ATE281000T1 - Verfahren und gerät zur stabilisierung eines plasmas - Google Patents
Verfahren und gerät zur stabilisierung eines plasmasInfo
- Publication number
- ATE281000T1 ATE281000T1 AT00919057T AT00919057T ATE281000T1 AT E281000 T1 ATE281000 T1 AT E281000T1 AT 00919057 T AT00919057 T AT 00919057T AT 00919057 T AT00919057 T AT 00919057T AT E281000 T1 ATE281000 T1 AT E281000T1
- Authority
- AT
- Austria
- Prior art keywords
- plasma
- steps
- chamber
- impedance
- workpiece
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
- H01L21/30655—Plasma etching; Reactive-ion etching comprising alternated and repeated etching and passivation steps, e.g. Bosch process
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9908374.3A GB9908374D0 (en) | 1999-04-14 | 1999-04-14 | Method and apparatus for stabilising a plasma |
GBGB9914689.6A GB9914689D0 (en) | 1999-06-24 | 1999-06-24 | Method and apparatus for stabilising a plasma |
PCT/GB2000/001383 WO2000062328A1 (en) | 1999-04-14 | 2000-04-12 | Method and apparatus for stabilising a plasma |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE281000T1 true ATE281000T1 (de) | 2004-11-15 |
Family
ID=26315409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00919057T ATE281000T1 (de) | 1999-04-14 | 2000-04-12 | Verfahren und gerät zur stabilisierung eines plasmas |
Country Status (7)
Country | Link |
---|---|
US (1) | US7306745B1 (de) |
EP (1) | EP1088329B1 (de) |
JP (1) | JP4865948B2 (de) |
KR (1) | KR100738141B1 (de) |
AT (1) | ATE281000T1 (de) |
DE (1) | DE60015270T2 (de) |
WO (1) | WO2000062328A1 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19927806A1 (de) | 1999-06-18 | 2001-01-04 | Bosch Gmbh Robert | Vorrichtung und Verfahren zum Hochratenätzen eines Substrates mit einer Plasmaätzanlage und Vorrichtung und Verfahren zum Zünden eines Plasmas und Hochregeln oder Pulsen der Plasmaleistung |
JP3555084B2 (ja) * | 2001-06-11 | 2004-08-18 | Necエレクトロニクス株式会社 | 半導体基板に対するプラズマ処理方法及び半導体基板のためのプラズマ処理装置 |
FR2842387B1 (fr) * | 2002-07-11 | 2005-07-08 | Cit Alcatel | Chemisage chauffant pour reacteur de gravure plasma, procede de gravure pour sa mise en oeuvre |
US6924235B2 (en) | 2002-08-16 | 2005-08-02 | Unaxis Usa Inc. | Sidewall smoothing in high aspect ratio/deep etching using a discrete gas switching method |
US7115520B2 (en) * | 2003-04-07 | 2006-10-03 | Unaxis Usa, Inc. | Method and apparatus for process control in time division multiplexed (TDM) etch process |
US7381650B2 (en) * | 2003-04-07 | 2008-06-03 | Unaxis Usa Inc. | Method and apparatus for process control in time division multiplexed (TDM) etch processes |
JP4512533B2 (ja) | 2005-07-27 | 2010-07-28 | 住友精密工業株式会社 | エッチング方法及びエッチング装置 |
WO2007031778A1 (en) * | 2005-09-16 | 2007-03-22 | Aviza Technology Limited | A method of etching a feature in a silicone substrate |
JP4145925B2 (ja) * | 2006-01-31 | 2008-09-03 | シャープ株式会社 | プラズマエッチング方法 |
JP2008118017A (ja) * | 2006-11-07 | 2008-05-22 | Hitachi High-Technologies Corp | プラズマ処理方法および処理装置 |
US8502455B2 (en) | 2009-05-29 | 2013-08-06 | Agilent Technologies, Inc. | Atmospheric inductively coupled plasma generator |
US8936703B2 (en) | 2009-08-31 | 2015-01-20 | Semicat, Inc. | Methods to fabricate non-metal films on semiconductor substrates using physical vapor deposition |
US8956516B2 (en) * | 2009-08-31 | 2015-02-17 | Semicat, Inc. | System and apparatus to facilitate physical vapor deposition to modify non-metal films on semiconductor substrates |
BR112012006823A2 (pt) * | 2009-09-30 | 2019-09-24 | Koninl Philips Electronics Nv | disposição de concentração de gás, sistema de concentração de gás e bomba de gás para bombeamento de gás |
JP6043046B2 (ja) * | 2010-08-12 | 2016-12-14 | 東京エレクトロン株式会社 | エッチングガスの供給方法及びエッチング装置 |
US8609548B2 (en) | 2011-06-06 | 2013-12-17 | Lam Research Corporation | Method for providing high etch rate |
US8828259B2 (en) * | 2011-07-07 | 2014-09-09 | Lam Research Corporation | Methods for automatically determining capacitor values and systems thereof |
DE102013014147B4 (de) * | 2013-08-23 | 2017-02-16 | Centrotherm Photovoltaics Ag | Verfahren und vorrichtung zum detektieren einer plasmazündung |
CN104425208B (zh) * | 2013-09-11 | 2018-01-19 | 北京北方华创微电子装备有限公司 | 一种阻抗匹配方法 |
JP6334369B2 (ja) * | 2014-11-11 | 2018-05-30 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置およびプラズマ処理方法 |
JP6603586B2 (ja) * | 2016-01-19 | 2019-11-06 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
CN114188204B (zh) * | 2020-09-14 | 2023-10-31 | 中微半导体设备(上海)股份有限公司 | 一种等离子体处理方法、射频发生器以及装置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3569777A (en) * | 1969-07-28 | 1971-03-09 | Int Plasma Corp | Impedance matching network for plasma-generating apparatus |
KR900007687B1 (ko) * | 1986-10-17 | 1990-10-18 | 가부시기가이샤 히다찌세이사꾸쇼 | 플라즈마처리방법 및 장치 |
JP2918892B2 (ja) * | 1988-10-14 | 1999-07-12 | 株式会社日立製作所 | プラズマエッチング処理方法 |
JPH03224226A (ja) * | 1989-10-18 | 1991-10-03 | Matsushita Electric Ind Co Ltd | プラズマ加工方法およびそれに用いる装置 |
JPH05205898A (ja) * | 1991-07-24 | 1993-08-13 | Tokyo Electron Yamanashi Kk | プラズマ処理装置 |
JP3067375B2 (ja) * | 1992-03-27 | 2000-07-17 | 松下電器産業株式会社 | プラズマ加工装置及びプラズマ加工方法 |
DE4241045C1 (de) * | 1992-12-05 | 1994-05-26 | Bosch Gmbh Robert | Verfahren zum anisotropen Ätzen von Silicium |
US5414324A (en) * | 1993-05-28 | 1995-05-09 | The University Of Tennessee Research Corporation | One atmosphere, uniform glow discharge plasma |
JP3223661B2 (ja) * | 1993-08-31 | 2001-10-29 | ソニー株式会社 | プラズマ堆積方法 |
JPH07161493A (ja) | 1993-12-08 | 1995-06-23 | Fujitsu Ltd | プラズマ発生装置及び方法 |
US5424691A (en) * | 1994-02-03 | 1995-06-13 | Sadinsky; Samuel | Apparatus and method for electronically controlled admittance matching network |
US5688357A (en) * | 1995-02-15 | 1997-11-18 | Applied Materials, Inc. | Automatic frequency tuning of an RF power source of an inductively coupled plasma reactor |
US5793162A (en) | 1995-12-29 | 1998-08-11 | Lam Research Corporation | Apparatus for controlling matching network of a vacuum plasma processor and memory for same |
GB9616225D0 (en) * | 1996-08-01 | 1996-09-11 | Surface Tech Sys Ltd | Method of surface treatment of semiconductor substrates |
US5783282A (en) * | 1996-10-07 | 1998-07-21 | Micron Technology, Inc. | Resputtering to achieve better step coverage of contact holes |
US6174450B1 (en) | 1997-04-16 | 2001-01-16 | Lam Research Corporation | Methods and apparatus for controlling ion energy and plasma density in a plasma processing system |
JP3630982B2 (ja) * | 1997-05-22 | 2005-03-23 | キヤノン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
DE19730644C1 (de) * | 1997-07-17 | 1998-11-19 | Bosch Gmbh Robert | Verfahren zum Erkennen des Übergangs unterschiedlicher Materialien in Halbleiterstrukturen bei einer anisotropen Tiefenätzung |
US6187685B1 (en) * | 1997-08-01 | 2001-02-13 | Surface Technology Systems Limited | Method and apparatus for etching a substrate |
US6194038B1 (en) * | 1998-03-20 | 2001-02-27 | Applied Materials, Inc. | Method for deposition of a conformal layer on a substrate |
-
2000
- 2000-04-12 KR KR1020007013299A patent/KR100738141B1/ko active IP Right Grant
- 2000-04-12 WO PCT/GB2000/001383 patent/WO2000062328A1/en active IP Right Grant
- 2000-04-12 JP JP2000611304A patent/JP4865948B2/ja not_active Expired - Lifetime
- 2000-04-12 EP EP00919057A patent/EP1088329B1/de not_active Expired - Lifetime
- 2000-04-12 US US09/674,925 patent/US7306745B1/en not_active Expired - Lifetime
- 2000-04-12 DE DE60015270T patent/DE60015270T2/de not_active Expired - Lifetime
- 2000-04-12 AT AT00919057T patent/ATE281000T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE60015270T2 (de) | 2006-02-09 |
WO2000062328A1 (en) | 2000-10-19 |
KR20010043839A (ko) | 2001-05-25 |
JP4865948B2 (ja) | 2012-02-01 |
EP1088329B1 (de) | 2004-10-27 |
KR100738141B1 (ko) | 2007-07-10 |
JP2002541677A (ja) | 2002-12-03 |
EP1088329A1 (de) | 2001-04-04 |
DE60015270D1 (de) | 2004-12-02 |
US7306745B1 (en) | 2007-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |