SE7604725L - Beleggning eller pletering av tenn-blylegeringar medelst doppning - Google Patents

Beleggning eller pletering av tenn-blylegeringar medelst doppning

Info

Publication number
SE7604725L
SE7604725L SE7604725A SE7604725A SE7604725L SE 7604725 L SE7604725 L SE 7604725L SE 7604725 A SE7604725 A SE 7604725A SE 7604725 A SE7604725 A SE 7604725A SE 7604725 L SE7604725 L SE 7604725L
Authority
SE
Sweden
Prior art keywords
tenn
doping
plating
coating
lead alloys
Prior art date
Application number
SE7604725A
Other languages
English (en)
Inventor
T F Davis
Original Assignee
Amp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amp Inc filed Critical Amp Inc
Publication of SE7604725L publication Critical patent/SE7604725L/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SE7604725A 1975-05-06 1976-04-23 Beleggning eller pletering av tenn-blylegeringar medelst doppning SE7604725L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/574,979 US4093466A (en) 1975-05-06 1975-05-06 Electroless tin and tin-lead alloy plating baths

Publications (1)

Publication Number Publication Date
SE7604725L true SE7604725L (sv) 1976-11-07

Family

ID=24298412

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7604725A SE7604725L (sv) 1975-05-06 1976-04-23 Beleggning eller pletering av tenn-blylegeringar medelst doppning

Country Status (16)

Country Link
US (1) US4093466A (sv)
JP (1) JPS51134334A (sv)
AR (1) AR208032A1 (sv)
AU (1) AU502810B2 (sv)
BE (1) BE841417A (sv)
BR (1) BR7602706A (sv)
CA (1) CA1049704A (sv)
CH (1) CH597361A5 (sv)
DE (1) DE2616409A1 (sv)
ES (1) ES447301A1 (sv)
FI (1) FI761203A (sv)
FR (1) FR2310419A1 (sv)
GB (1) GB1492506A (sv)
IT (1) IT1059580B (sv)
NL (1) NL7603849A (sv)
SE (1) SE7604725L (sv)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4194913A (en) * 1975-05-06 1980-03-25 Amp Incorporated Electroless tin and tin-lead alloy plating baths
IT1106957B (it) * 1978-01-11 1985-11-18 Alfachimici Spa Composizione per la stagnatura anelettrica di metallo specialmente con procedimenti a spruzzo
US4511403A (en) * 1979-01-22 1985-04-16 Shipley Company Inc. Immersion tin composition and process for using
US4234631A (en) * 1979-07-20 1980-11-18 Amp Incorporated Method for immersion deposition of tin and tin-lead alloys
US4419123A (en) * 1981-10-19 1983-12-06 Rohm And Haas Company Herbicidal 4-trifluoromethyl-3'-carbon-substituted-4'-substituted diphenyl ethers
US4405663A (en) * 1982-03-29 1983-09-20 Republic Steel Corporation Tin plating bath composition and process
US4749626A (en) * 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
JPH02197580A (ja) * 1989-01-24 1990-08-06 Okuno Seiyaku Kogyo Kk 無電解ハンダめっき浴
JP2815401B2 (ja) * 1989-06-02 1998-10-27 株式会社 シミズ 浸漬はんだめつき浴
US5143544A (en) * 1990-06-04 1992-09-01 Shipley Company Inc. Tin lead plating solution
JP2654715B2 (ja) * 1990-07-12 1997-09-17 上村工業 株式会社 無電解錫及び錫・鉛合金めっき浴並びにめっき方法
JPH04363093A (ja) * 1990-11-27 1992-12-15 Mitsubishi Electric Corp プリント基板の製造方法
JP2787142B2 (ja) * 1991-03-01 1998-08-13 上村工業 株式会社 無電解錫、鉛又はそれらの合金めっき方法
US5266103A (en) * 1991-07-04 1993-11-30 C. Uyemura & Co., Ltd. Bath and method for the electroless plating of tin and tin-lead alloy
US5393573A (en) * 1991-07-16 1995-02-28 Microelectronics And Computer Technology Corporation Method of inhibiting tin whisker growth
US5296268A (en) * 1991-09-03 1994-03-22 Shipley Company Inc. Pretreatment process of tin lead plating
DE4238765A1 (de) * 1992-11-10 1994-05-11 Stuebing Gmbh Verfahren zur stromlosen Verzinnung von Leiterplatten und deren Verwendung
US6200636B1 (en) * 1998-08-19 2001-03-13 The University Of Cincinnati Fluxing process for galvanization of steel
US6372296B2 (en) * 1999-05-21 2002-04-16 University Of Cincinnati High aluminum galvanized steel
US6361823B1 (en) 1999-12-03 2002-03-26 Atotech Deutschland Gmbh Process for whisker-free aqueous electroless tin plating
US6906539B2 (en) * 2000-07-19 2005-06-14 Texas Instruments Incorporated High density, area array probe card apparatus
JP4228234B2 (ja) * 2004-07-08 2009-02-25 株式会社フジクラ フレキシブルプリント配線基板端子部或いはフレキシブルフラットケーブル端子部
US10231344B2 (en) * 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US8404160B2 (en) * 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
US8226807B2 (en) 2007-12-11 2012-07-24 Enthone Inc. Composite coatings for whisker reduction
US20090145764A1 (en) * 2007-12-11 2009-06-11 Enthone Inc. Composite coatings for whisker reduction
US8506849B2 (en) * 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
JP2009231065A (ja) * 2008-03-24 2009-10-08 Fujikura Ltd 錫系めっき平角導体およびフレキシブルフラットケーブル
US20090286383A1 (en) * 2008-05-15 2009-11-19 Applied Nanotech Holdings, Inc. Treatment of whiskers
US9730333B2 (en) * 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
US20100000762A1 (en) * 2008-07-02 2010-01-07 Applied Nanotech Holdings, Inc. Metallic pastes and inks
US8647979B2 (en) 2009-03-27 2014-02-11 Applied Nanotech Holdings, Inc. Buffer layer to enhance photo and/or laser sintering
US8422197B2 (en) * 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
US8834958B2 (en) 2011-07-08 2014-09-16 The United States Of America As Represented By The Secretary Of The Army Process of making negative electrode
WO2014011578A1 (en) 2012-07-09 2014-01-16 Applied Nanotech Holdings, Inc. Photosintering of micron-sized copper particles
US10858748B2 (en) 2017-06-30 2020-12-08 Apollo Energy Systems, Inc. Method of manufacturing hybrid metal foams

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2369620A (en) * 1941-03-07 1945-02-13 Battelle Development Corp Method of coating cupreous metal with tin
US3050410A (en) * 1960-09-15 1962-08-21 Gen Motors Corp Method of coating aluminum with lead
US3303029A (en) * 1964-01-23 1967-02-07 Shipley Co Tin coating of copper surfaces by replacement plating
JPS4988746A (sv) * 1972-12-26 1974-08-24
SU455171A1 (ru) * 1973-02-14 1974-12-30 Предприятие П/Я А-7284 Раствор дл химического осаждени сплава олово-свинец

Also Published As

Publication number Publication date
AR208032A1 (es) 1976-11-22
AU1277976A (en) 1977-10-13
NL7603849A (nl) 1976-11-09
DE2616409A1 (de) 1976-11-25
BR7602706A (pt) 1976-11-09
CH597361A5 (sv) 1978-03-31
AU502810B2 (en) 1979-08-09
FR2310419A1 (fr) 1976-12-03
ES447301A1 (es) 1977-12-01
US4093466A (en) 1978-06-06
JPS51134334A (en) 1976-11-20
CA1049704A (en) 1979-03-06
BE841417A (fr) 1976-11-03
IT1059580B (it) 1982-06-21
GB1492506A (en) 1977-11-23
FI761203A (sv) 1976-11-07

Similar Documents

Publication Publication Date Title
SE7604725L (sv) Beleggning eller pletering av tenn-blylegeringar medelst doppning
SE416742B (sv) Med ytbeleggning forsett foremal av varmhallfast legering
IT1062136B (it) Composizione di rivestimento di fluoropolimero con aderenza migliorata
FR2332312A1 (fr) Composition de revetement auto-enlevable
FR2277902A1 (fr) Revetement en alliage du type mcraly
IT1067508B (it) Composizione di rivestimento indurible mediante raiazione
BE844676A (fr) Compositions de revetement
IT1064756B (it) Insiemi di pellicole rivestiti
DK437376A (da) Overtrekskomposition
IT1063379B (it) Composizioni di fluoropolimeri,per rivestimenti,aventi aderenza migliorata
ATA46576A (de) Haertbare ueberzugsmasse
DK377775A (da) Bagbekledning af guldbelegninger med polyurethaner
AR198566A1 (es) Metodo de recubrir sustratos
FR2333841A1 (fr) Composition de revetement
FR2306243A1 (fr) Composition de revetement hydrophyle
FR2302578A1 (fr) Compositions de revetements i
BE845992A (fr) Revetement de facade
SE443376B (sv) Dikromatlakning av kopparanodslam
SE7612920L (sv) Beleggningskompositioner
SE7607677L (sv) Forbettring av lodbarhet
SE7610423L (sv) Forfarande for framstellning av beleggningar
SE7607429L (sv) Anvendning av aluminiumlegering
DD132272A5 (de) Schutzschichtzusammensetzung
NO148193C (no) Anordning for elektrolytisk belegging av flater.
SE7610517L (sv) Elektrolytisk beleggning