TW492165B (en) 2002-06-21
US20050136571A1 (en) 2005-06-23
WO2001004963A1 (en) 2001-01-18
CA2342946A1 (en) 2001-01-18
DE69937407T2 (de) 2008-07-24
CN1317154A (zh) 2001-10-10
US7214570B2 (en) 2007-05-08
EP1119878B1 (de) 2007-10-24
US6888237B1 (en) 2005-05-03
DE69937407D1 (de) 2007-12-06
JP2003504676A (ja) 2003-02-04

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties