ZA826116B - Process for the manufacture of circuit boards - Google Patents

Process for the manufacture of circuit boards

Info

Publication number
ZA826116B
ZA826116B ZA826116A ZA826116A ZA826116B ZA 826116 B ZA826116 B ZA 826116B ZA 826116 A ZA826116 A ZA 826116A ZA 826116 A ZA826116 A ZA 826116A ZA 826116 B ZA826116 B ZA 826116B
Authority
ZA
South Africa
Prior art keywords
manufacture
circuit boards
boards
circuit
Prior art date
Application number
ZA826116A
Other languages
English (en)
Inventor
Robert Page Burr
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of ZA826116B publication Critical patent/ZA826116B/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Supply And Installment Of Electrical Components (AREA)
ZA826116A 1981-12-18 1982-08-23 Process for the manufacture of circuit boards ZA826116B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/332,346 US4450623A (en) 1981-12-18 1981-12-18 Process for the manufacture of circuit boards

Publications (1)

Publication Number Publication Date
ZA826116B true ZA826116B (en) 1983-09-28

Family

ID=23297825

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA826116A ZA826116B (en) 1981-12-18 1982-08-23 Process for the manufacture of circuit boards

Country Status (10)

Country Link
US (1) US4450623A (de)
JP (1) JPS6034279B2 (de)
AU (1) AU541980B2 (de)
CA (1) CA1175949A (de)
DE (1) DE3247344A1 (de)
FR (1) FR2518863B1 (de)
GB (1) GB2111759B (de)
IT (1) IT1149166B (de)
NL (1) NL8204889A (de)
ZA (1) ZA826116B (de)

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US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
US4693778A (en) * 1985-07-19 1987-09-15 Kollmorgen Technologies Corporation Apparatus for making scribed circuit boards and circuit board modifications
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
CA1260157A (en) * 1985-07-26 1989-09-26 Preleg, Inc. Electrical circuit fabrication apparatus and method
US4918260A (en) * 1985-07-26 1990-04-17 Preleg, Inc. Adhesive-coated wire and method and printed circuit board using same
US4864723A (en) * 1986-07-01 1989-09-12 Preleg, Inc. Electrical circuit modification method
US4641773A (en) * 1985-08-09 1987-02-10 Kollmorgen Technologies Corp. Ultrasonic stylus position stabilizer
US4908939A (en) * 1985-10-18 1990-03-20 Kollmorgen Corporation Method of making coaxial interconnection boards
US4884334A (en) * 1986-02-05 1989-12-05 International Business Machines, Corp. Resonant stylus support
US4870240A (en) * 1987-01-30 1989-09-26 Siemens Aktiengesellschaft Apparatus for contacting wires with resistance welding
US5334962A (en) * 1987-09-18 1994-08-02 Q-Dot Inc. High-speed data supply pathway systems
DE3831394A1 (de) * 1988-09-15 1990-03-22 Prithwis Basu Verfahren und vorrichtung zum kontaktieren eines elektrischen leitungsdrahtes mit kontaktstellen auf einer leiterplatte
US5253415A (en) * 1990-03-20 1993-10-19 Die Tech, Inc. Method of making an integrated circuit substrate lead assembly
US5403869A (en) * 1992-08-17 1995-04-04 Hitachi Chemical Company, Ltd. Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator
US5259051A (en) * 1992-08-28 1993-11-02 At&T Bell Laboratories Optical fiber interconnection apparatus and methods of making interconnections
US5378857A (en) * 1993-01-15 1995-01-03 Advanced Interconnection Technology, Inc. Directly bondable termination for a fixed discrete wire
US5421930A (en) * 1993-11-01 1995-06-06 American Telephone And Telegraph Company Optical fiber routing method and apparatus
US5425831A (en) * 1994-03-18 1995-06-20 At&T Corp. Optical fiber connecting method
EP1004226B1 (de) * 1997-06-02 2002-05-08 Juma Leiterplattentechnologie GmbH Verfahren und vorrichtung zur herstellung von drahtgeschriebenen leiterplatten
US6005991A (en) * 1997-11-26 1999-12-21 Us Conec Ltd Printed circuit board assembly having a flexible optical circuit and associated fabrication method
DE19855023B4 (de) * 1998-11-30 2006-10-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Aufbringen von Leiterstrukturen auf beliebig geformte Oberflächen
US6883714B2 (en) * 1998-12-14 2005-04-26 Stratos Lightwave, Inc. Methods of optical filament scribing of circuit patterns with planar and non-planar portions
EP1061393A1 (de) 1999-06-17 2000-12-20 Nippon Telegraph and Telephone Corporation Faser optische Verdrahtungs Apparat und Verfahren zum Verdrahten eine optische Faser
WO2002001264A1 (en) * 2000-06-26 2002-01-03 Fiberconnex Corporation Optical fiber dispensing, routing and termination apparatus and method
US6400882B1 (en) 2000-08-24 2002-06-04 Molex Incorporated Apparatus for fabricating optical backplanes
US6486408B1 (en) 2000-10-31 2002-11-26 Hewlett-Packard Company Flexible circuit using discrete wiring
US6825679B2 (en) 2002-07-19 2004-11-30 Agilent Technologies, Inc. Electrically conductive structure and method for implementing circuit changes on printed circuit boards
WO2006050691A2 (de) * 2004-11-02 2006-05-18 Imasys Ag Verlegevorrichtung, kontaktiervorrichtung, zustellsystem, verlege- und kontaktiereinheit herstellungsanlage, verfahren zur herstellung und eine transpondereinheit
DE202005001161U1 (de) † 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Drahtgeschriebene Leiterplatte oder Platine mit Leiterdrähten mit rechteckigem oder quadratischem Querschnitt
DE202005001163U1 (de) * 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Leiterplatte oder Platine mit Heizdraht
DE102006037093B3 (de) * 2006-08-07 2008-03-13 Reinhard Ulrich Fügeverfahren und Vorrichtung zum Verlegen von dünnem Draht
US8286332B2 (en) * 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7971339B2 (en) * 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
DE102006053696A1 (de) * 2006-11-13 2008-05-29 Häusermann GmbH Anlage zur Herstellung einer Leiterplatte mit additiven und integrierten und mittels Ultraschall kontaktierten Kupferelementen
DE102006053697A1 (de) * 2006-11-13 2008-05-29 Häusermann GmbH Leiterplatte mit additiven und integrierten und mittels Ultraschall kontaktierten Kupferelementen und Herstellverfahren und Anwendung
IL184260A0 (en) * 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
DE102007037165A1 (de) 2007-08-07 2009-02-12 Mühlbauer Ag Verfahren und Vorrichtung zum Verlegen von dünnem Draht
DE602007010634D1 (de) * 2007-09-18 2010-12-30 Baile Na Habhann Co Galway Verfahren zur Kontaktierung eines Drahtleiters gelegt auf ein Substrat
US20090123743A1 (en) * 2007-11-14 2009-05-14 Guy Shafran Method of manufacture of wire imbedded inlay
US8028923B2 (en) * 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US20100090008A1 (en) * 2008-10-13 2010-04-15 Oded Bashan Authentication seal
IT1398079B1 (it) * 2010-02-10 2013-02-07 Lolli Apparato per realizzare antenne per dispositivi di identificazione a radiofrequenza
US8195236B2 (en) 2010-06-16 2012-06-05 On Track Innovations Ltd. Retrofit contactless smart SIM functionality in mobile communicators
US8424757B2 (en) 2010-12-06 2013-04-23 On Track Innovations Ltd. Contactless smart SIM functionality retrofit for mobile communication device
DE102012002945B4 (de) 2012-02-16 2017-07-13 Häusermann GmbH Multifunktionelle Mehrlagenleiterplatten mit einer elektrisch leitfähigen Hochstrom-Leitstruktur und Verfahren zur Herstellung
CN104756202B (zh) * 2012-10-25 2016-12-14 Adc电信股份有限公司 用于把涂覆有粘合剂的电缆施加到表面的系统和方法
DE102014004580B4 (de) * 2014-03-28 2023-07-06 Ambright GmbH Leuchtvorrichtung
US10392076B2 (en) * 2014-10-31 2019-08-27 Piaggio & C. S.P.A Propulsion unit for an electric pedal-assisted cycle and pedal-assisted cycle thereof

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SU47904A1 (ru) * 1934-03-21 1936-07-31 П.А. Оружинский Аэростат дл подъема и выпуска ракет в стратосфере
DE1279164B (de) * 1963-09-19 1968-10-03 Siemens Ag Verfahren zur Verdrahtung von Schaltungsplatten fuer Fernmeldeanlagen, insbesondere fuer Fernsprechvermittlungsanlagen
US3353263A (en) * 1964-08-17 1967-11-21 Texas Instruments Inc Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
US3608190A (en) * 1969-06-13 1971-09-28 Inforex Routing pins for wiring apparatus
US3674602A (en) * 1969-10-09 1972-07-04 Photocircuits Corp Apparatus for making wire scribed circuit boards
JPS5550399B1 (de) * 1970-03-05 1980-12-17
US3646246A (en) * 1970-05-22 1972-02-29 Honeywell Inf Systems Circuit board and method of making
US3981076A (en) * 1974-11-27 1976-09-21 Commissariat A L'energie Atomique Method of connecting electronic microcomponents
FR2304247A1 (fr) * 1975-03-12 1976-10-08 Commissariat Energie Atomique Procede et dispositif d'interconnexion de composants electroniques
US4175816A (en) * 1975-08-13 1979-11-27 Kollmorgen Technologies Corporation Multi-wire electrical interconnecting member having a multi-wire matrix of insulated wires mechanically terminated thereon
US4065850A (en) * 1975-08-13 1978-01-03 Kollmorgen Technologies Corporation Method of making multi-wire electrical interconnecting member having a multi-wire matrix of insulated wires mechanically terminated thereon
US4031612A (en) * 1976-03-02 1977-06-28 Commissariat A L'energie Atomique Method and a device for the interconnection of electronic components
ZA781637B (en) * 1977-06-20 1979-02-28 Kollmorgen Tech Corp Wire scribed circuit board and method for the manufacture thereof
FR2458978A2 (fr) * 1979-06-07 1981-01-02 Commissariat Energie Atomique Procede et dispositif d'interconnexions de composants electronique

Also Published As

Publication number Publication date
IT1149166B (it) 1986-12-03
JPS58112385A (ja) 1983-07-04
FR2518863B1 (fr) 1986-03-07
NL8204889A (nl) 1983-07-18
DE3247344C2 (de) 1987-09-17
IT8249694A0 (it) 1982-12-20
AU541980B2 (en) 1985-01-31
FR2518863A1 (fr) 1983-06-24
GB2111759A (en) 1983-07-06
CA1175949A (en) 1984-10-09
GB2111759B (en) 1985-08-21
DE3247344A1 (de) 1983-07-07
US4450623A (en) 1984-05-29
JPS6034279B2 (ja) 1985-08-07
AU8811682A (en) 1983-08-18

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