ATE108196T1 - Polyimidharz-zusammensetzungen. - Google Patents

Polyimidharz-zusammensetzungen.

Info

Publication number
ATE108196T1
ATE108196T1 AT88303358T AT88303358T ATE108196T1 AT E108196 T1 ATE108196 T1 AT E108196T1 AT 88303358 T AT88303358 T AT 88303358T AT 88303358 T AT88303358 T AT 88303358T AT E108196 T1 ATE108196 T1 AT E108196T1
Authority
AT
Austria
Prior art keywords
polyimide resin
resin compositions
ranges
weight ratio
inorganic filler
Prior art date
Application number
AT88303358T
Other languages
English (en)
Inventor
Kaoru Tominaga
Kojiro Kan
Toshimasa Takata
Toru Tomoshige
Original Assignee
Mitsui Petrochemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62089692A external-priority patent/JPH0737571B2/ja
Priority claimed from JP62131398A external-priority patent/JPS63297419A/ja
Application filed by Mitsui Petrochemical Ind filed Critical Mitsui Petrochemical Ind
Application granted granted Critical
Publication of ATE108196T1 publication Critical patent/ATE108196T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085Unsaturated polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12Unsaturated polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
AT88303358T 1987-04-14 1988-04-14 Polyimidharz-zusammensetzungen. ATE108196T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62089692A JPH0737571B2 (ja) 1987-04-14 1987-04-14 電子部品用成形体
JP62131398A JPS63297419A (ja) 1987-05-29 1987-05-29 イミド系プレポリマ−組成物

Publications (1)

Publication Number Publication Date
ATE108196T1 true ATE108196T1 (de) 1994-07-15

Family

ID=26431103

Family Applications (1)

Application Number Title Priority Date Filing Date
AT88303358T ATE108196T1 (de) 1987-04-14 1988-04-14 Polyimidharz-zusammensetzungen.

Country Status (7)

Country Link
US (1) US4885329A (de)
EP (1) EP0288209B1 (de)
KR (1) KR910004764B1 (de)
CN (1) CN1024420C (de)
AT (1) ATE108196T1 (de)
CA (1) CA1335616C (de)
DE (1) DE3850517T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235005A (en) * 1988-07-05 1993-08-10 Shin-Etsu Chemical Co., Ltd. Polyimide resin composition and semiconductor device encapsulated therewith
NL8901251A (nl) * 1989-05-19 1990-12-17 Stamicarbon Vulmateriaal.
US5137942A (en) * 1989-10-23 1992-08-11 Ralph B. Andy Method of mixing high temperature composite filled, thermoplastic engineering resins
CN1090646C (zh) * 1993-08-20 2002-09-11 日东电工株式会社 半导体器件
EP0978542B1 (de) 1997-04-21 2007-10-24 Nitto Denko Corporation Halbleiter-dichtharzzusammensetzung, damit versiegelte halbleiteranordnung, und verfahren zur herstellung einer halbleiteranordnung.
JP4767931B2 (ja) * 2007-09-19 2011-09-07 信越化学工業株式会社 難燃性ポリイミドシリコーン樹脂組成物
WO2013147856A1 (en) 2012-03-30 2013-10-03 Intel Corporation Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (tsvs)
WO2016003166A1 (ko) * 2014-06-30 2016-01-07 코오롱인더스트리 주식회사 표면 개질 복합 실리카 입자 및 이를 포함하는 폴리이미드 필름
US20250136761A1 (en) * 2022-10-11 2025-05-01 Shengyi Technology (Suzhou) Co., Ltd Modified bismaleimide prepolymer, resin composition and application of resin composition

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2205552B1 (de) * 1972-11-08 1976-04-23 Rhone Poulenc Ind
FR2422696A1 (fr) * 1978-04-13 1979-11-09 Rhone Poulenc Ind Polymeres a groupements imide
FR2460308A1 (fr) * 1979-07-03 1981-01-23 Rhone Poulenc Ind Procede de preparation de polymeres a groupements imide modifies par du silicium

Also Published As

Publication number Publication date
DE3850517D1 (de) 1994-08-11
US4885329A (en) 1989-12-05
KR910004764B1 (ko) 1991-07-13
CN1024420C (zh) 1994-05-04
DE3850517T2 (de) 1994-10-27
EP0288209A1 (de) 1988-10-26
KR880012706A (ko) 1988-11-28
EP0288209B1 (de) 1994-07-06
CN88102982A (zh) 1988-12-21
CA1335616C (en) 1995-05-16

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Legal Events

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