ATE329961T1 - Elektrisch leitfähige flexible zusammensetzung, verfahren zu ihrer herstellung - Google Patents

Elektrisch leitfähige flexible zusammensetzung, verfahren zu ihrer herstellung

Info

Publication number
ATE329961T1
ATE329961T1 AT00921325T AT00921325T ATE329961T1 AT E329961 T1 ATE329961 T1 AT E329961T1 AT 00921325 T AT00921325 T AT 00921325T AT 00921325 T AT00921325 T AT 00921325T AT E329961 T1 ATE329961 T1 AT E329961T1
Authority
AT
Austria
Prior art keywords
particulate filler
composition
conductive
production
matrix
Prior art date
Application number
AT00921325T
Other languages
English (en)
Inventor
Robert A Schleifstein
Mohammad S Abuelhawa
Bruce C Zimmerman
Original Assignee
Pq Holding Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pq Holding Inc filed Critical Pq Holding Inc
Application granted granted Critical
Publication of ATE329961T1 publication Critical patent/ATE329961T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Silicon Polymers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AT00921325T 1999-02-12 2000-02-09 Elektrisch leitfähige flexible zusammensetzung, verfahren zu ihrer herstellung ATE329961T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/250,031 US6533963B1 (en) 1999-02-12 1999-02-12 Electrically conductive flexible compositions, and materials and methods for making same

Publications (1)

Publication Number Publication Date
ATE329961T1 true ATE329961T1 (de) 2006-07-15

Family

ID=22946027

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00921325T ATE329961T1 (de) 1999-02-12 2000-02-09 Elektrisch leitfähige flexible zusammensetzung, verfahren zu ihrer herstellung

Country Status (8)

Country Link
US (1) US6533963B1 (de)
EP (1) EP1163292B1 (de)
JP (1) JP2002541616A (de)
KR (1) KR100751630B1 (de)
AT (1) ATE329961T1 (de)
AU (1) AU4166700A (de)
DE (1) DE60028737T2 (de)
WO (1) WO2000047660A2 (de)

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US9142369B2 (en) 2005-03-14 2015-09-22 Qualcomm Incorporated Stack assembly for implementing keypads on mobile computing devices
US7525534B2 (en) * 2005-03-14 2009-04-28 Palm, Inc. Small form-factor keypad for mobile computing devices
KR100781667B1 (ko) * 2005-03-31 2007-12-04 엘지전자 주식회사 이동통신 단말기
CN101156219B (zh) * 2005-04-12 2011-04-20 旭硝子株式会社 油墨组合物及金属质材料
US7394030B2 (en) 2005-06-02 2008-07-01 Palm, Inc. Small form-factor keyboard using keys with offset peaks and pitch variations
KR20130090932A (ko) * 2005-06-03 2013-08-14 프레자코르, 인크. 원소 금속을 포함하는 조성물 및 그의 용도
DE102005043242A1 (de) * 2005-09-09 2007-03-15 Basf Ag Dispersion zum Aufbringen einer Metallschicht
US20070200828A1 (en) * 2006-02-27 2007-08-30 Peter Skillman Small form-factor key design for keypads of mobile computing devices
US20090311436A1 (en) * 2006-05-16 2009-12-17 Board Of Trustees Of Michigan State University Conductive composite materials with graphite coated particles
US8989822B2 (en) * 2006-09-08 2015-03-24 Qualcomm Incorporated Keypad assembly for use on a contoured surface of a mobile computing device
GB0710425D0 (en) * 2007-06-01 2007-07-11 Hexcel Composites Ltd Improved structural adhesive materials
KR100898502B1 (ko) * 2007-08-13 2009-05-20 주식회사 아이에스시테크놀러지 인테나 연결장치
US7906046B2 (en) * 2008-04-04 2011-03-15 Panduit Corp. Antioxidant joint compound and method for forming an electrical connection
CN101605447B (zh) * 2008-06-13 2012-07-25 张仁鸿 抗电磁波微粒材料
US20100059243A1 (en) * 2008-09-09 2010-03-11 Jin-Hong Chang Anti-electromagnetic interference material arrangement
US8133384B2 (en) * 2009-03-02 2012-03-13 Harris Corporation Carbon strand radio frequency heating susceptor
RU2011154465A (ru) * 2009-06-03 2013-07-20 ДжиЛТ ТЕХНОВЭЙШНЗ, ЛЛСи Материал для использования с емкостным сенсорным экраном
WO2011001910A1 (ja) * 2009-06-30 2011-01-06 東海ゴム工業株式会社 柔軟導電材料およびトランスデューサ
US8350728B2 (en) 2010-04-23 2013-01-08 Hewlett-Packard Development Company, L.P. Keyboard with integrated and numeric keypad
US8957394B2 (en) 2011-11-29 2015-02-17 Kla-Tencor Corporation Compact high-voltage electron gun
DE202012011808U1 (de) * 2012-12-10 2014-03-13 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Verbindungsvorrichtung
US10806509B2 (en) * 2012-12-27 2020-10-20 Cook Medical Technologies Llc Method of adhering a conductive coating to an adhesion-resistant outer surface
US10669436B1 (en) * 2018-11-16 2020-06-02 Conductive Composites Company Ip, Llc Multifunctional paints and caulks with controllable electromagnetic properties
KR102111920B1 (ko) * 2019-03-27 2020-05-18 베스트그래핀(주) 도전성 페이스트 조성물과 이를 이용하여 형성된 외부전극을 가지는 전자부품
JP6653854B1 (ja) * 2019-07-10 2020-02-26 宮川ローラー株式会社 導電性ゴム
JP7395413B2 (ja) * 2020-04-09 2023-12-11 株式会社東芝 超電導コイルの製造方法、および、電気機器の製造方法

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Also Published As

Publication number Publication date
EP1163292B1 (de) 2006-06-14
DE60028737T2 (de) 2007-05-24
WO2000047660A2 (en) 2000-08-17
DE60028737D1 (de) 2006-07-27
KR100751630B1 (ko) 2007-08-22
JP2002541616A (ja) 2002-12-03
EP1163292A2 (de) 2001-12-19
US6533963B1 (en) 2003-03-18
AU4166700A (en) 2000-08-29
WO2000047660A3 (en) 2000-11-30
KR20010102079A (ko) 2001-11-15

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