ATE251800T1 - Hubstift aus formgedächtnislegierung für eine anlage zur behandlung von halbleitern - Google Patents

Hubstift aus formgedächtnislegierung für eine anlage zur behandlung von halbleitern

Info

Publication number
ATE251800T1
ATE251800T1 AT96944410T AT96944410T ATE251800T1 AT E251800 T1 ATE251800 T1 AT E251800T1 AT 96944410 T AT96944410 T AT 96944410T AT 96944410 T AT96944410 T AT 96944410T AT E251800 T1 ATE251800 T1 AT E251800T1
Authority
AT
Austria
Prior art keywords
lift pins
shape memory
memory alloy
lifting pin
pin made
Prior art date
Application number
AT96944410T
Other languages
German (de)
English (en)
Inventor
Paul Kevin Shufflebotham
Christopher Griffin
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE251800T1 publication Critical patent/ATE251800T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/914—Differential etching apparatus including particular materials of construction

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT96944410T 1995-12-22 1996-12-18 Hubstift aus formgedächtnislegierung für eine anlage zur behandlung von halbleitern ATE251800T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/577,520 US5669977A (en) 1995-12-22 1995-12-22 Shape memory alloy lift pins for semiconductor processing equipment
PCT/US1996/020028 WO1997023899A1 (en) 1995-12-22 1996-12-18 Shape memory alloy lift pins for semiconductor processing equipment

Publications (1)

Publication Number Publication Date
ATE251800T1 true ATE251800T1 (de) 2003-10-15

Family

ID=24309090

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96944410T ATE251800T1 (de) 1995-12-22 1996-12-18 Hubstift aus formgedächtnislegierung für eine anlage zur behandlung von halbleitern

Country Status (8)

Country Link
US (1) US5669977A (enExample)
EP (1) EP0868741B1 (enExample)
JP (1) JP2000502508A (enExample)
KR (1) KR100461996B1 (enExample)
CN (1) CN1209216A (enExample)
AT (1) ATE251800T1 (enExample)
DE (1) DE69630314T2 (enExample)
WO (1) WO1997023899A1 (enExample)

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JP3028462B2 (ja) * 1995-05-12 2000-04-04 東京エレクトロン株式会社 熱処理装置
US5885353A (en) 1996-06-21 1999-03-23 Micron Technology, Inc. Thermal conditioning apparatus
US5848670A (en) * 1996-12-04 1998-12-15 Applied Materials, Inc. Lift pin guidance apparatus
US6168668B1 (en) * 1998-11-25 2001-01-02 Applied Materials, Inc. Shadow ring and guide for supporting the shadow ring in a chamber
JP2000223549A (ja) * 1999-01-29 2000-08-11 Canon Inc 基板搬送装置、基板搬送方法、基板搬送用ハンド機構、灰化処理装置及び灰化処理方法
US6236300B1 (en) 1999-03-26 2001-05-22 R. Sjhon Minners Bistable micro-switch and method of manufacturing the same
US6958098B2 (en) * 2000-02-28 2005-10-25 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
US6572708B2 (en) * 2000-02-28 2003-06-03 Applied Materials Inc. Semiconductor wafer support lift-pin assembly
US6640432B1 (en) * 2000-04-12 2003-11-04 Formfactor, Inc. Method of fabricating shaped springs
US7324635B2 (en) 2000-05-04 2008-01-29 Telemaze Llc Branch calling and caller ID based call routing telephone features
US6422010B1 (en) * 2000-06-11 2002-07-23 Nitinol Technologies, Inc. Manufacturing of Nitinol parts and forms
KR100769826B1 (ko) * 2001-05-22 2007-10-23 엘지.필립스 엘시디 주식회사 리프터핀 유닛
TW588403B (en) * 2001-06-25 2004-05-21 Tokyo Electron Ltd Substrate treating device and substrate treating method
DE10134513A1 (de) * 2001-07-16 2003-01-30 Unaxis Balzers Ag Hebe-und Stützvorichtung
DE10232478A1 (de) * 2002-07-17 2004-02-12 Infineon Technologies Ag Waferhubvorrichtung
US6779963B2 (en) * 2002-11-21 2004-08-24 General Electric Company Apparatus and method to control force exerted on steam turbines by inlet pipes
EP1475670B1 (en) * 2003-05-09 2008-10-29 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1475667A1 (en) * 2003-05-09 2004-11-10 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100808374B1 (ko) * 2003-12-27 2008-02-27 동부일렉트로닉스 주식회사 반도체 제조설비의 포토레지스트 경화장치
CN100371783C (zh) * 2005-01-27 2008-02-27 中华映管股份有限公司 反应室的顶升栓装置
US7744730B2 (en) * 2005-04-14 2010-06-29 Tango Systems, Inc. Rotating pallet in sputtering system
WO2007062199A2 (en) * 2005-11-23 2007-05-31 Materials And Technologies Corporation Device and method for holding a substrate
US7867176B2 (en) * 2005-12-27 2011-01-11 Cordis Corporation Variable stiffness guidewire
US7785317B2 (en) 2006-03-29 2010-08-31 Codman & Shurtleff, Inc. Joined metal tubing and method of manufacture
US8690938B2 (en) * 2006-05-26 2014-04-08 DePuy Synthes Products, LLC Occlusion device combination of stent and mesh with diamond-shaped porosity
US8118859B2 (en) * 2006-05-26 2012-02-21 Codman & Shurtleff, Inc. Occlusion device combination of stent and mesh having offset parallelogram porosity
US7766935B2 (en) 2006-06-12 2010-08-03 Codman & Shurtleff, Inc. Modified headpiece for hydraulic coil deployment system
US7670353B2 (en) * 2006-06-12 2010-03-02 Codman & Shurtleff, Inc. Modified headpiece for hydraulic coil deployment system
US8585732B2 (en) * 2006-06-14 2013-11-19 DePuy Synthes Products, LLC Retrieval device with sidewall grippers
TWI456683B (zh) * 2007-06-29 2014-10-11 Ulvac Inc 基板搬送機器人
WO2010009050A2 (en) * 2008-07-15 2010-01-21 Applied Materials, Inc. Substrate lift pin sensor
US8802545B2 (en) 2011-03-14 2014-08-12 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US9105705B2 (en) 2011-03-14 2015-08-11 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US8946058B2 (en) 2011-03-14 2015-02-03 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US8643313B2 (en) * 2011-12-29 2014-02-04 General Electric Company Cyclotron actuator using a shape memory alloy
CN105830208B (zh) 2013-10-30 2019-07-16 株式会社尼康 基板保持装置、曝光装置及器件制造方法
US20150203955A1 (en) * 2013-11-07 2015-07-23 Carnegie Mellon University, A Pennsylvania Non-Profit Corporation Apparatus and method for making composition spread alloy films
CN105363627A (zh) * 2015-10-09 2016-03-02 昆山希盟自动化科技有限公司 Ccd对位的loca贴合机
CN106711080A (zh) * 2015-11-16 2017-05-24 北京北方微电子基地设备工艺研究中心有限责任公司 承载装置及半导体加工设备
US10784142B2 (en) 2018-01-09 2020-09-22 Varian Semiconductor Equipment Associates, Inc. Lift pin system for wafer handling
KR102420343B1 (ko) * 2019-11-04 2022-07-14 세메스 주식회사 공정챔버
US11335585B2 (en) * 2020-05-08 2022-05-17 Taiwan Semiconductor Manufacturing Co., Ltd. Vacuum wafer chuck for manufacturing semiconductor devices
CN114864452B (zh) * 2022-05-31 2024-06-21 北京北方华创微电子装备有限公司 半导体热处理设备的冷却装置及半导体热处理设备

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JPS5816078A (ja) * 1981-07-17 1983-01-29 Toshiba Corp プラズマエツチング装置
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US4665906A (en) * 1983-10-14 1987-05-19 Raychem Corporation Medical devices incorporating sim alloy elements
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JPH0348204Y2 (enExample) * 1985-03-20 1991-10-15
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US4615755A (en) * 1985-08-07 1986-10-07 The Perkin-Elmer Corporation Wafer cooling and temperature control for a plasma etching system
US4733632A (en) * 1985-09-25 1988-03-29 Tokyo Electron Limited Wafer feeding apparatus
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JPH0665742B2 (ja) * 1987-01-08 1994-08-24 株式会社ト−キン 形状記憶ＴｉＮｉＶ合金の製造方法
US4790258A (en) * 1987-04-03 1988-12-13 Tegal Corporation Magnetically coupled wafer lift pins
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JPH06151366A (ja) * 1992-11-06 1994-05-31 Nippon Steel Corp ドライエッチング装置

Also Published As

Publication number Publication date
EP0868741B1 (en) 2003-10-08
KR100461996B1 (ko) 2005-04-08
DE69630314T2 (de) 2004-07-29
CN1209216A (zh) 1999-02-24
WO1997023899A1 (en) 1997-07-03
EP0868741A1 (en) 1998-10-07
JP2000502508A (ja) 2000-02-29
KR19990076703A (ko) 1999-10-15
US5669977A (en) 1997-09-23
DE69630314D1 (de) 2003-11-13

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties