DE69815022D1 - Verfahren und Vorrichtung zum Zuführen von Metallionen an ein Bad für das Elektroplattieren von Legierungen - Google Patents

Verfahren und Vorrichtung zum Zuführen von Metallionen an ein Bad für das Elektroplattieren von Legierungen

Info

Publication number
DE69815022D1
DE69815022D1 DE69815022T DE69815022T DE69815022D1 DE 69815022 D1 DE69815022 D1 DE 69815022D1 DE 69815022 T DE69815022 T DE 69815022T DE 69815022 T DE69815022 T DE 69815022T DE 69815022 D1 DE69815022 D1 DE 69815022D1
Authority
DE
Germany
Prior art keywords
nickel
electroplating
solution
ions
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69815022T
Other languages
English (en)
Other versions
DE69815022T2 (de
Inventor
Naokazu Kumagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daiki Ataka Engineering Co Ltd
Original Assignee
Daiki Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiki Engineering Co Ltd filed Critical Daiki Engineering Co Ltd
Application granted granted Critical
Publication of DE69815022D1 publication Critical patent/DE69815022D1/de
Publication of DE69815022T2 publication Critical patent/DE69815022T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • C25D21/14Controlled addition of electrolyte components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00Chemistry: electrical and wave energy
    • Y10S204/13Purification and treatment of electroplating baths and plating wastes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
DE69815022T 1997-10-30 1998-10-28 Verfahren und Vorrichtung zum Zuführen von Metallionen an ein Bad für das Elektroplattieren von Legierungen Expired - Lifetime DE69815022T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29848197 1997-10-30
JP29848197 1997-10-30

Publications (2)

Publication Number Publication Date
DE69815022D1 true DE69815022D1 (de) 2003-07-03
DE69815022T2 DE69815022T2 (de) 2004-04-08

Family

ID=17860267

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69815022T Expired - Lifetime DE69815022T2 (de) 1997-10-30 1998-10-28 Verfahren und Vorrichtung zum Zuführen von Metallionen an ein Bad für das Elektroplattieren von Legierungen

Country Status (5)

Country Link
US (1) US6056862A (de)
EP (1) EP0915190B1 (de)
AT (1) ATE241712T1 (de)
DE (1) DE69815022T2 (de)
ES (1) ES2200276T3 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19932524C1 (de) * 1999-07-12 2001-03-29 Wmv App Bau Gmbh & Co Kg Verfahren und Vorrichtung zur elektrochemischen Behandlung
JP2002004076A (ja) * 2000-06-16 2002-01-09 Sony Corp 電鋳装置
EP1207219A1 (de) * 2000-11-20 2002-05-22 PIRELLI PNEUMATICI S.p.A. Ausrüstung und Verfahren zum Bedecken eines metallischen Elements mit einer Kupferschicht
US20040055873A1 (en) * 2002-09-24 2004-03-25 Digital Matrix Corporation Apparatus and method for improved electroforming
US8980068B2 (en) * 2010-08-18 2015-03-17 Allen R. Hayes Nickel pH adjustment method and apparatus
CN104947173A (zh) * 2015-05-22 2015-09-30 北京中冶设备研究设计总院有限公司 一种提高连续电镀镍镀液pH值的装置与方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL71231C (de) * 1948-04-22
US3474011A (en) * 1967-08-03 1969-10-21 American Bank Note Co Electroplating method and apparatus
JPH0413900A (ja) * 1990-05-08 1992-01-17 Asahi Glass Co Ltd ニッケルメッキ浴用ニッケル金属の電解溶解方法
JPH0625900A (ja) * 1992-07-13 1994-02-01 Daiso Co Ltd 電気メッキ浴用ニッケルの溶解方法

Also Published As

Publication number Publication date
DE69815022T2 (de) 2004-04-08
US6056862A (en) 2000-05-02
EP0915190A2 (de) 1999-05-12
EP0915190A3 (de) 1999-07-28
ES2200276T3 (es) 2004-03-01
ATE241712T1 (de) 2003-06-15
EP0915190B1 (de) 2003-05-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: DAIKI ATAKA ENGINEERING CO., LTD., TOKIO, JP