WO2010078611A1 - Carte de circuit imprimé comprenant au moins un élément d'arrêt de faisceau laser, et procédé de fabrication de ladite carte - Google Patents

Carte de circuit imprimé comprenant au moins un élément d'arrêt de faisceau laser, et procédé de fabrication de ladite carte Download PDF

Info

Publication number
WO2010078611A1
WO2010078611A1 PCT/AT2010/000004 AT2010000004W WO2010078611A1 WO 2010078611 A1 WO2010078611 A1 WO 2010078611A1 AT 2010000004 W AT2010000004 W AT 2010000004W WO 2010078611 A1 WO2010078611 A1 WO 2010078611A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
layer
laser beam
particles
Prior art date
Application number
PCT/AT2010/000004
Other languages
German (de)
English (en)
Inventor
Markus Leitgeb
Andreas Zluc
Alexander Kasper
Original Assignee
At & S Austria Technologie & Systemtechnik Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & S Austria Technologie & Systemtechnik Aktiengesellschaft filed Critical At & S Austria Technologie & Systemtechnik Aktiengesellschaft
Priority to EP10701190A priority Critical patent/EP2386193A1/fr
Priority to CN201080011207.9A priority patent/CN102349360B/zh
Priority to JP2011544753A priority patent/JP5693468B2/ja
Publication of WO2010078611A1 publication Critical patent/WO2010078611A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Definitions

  • the invention relates to a printed circuit board element, in particular multilayer printed circuit board element, with a plurality of dielectric layers and conductor layers, and with at least one separate laser beam stop element in the interior of the printed circuit board element, around a laser beam used for drilling or cutting at a deep penetration into the Prevent PCB element.
  • the invention relates to a method for producing such a printed circuit board element.
  • Circuit board elements are generally constructed of different layers which are adhesively bonded together, whereby a thermal pressing process can be used.
  • multilayer printed circuit board elements so-called multilayer printed circuit board elements, a plurality of dielectric layers (insulating layers) and metallizations (conductor layers) are stacked on top of each other, thus producing conductive connections between electronic components at several levels.
  • Such printed circuit board elements are made of resin layers, e.g. Epoxy resin layers, and copper layers constructed, wherein at least two layers are provided.
  • this stopping effect is based on the fact that copper layers or generally metal layers reflect very well in the visible or infrared light range; For example, a CO 2 laser beam is reflected well on a copper layer. In contrast, a laser beam would cut copper in the UV range.
  • the invention provides a printed circuit board element as in claim 1 and a method as specified in claim 9.
  • Advantageous embodiments and further developments are specified in the dependent claims.
  • a separate, "additional" stop element for the laser beam is also introduced, but this stop element is now formed with small particles which receive and / or reflect the laser beam energy, and whose size is in particular in the nm to ⁇ m.
  • These particles consist in particular of a suitable metal, for example of gold, silver, copper, aluminum, tin and / or lead, but it is also possible to use other suitable refelective or fusible materials, for example ceramic particles.
  • the particles which may be, for example, spherical or platelet-shaped, are so small that the laser beam can not easily penetrate through the material of the layer, for example because of multiple reflection on the particles, if they are larger, or if the particles are not round but are platelet-shaped, or when a large proportion of particulate binder is present to the large particles with connect to each other, in which case this binder can not be reflected and penetrated by the laser beam. Even with such larger particles in the stop element, the reflection may be poor. In this way, it would be conceivable that with the laser beam enough energy can be introduced into the stop member to penetrate this, rather than that the laser beam is stopped. For small particles, however, on the one hand, the binder content can be very low, and on the other hand, the energy of the laser beam can be used to melt the material, or can be higher due to the higher proportion of particles, the reflection.
  • the particles should have a "nano-character", ie the particles should have a size at which the melting point of the nanoparticles deviates from the melting point of the general printed circuit board material, for example, with particles of silver having a particle size of about 100 nm proved to be advantageous.
  • This own stop element can, at least in those places where the restriction of the depth of cut or depth of the laser beam is desired, but of course also be applied over the entire surface of the underlying layer; In particular, it can also be structured in a conventional manner.
  • a printing technique for local application such as ink-jet printing, screen printing or the like, may preferably be used.
  • a structuring is also possible if the material of the additional stop layer is equipped in a conventional manner photosensitive, so that then with the aid of a conventional photoprocess, the structuring can be performed.
  • printing techniques as indicated above, or other coating methods, for example: spraying, etc., can be used.
  • the energy of the laser beam can also be used to completely or partially melt the particles, thereby stopping the laser beam at this point, except that the laser beam is similar on the known copper layer, completely or at least for the most part can be reflected.
  • a cooling effect By the thermal contact of the particles in the laser beam impingement area, by the way, a cooling effect, a heat dissipation, is effected.
  • the present stop element is preferably provided as an additional layer part, in particular in the form of a paste, and used up, e.g. printed, this paste containing the small particles and the binder.
  • the stopper for stopping a laser beam in a layer above or below a removable Separating layer or between two removable separating layers are used to prevent overlying and underlying resin layers from sticking together.
  • a part of a substrate ie a rigid resin layer
  • rigid-flex printed circuit board cf.
  • the attachment of the stop element to or between the separating layers also has the advantage that it can be removed together with the separating layers.
  • the laser stop element can also be present as a separate, prefabricated film (tape) and, for example, laminated onto a resin layer or inserted into a resin layer. Also in this case, there is a layered, separate, independently of the conductor layers mounted laser stop element, which is attached as an additional layer.
  • a frequently particularly favorable embodiment is further characterized in that the present particles are or are incorporated directly as a filler in one of the layers of the printed circuit board element.
  • the particles may be introduced into a respective resin layer of the circuit board member, but they may be incorporated in or contained in the aforementioned separation layers, in which case the separation layer additionally functions as a stopper member;
  • the separation layer additionally functions as a stopper member;
  • the latter serves as a laser stop pest.
  • stop elements will be present on a printed circuit board element as stop elements mounted in addition to conductor layers.
  • Fig. 1 shows a per se known multilayer printed circuit board element in a very schematic cross section, wherein also only very schematically a laser beam for cutting or drilling a Needles istslochs for a conductor layer is shown in the interior of the conductor element, wherein the laser beam to the inner conductor layer in a conventional manner (by reflection) is stopped;
  • Fig. 2 is a similar schematic cross-sectional view, but now compared to Fig. 1, the inner conductor layer is structured, so that the laser beam, when it is directed to a point where the inner conductor layer has no metal through the structuring, at a deeper Penetration is not hindered;
  • FIG. 3 shows a comparable schematic cross section through a printed circuit board element, wherein, however, a separate stop element with small particles for stopping the laser beam is now provided;
  • Fig. 4 is a similar cross section, but here with only two PCB layers, again with an additional stop element is provided for the laser beam, but now between two removable separating layers;
  • Figure 4A is a cross-sectional view similar to Figure 4, but now with only a removable release liner on which an auxiliary stop member is mounted;
  • Fig. 5 shows a single layer with a resin layer and an attached, already structured conductor layer, as well as with a layer provided above with small particles, which form an additional layer for the production of a separate element for stopping a laser beam during cutting or drilling of the finished Printed circuit board element is provided;
  • FIG. 6 shows a multilayer structure with three layers still shown separately for the multilayer structure, wherein the middle layer corresponds to that according to FIG. 5, after the additional layer has been patterned in order to form the additional stop elements according to the invention. Rankin to form, and wherein schematically also the pressing of the individual layers to the multilayer printed circuit board element is illustrated.
  • Fig. 1 is very schematic and not to scale a conventional per se structure of a multilayer printed circuit board element 1 is shown, wherein by way of example three layers 2, 3 and 4 are shown, but without the printed circuit board element structure should be limited thereto.
  • resin layers 5, 6 and 7 made of, for example, epoxy resin as known per se, and may contain glass fibers for reinforcement.
  • conductor layers metal layers, usually copper layers
  • a laser beam 12 is further indicated in Fig. 1; This laser beam 12 is used for drilling contact holes or for applying cuts, for example for removing parts of printed circuit board layers.
  • Such a removal of printed circuit board layer parts is provided, for example, when flexible parts of the printed circuit board element are desired, that is to say a so-called rigid flex printed circuit board is to be produced.
  • the penetration depth of the laser beam 12 is limited as shown in FIG. 1 by the inner copper layer 9, since this copper layer or metallization 9, the laser beam, such as a CO 2 laser beam, well reflected. Due to this reflection on the copper layer 9, therefore, the laser beam 12 can not penetrate further into the interior of the structure of the printed circuit board element 1.
  • metals used for conductor layers 8, 9, 10 and 11 reflect laser light in the visible or infrared range well; However, a laser beam in the UV range would cut a copper layer, for example.
  • the penetration depth during drilling or cutting of circuit board elements is otherwise controlled, with special, non-metallic spacer material parts embedded in the layer structure, their function in providing a space or distance is located for the UV laser, and which can be destroyed during drilling or cutting with the UV laser.
  • this method with the known "Distanzelmenten" is only suitable for a relatively slow cutting or drilling and requires the insertion of the spacer material in the interior of about the resin layers.
  • solder mask is already provided at the location of the conductor layer 9 (or also the conductor layer 10, if there also should be structuring), metallization nevertheless still lacks at the locations 13, so that the penetration depth of the laser beam 12 is not without can be further controlled or limited.
  • this auxiliary stopper 14 is mounted independently of (in addition to) the conductor layers, eg 9, and is formed with small particles which act as a laser beam stopper by reflecting the laser beam 12 thereon and / or its energy for reflowing is used by particles in this additional stop element 14.
  • FIG. 3 by way of example, such a locational The additional stop element 14 is shown in a metallization-free region 13 in an already structured conductor layer 9 of a printed circuit board element 1, which is otherwise constructed as shown in FIGS. 1 and 2.
  • the additive stopper 14 includes, as mentioned, small particles connected by a binder, which particles are so small that they melt earlier than the entire material complex. For example, silver particles and gold particles were tested for these "nano" particles, and it has been shown that good results can be achieved with silver particles and gold particles having a particle size of about 100 nm.
  • the present stop element 14 and its stop function are therefore the "smallness" of the particles in conjunction with the low binder content, or the reflection and absorption properties, in which case the energy of the laser beam 12 is also used, if necessary, the nano- Melting apart particles, except that the reflection at the stop element 14 can be comparable to that at a copper layer 9 (see Fig. 1), at any rate high.
  • nano-particles For example, copper, tin, lead, aluminum, generally metals that can be made into the "nano" particles, but also ceramics.
  • epoxy resins have proven suitable as binders; it may solvents based on ⁇ -terpin oil be used for the additional layer mass.
  • a layer mass can be produced in the form of a paste, which can be easily applied in the course of the production of the printed circuit board element 1 - as an addition to the other components.
  • a variety of printing techniques including screen printing or ink jet printing, and other coating techniques, e.g. also spray coating.
  • One possibility is also to first apply the paste in the form of a surface layer and then to structure this surface layer, which can be done by means of known photo-exposure techniques (with subsequent development processes) if photosensitive properties are provided for the paste. This will be explained in more detail below with reference to FIGS. 5 and 6.
  • the energy of the laser beam 12 is absorbed by the small particles, which energy is used to partially or completely melt the particles. Furthermore, the laser beam 12 is partially or completely reflected.
  • An advantage is further that, due to the thermal contact of the particles, the area where the laser beam 12 impinges is cooled, since heat is transported away by the particles.
  • the present laser beam stop 14 is particularly useful in applications where cuts are made in the printed circuit board element 1 by the laser beam 12, such as around a portion of a sheet, e.g. Layer 2 (see Fig. 1) so as to provide by removing the rigid resin part at this point a possible flexible printed circuit board area, as is known in the art.
  • a part 17 of the upper layer 5 with 8 could be removed from the remaining printed circuit board element 1.
  • This part 17 can be self-contained, e.g. its rectangle being formed by at least one separating layer 15, 16 and the stop element 14, and wherein the cut is made with the aid of the laser beam 12 around this part 17 in order to finally be able to remove the part 17.
  • This is not shown in detail in FIGS. 4 and 4A, but in itself, apart from the present stop element 14, is conventional technology.
  • a layer e.g. the layer 3 of the printed circuit board element 1 according to FIG. 1, with a resin layer 6 and an already structured conductor layer 9 applied thereon.
  • regions 13 are present in the conductor layer 9, where there is no more metallization.
  • This situation according to FIG. 5 is provided for an inner layer of a multilayer printed circuit board element 1 approximately according to FIGS. 1 to 3.
  • a particle surface layer 14 ' is now provided on the layer 3 in this example, for example, by brushing the paste and doctoring by spraying (spray-coa- ting), imprints or a similar known method can be done.
  • This surface layer 14 'of the paste with the nano-particles and the binder is additionally equipped with a photosensitive element, for example a commercially available photoinitiator together with a binder to be crosslinked.
  • the surface layer 14 'partially cured and partially attackable for an etchant are designed so that in a subsequent etching (or development step), much as in the structuring of Conductor layers, eg 9, takes place, a structured additional layer is obtained as a stop element 14, cf. Fig. 6.
  • the inner layer 3 is then stacked as shown in FIG. 6 together with the outer layers 2, 4 (and optionally with other inner layers, which are not shown) in a conventional manner on each other and - usually in conjunction with other such layer packages in the Type of "book", as it is known per se - arranged in a press and then with heating, in order to connect the layers 2, 3 and 4 sticking together, pressed, see the press parts 18, 19 shown in Fig 6. (It should be mentioned here that, of course, there are also non-thermal connection possibilities which can also be used if the present additional stop elements 14 are installed.)
  • Such pressing can of course also take place if the additional stop elements 14 have been attached in a different manner, for example by screen printing, at the desired locations (ie "structured").
  • Another way of achieving the present stop elements 14 independently of the conductor layers 8, 9, 10, 11 is, for example, also to incorporate the aforementioned particles directly as fillers in suitable layers or layers in a suitable manner.
  • the particles are thus in this case directly, as a "filler" in the resin system of a resin layer of the printed circuit board element or else optionally in a release layer 15 or 16 (in which case only one such release layer will be present), and the resin layer or Separation layer then acts as a laser stop layer or layer, ie as a laser stop element 14, again independently of the conductor layers 8, 9, 10, 11th
  • Another possibility for providing a stop element 14 may be that prefabricated stop elements 14 are present as a film (tape), wherein these stop element films are laminated on a (resin) layer or inserted in the layer structure.
  • the stop properties can be influenced via the reflection or absorption properties for which the particles and their size or shape are responsible, in particular.
  • the advantage here is that these additional stop elements 14 can be mounted anywhere in the multilayer structure, namely where later limiting the penetration depth of the laser beam when cutting or drilling of the printed circuit board element 1 is desired.
  • These variable application sites, as well as the flexible application methods, are of particular advantage.
  • a paste can be printed in layer form, with the nano-particles, or added to the circuit board element in another form, after which the conductor layers have been patterned and etched, without using a copper layer in the sense of a base layer is that can stop a laser beam.
  • the small particles reflected as mentioned, or possibly partially or completely melted and sintered to prevent the laser beam from further penetration into the printed circuit board element.
  • the laser stop element 14 is always shown (approximately) in a plane with the already structured conductor layer 9. But it is just as conceivable and possible, the additional stop element 14 within a resin layer, for example 6; to attach, as for the sake of simplicity in Fig. 3 - for the sake of simplicity additionally - indicated by dashed lines.
  • the resin layers consist, for example, of two layers before the pressing or gluing, as in the case of resin systems, for example Epoxy resin layers, which are formed from so-called prepregs, which are originally in film form and can be simply superimposed for pressing, about to achieve an increased insulation layer.
  • Epoxy resin layers which are formed from so-called prepregs, which are originally in film form and can be simply superimposed for pressing, about to achieve an increased insulation layer.
  • a photosensitive paste paste technologies are also applicable, whereby only a single-stage development process is used as the photographic process.
  • the additional layer mass there are, for example, pastes or inks filled with aluminum particles, wherein the aluminum particles are of the order of a few micrometers (eg approx. 4 ⁇ m) and are approximately platelet-shaped, so as to provide a layered arrangement during application (printing). to achieve.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne une carte de circuit imprimé (1), en particulier une carte de circuit imprimé multicouche, comportant plusieurs couches diélectriques (5, 6, 7) ainsi que des couches conductrices (8, 9, 10, 11), et comportant au moins un élément d'arrêt de faisceau laser (14) propre, différent des couches conductrices (8, 9, 10, 11), placé à l'intérieur de la carte de circuit imprimé, pour empêcher un faisceau laser utilisé pour le perçage ou la découpe de pénétrer profondément dans la carte de circuit imprimé, l'élément d'arrêt de faisceau laser étant constitué de particules absorbant et/ou réfléchissant l'énergie du faisceau laser. L'invention concerne également un procédé de fabrication correspondant.
PCT/AT2010/000004 2009-01-09 2010-01-08 Carte de circuit imprimé comprenant au moins un élément d'arrêt de faisceau laser, et procédé de fabrication de ladite carte WO2010078611A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP10701190A EP2386193A1 (fr) 2009-01-09 2010-01-08 Carte de circuit imprimé comprenant au moins un élément d'arrêt de faisceau laser, et procédé de fabrication de ladite carte
CN201080011207.9A CN102349360B (zh) 2009-01-09 2010-01-08 带有至少一个激光束阻挡元件的印刷电路板元件及其制造方法
JP2011544753A JP5693468B2 (ja) 2009-01-09 2010-01-08 少なくとも１つのレーザビームストップ素子を有するプリント基板素子ならびにプリント基板素子を作製する方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT0000509U AT12321U1 (de) 2009-01-09 2009-01-09 Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement
ATGM5/2009 2009-01-09

Publications (1)

Publication Number Publication Date
WO2010078611A1 true WO2010078611A1 (fr) 2010-07-15

Family

ID=42316135

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2010/000004 WO2010078611A1 (fr) 2009-01-09 2010-01-08 Carte de circuit imprimé comprenant au moins un élément d'arrêt de faisceau laser, et procédé de fabrication de ladite carte

Country Status (5)

Country Link
EP (1) EP2386193A1 (fr)
JP (1) JP5693468B2 (fr)
CN (1) CN102349360B (fr)
AT (1) AT12321U1 (fr)
WO (1) WO2010078611A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104247579A (zh) * 2012-02-03 2014-12-24 艾利丹尼森公司 光伏背板的激光图案化
DE102013212665A1 (de) * 2013-06-28 2014-12-31 Laser Zentrum Hannover E.V. Verfahren zum Laserbohren oder Laserschneiden eines Werkstücks
WO2017025552A1 (fr) 2015-08-12 2017-02-16 Schweizer Electronic Ag Élément à structure conductrice avec substrat de couche intérieure laminé et son procédé de fabrication
US9708509B2 (en) 2012-10-09 2017-07-18 Avery Dennison Corporation Adhesives and related methods
US10526511B2 (en) 2016-12-22 2020-01-07 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers
US11049421B2 (en) 2015-02-05 2021-06-29 Avery Dennison Corporation Label assemblies for adverse environments

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109219255A (zh) * 2018-11-14 2019-01-15 生益电子股份有限公司 一种非金属化阶梯槽的制作方法及pcb
KR20200106342A (ko) * 2019-03-04 2020-09-14 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN114543986A (zh) * 2022-03-07 2022-05-27 英特尔产品（成都）有限公司 光阻挡装置

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4931134A (en) 1989-08-15 1990-06-05 Parlex Corporation Method of using laser routing to form a rigid/flex circuit board
GB2231205A (en) * 1989-05-01 1990-11-07 Ibiden Co Ltd Method of manufacturing circuit board for mounting electronic components
JPH03165594A (ja) 1989-11-24 1991-07-17 Ibiden Co Ltd 多層プリント配線板の製造方法
US5108785A (en) 1989-09-15 1992-04-28 Microlithics Corporation Via formation method for multilayer interconnect board
EP0540184A1 (fr) * 1991-10-02 1993-05-05 American National Can Company Emballage entaillé avec un laser
JPH05235556A (ja) 1992-02-26 1993-09-10 Fujitsu Ltd 薄膜基板のパターンカット構造
EP1061785A2 (fr) * 1999-06-17 2000-12-20 Mitsubishi Gas Chemical Company, Inc. Panneau circuit imprimé multicouche à haute densité ayant des trous traversants à haute fiabilité et procédé de fabrication de ce panneau à circuit imprimé
JP2002271039A (ja) 2001-03-13 2002-09-20 Canon Inc 多層基板及びその加工方法
US20070089826A1 (en) 2005-10-17 2007-04-26 Sharp Kabushiki Kaisha Method for producing a multilayer printed wiring board
US20080099230A1 (en) * 2006-10-30 2008-05-01 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
WO2008098269A1 (fr) 2007-02-16 2008-08-21 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé pour enlever une portion d'une couche de matière plane, structure multicouche et leur utilisation
WO2008098271A1 (fr) 2007-02-16 2008-08-21 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Matière inhibitrice d'adhérence, procédé pour enlever une portion d'une couche de matière plane, structure multicouche et leur utilisation.
WO2008098270A1 (fr) 2007-02-16 2008-08-21 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé de fabrication d'une carte de circuits imprimés flexo-rigide et carte de circuits imprimés flexo-rigide
WO2008098272A1 (fr) 2007-02-16 2008-08-21 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé de fabrication d'une carte de circuits imprimés flexo-rigide et carte de circuits imprimés flexo-rigide

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060356A (ja) * 2001-08-09 2003-02-28 Ngk Spark Plug Co Ltd 多層プリント配線基板の製造方法
JP3759931B2 (ja) * 2003-02-18 2006-03-29 株式会社野田スクリーン 多層回路基板の製造方法
JP2005240092A (ja) * 2004-02-26 2005-09-08 Dowa Mining Co Ltd 銀粉およびその製造方法
TWI318173B (en) * 2004-03-01 2009-12-11 Sumitomo Electric Industries Metallic colloidal solution and inkjet-use metallic ink
JP2008288607A (ja) * 2008-07-04 2008-11-27 Shinko Electric Ind Co Ltd 電子部品実装構造の製造方法

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2231205A (en) * 1989-05-01 1990-11-07 Ibiden Co Ltd Method of manufacturing circuit board for mounting electronic components
US4931134A (en) 1989-08-15 1990-06-05 Parlex Corporation Method of using laser routing to form a rigid/flex circuit board
US5108785A (en) 1989-09-15 1992-04-28 Microlithics Corporation Via formation method for multilayer interconnect board
JPH03165594A (ja) 1989-11-24 1991-07-17 Ibiden Co Ltd 多層プリント配線板の製造方法
EP0540184A1 (fr) * 1991-10-02 1993-05-05 American National Can Company Emballage entaillé avec un laser
JPH05235556A (ja) 1992-02-26 1993-09-10 Fujitsu Ltd 薄膜基板のパターンカット構造
EP1061785A2 (fr) * 1999-06-17 2000-12-20 Mitsubishi Gas Chemical Company, Inc. Panneau circuit imprimé multicouche à haute densité ayant des trous traversants à haute fiabilité et procédé de fabrication de ce panneau à circuit imprimé
JP2002271039A (ja) 2001-03-13 2002-09-20 Canon Inc 多層基板及びその加工方法
US20070089826A1 (en) 2005-10-17 2007-04-26 Sharp Kabushiki Kaisha Method for producing a multilayer printed wiring board
US20080099230A1 (en) * 2006-10-30 2008-05-01 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
WO2008098269A1 (fr) 2007-02-16 2008-08-21 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé pour enlever une portion d'une couche de matière plane, structure multicouche et leur utilisation
WO2008098271A1 (fr) 2007-02-16 2008-08-21 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Matière inhibitrice d'adhérence, procédé pour enlever une portion d'une couche de matière plane, structure multicouche et leur utilisation.
WO2008098270A1 (fr) 2007-02-16 2008-08-21 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé de fabrication d'une carte de circuits imprimés flexo-rigide et carte de circuits imprimés flexo-rigide
WO2008098272A1 (fr) 2007-02-16 2008-08-21 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé de fabrication d'une carte de circuits imprimés flexo-rigide et carte de circuits imprimés flexo-rigide

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2386193A1 *

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104247579A (zh) * 2012-02-03 2014-12-24 艾利丹尼森公司 光伏背板的激光图案化
US10040978B2 (en) 2012-10-09 2018-08-07 Avery Dennison Corporation Adhesives and related methods
US10040973B2 (en) 2012-10-09 2018-08-07 Avery Dennison Corporation Adhesives and related methods
US10035930B2 (en) 2012-10-09 2018-07-31 Avery Dennison Corporation Adhesives and related methods
US11292942B2 (en) 2012-10-09 2022-04-05 Avery Dennison Corporation Adhesives and related methods
US9708509B2 (en) 2012-10-09 2017-07-18 Avery Dennison Corporation Adhesives and related methods
US9714365B2 (en) 2012-10-09 2017-07-25 Avery Dennison Corporation Adhesives and related methods
US9725623B2 (en) 2012-10-09 2017-08-08 Avery Dennison Corporation Adhesives and related methods
US11008483B2 (en) 2012-10-09 2021-05-18 Avery Dennison Corporation Adhesives and related methods
US11685841B2 (en) 2012-10-09 2023-06-27 Avery Dennison Corporation Adhesives and related methods
US10597560B2 (en) 2012-10-09 2020-03-24 Avery Dennison Corporation Adhesives and related methods
US9738817B2 (en) 2012-10-09 2017-08-22 Avery Dennison Corporation Adhesives and related methods
US10040974B2 (en) 2012-10-09 2018-08-07 Avery Dennison Corporation Adhesives and related methods
US10457838B2 (en) 2012-10-09 2019-10-29 Avery Dennison Corporation Adhesives and related methods
US10533117B2 (en) 2012-10-09 2020-01-14 Avery Dennison Corporation Adhesives and related methods
DE102013212665A1 (de) * 2013-06-28 2014-12-31 Laser Zentrum Hannover E.V. Verfahren zum Laserbohren oder Laserschneiden eines Werkstücks
DE102013212665B4 (de) * 2013-06-28 2015-06-25 Laser Zentrum Hannover E.V. Verfahren zum Laserbohren oder Laserschneiden eines Werkstücks
US11049421B2 (en) 2015-02-05 2021-06-29 Avery Dennison Corporation Label assemblies for adverse environments
DE102015113324A1 (de) 2015-08-12 2017-02-16 Schweizer Electronic Ag Leiterstrukturelement mit einlaminiertem Innenlagensubstrat und Verfahren zu dessen Herstellung
WO2017025552A1 (fr) 2015-08-12 2017-02-16 Schweizer Electronic Ag Élément à structure conductrice avec substrat de couche intérieure laminé et son procédé de fabrication
US10526511B2 (en) 2016-12-22 2020-01-07 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers

Also Published As

Publication number Publication date
EP2386193A1 (fr) 2011-11-16
JP2012514859A (ja) 2012-06-28
CN102349360A (zh) 2012-02-08
CN102349360B (zh) 2015-09-30
AT12321U1 (de) 2012-03-15
JP5693468B2 (ja) 2015-04-01

Similar Documents

Publication Publication Date Title
EP2386193A1 (fr) Carte de circuit imprimé comprenant au moins un élément d'arrêt de faisceau laser, et procédé de fabrication de ladite carte
DE60224611T2 (de) Leiterplatte mit eingebetteter elektrischer Vorrichtung und Verfahren zur Herstellung einer Leiterplatte mit eingebetteter elektrischer Vorrichtung
DE4006063C2 (de) Verfahren zur Herstellung einer Leiterplatte
EP2868170B1 (fr) Procédé permettant d'intégrer au moins un composant dans une carte de circuit imprimé
DE69725689T2 (de) Gedruckte Leiterplatte und elektronische Bauteile
EP2260683B1 (fr) Procédé de fabrication d'un module électronique
DE19615395A1 (de) Elektrostatische Schutzvorrichtung und Verfahren zu ihrer Herstellung
DE112008003532T5 (de) Verfahren zum Herstellen eines Mehrschichtverdrahtungssubstrats
WO2008098271A1 (fr) Matière inhibitrice d'adhérence, procédé pour enlever une portion d'une couche de matière plane, structure multicouche et leur utilisation.
WO2006063822A2 (fr) Structure multicouche pourvue d'un canal a fluide de regulation de temperature et procede de fabrication de ladite structure
DE102007024189A1 (de) Verfahren zur Herstellung einer elektronischen Baugruppe
EP2982226B1 (fr) Procédé de fabrication d'un élément de circuit imprimé
DE112012002829T5 (de) Mehrschichtige Leiterplatte und Verfahren zum Herstellen einer mehrschichtigen Leiterplatte
DE102006004320A1 (de) Leiterplatte mit funktionalen Elementen und selektiv gefüllten und thermisch leitfähigen Durchsteigelöchern sowie Herstellverfahren und Anwendung
WO2004030429A1 (fr) Procede de production de cartes imprimees flexo-rigides et carte imprimee comprenant au moins une zone rigide et au moins une zone flexible
DE10335805A1 (de) Leiterplatte und Verfahren zu ihrer Herstellung
EP0849981A1 (fr) Panneau à circuit à double face ou multicouche laminé d'un film en cuivre et méthode de fabrication associé
EP0282078B1 (fr) Procédé de fabrication d'un circuit électrique comportant un noyau métallique et matériau de base utilisé
EP3066898B1 (fr) Circuit imprimé
EP2988576B1 (fr) Assemblage avec carte de circuit pour dispositifs d'eclairage de vehicule automobile
DE102011016512A1 (de) Verfahren zur Durchkontaktierung elektrisch leitfähiger Strukturen an entgegengesetzten Oberflächen eines Substrats
AT399250B (de) Multilayerleiterplatte sowie verfahren zu ihrer herstellung
DE10136114B4 (de) Verfahren zur Herstellung eines flächigen Schaltungsträgers
DE10258090A1 (de) Verfahren zur Herstellung von starr-flexiblen Leiterplatten und Leiterplatten mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich
DE19515159A1 (de) Verbindungsanordnung und Verfahren zur Herstellung einer Verbindungsanordnung für Multilayer-Schaltungen

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201080011207.9

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10701190

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2011544753

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2010701190

Country of ref document: EP