ATE364738T1 - Verfahren zur verbesserung der elektrischen leitfähigkeit von metallen, metalllegierungen und metalloxiden - Google Patents
Verfahren zur verbesserung der elektrischen leitfähigkeit von metallen, metalllegierungen und metalloxidenInfo
- Publication number
- ATE364738T1 ATE364738T1 AT99308131T AT99308131T ATE364738T1 AT E364738 T1 ATE364738 T1 AT E364738T1 AT 99308131 T AT99308131 T AT 99308131T AT 99308131 T AT99308131 T AT 99308131T AT E364738 T1 ATE364738 T1 AT E364738T1
- Authority
- AT
- Austria
- Prior art keywords
- metals
- metal
- substrate
- group
- improving
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title abstract 10
- 239000002184 metal Substances 0.000 title abstract 10
- 150000002739 metals Chemical class 0.000 title abstract 6
- 229910001092 metal group alloy Inorganic materials 0.000 title abstract 3
- 229910044991 metal oxide Inorganic materials 0.000 title abstract 3
- 150000004706 metal oxides Chemical class 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 5
- 238000000151 deposition Methods 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- -1 IVA metals Chemical class 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 238000005137 deposition process Methods 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 229910052735 hafnium Inorganic materials 0.000 abstract 1
- 229910052741 iridium Inorganic materials 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 229910052748 manganese Inorganic materials 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 229910052758 niobium Inorganic materials 0.000 abstract 1
- 229910052762 osmium Inorganic materials 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 229910052703 rhodium Inorganic materials 0.000 abstract 1
- 229910052707 ruthenium Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 229910052715 tantalum Inorganic materials 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
- 229910052721 tungsten Inorganic materials 0.000 abstract 1
- 229910052720 vanadium Inorganic materials 0.000 abstract 1
- 229910052726 zirconium Inorganic materials 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
- Y10T428/12507—More than two components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12722—Next to Group VIII metal-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Physical Vapour Deposition (AREA)
- Conductive Materials (AREA)
- Chemical Vapour Deposition (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/174,132 US6096391A (en) | 1998-10-16 | 1998-10-16 | Method for improving electrical conductivity of metals, metal alloys and metal oxides |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE364738T1 true ATE364738T1 (de) | 2007-07-15 |
Family
ID=22634961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT99308131T ATE364738T1 (de) | 1998-10-16 | 1999-10-15 | Verfahren zur verbesserung der elektrischen leitfähigkeit von metallen, metalllegierungen und metalloxiden |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6096391A (de) |
| EP (1) | EP0994202B1 (de) |
| JP (1) | JP2000129426A (de) |
| AT (1) | ATE364738T1 (de) |
| DE (1) | DE69936281T2 (de) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6221747B1 (en) * | 1999-07-02 | 2001-04-24 | United Integrated Circuits Corp. | Method of fabricating a conductive plug with a low junction resistance in an integrated circuit |
| KR100403957B1 (ko) * | 2001-05-03 | 2003-11-03 | 주식회사 하이닉스반도체 | 강유전체 메모리 소자의 제조 방법 |
| KR100422594B1 (ko) * | 2001-09-12 | 2004-03-16 | 주식회사 하이닉스반도체 | 반도체 소자의 커패시터 및 제조방법 |
| US7241344B2 (en) * | 2004-02-10 | 2007-07-10 | Boston Scientific Scimed, Inc. | Apparatus and method for electrostatic spray coating of medical devices |
| US7410509B2 (en) * | 2005-01-19 | 2008-08-12 | Greatbatch Ltd. | Sputtered ruthenium oxide coatings in electrolytic capacitor |
| DE102007043479A1 (de) * | 2007-09-12 | 2009-03-19 | Valeo Schalter Und Sensoren Gmbh | Verfahren zur Oberflächenbehandlung von Aluminium und ein Schichtaufbau eines Bauteils aus Aluminium mit einer elektrischen Kontaktierung |
| US7989703B2 (en) * | 2008-02-29 | 2011-08-02 | Fort Wayne Metals Research Products Corporation | Alternating core composite wire |
| US8023250B2 (en) | 2008-09-12 | 2011-09-20 | Avx Corporation | Substrate for use in wet capacitors |
| US8279585B2 (en) * | 2008-12-09 | 2012-10-02 | Avx Corporation | Cathode for use in a wet capacitor |
| US8405956B2 (en) * | 2009-06-01 | 2013-03-26 | Avx Corporation | High voltage electrolytic capacitors |
| US8605411B2 (en) | 2010-09-16 | 2013-12-10 | Avx Corporation | Abrasive blasted conductive polymer cathode for use in a wet electrolytic capacitor |
| US8514547B2 (en) | 2010-11-01 | 2013-08-20 | Avx Corporation | Volumetrically efficient wet electrolytic capacitor |
| US8259435B2 (en) | 2010-11-01 | 2012-09-04 | Avx Corporation | Hermetically sealed wet electrolytic capacitor |
| US9105401B2 (en) | 2011-12-02 | 2015-08-11 | Avx Corporation | Wet electrolytic capacitor containing a gelled working electrolyte |
| US9129747B2 (en) | 2012-03-16 | 2015-09-08 | Avx Corporation | Abrasive blasted cathode of a wet electrolytic capacitor |
| EP2926406A4 (de) | 2012-11-30 | 2016-07-20 | Electric Power Res Inst | Verbesserte elektrische kontaktleitfähigkeit über oberflächendotierung |
| CN106044963B (zh) * | 2016-07-26 | 2019-01-29 | 西安建筑科技大学 | 一种钛基聚苯胺掺杂二氧化铅复合电极材料的制备方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4351855A (en) * | 1981-02-24 | 1982-09-28 | Eduard Pinkhasov | Noncrucible method of and apparatus for the vapor deposition of material upon a substrate using voltaic arc in vacuum |
| US4609564C2 (en) * | 1981-02-24 | 2001-10-09 | Masco Vt Inc | Method of and apparatus for the coating of a substrate with material electrically transformed into a vapor phase |
| US4438153A (en) * | 1981-02-24 | 1984-03-20 | Welbilt Electronics Die Corporation | Method of and apparatus for the vapor deposition of material upon a substrate |
| US4596719A (en) * | 1981-02-24 | 1986-06-24 | Wedtech Corp. | Multilayer coating method and apparatus |
| US4569719A (en) * | 1981-07-17 | 1986-02-11 | Plasma Physics Corporation | Glow discharge method and apparatus and photoreceptor devices made therewith |
| US4780797A (en) * | 1987-12-16 | 1988-10-25 | Tansitor Electronic, Inc. | Capacitor tantalum surface for use as a counterelectrode device and method |
| US5011638A (en) * | 1988-06-17 | 1991-04-30 | Vapor Technologies, Inc. | Method of making open-pore structures |
| US4975230A (en) * | 1988-06-17 | 1990-12-04 | Vapor Technologies Inc. | Method of making an open pore structure |
| US4978556A (en) * | 1988-07-18 | 1990-12-18 | Vapor Technologies Inc. | Electrode for vapor deposition and vapor-deposition method using same |
| US4942844A (en) * | 1988-11-25 | 1990-07-24 | Vapor Technologies Inc. | High penetration deposition process and apparatus |
| JPH03147310A (ja) * | 1989-11-01 | 1991-06-24 | Nippon Chemicon Corp | 電解コンデンサ用アルミニウム電極の製造方法 |
| US5098485A (en) * | 1990-09-19 | 1992-03-24 | Evans Findings Company | Method of making electrically insulating metallic oxides electrically conductive |
| US5269898A (en) * | 1991-03-20 | 1993-12-14 | Vapor Technologies, Inc. | Apparatus and method for coating a substrate using vacuum arc evaporation |
| JPH05295522A (ja) * | 1992-04-17 | 1993-11-09 | Nippon Steel Corp | 薄膜形成方法 |
| US5369547A (en) * | 1993-03-22 | 1994-11-29 | The Evans Findings Co., Ltd. | Capacitor |
| JPH09194972A (ja) * | 1995-11-15 | 1997-07-29 | Tosoh Corp | 低水素過電圧陰極およびその製造方法 |
| US6599580B2 (en) * | 1997-05-01 | 2003-07-29 | Wilson Greatbatch Ltd. | Method for improving electrical conductivity of a metal oxide layer on a substrate utilizing high energy beam mixing |
-
1998
- 1998-10-16 US US09/174,132 patent/US6096391A/en not_active Expired - Lifetime
-
1999
- 1999-10-15 DE DE69936281T patent/DE69936281T2/de not_active Expired - Lifetime
- 1999-10-15 JP JP11293486A patent/JP2000129426A/ja active Pending
- 1999-10-15 EP EP99308131A patent/EP0994202B1/de not_active Expired - Lifetime
- 1999-10-15 AT AT99308131T patent/ATE364738T1/de not_active IP Right Cessation
-
2005
- 2005-07-11 US US11/178,976 patent/US20050266261A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US6096391A (en) | 2000-08-01 |
| DE69936281T2 (de) | 2008-04-03 |
| JP2000129426A (ja) | 2000-05-09 |
| EP0994202A3 (de) | 2002-08-21 |
| EP0994202A2 (de) | 2000-04-19 |
| US20050266261A1 (en) | 2005-12-01 |
| EP0994202B1 (de) | 2007-06-13 |
| DE69936281D1 (de) | 2007-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69936281D1 (de) | Verfahren zur Verbesserung der elektrischen Leitfähigkeit von Metallen, Metalllegierungen und Metalloxiden | |
| CN100383898C (zh) | Mim电容器之形成方法 | |
| AU754373B2 (en) | Thermal spray coated substrate for use in an electrical energy storage device and method | |
| JPS57192281A (en) | Durable electrode for electrolysis and manufacture thereof | |
| DE2215151B2 (de) | Verfahren zum Herstellen von dünnen Schichten aus Tantal | |
| US4372809A (en) | Method for manufacturing solderable, temperable, thin film tracks which do not contain precious metal | |
| JPH06128743A (ja) | 透明導電膜とその製造方法およびそれに用いるターゲット | |
| US4100385A (en) | Electrical terminal, particularly plug-type terminal | |
| TW569256B (en) | Electrode materials with improved hydrogen degradation resistance and fabrication method | |
| JPH09328303A (ja) | 沿面放電型放電素子 | |
| TW200908290A (en) | Method for manufacturing capacitor of semiconductor | |
| JP2001011612A (ja) | ターゲット材料、電極材料、及び実装部品 | |
| JPH0423401B2 (de) | ||
| US20230360825A1 (en) | Temperature sensor and method for producing a temperature sensor of this kind | |
| JPH08188869A (ja) | 半導体素子の金属薄膜形成方法及びガスセンサの製造方法 | |
| JPH0140511B2 (de) | ||
| CN107331489A (zh) | 一种复合电极电子陶瓷元件的制造工艺 | |
| CN112167727B (zh) | 发热体及其制备方法、电子烟具 | |
| JP3259884B2 (ja) | 金属酸化物皮膜抵抗器 | |
| JP2001291604A (ja) | チップ形積層サーミスタ及びその製造方法 | |
| JPH11195504A (ja) | 電気抵抗薄膜及びその製造法並びにセンサデ バイス | |
| JP2821239B2 (ja) | ガラス基板の金属多層膜形成方法 | |
| GB1177302A (en) | Improvements in or relating to Grid Electrodes | |
| JP3481546B2 (ja) | 対サージ防御装置の主構成部材を作製する方法 | |
| JPH0294269A (ja) | 零抵抗素子 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |