AT12321U1 - Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement - Google Patents

Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement Download PDF

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Publication number
AT12321U1
AT12321U1 AT0000509U AT52009U AT12321U1 AT 12321 U1 AT12321 U1 AT 12321U1 AT 0000509 U AT0000509 U AT 0000509U AT 52009 U AT52009 U AT 52009U AT 12321 U1 AT12321 U1 AT 12321U1
Authority
AT
Austria
Prior art keywords
circuit board
layer
printed circuit
laser beam
particles
Prior art date
Application number
AT0000509U
Other languages
German (de)
English (en)
Original Assignee
Austria Tech & System Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Austria Tech & System Tech filed Critical Austria Tech & System Tech
Priority to AT0000509U priority Critical patent/AT12321U1/de
Priority to PCT/AT2010/000004 priority patent/WO2010078611A1/fr
Priority to JP2011544753A priority patent/JP5693468B2/ja
Priority to CN201080011207.9A priority patent/CN102349360B/zh
Priority to EP10701190A priority patent/EP2386193A1/fr
Publication of AT12321U1 publication Critical patent/AT12321U1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AT0000509U 2009-01-09 2009-01-09 Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement AT12321U1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AT0000509U AT12321U1 (de) 2009-01-09 2009-01-09 Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement
PCT/AT2010/000004 WO2010078611A1 (fr) 2009-01-09 2010-01-08 Carte de circuit imprimé comprenant au moins un élément d'arrêt de faisceau laser, et procédé de fabrication de ladite carte
JP2011544753A JP5693468B2 (ja) 2009-01-09 2010-01-08 少なくとも１つのレーザビームストップ素子を有するプリント基板素子ならびにプリント基板素子を作製する方法
CN201080011207.9A CN102349360B (zh) 2009-01-09 2010-01-08 带有至少一个激光束阻挡元件的印刷电路板元件及其制造方法
EP10701190A EP2386193A1 (fr) 2009-01-09 2010-01-08 Carte de circuit imprimé comprenant au moins un élément d'arrêt de faisceau laser, et procédé de fabrication de ladite carte

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0000509U AT12321U1 (de) 2009-01-09 2009-01-09 Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement

Publications (1)

Publication Number Publication Date
AT12321U1 true AT12321U1 (de) 2012-03-15

Family

ID=42316135

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0000509U AT12321U1 (de) 2009-01-09 2009-01-09 Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement

Country Status (5)

Country Link
EP (1) EP2386193A1 (fr)
JP (1) JP5693468B2 (fr)
CN (1) CN102349360B (fr)
AT (1) AT12321U1 (fr)
WO (1) WO2010078611A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013115851A1 (fr) * 2012-02-03 2013-08-08 Avery Dennison Corporation Formation de motifs au laser sur film photovoltaïque arrière
WO2014059057A1 (fr) 2012-10-09 2014-04-17 Avery Dennison Corporation Adhésifs et procédés associés
DE102013212665B4 (de) * 2013-06-28 2015-06-25 Laser Zentrum Hannover E.V. Verfahren zum Laserbohren oder Laserschneiden eines Werkstücks
CN107207924B (zh) 2015-02-05 2020-03-13 艾利丹尼森公司 恶劣环境用标签组件
DE102015113324A1 (de) 2015-08-12 2017-02-16 Schweizer Electronic Ag Leiterstrukturelement mit einlaminiertem Innenlagensubstrat und Verfahren zu dessen Herstellung
US10526511B2 (en) 2016-12-22 2020-01-07 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers
CN109219255A (zh) * 2018-11-14 2019-01-15 生益电子股份有限公司 一种非金属化阶梯槽的制作方法及pcb
KR20200106342A (ko) * 2019-03-04 2020-09-14 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN114543986A (zh) * 2022-03-07 2022-05-27 英特尔产品（成都）有限公司 光阻挡装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2676112B2 (ja) * 1989-05-01 1997-11-12 イビデン株式会社 電子部品搭載用基板の製造方法
US4931134A (en) 1989-08-15 1990-06-05 Parlex Corporation Method of using laser routing to form a rigid/flex circuit board
US5108785A (en) * 1989-09-15 1992-04-28 Microlithics Corporation Via formation method for multilayer interconnect board
JPH03165594A (ja) 1989-11-24 1991-07-17 Ibiden Co Ltd 多層プリント配線板の製造方法
US5229180A (en) * 1991-10-02 1993-07-20 American National Can Company Laser scored package
JPH05235556A (ja) 1992-02-26 1993-09-10 Fujitsu Ltd 薄膜基板のパターンカット構造
US6708404B1 (en) * 1999-06-17 2004-03-23 Mitsubishi Gas Chemical Company, Inc. Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole
JP2002271039A (ja) 2001-03-13 2002-09-20 Canon Inc 多層基板及びその加工方法
JP2003060356A (ja) * 2001-08-09 2003-02-28 Ngk Spark Plug Co Ltd 多層プリント配線基板の製造方法
JP3759931B2 (ja) * 2003-02-18 2006-03-29 株式会社野田スクリーン 多層回路基板の製造方法
JP2005240092A (ja) * 2004-02-26 2005-09-08 Dowa Mining Co Ltd 銀粉およびその製造方法
TWI318173B (en) * 2004-03-01 2009-12-11 Sumitomo Electric Industries Metallic colloidal solution and inkjet-use metallic ink
JP3954080B2 (ja) 2005-10-17 2007-08-08 シャープ株式会社 多層プリント配線板の製造方法
US7982135B2 (en) * 2006-10-30 2011-07-19 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
AT11663U1 (de) 2007-02-16 2011-02-15 Austria Tech & System Tech Haftverhinderungsmaterial, verfahren zum entfernen eines teilbereichs einer flächigen materialschicht sowie mehrlagige struktur und verwendung hiefür
AT11664U1 (de) 2007-02-16 2011-02-15 Austria Tech & System Tech Verfahren zum entfernen eines teilbereichs einer flächigen materialschicht sowie mehrlagige struktur und verwendung hiefür
AT10030U1 (de) 2007-02-16 2008-07-15 Austria Tech & System Tech Verfahren zum herstellen einer starr-flexiblen leiterplatte sowie starr-flexible leiterplatte
AT10029U1 (de) 2007-02-16 2008-07-15 Austria Tech & System Tech Verfahren zum herstellen einer starr-flexiblen leiterplatte sowie starr-flexible leiterplatte
JP2008288607A (ja) * 2008-07-04 2008-11-27 Shinko Electric Ind Co Ltd 電子部品実装構造の製造方法

Also Published As

Publication number Publication date
WO2010078611A1 (fr) 2010-07-15
JP5693468B2 (ja) 2015-04-01
EP2386193A1 (fr) 2011-11-16
CN102349360B (zh) 2015-09-30
JP2012514859A (ja) 2012-06-28
CN102349360A (zh) 2012-02-08

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Effective date: 20170131