AR061209A1 - Instalacion de soldadura - Google Patents

Instalacion de soldadura

Info

Publication number
AR061209A1
AR061209A1 ARP070102314A ARP070102314A AR061209A1 AR 061209 A1 AR061209 A1 AR 061209A1 AR P070102314 A ARP070102314 A AR P070102314A AR P070102314 A ARP070102314 A AR P070102314A AR 061209 A1 AR061209 A1 AR 061209A1
Authority
AR
Argentina
Prior art keywords
welding
module
station
installation
welding installation
Prior art date
Application number
ARP070102314A
Other languages
English (en)
Inventor
Hans Otto Willenegger
Bruno Ghidotti
Original Assignee
Kirsten Soldering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kirsten Soldering Ag filed Critical Kirsten Soldering Ag
Publication of AR061209A1 publication Critical patent/AR061209A1/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/02—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity of multiple-track type; of multiple-chamber type; Combinations of furnaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

Una instalacion de soldadura (1) para soldar piezas constructivas que están montadas sobre una placa de circuito impreso que comprende un modulo de soldadura (4) y al menos una estacion de soldadura (8) que se puede colocar en el modulo de soldadura (4). La estacion de soldadura (8) y el modulo de soldadura (4) están equipados con medios para la alineacion mutua y con conectores hembra y macho que se complementan, cuyos conectores cierran conductos/conductores para fluidos. Al colocar la estacion de soldadura (8) en el modulo de soldadura (4), dichos medios alinean la estacion de soldadura (8) con respecto del modulo de soldadura (4). La instalacion de soldadura está compuesta preferentemente por modulos dispuestos sucesivamente en direccion de transporte y unidos entre sí de manera separable Cada modulo presenta un sistema de transporte propio.
ARP070102314A 2006-05-29 2007-05-29 Instalacion de soldadura AR061209A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH8712006 2006-05-29
CH19402006 2006-11-27

Publications (1)

Publication Number Publication Date
AR061209A1 true AR061209A1 (es) 2008-08-13

Family

ID=38458140

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP070102314A AR061209A1 (es) 2006-05-29 2007-05-29 Instalacion de soldadura

Country Status (10)

Country Link
US (1) US8091759B2 (es)
EP (1) EP2029307B1 (es)
JP (1) JP5488974B2 (es)
KR (1) KR101355255B1 (es)
AR (1) AR061209A1 (es)
AT (1) ATE500017T1 (es)
DE (1) DE502007006611D1 (es)
PL (1) PL2029307T3 (es)
TW (1) TWI417162B (es)
WO (1) WO2007137952A1 (es)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2138259A1 (de) 2008-06-13 2009-12-30 Kirsten Soldering AG Wellenlötanlage mit einem Beleuchtungsmittel und einer Kamera
GB2479553B (en) * 2010-04-14 2012-07-18 Afc Holcroft Aluminium brazing
DE202010014074U1 (de) * 2010-10-11 2012-01-12 Illinois Tool Works Inc. Heizeinrichtung für eine Lötanlage
KR101409470B1 (ko) * 2012-11-16 2014-06-18 주식회사 경신 복층회로기판의 점퍼핀 솔더링 장치
CN203636153U (zh) * 2014-01-08 2014-06-11 纬创资通股份有限公司 自动加锡机
US9198300B2 (en) 2014-01-23 2015-11-24 Illinois Tool Works Inc. Flux management system and method for a wave solder machine
US9161459B2 (en) 2014-02-25 2015-10-13 Illinois Tool Works Inc. Pre-heater latch and seal mechanism for wave solder machine and related method
DE102014110720A1 (de) * 2014-07-29 2016-02-04 Illinois Tool Works Inc. Lötmodul
CN107127415A (zh) * 2017-05-15 2017-09-05 深圳市睿冠科技有限公司 一种麦克风自动焊接设备
JP6593400B2 (ja) * 2017-08-04 2019-10-23 千住金属工業株式会社 噴流はんだ槽及び噴流はんだ付け装置
CN109807421B (zh) * 2018-12-29 2020-12-22 东莞市荣享电子科技有限公司 一种pcba板保护罩焊接加工一体机
DE102019213511A1 (de) * 2019-09-05 2021-03-11 Rehm Thermal Systems Gmbh Reflow-Lötanlage zum kombinierten Konvektionslöten und Kondensationslöten
CN112053819B (zh) * 2020-09-02 2021-11-23 杭州瞳阳科技有限公司 一种基于贴片电子元器件的生产线
CN114535890B (zh) * 2022-04-28 2022-07-15 潍坊工商职业学院 一种多角度焊接装置
CN116160173B (zh) * 2023-03-21 2023-08-15 杭州豪帅机械制造有限公司 一种窗锁扣焊接装置及其焊接方法
CN117042333B (zh) * 2023-08-29 2024-03-29 安徽广晟德自动化设备有限公司 一种dip插装产线

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3218193A (en) * 1961-09-19 1965-11-16 Leesona Corp Automatic foam fluxing
US3429421A (en) * 1967-03-31 1969-02-25 Eugene J Wiecek Conveyor systems
US3482755A (en) * 1967-09-25 1969-12-09 Gen Electric Automatic wave soldering machine
US3604611A (en) * 1969-01-07 1971-09-14 Dee Electric Co Soldering apparatus
JPS4849231U (es) * 1971-10-13 1973-06-28
US4366177A (en) * 1981-01-26 1982-12-28 Pet Incorporated Method of flameless broiling or baking greasy meat products
DE3111809C2 (de) * 1981-03-25 1985-05-15 Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken
JPS63140763A (ja) * 1986-12-03 1988-06-13 Tamura Seisakusho Co Ltd 自動はんだ付け装置
EP0311393A3 (en) 1987-10-07 1989-08-30 Corfin Technologies Inc. Tinning system for axial and radial leaded components
DE3735949A1 (de) * 1987-10-23 1989-05-03 Ruhrgas Ag Verfahren und vorrichtung zum reinigen der oberflaeche von ofenrollen eines rollenherdofens
US4890781A (en) * 1988-08-04 1990-01-02 Texas Instruments Incorporated Automated flow solder machine
US5110147A (en) * 1988-11-10 1992-05-05 Gershman Leonard B Highly stable, continuously adjustable trash can transporter
JPH03234447A (ja) 1990-02-05 1991-10-18 Heinz Finzer モジュラーに構成された工作物加工センターとそれに属する作業モジュール
JP3137372B2 (ja) * 1991-08-15 2001-02-19 ソニー株式会社 自動はんだ付け装置
IT1255748B (it) 1992-04-01 1995-11-15 Iemme Italia Spa Dispositivo riscaldante modulare e macchina di saldatura utilizzante tale dispositivo
NL9301743A (nl) 1993-10-08 1995-05-01 Soltec Bv Soldeerinrichting met horizontaal transport.
US5439158A (en) * 1994-02-22 1995-08-08 Sund; William Atmosphere controlled soldering apparatus with incorporated solder pump
KR100504404B1 (ko) * 1996-06-11 2005-11-01 가부시키가이샤 다무라 세이사쿠쇼 납땜장치
US6367677B1 (en) * 1999-09-28 2002-04-09 Hill-Rom Services, Inc. Wave solder apparatus and method
DE19953654A1 (de) 1999-11-08 2001-05-23 Pink Gmbh Vakuumtechnik Verfahren und Vorrichtung zur Herstellung einer Lotverbindung
JP4480231B2 (ja) * 2000-05-30 2010-06-16 トーヨーユニバーサル株式会社 金属製ワークピースのコンベクション式ろう付け方法およびその装置
JP2003205362A (ja) * 2002-01-10 2003-07-22 Canon Inc リフローはんだ付け装置
TWI289491B (en) * 2002-04-16 2007-11-11 Tadatomo Suga Reflow soldering method
JP3860511B2 (ja) * 2002-07-09 2006-12-20 山形カシオ株式会社 一括交換台車、部品実装システム、及び接続確認方法
JP3860088B2 (ja) * 2002-07-25 2006-12-20 Ｎｅｃエレクトロニクス株式会社 ボンディング方法及びボンディング装置
JP3851855B2 (ja) * 2002-08-30 2006-11-29 山形カシオ株式会社 部品供給装置、部品搭載装置、及びその電気接続方法
US7213738B2 (en) * 2002-09-30 2007-05-08 Speedline Technologies, Inc. Selective wave solder system
WO2005049258A2 (en) 2003-11-15 2005-06-02 Tec-Option, Inc. Modular welding equipment
WO2005107991A1 (de) 2004-04-08 2005-11-17 Kirsten Soldering Ag Wellenlötanlage und verfahren zum wellenlöten
JP2006026759A (ja) 2004-07-13 2006-02-02 Ishikawajima Harima Heavy Ind Co Ltd 溶接システム
DE102005028683A1 (de) 2005-06-21 2006-12-28 Linde Ag Wellenlötmaschine mit auswechselbarem Lotbad

Also Published As

Publication number Publication date
JP2009539238A (ja) 2009-11-12
KR20090010192A (ko) 2009-01-29
US20090236402A1 (en) 2009-09-24
US8091759B2 (en) 2012-01-10
KR101355255B1 (ko) 2014-01-27
ATE500017T1 (de) 2011-03-15
JP5488974B2 (ja) 2014-05-14
TWI417162B (zh) 2013-12-01
EP2029307A1 (de) 2009-03-04
WO2007137952A1 (de) 2007-12-06
PL2029307T3 (pl) 2011-07-29
DE502007006611D1 (de) 2011-04-14
EP2029307B1 (de) 2011-03-02
TW200808481A (en) 2008-02-16

Similar Documents

Publication Publication Date Title
AR061209A1 (es) Instalacion de soldadura
ATE534868T1 (de) Beleuchtungssystem
AR076580A1 (es) Conjuntos de conectores para la union de paneles
CL2010001101A1 (es) Un sistema de cableado electrico para usarse un sistema de aire acondicinado.
AR063667A1 (es) Disposicion modular para la produccion de bebidas con una estacion de acoplamiento
EP2113899A3 (en) Expandable LED module for arbitrary display assembly
TW200714196A (en) Systems for integrated cold plate and heat spreader
HK1155801A1 (en) Modular heat exchange system for use in central heat exchange installations in buildings
CL2011000457A1 (es) Un cartucho de tinta instalable en una impresora que tiene una pluralidad de miembros de contacto electrico que comprende una primera linea de partes de contacto situada sobre un lado principal de otra línea en una dirección prescrita en que el cartucho de tinta se mueve para su instalacion en la impresora.
CO7200287A2 (es) Conjunto retenedor que tiene características de posicionamiento para una circuitería de procesamiento usada con un elemento de suministro de un dispositivo de formación de imágenes
GB2482629A (en) Self-contained electrochemical heat transfer system
CL2018003019A1 (es) Habilitación del encendido de un dispositivo con un ensamble apropiado.
GB2481771A (en) Printed circuit board cooling assembly
MX2009003358A (es) Sistema de carriles de energia.
AR084113A1 (es) Conector de enchufe y sistema modular de enchufe
SG130055A1 (en) Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
MY150346A (en) Led based hazardous location light with versatile mounting configurations
AR062002A1 (es) Disposicion conectora
AR068039A1 (es) Barra de acople con separacion de acoplamiento reducida, conjunto de tubo de flujo, metodo para formar la barra de acople y metodo para formar el conjunto de tubo de flujo.
TW200636638A (en) Double-sided display device
WO2010145844A3 (de) Vorrichtung zum handhaben und positionieren von grossformatigen solarmodulen
WO2009080270A3 (de) Batteriemodul mit mehreren einzelzellen
ITMI20092299A1 (it) Sistemi micro-elettro-meccanici mems e relativo metodo di realizzazione
UA106638C2 (uk) Системи і способи для пластинчастого клапанного модуля і клапанного вузла
ES2567559T3 (es) Cabina de ducha

Legal Events

Date Code Title Description
FB Suspension of granting procedure