IN2014DN08522A - - Google Patents

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Publication number
IN2014DN08522A
IN2014DN08522A IN8522DEN2014A IN2014DN08522A IN 2014DN08522 A IN2014DN08522 A IN 2014DN08522A IN 8522DEN2014 A IN8522DEN2014 A IN 8522DEN2014A IN 2014DN08522 A IN2014DN08522 A IN 2014DN08522A
Authority
IN
India
Prior art keywords
target
embodied
carbon film
rear side
self adhesive
Prior art date
Application number
Inventor
Siegfried Krassnitzer
Juerg Hagmann
Original Assignee
Oerlikon Trading Ag Trübbach
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Trading Ag Trübbach filed Critical Oerlikon Trading Ag Trübbach
Publication of IN2014DN08522A publication Critical patent/IN2014DN08522A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
  • Endoscopes (AREA)

Abstract

The invention relates to a target which is embodied as a material source for a depositing method from the gas phase comprising a front side and a rear side characterized in that a self adhesive carbon film is applied to the rear side. Said target can be embodied as a material source for a sputtering method and/or for an arc evaporation method. A particular advantage is that the target is used in a coating source with indirect cooling the self adhesive carbon film being in contact with the surface of the membrane which is part of a cooling channel.
IN8522DEN2014 2012-04-04 2013-03-05 IN2014DN08522A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012006717A DE102012006717A1 (en) 2012-04-04 2012-04-04 Target adapted to an indirect cooling device
PCT/EP2013/000623 WO2013149692A1 (en) 2012-04-04 2013-03-05 Target adapted to an indirect cooling device

Publications (1)

Publication Number Publication Date
IN2014DN08522A true IN2014DN08522A (en) 2015-05-15

Family

ID=47884231

Family Applications (1)

Application Number Title Priority Date Filing Date
IN8522DEN2014 IN2014DN08522A (en) 2012-04-04 2013-03-05

Country Status (14)

Country Link
US (1) US9934951B2 (en)
EP (1) EP2834389B1 (en)
JP (1) JP6407857B2 (en)
KR (2) KR102372968B1 (en)
CN (1) CN104204286B (en)
AR (1) AR090374A1 (en)
DE (1) DE102012006717A1 (en)
ES (1) ES2617518T3 (en)
HU (1) HUE033200T2 (en)
IN (1) IN2014DN08522A (en)
MX (1) MX356932B (en)
PL (1) PL2834389T3 (en)
RU (1) RU2631571C2 (en)
WO (1) WO2013149692A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AR099253A1 (en) 2013-04-08 2016-07-13 Oerlikon Surface Solutions Ag Trubbach SOURCE OF COATING OR WHITE TO PROVIDE MATERIAL FOR COATING BY PHYSICAL VAPOR DEPOSITION (PVD)
CN108130516A (en) * 2018-01-03 2018-06-08 梧州三和新材料科技有限公司 A kind of Vacuum Deposition cathode target using foam metal enhancing cooling
CN108203812B (en) * 2018-01-25 2020-02-07 京东方科技集团股份有限公司 Substrate fixing carrier, evaporation equipment and evaporation method
RU190474U1 (en) * 2018-12-24 2019-07-02 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный технологический университет "СТАНКИН" (ФГБОУ ВО "МГТУ "СТАНКИН") Electric arc evaporator
US10964015B2 (en) 2019-01-15 2021-03-30 International Business Machines Corporation Product defect detection
CN112626482A (en) * 2020-12-15 2021-04-09 华能新能源股份有限公司 Substrate temperature control device for vacuum evaporation

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SU823459A1 (en) * 1979-06-11 1981-04-23 Предприятие П/Я А-1067 Cathode device
CH664303A5 (en) * 1985-04-03 1988-02-29 Balzers Hochvakuum HOLDING DEVICE FOR TARGETS FOR CATHODE SPRAYING.
DE4015388C2 (en) * 1990-05-14 1997-07-17 Leybold Ag Cathode sputtering device
JPH0774436B2 (en) * 1990-09-20 1995-08-09 富士通株式会社 Thin film formation method
DE59208623D1 (en) 1991-05-08 1997-07-24 Balzers Hochvakuum Method for assembling or disassembling a target plate in a vacuum process room, assembly arrangement therefor and target plate or vacuum chamber
RU2026418C1 (en) * 1991-06-24 1995-01-09 Минский радиотехнический институт Apparatus for application of coatings in vacuum
DE4201551C2 (en) * 1992-01-22 1996-04-25 Leybold Ag Atomizing cathode
JPH05230638A (en) * 1992-02-20 1993-09-07 Anelva Corp Target for sputtering
DE4301516C2 (en) * 1993-01-21 2003-02-13 Applied Films Gmbh & Co Kg Target cooling with a tub
DE19535894A1 (en) 1995-09-27 1997-04-03 Leybold Materials Gmbh Target for the sputter cathode of a vacuum coating system and process for its production
JPH09125560A (en) * 1995-10-26 1997-05-13 Hiroshi Nasu Carbon fiber mat type
JPH09156913A (en) * 1995-11-30 1997-06-17 Matsushita Electric Ind Co Ltd Production of heat-conductive sheet and sputtering apparatus using the sheet
US6093293A (en) * 1997-12-17 2000-07-25 Balzers Hochvakuum Ag Magnetron sputtering source
EP0951049A1 (en) * 1998-04-16 1999-10-20 Balzers Aktiengesellschaft Retaining ring, target and its manufacturing procedure
JP2000226650A (en) * 1999-02-08 2000-08-15 Mitsubishi Materials Corp Reinforcement ring for preventing deformation of backing plate, backing plate with the reinforcement ring, sputtering target, and their use
RU2218450C2 (en) * 2001-07-26 2003-12-10 Дочернее государственное предприятие "Институт ядерной физики" Национального ядерного центра Республики Казахстан Magnetron
FR2842348B1 (en) * 2002-07-10 2004-09-10 Tecmachine CATHODE FOR VACUUM SPRAYING
ATE395447T1 (en) * 2004-06-22 2008-05-15 Applied Materials Gmbh & Co Kg SPUTTING CATODE FOR COATING PROCESSES
EP1826811A1 (en) * 2006-02-22 2007-08-29 Applied Materials GmbH & Co. KG Cooled target sputtering
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Also Published As

Publication number Publication date
JP2015517032A (en) 2015-06-18
WO2013149692A1 (en) 2013-10-10
MX2014011991A (en) 2015-09-16
RU2631571C2 (en) 2017-09-25
DE102012006717A1 (en) 2013-10-10
AR090374A1 (en) 2014-11-05
RU2014143978A (en) 2016-05-27
KR102372968B1 (en) 2022-03-10
EP2834389B1 (en) 2016-11-30
KR20150002747A (en) 2015-01-07
EP2834389A1 (en) 2015-02-11
US20150060261A1 (en) 2015-03-05
ES2617518T3 (en) 2017-06-19
US9934951B2 (en) 2018-04-03
PL2834389T3 (en) 2017-05-31
KR20210100742A (en) 2021-08-17
CN104204286A (en) 2014-12-10
HUE033200T2 (en) 2017-11-28
JP6407857B2 (en) 2018-10-17
MX356932B (en) 2018-06-20
CN104204286B (en) 2017-03-29

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