ATE304185T1 - Laser-strahlführungssystem mit bohr-modul - Google Patents

Laser-strahlführungssystem mit bohr-modul

Info

Publication number
ATE304185T1
ATE304185T1 AT02254124T AT02254124T ATE304185T1 AT E304185 T1 ATE304185 T1 AT E304185T1 AT 02254124 T AT02254124 T AT 02254124T AT 02254124 T AT02254124 T AT 02254124T AT E304185 T1 ATE304185 T1 AT E304185T1
Authority
AT
Austria
Prior art keywords
laser beam
positioning device
beams
laser beams
converging
Prior art date
Application number
AT02254124T
Other languages
English (en)
Inventor
Todd E Lizotte
Orest Ohar
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Application granted granted Critical
Publication of ATE304185T1 publication Critical patent/ATE304185T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G02B26/123—Multibeam scanners, e.g. using multiple light sources or beam splitters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/106—Beam splitting or combining systems for splitting or combining a plurality of identical beams or images, e.g. image replication
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/1086—Beam splitting or combining systems operating by diffraction only
    • G02B27/1093—Beam splitting or combining systems operating by diffraction only for use with monochromatic radiation only, e.g. devices for splitting a single laser source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/144—Beam splitting or combining systems operating by reflection only using partially transparent surfaces without spectral selectivity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/145—Beam splitting or combining systems operating by reflection only having sequential partially reflecting surfaces
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/32—Holograms used as optical elements

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Lenses (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Holo Graphy (AREA)
  • Lasers (AREA)
AT02254124T 2001-06-19 2002-06-13 Laser-strahlführungssystem mit bohr-modul ATE304185T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29920501P 2001-06-19 2001-06-19
US32300501P 2001-09-18 2001-09-18

Publications (1)

Publication Number Publication Date
ATE304185T1 true ATE304185T1 (de) 2005-09-15

Family

ID=26971093

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02254124T ATE304185T1 (de) 2001-06-19 2002-06-13 Laser-strahlführungssystem mit bohr-modul

Country Status (6)

Country Link
US (1) US6804269B2 (de)
EP (1) EP1271219B1 (de)
JP (1) JP4204810B2 (de)
AT (1) ATE304185T1 (de)
DE (1) DE60205991T2 (de)
TW (1) TW550867B (de)

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4662411B2 (ja) * 2003-03-14 2011-03-30 日立ビアメカニクス株式会社 レーザ加工装置
US7057720B2 (en) 2003-06-24 2006-06-06 Corning Incorporated Optical interrogation system and method for using same
US7292333B2 (en) 2003-06-24 2007-11-06 Corning Incorporated Optical interrogation system and method for 2-D sensor arrays
US7285365B2 (en) 2004-02-13 2007-10-23 Micronic Laser Systems Ab Image enhancement for multiple exposure beams
KR100626554B1 (ko) * 2004-05-11 2006-09-21 주식회사 탑 엔지니어링 비금속재 절단장치 및 비금속재 절단시의 절단깊이 제어방법
WO2006000549A1 (de) * 2004-06-29 2006-01-05 Hitachi Via Mechanics, Ltd. Laserbearbeitungsmaschine zum bohren von löchern in ein werkstück mit einer optischen auslenkvorrichtung und einer ablenkeinheit
US7893384B2 (en) 2004-12-07 2011-02-22 Chosen Technologies, Inc. Systems and methods for laser material manipulation
US7772520B2 (en) * 2005-07-08 2010-08-10 Climax Molybdenum Company Hand-held laser cutting apparatus and method using same
JP5030512B2 (ja) * 2005-09-30 2012-09-19 日立ビアメカニクス株式会社 レーザ加工方法
KR100785050B1 (ko) * 2006-04-21 2007-12-12 에이치비전자주식회사 레이저 디스플레이 장치
FR2903923B1 (fr) * 2006-07-20 2008-09-26 Ly Son Systeme laser a noyau focal pour le travail thermique tel que le coupage, le percage, le soudage, le marquage et le traitement de surface de corps solide comme du metal.
JP5010978B2 (ja) * 2007-05-22 2012-08-29 株式会社ディスコ レーザー加工装置
CN101861228B (zh) 2007-11-14 2013-09-11 浜松光子学株式会社 激光加工装置以及激光加工方法
JP2009252892A (ja) * 2008-04-03 2009-10-29 Mitsubishi Electric Corp レーザ加工方法、プリント基板製造方法およびレーザ加工装置
CN101275818B (zh) * 2008-05-09 2011-04-20 厦门大学 全息枪瞄光路系统
DE102008029946A1 (de) * 2008-06-26 2009-12-31 Limo Patentverwaltung Gmbh & Co. Kg Scannvorrichtung für einen Laserstrahl
DE102008032751B3 (de) * 2008-07-11 2009-12-10 Innolas Systems Gmbh Laserbearbeitungsvorrichtung und Laserbearbeitungsverfahren mit Doppel- oder Mehrfachspot mittels eines Galvanoscanners
DE102008053507B4 (de) * 2008-10-28 2011-05-12 Lpkf Laser & Electronics Ag Vorrichtung zur Bearbeitung eines Werkstücks mittels Laserstrahlen
US8388609B2 (en) 2008-12-01 2013-03-05 Amo Development, Llc. System and method for multibeam scanning
AU2015201408B2 (en) * 2008-12-01 2017-04-13 Amo Development, Llc System and method for laser photoaltering a material using multi-beam scanning
US8908995B2 (en) 2009-01-12 2014-12-09 Intermec Ip Corp. Semi-automatic dimensioning with imager on a portable device
US20100243916A1 (en) * 2009-03-30 2010-09-30 Lockheed Martin Corporation Modular optical diagnostic platform for chemical and biological target diagnosis and detection
US20100295919A1 (en) * 2009-05-21 2010-11-25 Palo Alto Research Center Incorporated Multiple Integrated Multi-Beam Laser Scanning System
JP5416492B2 (ja) * 2009-06-30 2014-02-12 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板加工装置
TWI395630B (zh) * 2009-06-30 2013-05-11 Mitsuboshi Diamond Ind Co Ltd 使用雷射光之玻璃基板加工裝置
US10029331B2 (en) * 2009-09-14 2018-07-24 Preco, Inc. Multiple laser beam focusing head
US9036262B2 (en) 2011-07-13 2015-05-19 Bae Systems Information And Electronic Systems Integration Inc. Beam shaping and control apparatus
EP2564976B1 (de) 2011-09-05 2015-06-10 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Markierungsvorrichtung mit mindestens einem Gaslaser und einer Kühleinrichtung
EP2564972B1 (de) * 2011-09-05 2015-08-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Markierungsvorrichtung mith mehreren Lasern, Deflektionmitteln und Telescopikmitteln für jeden Laserstrahl
DK2565673T3 (da) 2011-09-05 2014-01-06 Alltec Angewandte Laserlicht Technologie Gmbh Indretning og fremgangsmåde til markering af et objekt ved hjælp af en laserstråle
DK2564975T3 (en) * 2011-09-05 2015-01-12 Alltec Angewandte Laserlicht Technologie Ges Mit Beschränkter Haftung Selection apparatus with a plurality of lasers and sets of deflecting agents that can be individually adjusted
EP2564973B1 (de) * 2011-09-05 2014-12-10 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Markierungsvorrichtung mit mehreren Lasern und einem Mischungsdeflektorsmittel
DK2565994T3 (en) 2011-09-05 2014-03-10 Alltec Angewandte Laserlicht Technologie Gmbh Laser device and method for marking an object
ES2544269T3 (es) * 2011-09-05 2015-08-28 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con una pluralidad de láseres de gas con tubos de resonancia y medios de deflexión ajustables individualmente
EP2565996B1 (de) 2011-09-05 2013-12-11 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Lasergerät mit Lasereinheit und Flüssigkeitsbehälter für eine Kühlvorrichtung dieser Lasereinheit
US9779546B2 (en) 2012-05-04 2017-10-03 Intermec Ip Corp. Volume dimensioning systems and methods
US10007858B2 (en) 2012-05-15 2018-06-26 Honeywell International Inc. Terminals and methods for dimensioning objects
US10321127B2 (en) 2012-08-20 2019-06-11 Intermec Ip Corp. Volume dimensioning system calibration systems and methods
US9939259B2 (en) 2012-10-04 2018-04-10 Hand Held Products, Inc. Measuring object dimensions using mobile computer
CN203265914U (zh) * 2012-10-12 2013-11-06 张立国 一种大幅面微孔高速钻孔系统
US9841311B2 (en) 2012-10-16 2017-12-12 Hand Held Products, Inc. Dimensioning system
US9080856B2 (en) 2013-03-13 2015-07-14 Intermec Ip Corp. Systems and methods for enhancing dimensioning, for example volume dimensioning
CN105163894B (zh) * 2013-04-26 2018-06-22 联合工艺公司 选择性激光熔融系统
JP2014231071A (ja) * 2013-05-29 2014-12-11 三星ダイヤモンド工業株式会社 レーザ光による基板切断装置
US10228452B2 (en) 2013-06-07 2019-03-12 Hand Held Products, Inc. Method of error correction for 3D imaging device
KR20150102180A (ko) * 2014-02-27 2015-09-07 삼성디스플레이 주식회사 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
US10760971B2 (en) * 2014-03-13 2020-09-01 National University Of Singapore Optical interference device
US9823059B2 (en) 2014-08-06 2017-11-21 Hand Held Products, Inc. Dimensioning system with guided alignment
US9779276B2 (en) 2014-10-10 2017-10-03 Hand Held Products, Inc. Depth sensor based auto-focus system for an indicia scanner
US10775165B2 (en) 2014-10-10 2020-09-15 Hand Held Products, Inc. Methods for improving the accuracy of dimensioning-system measurements
US10810715B2 (en) 2014-10-10 2020-10-20 Hand Held Products, Inc System and method for picking validation
KR101590774B1 (ko) * 2014-10-16 2016-02-19 한국생산기술연구원 단방향으로 회전하는 폴리곤미러를 구비하는 입체조형장비의 헤드장치 및 이를 이용하는 조형평면의 스캐닝방법 및 이를 이용하는 입체조형장치.
US9762793B2 (en) 2014-10-21 2017-09-12 Hand Held Products, Inc. System and method for dimensioning
US9897434B2 (en) 2014-10-21 2018-02-20 Hand Held Products, Inc. Handheld dimensioning system with measurement-conformance feedback
US9752864B2 (en) 2014-10-21 2017-09-05 Hand Held Products, Inc. Handheld dimensioning system with feedback
US10060729B2 (en) 2014-10-21 2018-08-28 Hand Held Products, Inc. Handheld dimensioner with data-quality indication
US10478918B2 (en) * 2014-11-20 2019-11-19 Zeon Corporation Method for manufacturing optical film
US9786101B2 (en) 2015-05-19 2017-10-10 Hand Held Products, Inc. Evaluating image values
US10066982B2 (en) 2015-06-16 2018-09-04 Hand Held Products, Inc. Calibrating a volume dimensioner
US9857167B2 (en) 2015-06-23 2018-01-02 Hand Held Products, Inc. Dual-projector three-dimensional scanner
US20160377414A1 (en) * 2015-06-23 2016-12-29 Hand Held Products, Inc. Optical pattern projector
US9835486B2 (en) 2015-07-07 2017-12-05 Hand Held Products, Inc. Mobile dimensioner apparatus for use in commerce
EP3118576B1 (de) 2015-07-15 2018-09-12 Hand Held Products, Inc. Mobile dimensionierungsvorrichtung mit dynamischer nist-standardkonformer genauigkeit
US20170017301A1 (en) 2015-07-16 2017-01-19 Hand Held Products, Inc. Adjusting dimensioning results using augmented reality
US10094650B2 (en) 2015-07-16 2018-10-09 Hand Held Products, Inc. Dimensioning and imaging items
US9704007B2 (en) * 2015-09-16 2017-07-11 Datalogic ADC, Inc. Illumination with wedge-shaped optical element
US10249030B2 (en) 2015-10-30 2019-04-02 Hand Held Products, Inc. Image transformation for indicia reading
US10225544B2 (en) 2015-11-19 2019-03-05 Hand Held Products, Inc. High resolution dot pattern
US10025314B2 (en) 2016-01-27 2018-07-17 Hand Held Products, Inc. Vehicle positioning and object avoidance
US10339352B2 (en) 2016-06-03 2019-07-02 Hand Held Products, Inc. Wearable metrological apparatus
US9940721B2 (en) 2016-06-10 2018-04-10 Hand Held Products, Inc. Scene change detection in a dimensioner
US10163216B2 (en) 2016-06-15 2018-12-25 Hand Held Products, Inc. Automatic mode switching in a volume dimensioner
US10909708B2 (en) 2016-12-09 2021-02-02 Hand Held Products, Inc. Calibrating a dimensioner using ratios of measurable parameters of optic ally-perceptible geometric elements
RU2650776C1 (ru) * 2016-12-26 2018-04-17 федеральное государственное автономное образовательное учреждение высшего образования "Санкт-Петербургский национальный исследовательский университет информационных технологий, механики и оптики" (Университет ИТМО) Лидарный комплекс
US11047672B2 (en) 2017-03-28 2021-06-29 Hand Held Products, Inc. System for optically dimensioning
US10733748B2 (en) 2017-07-24 2020-08-04 Hand Held Products, Inc. Dual-pattern optical 3D dimensioning
KR101943227B1 (ko) * 2017-12-26 2019-01-28 김찬삼 레이저빔의 회절을 이용하여 재질의 표면에 패턴을 형성하는 가공 장치 및 그 방법
US10584962B2 (en) 2018-05-01 2020-03-10 Hand Held Products, Inc System and method for validating physical-item security
CN109141825B (zh) * 2018-09-13 2019-07-02 西华大学 亚波长光学成像器件焦距测量装置及其测量方法
US11360218B2 (en) * 2018-09-21 2022-06-14 Aptiv Technologies Limited Wide field-of-view lidar optical assembly and system
TWI843784B (zh) * 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
CH716546A1 (fr) * 2019-08-29 2021-03-15 Haute Ecole Arc Dispositif d'usinage laser et procédé de trépanation optique.
US11639846B2 (en) 2019-09-27 2023-05-02 Honeywell International Inc. Dual-pattern optical 3D dimensioning
RU2762744C2 (ru) 2019-12-23 2021-12-22 Общество с ограниченной ответственностью "Яндекс Беспилотные Технологии" СПОСОБЫ И СИСТЕМЫ ОБНАРУЖЕНИЯ С ПОМОЩЬЮ ЛИДАРА (LiDAR) С ВОЛОКОННО-ОПТИЧЕСКОЙ МАТРИЦЕЙ
RU2762618C2 (ru) 2019-12-23 2021-12-21 Общество с ограниченной ответственностью "Яндекс Беспилотные Технологии" ЛИДАРНАЯ (LiDAR) СИСТЕМА ДЛЯ ОБНАРУЖЕНИЯ ОБЪЕКТОВ В ИНТЕРЕСУЮЩЕЙ ОБЛАСТИ И СПОСОБ НА ЕЕ ОСНОВЕ
RU2724240C1 (ru) * 2019-12-30 2020-06-22 Акционерное общество "Корпорация космических систем специального назначения "Комета" (АО "Корпорация "Комета") Способ доставки на точечную цель излучения лазерного дальномера
KR102331321B1 (ko) * 2020-02-12 2021-11-26 주식회사 이오테크닉스 가변 펄스폭 플랫 탑 레이저 장치 및 이의 동작 방법
DE102021101373A1 (de) 2021-01-22 2022-07-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Anordnung zur Lasermaterialbearbeitung
WO2023180791A1 (en) * 2022-03-25 2023-09-28 Creal Sa Light-field image projection system for time sequential generating virtual images using a single narrow band light source per color
CN118060708B (zh) * 2024-04-22 2024-08-27 深圳市圭华智能科技有限公司 一种电池激光加工设备

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02198193A (ja) 1989-01-27 1990-08-06 Hitachi Seiko Ltd プリント基板の穴明け方法
WO1992003187A1 (en) * 1990-08-22 1992-03-05 Phoenix Laser Systems, Inc. System for scanning a surgical laser beam
US5627649A (en) * 1991-10-11 1997-05-06 Ricoh Company, Ltd. Method and device for correcting a position for writing an image
JP2588281Y2 (ja) * 1992-11-25 1999-01-06 株式会社小松製作所 レーザマーキング装置
JP3235078B2 (ja) * 1993-02-24 2001-12-04 株式会社ニコン 走査露光方法、露光制御装置、走査型露光装置、及びデバイス製造方法
JP3211538B2 (ja) * 1994-01-13 2001-09-25 キヤノン株式会社 検査装置及びそれを用いた半導体デバイスの製造方法
US6268904B1 (en) * 1997-04-23 2001-07-31 Nikon Corporation Optical exposure apparatus and photo-cleaning method
JP3937580B2 (ja) * 1998-04-30 2007-06-27 キヤノン株式会社 投影露光装置及びそれを用いたデバイスの製造方法
EP1043110B1 (de) * 1999-04-02 2006-08-23 Murata Manufacturing Co., Ltd. Laserverfahren zur Bearbeitung von Löchern in einer keramischen Grünfolie
TW482705B (en) 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
US6791060B2 (en) * 1999-05-28 2004-09-14 Electro Scientific Industries, Inc. Beam shaping and projection imaging with solid state UV gaussian beam to form vias
US6392742B1 (en) * 1999-06-01 2002-05-21 Canon Kabushiki Kaisha Illumination system and projection exposure apparatus
JP3346374B2 (ja) * 1999-06-23 2002-11-18 住友電気工業株式会社 レーザ穴開け加工装置
US6653593B2 (en) * 1999-10-08 2003-11-25 Nanovia, Lp Control system for ablating high-density array of vias or indentation in surface of object
JP3479878B2 (ja) * 2000-03-27 2003-12-15 住友重機械工業株式会社 レーザ加工方法及び加工装置
WO2001074529A2 (en) 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
US6696008B2 (en) 2000-05-25 2004-02-24 Westar Photonics Inc. Maskless laser beam patterning ablation of multilayered structures with continuous monitoring of ablation
US6585903B1 (en) 2000-09-06 2003-07-01 Visteon Global Tech. Inc. Electrical circuit board and a method for making the same
TW503143B (en) 2000-10-06 2002-09-21 Hitachi Via Mechanics Ltd Method and apparatus for drilling printed wiring boards
DE10125397B4 (de) 2001-05-23 2005-03-03 Siemens Ag Verfahren zum Bohren von Mikrolöchern mit einem Laserstrahl

Also Published As

Publication number Publication date
US6804269B2 (en) 2004-10-12
EP1271219B1 (de) 2005-09-07
EP1271219A1 (de) 2003-01-02
JP4204810B2 (ja) 2009-01-07
US20020196534A1 (en) 2002-12-26
JP2003117675A (ja) 2003-04-23
DE60205991T2 (de) 2006-07-13
TW550867B (en) 2003-09-01
DE60205991D1 (de) 2005-10-13

Similar Documents

Publication Publication Date Title
ATE304185T1 (de) Laser-strahlführungssystem mit bohr-modul
US7413311B2 (en) Speckle reduction in laser illuminated projection displays having a one-dimensional spatial light modulator
WO2007011361A3 (en) Laser spark delivery system with optional integrated optical diagnostics
EP1333308A3 (de) Kompaktes Beleuchtungssystem und damit versehene Projektionsanzeigevorrichtung
WO2002073245A3 (en) High power incoherent light source with laser array
ATE190733T1 (de) Hochleistungs-lichtquelle
FI923588A (fi) Solid state laserdiodljuskaella.
WO2007061515A3 (en) Vertically displaced stack of multi-mode single emitter laser diodes
WO2002082148A3 (de) Optisches oder optoelektronisches modul
SE0200568L (sv) Anordning och förfarande för smältskarvning av ändar av två optiska fibrer
WO2005079194A3 (en) Optical beam translation device and method utilizing a pivoting optical fiber
DK1138642T3 (da) Laserfotohærdesystem
WO2011043682A3 (en) Method and device for coupling laser light derived from at least two laser sources into one optical fiber
EP1555662A3 (de) Lasermodul mit zwei Wellenlängen und optischer Abtastkopfanordnung
JP2009229266A (ja) ワークのエッジ検出装置及びレーザー加工方法及び装置
DE60011277D1 (de) Lichtwellenleiter und herstellungsverfahren
EP1302009A4 (de) Lichtstrahl-kombinator
DE60042411D1 (de) Lasermodul zum Lesen optischer Codes
SE8700469L (sv) Inriktningsanordning for en ljuskella som utsender icke synligt laserljus
KR101057458B1 (ko) 드릴링 장치 및 드릴링 방법
KR101036878B1 (ko) 드릴링 장치 및 드릴링 방법
CN112073699B (zh) 投影系统及其投影方法
JP6183544B2 (ja) レーザダイオードの駆動回路及びレーザ装置
ATE310258T1 (de) Schmalbandiger uv laser mit justierlaser im sichtbaren bereich
KR101057457B1 (ko) 드릴링 장치 및 드릴링 방법

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties