ATE360259T1 - Werkzeug zur handhabung von wafern und reaktor für epitaxisches wachstum - Google Patents

Werkzeug zur handhabung von wafern und reaktor für epitaxisches wachstum

Info

Publication number
ATE360259T1
ATE360259T1 AT02800104T AT02800104T ATE360259T1 AT E360259 T1 ATE360259 T1 AT E360259T1 AT 02800104 T AT02800104 T AT 02800104T AT 02800104 T AT02800104 T AT 02800104T AT E360259 T1 ATE360259 T1 AT E360259T1
Authority
AT
Austria
Prior art keywords
disk
wafer
suction
lower side
tool
Prior art date
Application number
AT02800104T
Other languages
English (en)
Inventor
Franco Preti
Vincenzo Ogliari
Original Assignee
Lpe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=11448442&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE360259(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Lpe Spa filed Critical Lpe Spa
Application granted granted Critical
Publication of ATE360259T1 publication Critical patent/ATE360259T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
AT02800104T 2001-09-27 2002-09-20 Werkzeug zur handhabung von wafern und reaktor für epitaxisches wachstum ATE360259T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2001MI002014A ITMI20012014A1 (it) 2001-09-27 2001-09-27 Utensile per maneggiare fette e stazione per crescita epitassiale

Publications (1)

Publication Number Publication Date
ATE360259T1 true ATE360259T1 (de) 2007-05-15

Family

ID=11448442

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02800104T ATE360259T1 (de) 2001-09-27 2002-09-20 Werkzeug zur handhabung von wafern und reaktor für epitaxisches wachstum

Country Status (10)

Country Link
US (1) US6991420B2 (de)
EP (1) EP1430516B1 (de)
JP (1) JP4234007B2 (de)
KR (1) KR20040037094A (de)
CN (1) CN100349253C (de)
AT (1) ATE360259T1 (de)
DE (1) DE60219648T2 (de)
ES (1) ES2283643T3 (de)
IT (1) ITMI20012014A1 (de)
WO (1) WO2003030222A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1883959A1 (de) * 2005-05-26 2008-02-06 Lpe Spa Unterdrucksystem zur wafer-handhabung
CN103904013B (zh) * 2012-12-28 2016-12-28 上海微电子装备有限公司 一种真空吸附装置及吸附测校方法
CN106298618A (zh) * 2015-06-26 2017-01-04 北京北方微电子基地设备工艺研究中心有限责任公司 晶片传输装置
CN106558523A (zh) * 2015-09-29 2017-04-05 奇勗科技股份有限公司 非接触式的晶圆搬运装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4009785A (en) * 1974-10-02 1977-03-01 Motorola, Inc. Fixture and system for handling plate like objects
JPS61140432A (ja) * 1984-12-11 1986-06-27 Shinko Denki Kk ウエハ−等の保持装置
JPS62106643A (ja) * 1985-11-05 1987-05-18 Toshiba Corp 穴開きバキユ−ムウエハチヤツク
JPS63228637A (ja) * 1987-03-18 1988-09-22 Hitachi Ltd 取付治具
NL8701603A (nl) * 1987-07-08 1989-02-01 Philips & Du Pont Optical Vacuuminrichting voor het vastzuigen van werkstukken.
JPH0410529A (ja) * 1990-04-27 1992-01-14 Shin Etsu Handotai Co Ltd サセプタ及びウエーハ自動脱着装置
WO1997045862A1 (en) * 1996-05-31 1997-12-04 Ipec Precision, Inc. Non-contact holder for wafer-like articles
US5928537A (en) * 1997-03-14 1999-07-27 Fortune; William S. Pneumatic pickup tool for small parts
US6398621B1 (en) * 1997-05-23 2002-06-04 Applied Materials, Inc. Carrier head with a substrate sensor
EP1022615A4 (de) * 1997-08-29 2001-01-03 Nikon Corp Behälter für photomaske, transporteinrichtung sowie transportverfahren
JPH11300608A (ja) * 1998-04-20 1999-11-02 Nec Corp 化学機械研磨装置
US6254155B1 (en) * 1999-01-11 2001-07-03 Strasbaugh, Inc. Apparatus and method for reliably releasing wet, thin wafers
IT1308606B1 (it) * 1999-02-12 2002-01-08 Lpe Spa Dispositivo per maneggiare substrati mediante un istema autolivellante a depressione in reattori epistassiali ad induzione con suscettore
US6935830B2 (en) * 2001-07-13 2005-08-30 Tru-Si Technologies, Inc. Alignment of semiconductor wafers and other articles
US6638004B2 (en) * 2001-07-13 2003-10-28 Tru-Si Technologies, Inc. Article holders and article positioning methods

Also Published As

Publication number Publication date
JP4234007B2 (ja) 2009-03-04
KR20040037094A (ko) 2004-05-04
CN100349253C (zh) 2007-11-14
EP1430516B1 (de) 2007-04-18
WO2003030222A2 (en) 2003-04-10
DE60219648T2 (de) 2007-10-18
WO2003030222A3 (en) 2003-11-13
US20040191029A1 (en) 2004-09-30
EP1430516A2 (de) 2004-06-23
CN1636264A (zh) 2005-07-06
ES2283643T3 (es) 2007-11-01
JP2005505134A (ja) 2005-02-17
US6991420B2 (en) 2006-01-31
ITMI20012014A0 (it) 2001-09-27
ITMI20012014A1 (it) 2003-03-27
DE60219648D1 (de) 2007-05-31

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Legal Events

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