PL1609880T3 - Katoda do rozpylania jonowego do procesów nakładania powłok - Google Patents

Katoda do rozpylania jonowego do procesów nakładania powłok

Info

Publication number
PL1609880T3
PL1609880T3 PL04014534T PL04014534T PL1609880T3 PL 1609880 T3 PL1609880 T3 PL 1609880T3 PL 04014534 T PL04014534 T PL 04014534T PL 04014534 T PL04014534 T PL 04014534T PL 1609880 T3 PL1609880 T3 PL 1609880T3
Authority
PL
Poland
Prior art keywords
vacuum chamber
diaphragm
cooling agent
supporting structure
magnet system
Prior art date
Application number
PL04014534T
Other languages
English (en)
Inventor
JüRGEN ULRICH
Peter Sauer
Original Assignee
Applied Mat Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Mat Gmbh & Co Kg filed Critical Applied Mat Gmbh & Co Kg
Publication of PL1609880T3 publication Critical patent/PL1609880T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B35/00—Screw-bolts; Stay-bolts; Screw-threaded studs; Screws; Set screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/02—Permanent magnets [PM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
  • Cold Cathode And The Manufacture (AREA)
PL04014534T 2004-06-22 2004-06-22 Katoda do rozpylania jonowego do procesów nakładania powłok PL1609880T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04014534A EP1609880B1 (de) 2004-06-22 2004-06-22 Zerstäubungskatode für Beschichtungsprozesse

Publications (1)

Publication Number Publication Date
PL1609880T3 true PL1609880T3 (pl) 2008-10-31

Family

ID=34925430

Family Applications (1)

Application Number Title Priority Date Filing Date
PL04014534T PL1609880T3 (pl) 2004-06-22 2004-06-22 Katoda do rozpylania jonowego do procesów nakładania powłok

Country Status (10)

Country Link
US (1) US7771574B2 (pl)
EP (1) EP1609880B1 (pl)
JP (1) JP4490257B2 (pl)
KR (1) KR100616327B1 (pl)
CN (1) CN1712558A (pl)
AT (1) ATE395447T1 (pl)
DE (1) DE502004007133D1 (pl)
PL (1) PL1609880T3 (pl)
RU (1) RU2283367C1 (pl)
TW (1) TWI241352B (pl)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2912864B1 (fr) * 2007-02-15 2009-07-31 H E F Soc Par Actions Simplifi Dispositif pour generer un plasma froid dans une enceinte sous vide et utilisation du dispositif pour des traitements thermochimiques
CN101736300B (zh) * 2008-11-19 2012-04-11 中国科学院沈阳科学仪器研制中心有限公司 一种磁控溅射靶
KR20140027558A (ko) * 2009-05-15 2014-03-06 고쿠리츠다이가쿠호진 도호쿠다이가쿠 회전 마그넷 스퍼터 장치, 스퍼터 방법 및, 회전 마그넷 스퍼터 장치의 냉각 방법
CN102108490B (zh) * 2009-12-29 2012-10-03 中国科学院沈阳科学仪器研制中心有限公司 一种磁控溅射靶
CN102560401A (zh) * 2012-03-01 2012-07-11 上海福宜新能源科技有限公司 大功率密度的磁控溅射阴极
DE102012006717A1 (de) * 2012-04-04 2013-10-10 Oerlikon Trading Ag, Trübbach An eine indirekte Kühlvorrichtung angepasstes Target
RU2501886C1 (ru) * 2012-09-19 2013-12-20 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный индустриальный университет" Катод установки для ионной имплантации
CZ305631B6 (cs) * 2014-06-25 2016-01-13 Tesla Electrontubes S.R.O. Zařízení pro povlakování vnitřních dutin malého příčného průřezu a velkých podélných rozměrů metodou magnetronového naprašování
CN107663632B (zh) * 2017-10-30 2023-10-03 杭州比凡科电子科技有限公司 一种分布式磁控溅射靶
TWI641712B (zh) * 2017-12-04 2018-11-21 國家中山科學研究院 Heating stage device applied to sputtering target gun
JP6552590B2 (ja) * 2017-12-20 2019-07-31 キヤノントッキ株式会社 スパッタ装置及びその使用方法
SE542687C2 (en) 2018-06-27 2020-06-23 Impact Coatings Ab Publ Arc source system for a cathode

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59215485A (ja) * 1983-05-20 1984-12-05 Hitachi Ltd プレ−ナマグネトロン型スパツタ装置
JPH08321497A (ja) 1988-01-11 1996-12-03 Tadahiro Omi 薄膜形成装置のターゲット保持機構
DE4015388C2 (de) * 1990-05-14 1997-07-17 Leybold Ag Kathodenzerstäubungsvorrichtung
DE4018914C1 (pl) * 1990-06-13 1991-06-06 Leybold Ag, 6450 Hanau, De
JPH0774436B2 (ja) * 1990-09-20 1995-08-09 富士通株式会社 薄膜形成方法
US6689254B1 (en) * 1990-10-31 2004-02-10 Tokyo Electron Limited Sputtering apparatus with isolated coolant and sputtering target therefor
DE59208623D1 (de) * 1991-05-08 1997-07-24 Balzers Hochvakuum Verfahren zur Montage bzw. Demontage einer Targetplatte in einem Vakuumprozessraum, Montageanordnung hierfür sowie Targetplatte bzw. Vakuumkammer
DE4301516C2 (de) * 1993-01-21 2003-02-13 Applied Films Gmbh & Co Kg Targetkühlung mit Wanne
DE19755448A1 (de) * 1997-12-13 1999-06-17 Leybold Systems Gmbh Zerstäubungskathode zum Aufbringen dünner Schichten auf Substrate in einer Vakuumkammer
JPH11323542A (ja) 1998-05-13 1999-11-26 Sony Corp スパッタリング装置
US6146509A (en) * 1999-06-11 2000-11-14 Scivac Inverted field circular magnetron sputtering device
US6328856B1 (en) * 1999-08-04 2001-12-11 Seagate Technology Llc Method and apparatus for multilayer film deposition utilizing rotating multiple magnetron cathode device
US6494999B1 (en) * 2000-11-09 2002-12-17 Honeywell International Inc. Magnetron sputtering apparatus with an integral cooling and pressure relieving cathode

Also Published As

Publication number Publication date
US7771574B2 (en) 2010-08-10
EP1609880B1 (de) 2008-05-14
JP2006009139A (ja) 2006-01-12
EP1609880A1 (de) 2005-12-28
JP4490257B2 (ja) 2010-06-23
DE502004007133D1 (de) 2008-06-26
CN1712558A (zh) 2005-12-28
TW200600598A (en) 2006-01-01
ATE395447T1 (de) 2008-05-15
TWI241352B (en) 2005-10-11
KR100616327B1 (ko) 2006-08-30
RU2283367C1 (ru) 2006-09-10
KR20050121637A (ko) 2005-12-27
US20050279629A1 (en) 2005-12-22

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