ATE277720T1 - Polierkissen und anwendungsverfahren dafür - Google Patents

Polierkissen und anwendungsverfahren dafür

Info

Publication number
ATE277720T1
ATE277720T1 AT01946399T AT01946399T ATE277720T1 AT E277720 T1 ATE277720 T1 AT E277720T1 AT 01946399 T AT01946399 T AT 01946399T AT 01946399 T AT01946399 T AT 01946399T AT E277720 T1 ATE277720 T1 AT E277720T1
Authority
AT
Austria
Prior art keywords
unit cell
wafer
article
area
unit
Prior art date
Application number
AT01946399T
Other languages
English (en)
Inventor
Jeffrey S Kollodge
Robert P Messner
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE277720T1 publication Critical patent/ATE277720T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AT01946399T 2001-01-08 2001-06-15 Polierkissen und anwendungsverfahren dafür ATE277720T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/756,376 US6612916B2 (en) 2001-01-08 2001-01-08 Article suitable for chemical mechanical planarization processes
PCT/US2001/019212 WO2002053324A1 (en) 2001-01-08 2001-06-15 Polishing pad and method of use thereof

Publications (1)

Publication Number Publication Date
ATE277720T1 true ATE277720T1 (de) 2004-10-15

Family

ID=25043197

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01946399T ATE277720T1 (de) 2001-01-08 2001-06-15 Polierkissen und anwendungsverfahren dafür

Country Status (9)

Country Link
US (2) US6612916B2 (de)
EP (1) EP1349705B1 (de)
JP (1) JP4933716B2 (de)
KR (1) KR100777846B1 (de)
CN (1) CN1217769C (de)
AT (1) ATE277720T1 (de)
DE (1) DE60106084T2 (de)
TW (1) TW526554B (de)
WO (1) WO2002053324A1 (de)

Families Citing this family (50)

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US6790768B2 (en) * 2001-07-11 2004-09-14 Applied Materials Inc. Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects
US6908366B2 (en) * 2003-01-10 2005-06-21 3M Innovative Properties Company Method of using a soft subpad for chemical mechanical polishing
EP1590127A1 (de) * 2003-01-10 2005-11-02 3M Innovative Properties Company Unterlagenkonstruktionen für chemisch-mechanische planarisierungsanwendungen
US7311522B2 (en) * 2003-03-31 2007-12-25 Miltex Technology Corporation Endodontic instruments and method of manufacturing same
KR100590202B1 (ko) * 2003-08-29 2006-06-15 삼성전자주식회사 연마 패드 및 그 형성방법
US7186651B2 (en) * 2003-10-30 2007-03-06 Texas Instruments Incorporated Chemical mechanical polishing method and apparatus
US7294048B2 (en) * 2004-06-18 2007-11-13 3M Innovative Properties Company Abrasive article
JP5025478B2 (ja) * 2004-10-06 2012-09-12 バジャジ，ラジェーヴ 改良された化学機械平坦化の方法およびシステム
US20060079159A1 (en) * 2004-10-08 2006-04-13 Markus Naujok Chemical mechanical polish with multi-zone abrasive-containing matrix
US8075745B2 (en) * 2004-11-29 2011-12-13 Semiquest Inc. Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US20070224925A1 (en) * 2006-03-21 2007-09-27 Rajeev Bajaj Chemical Mechanical Polishing Pad
US7815778B2 (en) * 2005-11-23 2010-10-19 Semiquest Inc. Electro-chemical mechanical planarization pad with uniform polish performance
US20080318505A1 (en) * 2004-11-29 2008-12-25 Rajeev Bajaj Chemical mechanical planarization pad and method of use thereof
US20090061744A1 (en) * 2007-08-28 2009-03-05 Rajeev Bajaj Polishing pad and method of use
WO2006057720A1 (en) * 2004-11-29 2006-06-01 Rajeev Bajaj Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
US7846008B2 (en) * 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
US7169029B2 (en) * 2004-12-16 2007-01-30 3M Innovative Properties Company Resilient structured sanding article
US6997785B1 (en) 2004-12-23 2006-02-14 3M Innovative Properties Company Wafer planarization composition and method of use
US7762871B2 (en) * 2005-03-07 2010-07-27 Rajeev Bajaj Pad conditioner design and method of use
US8398463B2 (en) * 2005-03-07 2013-03-19 Rajeev Bajaj Pad conditioner and method
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
US7435162B2 (en) * 2005-10-24 2008-10-14 3M Innovative Properties Company Polishing fluids and methods for CMP
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
US20090011679A1 (en) * 2007-04-06 2009-01-08 Rajeev Bajaj Method of removal profile modulation in cmp pads
KR101618273B1 (ko) * 2008-04-29 2016-05-04 세미퀘스트, 인코포레이티드 연마 패드 조성물, 및 이의 제조 방법 및 용도
US20090266002A1 (en) * 2008-04-29 2009-10-29 Rajeev Bajaj Polishing pad and method of use
IES20080376A2 (en) * 2008-05-13 2010-05-12 Michael O'ceallaigh An abrasive material, wheel and tool for grinding semiconductor substrates, and method of manufacture of same
US20090313905A1 (en) * 2008-06-18 2009-12-24 Stephen Fisher Method and apparatus for assembly of cmp polishing pads
US8821214B2 (en) 2008-06-26 2014-09-02 3M Innovative Properties Company Polishing pad with porous elements and method of making and using the same
TWI449597B (zh) * 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法
US8292692B2 (en) * 2008-11-26 2012-10-23 Semiquest, Inc. Polishing pad with endpoint window and systems and method using the same
GB0823086D0 (en) * 2008-12-18 2009-01-28 Univ Nottingham Abrasive Tools
TWI535527B (zh) * 2009-07-20 2016-06-01 智勝科技股份有限公司 研磨方法、研磨墊與研磨系統
DE102010010885B4 (de) * 2010-03-10 2017-06-08 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
JP2013049112A (ja) * 2011-08-31 2013-03-14 Kyushu Institute Of Technology ポリシングパッド及びその製造方法
RU2620846C2 (ru) * 2012-07-06 2017-05-30 3М Инновейтив Пропертиз Компани Абразивное изделие с покрытием
US10226853B2 (en) 2013-01-18 2019-03-12 Applied Materials, Inc. Methods and apparatus for conditioning of chemical mechanical polishing pads
US9649742B2 (en) * 2013-01-22 2017-05-16 Nexplanar Corporation Polishing pad having polishing surface with continuous protrusions
EP3126092B1 (de) 2014-04-03 2022-08-17 3M Innovative Properties Company Polierkissen und systeme und verfahren zur herstellung und verwendung davon
EP3127984A4 (de) * 2014-04-04 2017-10-04 Fujimi Incorporated Polierzusammensetzung für harte materialien
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
KR102186895B1 (ko) * 2019-05-29 2020-12-07 한국생산기술연구원 마이크로 패턴을 갖는 연마용 패드의 설계방법
KR102440315B1 (ko) * 2020-05-11 2022-09-06 한국생산기술연구원 패턴구조를 갖는 화학기계적 연마용 패드 및 이의 제조방법
KR102221514B1 (ko) * 2019-05-29 2021-03-03 한국생산기술연구원 연마액의 유동 저항 구조를 갖는 연마용 패드
WO2020242110A1 (ko) * 2019-05-29 2020-12-03 한국생산기술연구원 연마면에 형성된 패턴 구조를 갖는 연마 패드, 이를 포함하는 연마 장치 및 연마 패드의 제조 방법
WO2020242172A1 (ko) * 2019-05-29 2020-12-03 한국생산기술연구원 패턴구조를 갖는 화학기계적 연마용 패드
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
US11833638B2 (en) * 2020-03-25 2023-12-05 Rohm and Haas Electronic Materials Holding, Inc. CMP polishing pad with polishing elements on supports
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies

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US4314827A (en) * 1979-06-29 1982-02-09 Minnesota Mining And Manufacturing Company Non-fused aluminum oxide-based abrasive mineral
US4623364A (en) * 1984-03-23 1986-11-18 Norton Company Abrasive material and method for preparing the same
CA1254238A (en) * 1985-04-30 1989-05-16 Alvin P. Gerk Process for durable sol-gel produced alumina-based ceramics, abrasive grain and abrasive products
US4652275A (en) * 1985-08-07 1987-03-24 Minnesota Mining And Manufacturing Company Erodable agglomerates and abrasive products containing the same
US4770671A (en) * 1985-12-30 1988-09-13 Minnesota Mining And Manufacturing Company Abrasive grits formed of ceramic containing oxides of aluminum and yttrium, method of making and using the same and products made therewith
US4799939A (en) * 1987-02-26 1989-01-24 Minnesota Mining And Manufacturing Company Erodable agglomerates and abrasive products containing the same
US4881951A (en) * 1987-05-27 1989-11-21 Minnesota Mining And Manufacturing Co. Abrasive grits formed of ceramic containing oxides of aluminum and rare earth metal, method of making and products made therewith
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US5177908A (en) 1990-01-22 1993-01-12 Micron Technology, Inc. Polishing pad
US5152917B1 (en) * 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5437754A (en) * 1992-01-13 1995-08-01 Minnesota Mining And Manufacturing Company Abrasive article having precise lateral spacing between abrasive composite members
US6022264A (en) 1997-02-10 2000-02-08 Rodel Inc. Polishing pad and methods relating thereto
US5435816A (en) * 1993-01-14 1995-07-25 Minnesota Mining And Manufacturing Company Method of making an abrasive article
US5549962A (en) * 1993-06-30 1996-08-27 Minnesota Mining And Manufacturing Company Precisely shaped particles and method of making the same
US5454844A (en) * 1993-10-29 1995-10-03 Minnesota Mining And Manufacturing Company Abrasive article, a process of making same, and a method of using same to finish a workpiece surface
US5391210A (en) * 1993-12-16 1995-02-21 Minnesota Mining And Manufacturing Company Abrasive article
AU686335B2 (en) 1994-02-22 1998-02-05 Minnesota Mining And Manufacturing Company Abrasive article, a method of making same, and a method of using same for finishing
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
JP3843545B2 (ja) * 1996-07-31 2006-11-08 東ソー株式会社 研磨用成形体、それを用いた研磨用定盤及び研磨方法
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US6224465B1 (en) 1997-06-26 2001-05-01 Stuart L. Meyer Methods and apparatus for chemical mechanical planarization using a microreplicated surface
JPH1148128A (ja) 1997-08-07 1999-02-23 Asahi Glass Co Ltd 研磨パッド及びこれを用いた板状材の研磨方法
US5888121A (en) 1997-09-23 1999-03-30 Lsi Logic Corporation Controlling groove dimensions for enhanced slurry flow
JP3056714B2 (ja) * 1997-10-06 2000-06-26 松下電子工業株式会社 半導体基板の研磨方法
US6299508B1 (en) * 1998-08-05 2001-10-09 3M Innovative Properties Company Abrasive article with integrally molded front surface protrusions containing a grinding aid and methods of making and using
JP2000301450A (ja) * 1999-04-19 2000-10-31 Rohm Co Ltd Ｃｍｐ研磨パッドおよびそれを用いたｃｍｐ処理装置
US6234875B1 (en) * 1999-06-09 2001-05-22 3M Innovative Properties Company Method of modifying a surface
US6390891B1 (en) * 2000-04-26 2002-05-21 Speedfam-Ipec Corporation Method and apparatus for improved stability chemical mechanical polishing

Also Published As

Publication number Publication date
US6612916B2 (en) 2003-09-02
DE60106084D1 (de) 2004-11-04
KR100777846B1 (ko) 2007-11-21
KR20030068576A (ko) 2003-08-21
TW526554B (en) 2003-04-01
WO2002053324A1 (en) 2002-07-11
US20020151253A1 (en) 2002-10-17
JP2004517480A (ja) 2004-06-10
CN1486233A (zh) 2004-03-31
US6817926B2 (en) 2004-11-16
JP4933716B2 (ja) 2012-05-16
EP1349705B1 (de) 2004-09-29
EP1349705A1 (de) 2003-10-08
CN1217769C (zh) 2005-09-07
US20030199235A1 (en) 2003-10-23
DE60106084T2 (de) 2005-10-13

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties