ATE228414T1 - Verfahren und vorrichtung zum verformen von beeintigten streifen - Google Patents

Verfahren und vorrichtung zum verformen von beeintigten streifen

Info

Publication number
ATE228414T1
ATE228414T1 AT97938345T AT97938345T ATE228414T1 AT E228414 T1 ATE228414 T1 AT E228414T1 AT 97938345 T AT97938345 T AT 97938345T AT 97938345 T AT97938345 T AT 97938345T AT E228414 T1 ATE228414 T1 AT E228414T1
Authority
AT
Austria
Prior art keywords
paste
carrier plate
platen
chips
doctor blade
Prior art date
Application number
AT97938345T
Other languages
English (en)
Inventor
Douglas J Garcia
Vernon Cooke
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Application granted granted Critical
Publication of ATE228414T1 publication Critical patent/ATE228414T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coating Apparatus (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Veneer Processing And Manufacture Of Plywood (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Wire Bonding (AREA)
AT97938345T 1996-08-26 1997-08-15 Verfahren und vorrichtung zum verformen von beeintigten streifen ATE228414T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/702,900 US5753299A (en) 1996-08-26 1996-08-26 Method and apparatus for forming termination stripes
PCT/US1997/014403 WO1998008644A1 (en) 1996-08-26 1997-08-15 Method and apparatus for forming termination stripes

Publications (1)

Publication Number Publication Date
ATE228414T1 true ATE228414T1 (de) 2002-12-15

Family

ID=24823069

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97938345T ATE228414T1 (de) 1996-08-26 1997-08-15 Verfahren und vorrichtung zum verformen von beeintigten streifen

Country Status (8)

Country Link
US (1) US5753299A (de)
EP (1) EP0921887B1 (de)
JP (1) JP3469904B2 (de)
KR (1) KR100510009B1 (de)
AT (1) ATE228414T1 (de)
DE (1) DE69717464D1 (de)
TW (1) TW358966B (de)
WO (1) WO1998008644A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6960366B2 (en) * 2002-04-15 2005-11-01 Avx Corporation Plated terminations
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US7463474B2 (en) * 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US6982863B2 (en) * 2002-04-15 2006-01-03 Avx Corporation Component formation via plating technology
TWI260657B (en) * 2002-04-15 2006-08-21 Avx Corp Plated terminations
US7576968B2 (en) 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
US7177137B2 (en) * 2002-04-15 2007-02-13 Avx Corporation Plated terminations
US7378337B2 (en) * 2003-11-04 2008-05-27 Electro Scientific Industries, Inc. Laser-based termination of miniature passive electronic components
JP4220460B2 (ja) * 2004-11-30 2009-02-04 Ｔｄｋ株式会社 外部電極形成方法
JP4337762B2 (ja) * 2005-03-30 2009-09-30 ブラザー工業株式会社 接着剤塗布方法及び基板接合構造の製造方法
CN101213627B (zh) * 2005-07-08 2012-05-09 株式会社村田制作所 用于形成电子元件的外部电极的方法和装置
JP4299296B2 (ja) 2005-12-15 2009-07-22 Ｔｄｋ株式会社 外部電極形成方法
JP4188972B2 (ja) * 2006-01-16 2008-12-03 Ｔｄｋ株式会社 外部電極形成方法
JP4835686B2 (ja) * 2008-12-22 2011-12-14 Ｔｄｋ株式会社 積層コンデンサ
CN104903735A (zh) * 2013-01-07 2015-09-09 伊雷克托科学工业股份有限公司 用于处置电组件的系统及方法
CN109047974B (zh) * 2017-01-04 2021-02-12 东莞理工学院 一种能够检测的线圈自动浸锡机
JPWO2022014038A1 (de) * 2020-07-17 2022-01-20

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4343833A (en) * 1979-06-26 1982-08-10 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing thermal head
US4395184A (en) * 1980-02-21 1983-07-26 Palomar Systems & Machines, Inc. Means and method for processing miniature electronic components such as capacitors or resistors
JPS60151968A (ja) * 1984-01-20 1985-08-10 Mitsubishi Electric Corp 燃料電池用電極の製造方法
US4845839A (en) * 1988-10-31 1989-07-11 Hamilton Standard Controls, Inc. Method of making a resistive element
JP2852372B2 (ja) * 1989-07-07 1999-02-03 株式会社村田製作所 積層セラミックコンデンサ
JP3086066B2 (ja) * 1991-10-29 2000-09-11 富士通株式会社 クリーム状はんだの印刷方法及び電子部品のソルダリング方法
US5275661A (en) * 1991-11-08 1994-01-04 Murata Mfg. Co., Ltd. Dipping apparatus
SG30567G (en) * 1991-11-08 1995-09-18 Murata Manufacturing Co Electrode forming apparatus
US5249906A (en) * 1991-11-08 1993-10-05 Murata Manufacturing Co., Ltd. Press machine for chip type electronic components
US5197655A (en) * 1992-06-05 1993-03-30 International Business Machines Corporation Fine pitch solder application
JP3049981B2 (ja) * 1992-12-04 2000-06-05 株式会社村田製作所 チップ部品の電極形成システム
US5482736A (en) * 1994-08-04 1996-01-09 Amkor Electronics, Inc. Method for applying flux to ball grid array package

Also Published As

Publication number Publication date
KR100510009B1 (ko) 2005-08-26
US5753299A (en) 1998-05-19
EP0921887B1 (de) 2002-11-27
KR20000029930A (ko) 2000-05-25
JP2001501367A (ja) 2001-01-30
EP0921887A1 (de) 1999-06-16
JP3469904B2 (ja) 2003-11-25
TW358966B (en) 1999-05-21
DE69717464D1 (de) 2003-01-09
WO1998008644A1 (en) 1998-03-05

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