ATE206959T1 - Umschlossenes halbleiterelement - Google Patents

Umschlossenes halbleiterelement

Info

Publication number
ATE206959T1
ATE206959T1 AT94909858T AT94909858T ATE206959T1 AT E206959 T1 ATE206959 T1 AT E206959T1 AT 94909858 T AT94909858 T AT 94909858T AT 94909858 T AT94909858 T AT 94909858T AT E206959 T1 ATE206959 T1 AT E206959T1
Authority
AT
Austria
Prior art keywords
flame retardant
hardener
metal oxide
semiconductor element
oxidizing
Prior art date
Application number
AT94909858T
Other languages
English (en)
Inventor
Anthony A Gallo
Original Assignee
Dexter Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexter Corp filed Critical Dexter Corp
Application granted granted Critical
Publication of ATE206959T1 publication Critical patent/ATE206959T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Bipolar Transistors (AREA)
  • Fireproofing Substances (AREA)
AT94909858T 1993-03-01 1994-03-01 Umschlossenes halbleiterelement ATE206959T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/024,630 US5476716A (en) 1988-10-17 1993-03-01 Flame retardant epoxy molding compound, method and encapsulated device
PCT/US1994/002393 WO1994020224A1 (en) 1993-03-01 1994-03-01 Flame retardant epoxy molding compound

Publications (1)

Publication Number Publication Date
ATE206959T1 true ATE206959T1 (de) 2001-11-15

Family

ID=21821584

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94909858T ATE206959T1 (de) 1993-03-01 1994-03-01 Umschlossenes halbleiterelement

Country Status (7)

Country Link
US (1) US5476716A (de)
EP (1) EP0644803B1 (de)
JP (1) JPH07506623A (de)
AT (1) ATE206959T1 (de)
AU (1) AU6253494A (de)
DE (1) DE69428653T2 (de)
WO (1) WO1994020224A1 (de)

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JP2001210761A (ja) * 2000-01-24 2001-08-03 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
US6610406B2 (en) 2000-03-23 2003-08-26 Henkel Locktite Corporation Flame retardant molding compositions
US6432540B1 (en) * 2000-03-23 2002-08-13 Loctite Corporation Flame retardant molding compositions
US7163973B2 (en) * 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
US20040166241A1 (en) * 2003-02-20 2004-08-26 Henkel Loctite Corporation Molding compositions containing quaternary organophosphonium salts
WO2004074359A2 (en) * 2003-02-20 2004-09-02 Henkel Corporation Flame retardant molding compositions containing group iva metal oxides
MXPA06013323A (es) * 2004-05-20 2007-02-02 Albemarle Corp Polimeros estirenicos anionicos bromados, en forma de pellas y su preparacion y uso.
TWI307350B (en) * 2006-01-27 2009-03-11 Chang Chun Plastics Co Ltd Flame retarding thermoset resin composition
TWI324168B (en) * 2006-03-17 2010-05-01 Chang Chun Plastics Co Ltd Flame retarding thermoset epoxy resin composition
ES2550540T3 (es) 2006-09-21 2015-11-10 Henkel Ag & Co. Kgaa Formulaciones que contienen benzoxazina polimerizables/curables a baja temperatura
JP2007131861A (ja) * 2006-12-28 2007-05-31 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
EP2152784A1 (de) * 2007-05-25 2010-02-17 Henkel AG & Co. KGaA Benzoxazinformulierungen mit vermindertem entgasungsverhalten
US10531555B1 (en) * 2016-03-22 2020-01-07 The United States Of America As Represented By The Secretary Of The Army Tungsten oxide thermal shield
WO2019040407A2 (en) 2017-08-21 2019-02-28 Palmese Giuseppe R HIGHLY RENEWABLE BIOSENZED POLYBENZOXAZINE THERMOENSEMBLIES FOR COMPOSITE APPLICATIONS

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ZA718662B (en) * 1971-02-12 1972-09-27 Cities Service Co Fire retardant compositions
BE792125A (fr) * 1971-12-27 1973-03-16 Petrow Henry G Sol colloidal d'oxyde d'antimoine, son procede de preparation et son utilisation
USRE31214E (en) * 1971-12-27 1983-04-19 Colloidal sol antimony pentaoxide flameproofing compositions
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US5041254A (en) * 1988-10-17 1991-08-20 Dexter Corporation Method of encapsulating a semiconductor device with a flame retardant epoxy molding compound
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Also Published As

Publication number Publication date
EP0644803A4 (de) 1997-03-26
WO1994020224A1 (en) 1994-09-15
US5476716A (en) 1995-12-19
JPH07506623A (ja) 1995-07-20
EP0644803B1 (de) 2001-10-17
AU6253494A (en) 1994-09-26
EP0644803A1 (de) 1995-03-29
DE69428653D1 (de) 2001-11-22
DE69428653T2 (de) 2002-09-05

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties