ATE241712T1 - Verfahren und vorrichtung zum zuführen von metallionen an ein bad für das elektroplattieren von legierungen - Google Patents

Verfahren und vorrichtung zum zuführen von metallionen an ein bad für das elektroplattieren von legierungen

Info

Publication number
ATE241712T1
ATE241712T1 AT98308839T AT98308839T ATE241712T1 AT E241712 T1 ATE241712 T1 AT E241712T1 AT 98308839 T AT98308839 T AT 98308839T AT 98308839 T AT98308839 T AT 98308839T AT E241712 T1 ATE241712 T1 AT E241712T1
Authority
AT
Austria
Prior art keywords
nickel
solution
electroplating
ions
bath
Prior art date
Application number
AT98308839T
Other languages
English (en)
Inventor
Naokazu Kumagai
Original Assignee
Daiki Engineering Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiki Engineering Co filed Critical Daiki Engineering Co
Application granted granted Critical
Publication of ATE241712T1 publication Critical patent/ATE241712T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • C25D21/14Controlled addition of electrolyte components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00Chemistry: electrical and wave energy
    • Y10S204/13Purification and treatment of electroplating baths and plating wastes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
AT98308839T 1997-10-30 1998-10-28 Verfahren und vorrichtung zum zuführen von metallionen an ein bad für das elektroplattieren von legierungen ATE241712T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29848197 1997-10-30

Publications (1)

Publication Number Publication Date
ATE241712T1 true ATE241712T1 (de) 2003-06-15

Family

ID=17860267

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98308839T ATE241712T1 (de) 1997-10-30 1998-10-28 Verfahren und vorrichtung zum zuführen von metallionen an ein bad für das elektroplattieren von legierungen

Country Status (5)

Country Link
US (1) US6056862A (de)
EP (1) EP0915190B1 (de)
AT (1) ATE241712T1 (de)
DE (1) DE69815022T2 (de)
ES (1) ES2200276T3 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19932524C1 (de) * 1999-07-12 2001-03-29 Wmv App Bau Gmbh & Co Kg Verfahren und Vorrichtung zur elektrochemischen Behandlung
JP2002004076A (ja) 2000-06-16 2002-01-09 Sony Corp 電鋳装置
EP1207219A1 (de) * 2000-11-20 2002-05-22 PIRELLI PNEUMATICI S.p.A. Ausrüstung und Verfahren zum Bedecken eines metallischen Elements mit einer Kupferschicht
US20040055873A1 (en) * 2002-09-24 2004-03-25 Digital Matrix Corporation Apparatus and method for improved electroforming
US8980068B2 (en) * 2010-08-18 2015-03-17 Allen R. Hayes Nickel pH adjustment method and apparatus
CN104947173A (zh) * 2015-05-22 2015-09-30 北京中冶设备研究设计总院有限公司 一种提高连续电镀镍镀液pH值的装置与方法
CZ2023241A3 (cs) * 2023-06-21 2024-10-16 ÄŚeskĂ© vysokĂ© uÄŤenĂ­ technickĂ© v Praze Zařízení pro elektrolytickou výrobu měděných fólií

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL71231C (de) * 1948-04-22
US3474011A (en) * 1967-08-03 1969-10-21 American Bank Note Co Electroplating method and apparatus
JPH0413900A (ja) * 1990-05-08 1992-01-17 Asahi Glass Co Ltd ニッケルメッキ浴用ニッケル金属の電解溶解方法
JPH0625900A (ja) * 1992-07-13 1994-02-01 Daiso Co Ltd 電気メッキ浴用ニッケルの溶解方法

Also Published As

Publication number Publication date
DE69815022T2 (de) 2004-04-08
EP0915190A3 (de) 1999-07-28
DE69815022D1 (de) 2003-07-03
ES2200276T3 (es) 2004-03-01
US6056862A (en) 2000-05-02
EP0915190B1 (de) 2003-05-28
EP0915190A2 (de) 1999-05-12

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