AR090374A1 - Blanco adecuado a un sistema de refrigeracion indirecto y fuente de recubrimiento - Google Patents

Blanco adecuado a un sistema de refrigeracion indirecto y fuente de recubrimiento

Info

Publication number
AR090374A1
AR090374A1 ARP130100883A ARP130100883A AR090374A1 AR 090374 A1 AR090374 A1 AR 090374A1 AR P130100883 A ARP130100883 A AR P130100883A AR P130100883 A ARP130100883 A AR P130100883A AR 090374 A1 AR090374 A1 AR 090374A1
Authority
AR
Argentina
Prior art keywords
indirect cooling
source
cooling system
covering source
white suitable
Prior art date
Application number
ARP130100883A
Other languages
English (en)
Inventor
Krassnitzer Siegfried
Hagmann Juerg
Original Assignee
Oerlikon Trading Ag Trübbach
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Trading Ag Trübbach filed Critical Oerlikon Trading Ag Trübbach
Publication of AR090374A1 publication Critical patent/AR090374A1/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
  • Endoscopes (AREA)

Abstract

La presente se refiere un blanco que está conformado corno fuente de material para un procedimiento de separación de la fase gaseosa con un lado anterior y un lado posterior, caracterizado porque en el lado posterior se encuentra adherida una lámina de carbono autoadhesiva. El blanco puede haberse conformado corno fuente de material para un procedimiento de pulverización catódica y/o para un procedimiento de evaporación de chispa. De manera especialmente ventajosa, el blanco se coloca en una fuente de recubrimiento con refrigeración indirecta, encontrándose la lámina de carbono autoadhesiva con su superficie en contacto con una membrana que es parte de un canal de refrigeración.
ARP130100883A 2012-04-04 2013-03-19 Blanco adecuado a un sistema de refrigeracion indirecto y fuente de recubrimiento AR090374A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102012006717A DE102012006717A1 (de) 2012-04-04 2012-04-04 An eine indirekte Kühlvorrichtung angepasstes Target

Publications (1)

Publication Number Publication Date
AR090374A1 true AR090374A1 (es) 2014-11-05

Family

ID=47884231

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP130100883A AR090374A1 (es) 2012-04-04 2013-03-19 Blanco adecuado a un sistema de refrigeracion indirecto y fuente de recubrimiento

Country Status (14)

Country Link
US (1) US9934951B2 (es)
EP (1) EP2834389B1 (es)
JP (1) JP6407857B2 (es)
KR (2) KR102372968B1 (es)
CN (1) CN104204286B (es)
AR (1) AR090374A1 (es)
DE (1) DE102012006717A1 (es)
ES (1) ES2617518T3 (es)
HU (1) HUE033200T2 (es)
IN (1) IN2014DN08522A (es)
MX (1) MX356932B (es)
PL (1) PL2834389T3 (es)
RU (1) RU2631571C2 (es)
WO (1) WO2013149692A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102234454B1 (ko) 2013-04-08 2021-04-01 외를리콘 서피스 솔루션즈 아게, 페피콘 향상된 전력 호환가능성을 갖는 스퍼터링 표적
CN108130516A (zh) * 2018-01-03 2018-06-08 梧州三和新材料科技有限公司 一种使用泡沫金属增强冷却的真空镀阴极靶
CN108203812B (zh) * 2018-01-25 2020-02-07 京东方科技集团股份有限公司 一种基板固定载具、蒸镀设备及蒸镀方法
RU190474U1 (ru) * 2018-12-24 2019-07-02 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный технологический университет "СТАНКИН" (ФГБОУ ВО "МГТУ "СТАНКИН") Электродуговой испаритель
US10964015B2 (en) 2019-01-15 2021-03-30 International Business Machines Corporation Product defect detection
CN112626482A (zh) * 2020-12-15 2021-04-09 华能新能源股份有限公司 一种真空蒸镀用基片温度控制装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
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SU823459A1 (ru) * 1979-06-11 1981-04-23 Предприятие П/Я А-1067 Катодный узел
CH664303A5 (de) * 1985-04-03 1988-02-29 Balzers Hochvakuum Haltevorrichtung fuer targets fuer kathodenzerstaeubung.
DE4015388C2 (de) * 1990-05-14 1997-07-17 Leybold Ag Kathodenzerstäubungsvorrichtung
JPH0774436B2 (ja) * 1990-09-20 1995-08-09 富士通株式会社 薄膜形成方法
DE59208623D1 (de) * 1991-05-08 1997-07-24 Balzers Hochvakuum Verfahren zur Montage bzw. Demontage einer Targetplatte in einem Vakuumprozessraum, Montageanordnung hierfür sowie Targetplatte bzw. Vakuumkammer
RU2026418C1 (ru) * 1991-06-24 1995-01-09 Минский радиотехнический институт Устройство для нанесения покрытий в вакууме
DE4201551C2 (de) * 1992-01-22 1996-04-25 Leybold Ag Zerstäubungskathode
JPH05230638A (ja) * 1992-02-20 1993-09-07 Anelva Corp スパッタリング用ターゲット
DE4301516C2 (de) * 1993-01-21 2003-02-13 Applied Films Gmbh & Co Kg Targetkühlung mit Wanne
DE19535894A1 (de) 1995-09-27 1997-04-03 Leybold Materials Gmbh Target für die Sputterkathode einer Vakuumbeschichtungsanlage und Verfahren zu seiner Herstellung
JPH09125560A (ja) * 1995-10-26 1997-05-13 Hiroshi Nasu 炭素繊維マットテープ
JPH09156913A (ja) * 1995-11-30 1997-06-17 Matsushita Electric Ind Co Ltd 熱伝導シートの製造方法及びそれを用いたスパッタリング装置
US6093293A (en) * 1997-12-17 2000-07-25 Balzers Hochvakuum Ag Magnetron sputtering source
EP0951049A1 (de) * 1998-04-16 1999-10-20 Balzers Aktiengesellschaft Haltering sowie Target und Verfahren zu seiner Herstellung
JP2000226650A (ja) * 1999-02-08 2000-08-15 Mitsubishi Materials Corp バッキングプレート変形防止用補強リング、その補強リングを取り付けたバッキングプレートおよびスパッタリングターゲット、並びにそれらの使用方法
RU2218450C2 (ru) * 2001-07-26 2003-12-10 Дочернее государственное предприятие "Институт ядерной физики" Национального ядерного центра Республики Казахстан Магнетрон
FR2842348B1 (fr) * 2002-07-10 2004-09-10 Tecmachine Cathode pour pulverisation sous vide
PL1609880T3 (pl) * 2004-06-22 2008-10-31 Applied Mat Gmbh & Co Kg Katoda do rozpylania jonowego do procesów nakładania powłok
EP1826811A1 (de) * 2006-02-22 2007-08-29 Applied Materials GmbH & Co. KG Sputtern mit gekühltem Target
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JP2011168807A (ja) * 2010-02-16 2011-09-01 Canon Inc スパッタリング装置

Also Published As

Publication number Publication date
KR102372968B1 (ko) 2022-03-10
IN2014DN08522A (es) 2015-05-15
JP6407857B2 (ja) 2018-10-17
HUE033200T2 (en) 2017-11-28
PL2834389T3 (pl) 2017-05-31
EP2834389A1 (de) 2015-02-11
MX2014011991A (es) 2015-09-16
CN104204286A (zh) 2014-12-10
ES2617518T3 (es) 2017-06-19
CN104204286B (zh) 2017-03-29
KR20210100742A (ko) 2021-08-17
EP2834389B1 (de) 2016-11-30
KR20150002747A (ko) 2015-01-07
JP2015517032A (ja) 2015-06-18
RU2014143978A (ru) 2016-05-27
WO2013149692A1 (de) 2013-10-10
MX356932B (es) 2018-06-20
DE102012006717A1 (de) 2013-10-10
US20150060261A1 (en) 2015-03-05
RU2631571C2 (ru) 2017-09-25
US9934951B2 (en) 2018-04-03

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