AR208032A1 - Metodo de chapeado por inmersion de una aleacion de estanoplomo sobre un substrato metalico en el cual el substrato se trata por inmersion en una solucion de una sal de estano y dicha solucion - Google Patents
Metodo de chapeado por inmersion de una aleacion de estanoplomo sobre un substrato metalico en el cual el substrato se trata por inmersion en una solucion de una sal de estano y dicha solucionInfo
- Publication number
- AR208032A1 AR208032A1 AR263029A AR26302976A AR208032A1 AR 208032 A1 AR208032 A1 AR 208032A1 AR 263029 A AR263029 A AR 263029A AR 26302976 A AR26302976 A AR 26302976A AR 208032 A1 AR208032 A1 AR 208032A1
- Authority
- AR
- Argentina
- Prior art keywords
- immersion
- solution
- substrate
- stanoplome
- staane
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/574,979 US4093466A (en) | 1975-05-06 | 1975-05-06 | Electroless tin and tin-lead alloy plating baths |
Publications (1)
Publication Number | Publication Date |
---|---|
AR208032A1 true AR208032A1 (es) | 1976-11-22 |
Family
ID=24298412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AR263029A AR208032A1 (es) | 1975-05-06 | 1976-01-01 | Metodo de chapeado por inmersion de una aleacion de estanoplomo sobre un substrato metalico en el cual el substrato se trata por inmersion en una solucion de una sal de estano y dicha solucion |
Country Status (16)
Country | Link |
---|---|
US (1) | US4093466A (xx) |
JP (1) | JPS51134334A (xx) |
AR (1) | AR208032A1 (xx) |
AU (1) | AU502810B2 (xx) |
BE (1) | BE841417A (xx) |
BR (1) | BR7602706A (xx) |
CA (1) | CA1049704A (xx) |
CH (1) | CH597361A5 (xx) |
DE (1) | DE2616409A1 (xx) |
ES (1) | ES447301A1 (xx) |
FI (1) | FI761203A (xx) |
FR (1) | FR2310419A1 (xx) |
GB (1) | GB1492506A (xx) |
IT (1) | IT1059580B (xx) |
NL (1) | NL7603849A (xx) |
SE (1) | SE7604725L (xx) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4194913A (en) * | 1975-05-06 | 1980-03-25 | Amp Incorporated | Electroless tin and tin-lead alloy plating baths |
IT1106957B (it) * | 1978-01-11 | 1985-11-18 | Alfachimici Spa | Composizione per la stagnatura anelettrica di metallo specialmente con procedimenti a spruzzo |
US4511403A (en) * | 1979-01-22 | 1985-04-16 | Shipley Company Inc. | Immersion tin composition and process for using |
US4234631A (en) * | 1979-07-20 | 1980-11-18 | Amp Incorporated | Method for immersion deposition of tin and tin-lead alloys |
US4419122A (en) * | 1981-10-19 | 1983-12-06 | Rohm And Haas Company | Herbicidal 4-trifluoromethyl-3'-oxygen-substituted-4'-substituted diphenyl ethers |
US4405663A (en) * | 1982-03-29 | 1983-09-20 | Republic Steel Corporation | Tin plating bath composition and process |
US4749626A (en) * | 1985-08-05 | 1988-06-07 | Olin Corporation | Whisker resistant tin coatings and baths and methods for making such coatings |
JPH02197580A (ja) * | 1989-01-24 | 1990-08-06 | Okuno Seiyaku Kogyo Kk | 無電解ハンダめっき浴 |
JP2815401B2 (ja) * | 1989-06-02 | 1998-10-27 | 株式会社 シミズ | 浸漬はんだめつき浴 |
US5143544A (en) * | 1990-06-04 | 1992-09-01 | Shipley Company Inc. | Tin lead plating solution |
JP2654715B2 (ja) * | 1990-07-12 | 1997-09-17 | 上村工業 株式会社 | 無電解錫及び錫・鉛合金めっき浴並びにめっき方法 |
JPH04363093A (ja) * | 1990-11-27 | 1992-12-15 | Mitsubishi Electric Corp | プリント基板の製造方法 |
JP2787142B2 (ja) * | 1991-03-01 | 1998-08-13 | 上村工業 株式会社 | 無電解錫、鉛又はそれらの合金めっき方法 |
US5266103A (en) * | 1991-07-04 | 1993-11-30 | C. Uyemura & Co., Ltd. | Bath and method for the electroless plating of tin and tin-lead alloy |
US5393573A (en) * | 1991-07-16 | 1995-02-28 | Microelectronics And Computer Technology Corporation | Method of inhibiting tin whisker growth |
US5296268A (en) * | 1991-09-03 | 1994-03-22 | Shipley Company Inc. | Pretreatment process of tin lead plating |
DE4238765A1 (de) * | 1992-11-10 | 1994-05-11 | Stuebing Gmbh | Verfahren zur stromlosen Verzinnung von Leiterplatten und deren Verwendung |
US6200636B1 (en) * | 1998-08-19 | 2001-03-13 | The University Of Cincinnati | Fluxing process for galvanization of steel |
US6372296B2 (en) * | 1999-05-21 | 2002-04-16 | University Of Cincinnati | High aluminum galvanized steel |
US6361823B1 (en) | 1999-12-03 | 2002-03-26 | Atotech Deutschland Gmbh | Process for whisker-free aqueous electroless tin plating |
US6906539B2 (en) * | 2000-07-19 | 2005-06-14 | Texas Instruments Incorporated | High density, area array probe card apparatus |
JP4228234B2 (ja) * | 2004-07-08 | 2009-02-25 | 株式会社フジクラ | フレキシブルプリント配線基板端子部或いはフレキシブルフラットケーブル端子部 |
US8404160B2 (en) * | 2007-05-18 | 2013-03-26 | Applied Nanotech Holdings, Inc. | Metallic ink |
US10231344B2 (en) * | 2007-05-18 | 2019-03-12 | Applied Nanotech Holdings, Inc. | Metallic ink |
US8226807B2 (en) | 2007-12-11 | 2012-07-24 | Enthone Inc. | Composite coatings for whisker reduction |
US20090145764A1 (en) * | 2007-12-11 | 2009-06-11 | Enthone Inc. | Composite coatings for whisker reduction |
US8506849B2 (en) * | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
JP2009231065A (ja) * | 2008-03-24 | 2009-10-08 | Fujikura Ltd | 錫系めっき平角導体およびフレキシブルフラットケーブル |
US20090286383A1 (en) * | 2008-05-15 | 2009-11-19 | Applied Nanotech Holdings, Inc. | Treatment of whiskers |
US9730333B2 (en) * | 2008-05-15 | 2017-08-08 | Applied Nanotech Holdings, Inc. | Photo-curing process for metallic inks |
US20100000762A1 (en) * | 2008-07-02 | 2010-01-07 | Applied Nanotech Holdings, Inc. | Metallic pastes and inks |
JP5740389B2 (ja) | 2009-03-27 | 2015-06-24 | アプライド・ナノテック・ホールディングス・インコーポレーテッド | 光焼結及び/またはレーザー焼結を強化するためのバッファ層 |
US8422197B2 (en) * | 2009-07-15 | 2013-04-16 | Applied Nanotech Holdings, Inc. | Applying optical energy to nanoparticles to produce a specified nanostructure |
US8834958B2 (en) | 2011-07-08 | 2014-09-16 | The United States Of America As Represented By The Secretary Of The Army | Process of making negative electrode |
TW201419315A (zh) | 2012-07-09 | 2014-05-16 | Applied Nanotech Holdings Inc | 微米尺寸銅粒子的光燒結法 |
US10858748B2 (en) | 2017-06-30 | 2020-12-08 | Apollo Energy Systems, Inc. | Method of manufacturing hybrid metal foams |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2369620A (en) * | 1941-03-07 | 1945-02-13 | Battelle Development Corp | Method of coating cupreous metal with tin |
US3050410A (en) * | 1960-09-15 | 1962-08-21 | Gen Motors Corp | Method of coating aluminum with lead |
US3303029A (en) * | 1964-01-23 | 1967-02-07 | Shipley Co | Tin coating of copper surfaces by replacement plating |
JPS4988746A (xx) * | 1972-12-26 | 1974-08-24 | ||
SU455171A1 (ru) * | 1973-02-14 | 1974-12-30 | Предприятие П/Я А-7284 | Раствор дл химического осаждени сплава олово-свинец |
-
1975
- 1975-05-06 US US05/574,979 patent/US4093466A/en not_active Expired - Lifetime
-
1976
- 1976-01-01 AR AR263029A patent/AR208032A1/es active
- 1976-03-29 CA CA249,074A patent/CA1049704A/en not_active Expired
- 1976-03-31 GB GB12910/76A patent/GB1492506A/en not_active Expired
- 1976-04-06 IT IT7621975A patent/IT1059580B/it active
- 1976-04-07 AU AU12779/76A patent/AU502810B2/en not_active Expired
- 1976-04-12 NL NL7603849A patent/NL7603849A/xx not_active Application Discontinuation
- 1976-04-14 DE DE19762616409 patent/DE2616409A1/de active Pending
- 1976-04-17 CH CH484776A patent/CH597361A5/xx not_active IP Right Cessation
- 1976-04-22 JP JP51045014A patent/JPS51134334A/ja active Pending
- 1976-04-23 ES ES447301A patent/ES447301A1/es not_active Expired
- 1976-04-23 SE SE7604725A patent/SE7604725L/xx unknown
- 1976-04-26 FR FR7612273A patent/FR2310419A1/fr not_active Withdrawn
- 1976-04-29 FI FI761203A patent/FI761203A/fi not_active Application Discontinuation
- 1976-04-30 BR BR2706/76A patent/BR7602706A/pt unknown
- 1976-05-03 BE BE166694A patent/BE841417A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
DE2616409A1 (de) | 1976-11-25 |
GB1492506A (en) | 1977-11-23 |
CA1049704A (en) | 1979-03-06 |
NL7603849A (nl) | 1976-11-09 |
JPS51134334A (en) | 1976-11-20 |
CH597361A5 (xx) | 1978-03-31 |
BR7602706A (pt) | 1976-11-09 |
FR2310419A1 (fr) | 1976-12-03 |
ES447301A1 (es) | 1977-12-01 |
AU1277976A (en) | 1977-10-13 |
SE7604725L (sv) | 1976-11-07 |
AU502810B2 (en) | 1979-08-09 |
BE841417A (fr) | 1976-11-03 |
IT1059580B (it) | 1982-06-21 |
FI761203A (xx) | 1976-11-07 |
US4093466A (en) | 1978-06-06 |
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