ATE341832T1 - Ono-abscheidung für 2-bit eeprom-bauelemente - Google Patents

Ono-abscheidung für 2-bit eeprom-bauelemente

Info

Publication number
ATE341832T1
ATE341832T1 AT00970962T AT00970962T ATE341832T1 AT E341832 T1 ATE341832 T1 AT E341832T1 AT 00970962 T AT00970962 T AT 00970962T AT 00970962 T AT00970962 T AT 00970962T AT E341832 T1 ATE341832 T1 AT E341832T1
Authority
AT
Austria
Prior art keywords
formation
oxide layer
top oxide
hto
bit eeprom
Prior art date
Application number
AT00970962T
Other languages
English (en)
Inventor
Arvind Halliyal
Robert B Ogle
Hideki Komori
Kenneth Au
Original Assignee
Spansion Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Spansion Llc filed Critical Spansion Llc
Application granted granted Critical
Publication of ATE341832T1 publication Critical patent/ATE341832T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
    • H01L29/7923—Programmable transistors with more than two possible different levels of programmation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40117—Multistep manufacturing processes for data storage electrodes the electrodes comprising a charge-trapping insulator

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
  • Formation Of Insulating Films (AREA)
  • Medicines Containing Plant Substances (AREA)
AT00970962T 1999-10-25 2000-10-16 Ono-abscheidung für 2-bit eeprom-bauelemente ATE341832T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/426,672 US6265268B1 (en) 1999-10-25 1999-10-25 High temperature oxide deposition process for fabricating an ONO floating-gate electrode in a two bit EEPROM device

Publications (1)

Publication Number Publication Date
ATE341832T1 true ATE341832T1 (de) 2006-10-15

Family

ID=23691746

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00970962T ATE341832T1 (de) 1999-10-25 2000-10-16 Ono-abscheidung für 2-bit eeprom-bauelemente

Country Status (9)

Country Link
US (1) US6265268B1 (de)
EP (1) EP1234324B1 (de)
JP (1) JP4907815B2 (de)
KR (1) KR100784472B1 (de)
CN (1) CN100447953C (de)
AT (1) ATE341832T1 (de)
DE (1) DE60031155T2 (de)
TW (1) TW523815B (de)
WO (1) WO2001031695A1 (de)

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US6559014B1 (en) 2001-10-15 2003-05-06 Advanced Micro Devices, Inc. Preparation of composite high-K / standard-K dielectrics for semiconductor devices
US7115469B1 (en) 2001-12-17 2006-10-03 Spansion, Llc Integrated ONO processing for semiconductor devices using in-situ steam generation (ISSG) process
US6790755B2 (en) 2001-12-27 2004-09-14 Advanced Micro Devices, Inc. Preparation of stack high-K gate dielectrics with nitrided layer
KR100426488B1 (ko) * 2001-12-29 2004-04-14 주식회사 하이닉스반도체 플래시 메모리 셀과 그 제조 방법 및 프로그램/소거/독출방법
US7031196B2 (en) * 2002-03-29 2006-04-18 Macronix International Co., Ltd. Nonvolatile semiconductor memory and operating method of the memory
US7094707B1 (en) * 2002-05-13 2006-08-22 Cypress Semiconductor Corporation Method of forming nitrided oxide in a hot wall single wafer furnace
US6917544B2 (en) 2002-07-10 2005-07-12 Saifun Semiconductors Ltd. Multiple use memory chip
US7136304B2 (en) 2002-10-29 2006-11-14 Saifun Semiconductor Ltd Method, system and circuit for programming a non-volatile memory array
US6885590B1 (en) * 2003-01-14 2005-04-26 Advanced Micro Devices, Inc. Memory device having A P+ gate and thin bottom oxide and method of erasing same
US6912163B2 (en) * 2003-01-14 2005-06-28 Fasl, Llc Memory device having high work function gate and method of erasing same
US7178004B2 (en) 2003-01-31 2007-02-13 Yan Polansky Memory array programming circuit and a method for using the circuit
US6822284B2 (en) * 2003-04-16 2004-11-23 Macronix International Co., Ltd. ONO dielectric for memory cells
CN1316574C (zh) * 2003-06-11 2007-05-16 旺宏电子股份有限公司 Ono介电质及其制造方法
JP4449374B2 (ja) * 2003-09-04 2010-04-14 株式会社日立製作所 半導体装置
US7164177B2 (en) * 2004-01-02 2007-01-16 Powerchip Semiconductor Corp. Multi-level memory cell
EP1553635A1 (de) * 2004-01-08 2005-07-13 Macronix International Co., Ltd. Nichtflüchtiger Halbleiterspeicher und Betriebsverfahren des Speichers
US7390718B2 (en) * 2004-02-20 2008-06-24 Tower Semiconductor Ltd. SONOS embedded memory with CVD dielectric
KR100525448B1 (ko) * 2004-04-30 2005-11-02 동부아남반도체 주식회사 플래시 메모리 소자의 제조 방법
KR100596484B1 (ko) * 2004-05-31 2006-07-03 삼성전자주식회사 유전막 형성 방법 및 이를 이용한 불휘발성 메모리 장치의제조방법
US7518179B2 (en) 2004-10-08 2009-04-14 Freescale Semiconductor, Inc. Virtual ground memory array and method therefor
US7638850B2 (en) 2004-10-14 2009-12-29 Saifun Semiconductors Ltd. Non-volatile memory structure and method of fabrication
CN100382282C (zh) * 2004-10-20 2008-04-16 力晶半导体股份有限公司 非挥发性存储单元的制作方法
US8053812B2 (en) 2005-03-17 2011-11-08 Spansion Israel Ltd Contact in planar NROM technology
US7804126B2 (en) 2005-07-18 2010-09-28 Saifun Semiconductors Ltd. Dense non-volatile memory array and method of fabrication
US7394686B2 (en) * 2005-07-25 2008-07-01 Freescale Semiconductor, Inc. Programmable structure including discontinuous storage elements and spacer control gates in a trench
US7642594B2 (en) * 2005-07-25 2010-01-05 Freescale Semiconductor, Inc Electronic device including gate lines, bit lines, or a combination thereof
US7619270B2 (en) * 2005-07-25 2009-11-17 Freescale Semiconductor, Inc. Electronic device including discontinuous storage elements
US7256454B2 (en) * 2005-07-25 2007-08-14 Freescale Semiconductor, Inc Electronic device including discontinuous storage elements and a process for forming the same
US7262997B2 (en) * 2005-07-25 2007-08-28 Freescale Semiconductor, Inc. Process for operating an electronic device including a memory array and conductive lines
US7285819B2 (en) * 2005-07-25 2007-10-23 Freescale Semiconductor, Inc. Nonvolatile storage array with continuous control gate employing hot carrier injection programming
US7582929B2 (en) * 2005-07-25 2009-09-01 Freescale Semiconductor, Inc Electronic device including discontinuous storage elements
US7619275B2 (en) * 2005-07-25 2009-11-17 Freescale Semiconductor, Inc. Process for forming an electronic device including discontinuous storage elements
US7314798B2 (en) * 2005-07-25 2008-01-01 Freescale Semiconductor, Inc. Method of fabricating a nonvolatile storage array with continuous control gate employing hot carrier injection programming
US20070020840A1 (en) * 2005-07-25 2007-01-25 Freescale Semiconductor, Inc. Programmable structure including nanocrystal storage elements in a trench
US7112490B1 (en) * 2005-07-25 2006-09-26 Freescale Semiconductor, Inc. Hot carrier injection programmable structure including discontinuous storage elements and spacer control gates in a trench
US7250340B2 (en) * 2005-07-25 2007-07-31 Freescale Semiconductor, Inc. Method of fabricating programmable structure including discontinuous storage elements and spacer control gates in a trench
US7668017B2 (en) 2005-08-17 2010-02-23 Saifun Semiconductors Ltd. Method of erasing non-volatile memory cells
US20070048936A1 (en) * 2005-08-31 2007-03-01 Jongoh Kim Method for forming memory cell and periphery circuits
US7808818B2 (en) 2006-01-12 2010-10-05 Saifun Semiconductors Ltd. Secondary injection for NROM
US7760554B2 (en) 2006-02-21 2010-07-20 Saifun Semiconductors Ltd. NROM non-volatile memory and mode of operation
US7692961B2 (en) 2006-02-21 2010-04-06 Saifun Semiconductors Ltd. Method, circuit and device for disturb-control of programming nonvolatile memory cells by hot-hole injection (HHI) and by channel hot-electron (CHE) injection
US8253452B2 (en) 2006-02-21 2012-08-28 Spansion Israel Ltd Circuit and method for powering up an integrated circuit and an integrated circuit utilizing same
US7592224B2 (en) 2006-03-30 2009-09-22 Freescale Semiconductor, Inc Method of fabricating a storage device including decontinuous storage elements within and between trenches
US7701779B2 (en) 2006-04-27 2010-04-20 Sajfun Semiconductors Ltd. Method for programming a reference cell
US7838922B2 (en) * 2007-01-24 2010-11-23 Freescale Semiconductor, Inc. Electronic device including trenches and discontinuous storage elements
US7651916B2 (en) * 2007-01-24 2010-01-26 Freescale Semiconductor, Inc Electronic device including trenches and discontinuous storage elements and processes of forming and using the same
US7572699B2 (en) * 2007-01-24 2009-08-11 Freescale Semiconductor, Inc Process of forming an electronic device including fins and discontinuous storage elements
US11038033B2 (en) 2014-04-30 2021-06-15 Hewlett-Packard Development Company, L.P. Integrated circuits
US9406683B2 (en) 2014-12-04 2016-08-02 International Business Machines Corporation Wet bottling process for small diameter deep trench capacitors
US9218978B1 (en) 2015-03-09 2015-12-22 Cypress Semiconductor Corporation Method of ONO stack formation
US9824895B1 (en) 2016-09-27 2017-11-21 Cypress Semiconductor Corporation Method of integration of ONO stack formation into thick gate oxide CMOS flow
CN109003879B (zh) * 2017-06-06 2021-03-19 中芯国际集成电路制造(上海)有限公司 栅介质层的形成方法

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JPS58500683A (ja) 1981-05-11 1983-04-28 エヌ・シ−・ア−ル・コ−ポレ−シヨン 閾値変更可能半導体メモリ−装置
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US5120672A (en) * 1989-02-22 1992-06-09 Texas Instruments Incorporated Fabricating a single level merged EEPROM cell having an ONO memory stack substantially spaced from the source region
US5104819A (en) * 1989-08-07 1992-04-14 Intel Corporation Fabrication of interpoly dielctric for EPROM-related technologies
US5467308A (en) * 1994-04-05 1995-11-14 Motorola Inc. Cross-point eeprom memory array
US5619052A (en) * 1994-09-29 1997-04-08 Macronix International Co., Ltd. Interpoly dielectric structure in EEPROM device
ATE249099T1 (de) * 1995-06-16 2003-09-15 Imec Inter Uni Micro Electr Vertikale misfet-bauelemente, cmos- prozessintegration, ram-anwendungen
JPH09283642A (ja) * 1996-04-18 1997-10-31 Sony Corp Ｍｏｉｏｓ構造の形成方法
KR100255512B1 (ko) * 1996-06-29 2000-05-01 김영환 플래쉬 메모리 소자 제조방법
JP3915154B2 (ja) * 1996-12-16 2007-05-16 ソニー株式会社 半導体不揮発性記憶装置及びその製造方法
US6768165B1 (en) * 1997-08-01 2004-07-27 Saifun Semiconductors Ltd. Two bit non-volatile electrically erasable and programmable semiconductor memory cell utilizing asymmetrical charge trapping
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JPH11111871A (ja) * 1997-10-06 1999-04-23 Seiko Epson Corp 不揮発性半導体記憶装置及びその製造方法
US6074917A (en) * 1998-06-16 2000-06-13 Advanced Micro Devices, Inc. LPCVD oxide and RTA for top oxide of ONO film to improve reliability for flash memory devices
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Also Published As

Publication number Publication date
DE60031155T2 (de) 2007-07-05
CN100447953C (zh) 2008-12-31
KR20020080330A (ko) 2002-10-23
EP1234324A1 (de) 2002-08-28
WO2001031695A1 (en) 2001-05-03
TW523815B (en) 2003-03-11
KR100784472B1 (ko) 2007-12-11
US6265268B1 (en) 2001-07-24
CN1378703A (zh) 2002-11-06
JP2003513445A (ja) 2003-04-08
DE60031155D1 (de) 2006-11-16
JP4907815B2 (ja) 2012-04-04
EP1234324B1 (de) 2006-10-04

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Legal Events

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