EP2386193A1 - Carte de circuit imprimé comprenant au moins un élément d'arrêt de faisceau laser, et procédé de fabrication de ladite carte - Google Patents

Carte de circuit imprimé comprenant au moins un élément d'arrêt de faisceau laser, et procédé de fabrication de ladite carte

Info

Publication number
EP2386193A1
EP2386193A1 EP10701190A EP10701190A EP2386193A1 EP 2386193 A1 EP2386193 A1 EP 2386193A1 EP 10701190 A EP10701190 A EP 10701190A EP 10701190 A EP10701190 A EP 10701190A EP 2386193 A1 EP2386193 A1 EP 2386193A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
layer
laser beam
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP10701190A
Other languages
German (de)
English (en)
Inventor
Markus Leitgeb
Andreas Zluc
Alexander Kasper
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&S Austria Technologie und Systemtechnik AG
Original Assignee
AT&S Austria Technologie und Systemtechnik AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&S Austria Technologie und Systemtechnik AG filed Critical AT&S Austria Technologie und Systemtechnik AG
Publication of EP2386193A1 publication Critical patent/EP2386193A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Definitions

  • the invention relates to a printed circuit board element, in particular multilayer printed circuit board element, with a plurality of dielectric layers and conductor layers, and with at least one separate laser beam stop element in the interior of the printed circuit board element, around a laser beam used for drilling or cutting at a deep penetration into the Prevent PCB element.
  • the invention relates to a method for producing such a printed circuit board element.
  • Circuit board elements are generally constructed of different layers which are adhesively bonded together, whereby a thermal pressing process can be used.
  • multilayer printed circuit board elements so-called multilayer printed circuit board elements, a plurality of dielectric layers (insulating layers) and metallizations (conductor layers) are stacked on top of each other, thus producing conductive connections between electronic components at several levels.
  • Such printed circuit board elements are made of resin layers, e.g. Epoxy resin layers, and copper layers constructed, wherein at least two layers are provided.
  • this stopping effect is based on the fact that copper layers or generally metal layers reflect very well in the visible or infrared light range; For example, a CO 2 laser beam is reflected well on a copper layer. In contrast, a laser beam would cut copper in the UV range.
  • the invention provides a printed circuit board element as in claim 1 and a method as specified in claim 9.
  • Advantageous embodiments and further developments are specified in the dependent claims.
  • a separate, "additional" stop element for the laser beam is also introduced, but this stop element is now formed with small particles which receive and / or reflect the laser beam energy, and whose size is in particular in the nm to ⁇ m.
  • These particles consist in particular of a suitable metal, for example of gold, silver, copper, aluminum, tin and / or lead, but it is also possible to use other suitable refelective or fusible materials, for example ceramic particles.
  • the particles which may be, for example, spherical or platelet-shaped, are so small that the laser beam can not easily penetrate through the material of the layer, for example because of multiple reflection on the particles, if they are larger, or if the particles are not round but are platelet-shaped, or when a large proportion of particulate binder is present to the large particles with connect to each other, in which case this binder can not be reflected and penetrated by the laser beam. Even with such larger particles in the stop element, the reflection may be poor. In this way, it would be conceivable that with the laser beam enough energy can be introduced into the stop member to penetrate this, rather than that the laser beam is stopped. For small particles, however, on the one hand, the binder content can be very low, and on the other hand, the energy of the laser beam can be used to melt the material, or can be higher due to the higher proportion of particles, the reflection.
  • the particles should have a "nano-character", ie the particles should have a size at which the melting point of the nanoparticles deviates from the melting point of the general printed circuit board material, for example, with particles of silver having a particle size of about 100 nm proved to be advantageous.
  • This own stop element can, at least in those places where the restriction of the depth of cut or depth of the laser beam is desired, but of course also be applied over the entire surface of the underlying layer; In particular, it can also be structured in a conventional manner.
  • a printing technique for local application such as ink-jet printing, screen printing or the like, may preferably be used.
  • a structuring is also possible if the material of the additional stop layer is equipped in a conventional manner photosensitive, so that then with the aid of a conventional photoprocess, the structuring can be performed.
  • printing techniques as indicated above, or other coating methods, for example: spraying, etc., can be used.
  • the energy of the laser beam can also be used to completely or partially melt the particles, thereby stopping the laser beam at this point, except that the laser beam is similar on the known copper layer, completely or at least for the most part can be reflected.
  • a cooling effect By the thermal contact of the particles in the laser beam impingement area, by the way, a cooling effect, a heat dissipation, is effected.
  • the present stop element is preferably provided as an additional layer part, in particular in the form of a paste, and used up, e.g. printed, this paste containing the small particles and the binder.
  • the stopper for stopping a laser beam in a layer above or below a removable Separating layer or between two removable separating layers are used to prevent overlying and underlying resin layers from sticking together.
  • a part of a substrate ie a rigid resin layer
  • rigid-flex printed circuit board cf.
  • the attachment of the stop element to or between the separating layers also has the advantage that it can be removed together with the separating layers.
  • the laser stop element can also be present as a separate, prefabricated film (tape) and, for example, laminated onto a resin layer or inserted into a resin layer. Also in this case, there is a layered, separate, independently of the conductor layers mounted laser stop element, which is attached as an additional layer.
  • a frequently particularly favorable embodiment is further characterized in that the present particles are or are incorporated directly as a filler in one of the layers of the printed circuit board element.
  • the particles may be introduced into a respective resin layer of the circuit board member, but they may be incorporated in or contained in the aforementioned separation layers, in which case the separation layer additionally functions as a stopper member;
  • the separation layer additionally functions as a stopper member;
  • the latter serves as a laser stop pest.
  • stop elements will be present on a printed circuit board element as stop elements mounted in addition to conductor layers.
  • Fig. 1 shows a per se known multilayer printed circuit board element in a very schematic cross section, wherein also only very schematically a laser beam for cutting or drilling a Needles istslochs for a conductor layer is shown in the interior of the conductor element, wherein the laser beam to the inner conductor layer in a conventional manner (by reflection) is stopped;
  • Fig. 2 is a similar schematic cross-sectional view, but now compared to Fig. 1, the inner conductor layer is structured, so that the laser beam, when it is directed to a point where the inner conductor layer has no metal through the structuring, at a deeper Penetration is not hindered;
  • FIG. 3 shows a comparable schematic cross section through a printed circuit board element, wherein, however, a separate stop element with small particles for stopping the laser beam is now provided;
  • Fig. 4 is a similar cross section, but here with only two PCB layers, again with an additional stop element is provided for the laser beam, but now between two removable separating layers;
  • Figure 4A is a cross-sectional view similar to Figure 4, but now with only a removable release liner on which an auxiliary stop member is mounted;
  • Fig. 5 shows a single layer with a resin layer and an attached, already structured conductor layer, as well as with a layer provided above with small particles, which form an additional layer for the production of a separate element for stopping a laser beam during cutting or drilling of the finished Printed circuit board element is provided;
  • FIG. 6 shows a multilayer structure with three layers still shown separately for the multilayer structure, wherein the middle layer corresponds to that according to FIG. 5, after the additional layer has been patterned in order to form the additional stop elements according to the invention. Rankin to form, and wherein schematically also the pressing of the individual layers to the multilayer printed circuit board element is illustrated.
  • Fig. 1 is very schematic and not to scale a conventional per se structure of a multilayer printed circuit board element 1 is shown, wherein by way of example three layers 2, 3 and 4 are shown, but without the printed circuit board element structure should be limited thereto.
  • resin layers 5, 6 and 7 made of, for example, epoxy resin as known per se, and may contain glass fibers for reinforcement.
  • conductor layers metal layers, usually copper layers
  • a laser beam 12 is further indicated in Fig. 1; This laser beam 12 is used for drilling contact holes or for applying cuts, for example for removing parts of printed circuit board layers.
  • Such a removal of printed circuit board layer parts is provided, for example, when flexible parts of the printed circuit board element are desired, that is to say a so-called rigid flex printed circuit board is to be produced.
  • the penetration depth of the laser beam 12 is limited as shown in FIG. 1 by the inner copper layer 9, since this copper layer or metallization 9, the laser beam, such as a CO 2 laser beam, well reflected. Due to this reflection on the copper layer 9, therefore, the laser beam 12 can not penetrate further into the interior of the structure of the printed circuit board element 1.
  • metals used for conductor layers 8, 9, 10 and 11 reflect laser light in the visible or infrared range well; However, a laser beam in the UV range would cut a copper layer, for example.
  • the penetration depth during drilling or cutting of circuit board elements is otherwise controlled, with special, non-metallic spacer material parts embedded in the layer structure, their function in providing a space or distance is located for the UV laser, and which can be destroyed during drilling or cutting with the UV laser.
  • this method with the known "Distanzelmenten" is only suitable for a relatively slow cutting or drilling and requires the insertion of the spacer material in the interior of about the resin layers.
  • solder mask is already provided at the location of the conductor layer 9 (or also the conductor layer 10, if there also should be structuring), metallization nevertheless still lacks at the locations 13, so that the penetration depth of the laser beam 12 is not without can be further controlled or limited.
  • this auxiliary stopper 14 is mounted independently of (in addition to) the conductor layers, eg 9, and is formed with small particles which act as a laser beam stopper by reflecting the laser beam 12 thereon and / or its energy for reflowing is used by particles in this additional stop element 14.
  • FIG. 3 by way of example, such a locational The additional stop element 14 is shown in a metallization-free region 13 in an already structured conductor layer 9 of a printed circuit board element 1, which is otherwise constructed as shown in FIGS. 1 and 2.
  • the additive stopper 14 includes, as mentioned, small particles connected by a binder, which particles are so small that they melt earlier than the entire material complex. For example, silver particles and gold particles were tested for these "nano" particles, and it has been shown that good results can be achieved with silver particles and gold particles having a particle size of about 100 nm.
  • the present stop element 14 and its stop function are therefore the "smallness" of the particles in conjunction with the low binder content, or the reflection and absorption properties, in which case the energy of the laser beam 12 is also used, if necessary, the nano- Melting apart particles, except that the reflection at the stop element 14 can be comparable to that at a copper layer 9 (see Fig. 1), at any rate high.
  • nano-particles For example, copper, tin, lead, aluminum, generally metals that can be made into the "nano" particles, but also ceramics.
  • epoxy resins have proven suitable as binders; it may solvents based on ⁇ -terpin oil be used for the additional layer mass.
  • a layer mass can be produced in the form of a paste, which can be easily applied in the course of the production of the printed circuit board element 1 - as an addition to the other components.
  • a variety of printing techniques including screen printing or ink jet printing, and other coating techniques, e.g. also spray coating.
  • One possibility is also to first apply the paste in the form of a surface layer and then to structure this surface layer, which can be done by means of known photo-exposure techniques (with subsequent development processes) if photosensitive properties are provided for the paste. This will be explained in more detail below with reference to FIGS. 5 and 6.
  • the energy of the laser beam 12 is absorbed by the small particles, which energy is used to partially or completely melt the particles. Furthermore, the laser beam 12 is partially or completely reflected.
  • An advantage is further that, due to the thermal contact of the particles, the area where the laser beam 12 impinges is cooled, since heat is transported away by the particles.
  • the present laser beam stop 14 is particularly useful in applications where cuts are made in the printed circuit board element 1 by the laser beam 12, such as around a portion of a sheet, e.g. Layer 2 (see Fig. 1) so as to provide by removing the rigid resin part at this point a possible flexible printed circuit board area, as is known in the art.
  • a part 17 of the upper layer 5 with 8 could be removed from the remaining printed circuit board element 1.
  • This part 17 can be self-contained, e.g. its rectangle being formed by at least one separating layer 15, 16 and the stop element 14, and wherein the cut is made with the aid of the laser beam 12 around this part 17 in order to finally be able to remove the part 17.
  • This is not shown in detail in FIGS. 4 and 4A, but in itself, apart from the present stop element 14, is conventional technology.
  • a layer e.g. the layer 3 of the printed circuit board element 1 according to FIG. 1, with a resin layer 6 and an already structured conductor layer 9 applied thereon.
  • regions 13 are present in the conductor layer 9, where there is no more metallization.
  • This situation according to FIG. 5 is provided for an inner layer of a multilayer printed circuit board element 1 approximately according to FIGS. 1 to 3.
  • a particle surface layer 14 ' is now provided on the layer 3 in this example, for example, by brushing the paste and doctoring by spraying (spray-coa- ting), imprints or a similar known method can be done.
  • This surface layer 14 'of the paste with the nano-particles and the binder is additionally equipped with a photosensitive element, for example a commercially available photoinitiator together with a binder to be crosslinked.
  • the surface layer 14 'partially cured and partially attackable for an etchant are designed so that in a subsequent etching (or development step), much as in the structuring of Conductor layers, eg 9, takes place, a structured additional layer is obtained as a stop element 14, cf. Fig. 6.
  • the inner layer 3 is then stacked as shown in FIG. 6 together with the outer layers 2, 4 (and optionally with other inner layers, which are not shown) in a conventional manner on each other and - usually in conjunction with other such layer packages in the Type of "book", as it is known per se - arranged in a press and then with heating, in order to connect the layers 2, 3 and 4 sticking together, pressed, see the press parts 18, 19 shown in Fig 6. (It should be mentioned here that, of course, there are also non-thermal connection possibilities which can also be used if the present additional stop elements 14 are installed.)
  • Such pressing can of course also take place if the additional stop elements 14 have been attached in a different manner, for example by screen printing, at the desired locations (ie "structured").
  • Another way of achieving the present stop elements 14 independently of the conductor layers 8, 9, 10, 11 is, for example, also to incorporate the aforementioned particles directly as fillers in suitable layers or layers in a suitable manner.
  • the particles are thus in this case directly, as a "filler" in the resin system of a resin layer of the printed circuit board element or else optionally in a release layer 15 or 16 (in which case only one such release layer will be present), and the resin layer or Separation layer then acts as a laser stop layer or layer, ie as a laser stop element 14, again independently of the conductor layers 8, 9, 10, 11th
  • Another possibility for providing a stop element 14 may be that prefabricated stop elements 14 are present as a film (tape), wherein these stop element films are laminated on a (resin) layer or inserted in the layer structure.
  • the stop properties can be influenced via the reflection or absorption properties for which the particles and their size or shape are responsible, in particular.
  • the advantage here is that these additional stop elements 14 can be mounted anywhere in the multilayer structure, namely where later limiting the penetration depth of the laser beam when cutting or drilling of the printed circuit board element 1 is desired.
  • These variable application sites, as well as the flexible application methods, are of particular advantage.
  • a paste can be printed in layer form, with the nano-particles, or added to the circuit board element in another form, after which the conductor layers have been patterned and etched, without using a copper layer in the sense of a base layer is that can stop a laser beam.
  • the small particles reflected as mentioned, or possibly partially or completely melted and sintered to prevent the laser beam from further penetration into the printed circuit board element.
  • the laser stop element 14 is always shown (approximately) in a plane with the already structured conductor layer 9. But it is just as conceivable and possible, the additional stop element 14 within a resin layer, for example 6; to attach, as for the sake of simplicity in Fig. 3 - for the sake of simplicity additionally - indicated by dashed lines.
  • the resin layers consist, for example, of two layers before the pressing or gluing, as in the case of resin systems, for example Epoxy resin layers, which are formed from so-called prepregs, which are originally in film form and can be simply superimposed for pressing, about to achieve an increased insulation layer.
  • Epoxy resin layers which are formed from so-called prepregs, which are originally in film form and can be simply superimposed for pressing, about to achieve an increased insulation layer.
  • a photosensitive paste paste technologies are also applicable, whereby only a single-stage development process is used as the photographic process.
  • the additional layer mass there are, for example, pastes or inks filled with aluminum particles, wherein the aluminum particles are of the order of a few micrometers (eg approx. 4 ⁇ m) and are approximately platelet-shaped, so as to provide a layered arrangement during application (printing). to achieve.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne une carte de circuit imprimé (1), en particulier une carte de circuit imprimé multicouche, comportant plusieurs couches diélectriques (5, 6, 7) ainsi que des couches conductrices (8, 9, 10, 11), et comportant au moins un élément d'arrêt de faisceau laser (14) propre, différent des couches conductrices (8, 9, 10, 11), placé à l'intérieur de la carte de circuit imprimé, pour empêcher un faisceau laser utilisé pour le perçage ou la découpe de pénétrer profondément dans la carte de circuit imprimé, l'élément d'arrêt de faisceau laser étant constitué de particules absorbant et/ou réfléchissant l'énergie du faisceau laser. L'invention concerne également un procédé de fabrication correspondant.
EP10701190A 2009-01-09 2010-01-08 Carte de circuit imprimé comprenant au moins un élément d'arrêt de faisceau laser, et procédé de fabrication de ladite carte Ceased EP2386193A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT0000509U AT12321U1 (de) 2009-01-09 2009-01-09 Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement
PCT/AT2010/000004 WO2010078611A1 (fr) 2009-01-09 2010-01-08 Carte de circuit imprimé comprenant au moins un élément d'arrêt de faisceau laser, et procédé de fabrication de ladite carte

Publications (1)

Publication Number Publication Date
EP2386193A1 true EP2386193A1 (fr) 2011-11-16

Family

ID=42316135

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10701190A Ceased EP2386193A1 (fr) 2009-01-09 2010-01-08 Carte de circuit imprimé comprenant au moins un élément d'arrêt de faisceau laser, et procédé de fabrication de ladite carte

Country Status (5)

Country Link
EP (1) EP2386193A1 (fr)
JP (1) JP5693468B2 (fr)
CN (1) CN102349360B (fr)
AT (1) AT12321U1 (fr)
WO (1) WO2010078611A1 (fr)

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EP2810539B1 (fr) * 2012-02-03 2018-03-28 Avery Dennison Corporation Formation de motifs au laser sur film photovoltaïque arrière
EP2906654B1 (fr) 2012-10-09 2020-04-08 Avery Dennison Corporation Adhésifs et procédés associés
DE102013212665B4 (de) * 2013-06-28 2015-06-25 Laser Zentrum Hannover E.V. Verfahren zum Laserbohren oder Laserschneiden eines Werkstücks
EP3253837A1 (fr) 2015-02-05 2017-12-13 Avery Dennison Corporation Ensembles étiquettes pour environnements hostiles
DE102015113324A1 (de) 2015-08-12 2017-02-16 Schweizer Electronic Ag Leiterstrukturelement mit einlaminiertem Innenlagensubstrat und Verfahren zu dessen Herstellung
US10526511B2 (en) 2016-12-22 2020-01-07 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers
CN109219255A (zh) * 2018-11-14 2019-01-15 生益电子股份有限公司 一种非金属化阶梯槽的制作方法及pcb
KR20200106342A (ko) * 2019-03-04 2020-09-14 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN114543986A (zh) * 2022-03-07 2022-05-27 英特尔产品（成都）有限公司 光阻挡装置

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JP5693468B2 (ja) 2015-04-01
CN102349360B (zh) 2015-09-30
AT12321U1 (de) 2012-03-15
CN102349360A (zh) 2012-02-08
JP2012514859A (ja) 2012-06-28

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