IT1035454B - Metod e bagno di placcatura chimica - Google Patents

Metod e bagno di placcatura chimica

Info

Publication number
IT1035454B
IT1035454B IT49280/75A IT4928075A IT1035454B IT 1035454 B IT1035454 B IT 1035454B IT 49280/75 A IT49280/75 A IT 49280/75A IT 4928075 A IT4928075 A IT 4928075A IT 1035454 B IT1035454 B IT 1035454B
Authority
IT
Italy
Prior art keywords
metod
plating bath
chemical plating
chemical
bath
Prior art date
Application number
IT49280/75A
Other languages
English (en)
Original Assignee
Engelhard Min & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Min & Chem filed Critical Engelhard Min & Chem
Application granted granted Critical
Publication of IT1035454B publication Critical patent/IT1035454B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
IT49280/75A 1974-04-26 1975-04-24 Metod e bagno di placcatura chimica IT1035454B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US464666A US3917885A (en) 1974-04-26 1974-04-26 Electroless gold plating process

Publications (1)

Publication Number Publication Date
IT1035454B true IT1035454B (it) 1979-10-20

Family

ID=23844812

Family Applications (1)

Application Number Title Priority Date Filing Date
IT49280/75A IT1035454B (it) 1974-04-26 1975-04-24 Metod e bagno di placcatura chimica

Country Status (10)

Country Link
US (1) US3917885A (it)
JP (1) JPS5818430B2 (it)
BR (1) BR7502540A (it)
CA (1) CA1038559A (it)
DD (1) DD117488A5 (it)
DE (1) DE2518559A1 (it)
FR (1) FR2268595B1 (it)
GB (1) GB1448659A (it)
IT (1) IT1035454B (it)
MX (1) MX146110A (it)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4082908A (en) * 1976-05-05 1978-04-04 Burr-Brown Research Corporation Gold plating process and product produced thereby
DE2747562A1 (de) * 1977-10-20 1979-05-03 Schering Ag Verfahren und anlage zur wiedergewinnung von im abwasser von anlagen zur chemischen oberflaechenbehandlung befindlichen metallen und anderen wertstoffen
US4162337A (en) * 1977-11-14 1979-07-24 Bell Telephone Laboratories, Incorporated Process for fabricating III-V semiconducting devices with electroless gold plating
FR2441666A1 (fr) * 1978-11-16 1980-06-13 Prost Tournier Patrick Procede de depot chimique d'or par reduction autocatalytique
US4340451A (en) * 1979-12-17 1982-07-20 Bell Telephone Laboratories, Incorporated Method of replenishing gold/in plating baths
DE3029785A1 (de) * 1980-08-04 1982-03-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Saures goldbad zur stromlosen abscheidung von gold
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating
US4374876A (en) * 1981-06-02 1983-02-22 Occidental Chemical Corporation Process for the immersion deposition of gold
US4474838A (en) * 1982-12-01 1984-10-02 Omi International Corporation Electroless direct deposition of gold on metallized ceramics
JPS60179127U (ja) * 1984-05-09 1985-11-28 ヤンマー農機株式会社 コンバイン
US4822641A (en) * 1985-04-30 1989-04-18 Inovan Gmbh & Co. Kg Method of manufacturing a contact construction material structure
US4863766A (en) * 1986-09-02 1989-09-05 General Electric Company Electroless gold plating composition and method for plating
US4925491A (en) * 1986-09-30 1990-05-15 Lamerie, N.V. Solutions and creams for silver plating and polishing
US4798626A (en) * 1986-09-30 1989-01-17 Lamerie, N.V. Solutions and creams for silver plating and polishing
US4919720A (en) * 1988-06-30 1990-04-24 Learonal, Inc. Electroless gold plating solutions
ES2032104T3 (es) * 1988-11-15 1993-01-01 H.B.T. Holland Biotechnology B.V. Proceso para la preparacion de coloides.
US5130168A (en) * 1988-11-22 1992-07-14 Technic, Inc. Electroless gold plating bath and method of using same
US4978559A (en) * 1989-11-03 1990-12-18 General Electric Company Autocatalytic electroless gold plating composition
US4979988A (en) * 1989-12-01 1990-12-25 General Electric Company Autocatalytic electroless gold plating composition
US5206055A (en) * 1991-09-03 1993-04-27 General Electric Company Method for enhancing the uniform electroless deposition of gold onto a palladium substrate
US5338343A (en) * 1993-07-23 1994-08-16 Technic Incorporated Catalytic electroless gold plating baths
EP1245697A3 (de) * 2002-07-17 2003-02-19 ATOTECH Deutschland GmbH Verfahren zum aussenstromlosen Abscheiden von Silber
JP2004176171A (ja) * 2002-09-30 2004-06-24 Shinko Electric Ind Co Ltd 非シアン電解金めっき液
US20060141149A1 (en) * 2004-12-29 2006-06-29 Industrial Technology Research Institute Method for forming superparamagnetic nanoparticles
US20090139264A1 (en) * 2007-11-30 2009-06-04 Rachel Brown Antique jewelry articles and methods of making same
US11579344B2 (en) 2012-09-17 2023-02-14 Government Of The United States Of America, As Represented By The Secretary Of Commerce Metallic grating
US20150345039A1 (en) * 2015-07-20 2015-12-03 National Institute Of Standards And Technology Composition having alkaline ph and process for forming superconformation therewith
CN102925933B (zh) * 2012-11-05 2015-03-04 福州大学 一种Au-FeNi两段式合金纳米马达及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3230098A (en) * 1962-10-09 1966-01-18 Engelhard Ind Inc Immersion plating with noble metals
US3515571A (en) * 1963-07-02 1970-06-02 Lockheed Aircraft Corp Deposition of gold films
US3294578A (en) * 1963-10-22 1966-12-27 Gen Aniline & Film Corp Deposition of a metallic coat on metal surfaces
US3589916A (en) * 1964-06-24 1971-06-29 Photocircuits Corp Autocatalytic gold plating solutions
US3506462A (en) * 1966-10-29 1970-04-14 Nippon Electric Co Electroless gold plating solutions
US3482974A (en) * 1966-12-27 1969-12-09 Gen Electric Method of plating gold films onto oxide-free silicon substrates
US3700469A (en) * 1971-03-08 1972-10-24 Bell Telephone Labor Inc Electroless gold plating baths
US3697296A (en) * 1971-03-09 1972-10-10 Du Pont Electroless gold plating bath and process

Also Published As

Publication number Publication date
JPS5818430B2 (ja) 1983-04-13
US3917885A (en) 1975-11-04
JPS50149542A (it) 1975-11-29
DE2518559A1 (de) 1975-11-13
FR2268595A1 (it) 1975-11-21
CA1038559A (en) 1978-09-19
GB1448659A (en) 1976-09-08
FR2268595B1 (it) 1981-03-20
DD117488A5 (it) 1976-01-12
BR7502540A (pt) 1976-03-03
MX146110A (es) 1982-05-18
AU8052375A (en) 1976-10-28

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