AT270330B - Stabilisiertes Bad zum stromlosen Abscheiden von Nickel, Kobalt, Kadmium oder Zinn - Google Patents

Stabilisiertes Bad zum stromlosen Abscheiden von Nickel, Kobalt, Kadmium oder Zinn

Info

Publication number
AT270330B
AT270330B AT570665A AT570665A AT270330B AT 270330 B AT270330 B AT 270330B AT 570665 A AT570665 A AT 570665A AT 570665 A AT570665 A AT 570665A AT 270330 B AT270330 B AT 270330B
Authority
AT
Austria
Prior art keywords
cadmium
cobalt
tin
nickel
electroless deposition
Prior art date
Application number
AT570665A
Other languages
English (en)
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Application granted granted Critical
Publication of AT270330B publication Critical patent/AT270330B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Paints Or Removers (AREA)
  • Catalysts (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AT570665A 1964-06-24 1965-06-23 Stabilisiertes Bad zum stromlosen Abscheiden von Nickel, Kobalt, Kadmium oder Zinn AT270330B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US377471A US3403035A (en) 1964-06-24 1964-06-24 Process for stabilizing autocatalytic metal plating solutions

Publications (1)

Publication Number Publication Date
AT270330B true AT270330B (de) 1969-04-25

Family

ID=23489240

Family Applications (1)

Application Number Title Priority Date Filing Date
AT570665A AT270330B (de) 1964-06-24 1965-06-23 Stabilisiertes Bad zum stromlosen Abscheiden von Nickel, Kobalt, Kadmium oder Zinn

Country Status (10)

Country Link
US (1) US3403035A (de)
AT (1) AT270330B (de)
BE (1) BE665911A (de)
CH (1) CH467342A (de)
DE (1) DE1521440B2 (de)
DK (1) DK129949B (de)
ES (1) ES314564A2 (de)
GB (1) GB1121282A (de)
NL (1) NL6508142A (de)
SE (1) SE316962B (de)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3507681A (en) * 1967-06-02 1970-04-21 Mine Safety Appliances Co Metal plating of plastics
US3992211A (en) * 1968-07-15 1976-11-16 Trans-Metals Corporation Electroless plating composition
US3946126A (en) * 1968-11-22 1976-03-23 Rca Corporation Method of electroless nickel plating
US3547818A (en) * 1969-04-07 1970-12-15 Ventron Corp Alcoholic ionic compositions containing a metal selected from hg (ii),cu (ii),ag (i),cd (ii),ni (ii),zn (ii),and co (ii)
US3915716A (en) * 1969-04-17 1975-10-28 Schering Ag Chemical nickel plating bath
US3653953A (en) * 1970-01-26 1972-04-04 North American Rockwell Nonaqueous electroless plating
US3637472A (en) * 1970-03-16 1972-01-25 Ventron Corp Chemical plating baths containing an alkali metal cyanoborohydride
US3650708A (en) * 1970-03-30 1972-03-21 Hooker Chemical Corp Metal plating of substrates
US3645749A (en) * 1970-06-04 1972-02-29 Kollmorgen Corp Electroless plating baths with improved deposition rates
DE2028950B2 (de) * 1970-06-12 1976-05-13 Shipley Co., Inc., Newton, Mass. (V.SLA.) Waessrige loesung zum stromlosen abschneiden von nickel, kobalt oder legierungen davon
US3663242A (en) * 1970-09-25 1972-05-16 Shipley Co Stabilized electroless plating solutions
US3893865A (en) * 1971-02-02 1975-07-08 Ppg Industries Inc Method for stabilizing a chemical filming composition
US3798050A (en) * 1971-05-28 1974-03-19 Ppg Industries Inc Catalytic sensitization of substrates for metallization
BE792310A (fr) * 1971-12-08 1973-06-05 Kalle Ag Procede pour le depot de couches de cuivre sur des pieces moulees en polyimides
US3899617A (en) * 1973-07-19 1975-08-12 Enthone Process for conditioning ABS resin surface
US3961109A (en) * 1973-08-01 1976-06-01 Photocircuits Division Of Kollmorgen Corporation Sensitizers and process for electroless metal deposition
US3870526A (en) * 1973-09-20 1975-03-11 Us Army Electroless deposition of copper and copper-tin alloys
US4036651A (en) * 1974-02-26 1977-07-19 Rca Corporation Electroless copper plating bath
US3963842A (en) * 1974-06-20 1976-06-15 London Laboratories Limited Co. Deposition of copper
CA1093911A (en) * 1976-04-08 1981-01-20 George A. Butter Electroless copper plating
US4328266A (en) * 1977-06-06 1982-05-04 Surface Technology, Inc. Method for rendering non-platable substrates platable
US4355083A (en) * 1977-06-06 1982-10-19 Nathan Feldstein Electrolessly metallized silver coated article
US4305997A (en) * 1977-06-06 1981-12-15 Surface Technology, Inc. Electrolessly metallized product of non-catalytic metal or alloy
JPS6018320B2 (ja) * 1977-10-06 1985-05-09 東方商館株式会社 炭酸カルシウムを主成分とする天然物の改質方法
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
NL184695C (nl) * 1978-12-04 1989-10-02 Philips Nv Bad voor het stroomloos neerslaan van tin op substraten.
US4279951A (en) * 1979-01-15 1981-07-21 Mine Safety Appliances Company Method for the electroless deposition of palladium
USH325H (en) 1980-07-30 1987-09-01 Richardson Chemical Company Electroless deposition of transition metals
JPS57501786A (de) * 1980-09-15 1982-10-07
DE3237394A1 (de) * 1982-10-08 1984-04-12 Siemens AG, 1000 Berlin und 8000 München Chemisches vergoldungsbad
DE3622090C1 (de) * 1986-07-02 1990-02-15 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De
JPH0331484A (ja) * 1989-06-27 1991-02-12 Nippon Parkerizing Co Ltd 亜鉛または亜鉛系メッキ材料の黒色化処理法
CA2087473C (en) * 1990-05-17 2001-10-16 Matthias P. Schriever Non-chromated oxide coating for aluminum substrates
US5298092A (en) * 1990-05-17 1994-03-29 The Boeing Company Non-chromated oxide coating for aluminum substrates
US5472524A (en) * 1990-05-17 1995-12-05 The Boeing Company Non-chromated cobalt conversion coating method and coated articles
US5551994A (en) * 1990-05-17 1996-09-03 The Boeing Company Non-chromated oxide coating for aluminum substrates
US5468307A (en) * 1990-05-17 1995-11-21 Schriever; Matthias P. Non-chromated oxide coating for aluminum substrates
US5411606A (en) * 1990-05-17 1995-05-02 The Boeing Company Non-chromated oxide coating for aluminum substrates
US5419926A (en) * 1993-11-22 1995-05-30 Lilly London, Inc. Ammonia-free deposition of copper by disproportionation
US5873953A (en) * 1996-12-26 1999-02-23 The Boeing Company Non-chromated oxide coating for aluminum substrates
US6183546B1 (en) 1998-11-02 2001-02-06 Mccomas Industries International Coating compositions containing nickel and boron
US6432225B1 (en) 1999-11-02 2002-08-13 The Boeing Company Non-chromated oxide coating for aluminum substrates
US20030190426A1 (en) * 2002-04-03 2003-10-09 Deenesh Padhi Electroless deposition method
US20040217005A1 (en) * 2002-07-24 2004-11-04 Aron Rosenfeld Method for electroplating bath chemistry control
US6821909B2 (en) * 2002-10-30 2004-11-23 Applied Materials, Inc. Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application
US7306662B2 (en) * 2006-05-11 2007-12-11 Lam Research Corporation Plating solution for electroless deposition of copper
US7297190B1 (en) * 2006-06-28 2007-11-20 Lam Research Corporation Plating solutions for electroless deposition of copper
JP2004327229A (ja) * 2003-04-24 2004-11-18 Konica Minolta Holdings Inc 導電性パターン形成用組成物、導電性パターンの形成方法及び導電性パターン形成用組成物の製造方法
US7064065B2 (en) * 2003-10-15 2006-06-20 Applied Materials, Inc. Silver under-layers for electroless cobalt alloys
TW200530427A (en) * 2003-10-17 2005-09-16 Applied Materials Inc Selective self-initiating electroless capping of copper with cobalt-containing alloys
US7205233B2 (en) 2003-11-07 2007-04-17 Applied Materials, Inc. Method for forming CoWRe alloys by electroless deposition
US7256111B2 (en) * 2004-01-26 2007-08-14 Applied Materials, Inc. Pretreatment for electroless deposition
SE0403042D0 (sv) * 2004-12-14 2004-12-14 Polymer Kompositer I Goeteborg Improved stabilization and performance of autocatalytic electroless process
TW200734482A (en) 2005-03-18 2007-09-16 Applied Materials Inc Electroless deposition process on a contact containing silicon or silicide
US7651934B2 (en) 2005-03-18 2010-01-26 Applied Materials, Inc. Process for electroless copper deposition
US7514353B2 (en) 2005-03-18 2009-04-07 Applied Materials, Inc. Contact metallization scheme using a barrier layer over a silicide layer
KR20060128739A (ko) * 2005-06-10 2006-12-14 엔쏜 인코포레이티드 비-전도성 기판의 직접적인 금속화 방법
US20150079276A1 (en) * 2013-08-06 2015-03-19 Earthone Circuit Technologies Corporation Method of forming a conductive image using high speed electroless plating

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3119709A (en) * 1956-09-28 1964-01-28 Atkinson Lab Inc Material and method for electroless deposition of metal
US3046159A (en) * 1957-12-17 1962-07-24 Hughes Aircraft Co Method of copper plating by chemical reduction
US3096182A (en) * 1958-10-01 1963-07-02 Du Pont Chemical plating solution and process for plating therewith
US3063850A (en) * 1959-09-11 1962-11-13 Metal Hydrides Inc Metal plating by chemical reduction with amine boranes
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating

Also Published As

Publication number Publication date
BE665911A (de) 1965-10-18
GB1121282A (en) 1968-07-24
US3403035A (en) 1968-09-24
ES314564A2 (es) 1967-07-01
SE316962B (de) 1969-11-03
DE1521440A1 (de) 1970-01-08
DK129949B (da) 1974-12-02
DE1521440B2 (de) 1970-11-26
DK129949C (de) 1975-06-30
NL6508142A (de) 1965-12-27
CH467342A (de) 1969-01-15

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