KR880012706A - 폴리이디드 수지 조성물 - Google Patents

폴리이디드 수지 조성물 Download PDF

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Publication number
KR880012706A
KR880012706A KR1019880004230A KR880004230A KR880012706A KR 880012706 A KR880012706 A KR 880012706A KR 1019880004230 A KR1019880004230 A KR 1019880004230A KR 880004230 A KR880004230 A KR 880004230A KR 880012706 A KR880012706 A KR 880012706A
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KR
South Korea
Prior art keywords
group
resin composition
silicone
polyimide resin
polyaminobismarimide
Prior art date
Application number
KR1019880004230A
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English (en)
Other versions
KR910004764B1 (ko
Inventor
가오루 도미나가
고오지로 간
도시마사 다가다
도오루 도모시게
Original Assignee
다께바야시 쇼오고
미쓰이 세끼유 가가꾸 고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from JP62089692A external-priority patent/JPH0737571B2/ja
Priority claimed from JP62131398A external-priority patent/JPS63297419A/ja
Application filed by 다께바야시 쇼오고, 미쓰이 세끼유 가가꾸 고오교오 가부시끼가이샤 filed Critical 다께바야시 쇼오고
Publication of KR880012706A publication Critical patent/KR880012706A/ko
Application granted granted Critical
Publication of KR910004764B1 publication Critical patent/KR910004764B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

내용 없음

Description

폴리이디드 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. 폴리아미노비스마레이미드 수지(A), 실리콘원자에 결합된 하이드록실 또는 알콕실기를 갖는 실리콘모노머들, 실리콘원자에 결합된 하이드록실 또는 알콕실기를 갖는 실리콘올리고머들과 상기 실리콘모노머와 올리고머의 혼합물로 구성되는 군으로 부터 선택된 실리콘성분(B) 및, 무기필러(C)로 구성되고, 폴리아미노비스마레이미드수지(A)대 실리콘성분(B)의 중량비가 99.5/0.5-70/30의 범위에 있으며, 폴리아미노비스마레이미드(A)대 무기필러(C)의 중량비가 100/50-100/100의 범위인 폴리이미드 수지 조성물.
  2. 제1항에 있어서, 폴리아미노비스마레이미드 수지가 일반식(I)의 비스마레이미드와 일반식(Ⅱ)의 방항족디아민을 반응시킴으로써 얻어지는 반응생성물인 폴리이미드 수지 조성물.
    여기에서, R은 2가의 유기기, 바람직하기로는 방향족기이다.
    여기에서, Z는 -CH2-, -O-, -S-, -SO- 또는 -SO2-, R1및 R2는 수소, 저급알킬기들, 아릴기들 시크로 알킬기를 및 저급아실기로 구성된 군으로 부터 독립적으로 선택된다.
  3. 제1항에 있어서, 실리콘 성분이 트리페닐실라놀, 디페닐실란디올, 메틸페닐실란디올, 디에틸실란디올, 디메톡시디페닐실란, 디에톡시디페닐실란, 페닐트리에톡시실란, 디에톡시디메틸실란, 트리에톡시실란, 1,1-디메틸-1-3, 3-디페닐디시록산-1,3-디올, 1,4-비스(하이드록시-디메틸실릴)벤젠 및 디페닐에톡시비닐실란과 그들의 혼합물로 구성되는 군으로 부터 선택된 폴리이미드 수지 조성물.
  4. 제1항에 있어서, 무리필러가 용융실리카, 결정성실리카, 알루미나와 그들의혼합물로 구성되는 군으로 부터 선택된 폴리이미드 수지 조성물.
  5. 제1항에 있어서, 무기필러가 용융실리카인 폴리이미드 수지 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880004230A 1987-04-14 1988-04-14 폴리이미드 수지조성물 KR910004764B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP89692 1987-04-14
JP62089692A JPH0737571B2 (ja) 1987-04-14 1987-04-14 電子部品用成形体
JP62-89692 1987-04-14
JP131398 1987-05-29
JP62131398A JPS63297419A (ja) 1987-05-29 1987-05-29 イミド系プレポリマ−組成物

Publications (2)

Publication Number Publication Date
KR880012706A true KR880012706A (ko) 1988-11-28
KR910004764B1 KR910004764B1 (ko) 1991-07-13

Family

ID=26431103

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880004230A KR910004764B1 (ko) 1987-04-14 1988-04-14 폴리이미드 수지조성물

Country Status (7)

Country Link
US (1) US4885329A (ko)
EP (1) EP0288209B1 (ko)
KR (1) KR910004764B1 (ko)
CN (1) CN1024420C (ko)
AT (1) ATE108196T1 (ko)
CA (1) CA1335616C (ko)
DE (1) DE3850517T2 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235005A (en) * 1988-07-05 1993-08-10 Shin-Etsu Chemical Co., Ltd. Polyimide resin composition and semiconductor device encapsulated therewith
NL8901251A (nl) * 1989-05-19 1990-12-17 Stamicarbon Vulmateriaal.
US5137942A (en) * 1989-10-23 1992-08-11 Ralph B. Andy Method of mixing high temperature composite filled, thermoplastic engineering resins
WO1995006085A1 (en) * 1993-08-20 1995-03-02 Nitto Denko Corporation Semiconductor device
DE69838610T2 (de) 1997-04-21 2008-02-07 Nitto Denko Corp., Ibaraki Halbleiter-dichtharzzusammensetzung, damit versiegelte halbleiteranordnung, und verfahren zur herstellung einer halbleiteranordnung.
CN101235200B (zh) * 2007-01-30 2011-03-30 长春人造树脂厂股份有限公司 热固性树脂改质的聚酰亚胺树脂组成物
JP4767931B2 (ja) * 2007-09-19 2011-09-07 信越化学工業株式会社 難燃性ポリイミドシリコーン樹脂組成物
US20140117559A1 (en) * 2012-03-30 2014-05-01 Paul A. Zimmerman Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (tsvs)
WO2016003166A1 (ko) * 2014-06-30 2016-01-07 코오롱인더스트리 주식회사 표면 개질 복합 실리카 입자 및 이를 포함하는 폴리이미드 필름
WO2024077887A1 (zh) * 2022-10-11 2024-04-18 苏州生益科技有限公司 改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2205552B1 (ko) * 1972-11-08 1976-04-23 Rhone Poulenc Ind
FR2422696A1 (fr) * 1978-04-13 1979-11-09 Rhone Poulenc Ind Polymeres a groupements imide
FR2460308A1 (fr) * 1979-07-03 1981-01-23 Rhone Poulenc Ind Procede de preparation de polymeres a groupements imide modifies par du silicium

Also Published As

Publication number Publication date
US4885329A (en) 1989-12-05
KR910004764B1 (ko) 1991-07-13
EP0288209B1 (en) 1994-07-06
DE3850517D1 (de) 1994-08-11
EP0288209A1 (en) 1988-10-26
DE3850517T2 (de) 1994-10-27
CN88102982A (zh) 1988-12-21
ATE108196T1 (de) 1994-07-15
CA1335616C (en) 1995-05-16
CN1024420C (zh) 1994-05-04

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