ZA827350B - Process for the production of circuit boards having both rigid and flexible regions - Google Patents
Process for the production of circuit boards having both rigid and flexible regionsInfo
- Publication number
- ZA827350B ZA827350B ZA827350A ZA827350A ZA827350B ZA 827350 B ZA827350 B ZA 827350B ZA 827350 A ZA827350 A ZA 827350A ZA 827350 A ZA827350 A ZA 827350A ZA 827350 B ZA827350 B ZA 827350B
- Authority
- ZA
- South Africa
- Prior art keywords
- rigid
- production
- circuit boards
- flexible regions
- regions
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3140061A DE3140061C1 (en) | 1981-10-08 | 1981-10-08 | Method of producing printed circuit boards having rigid and flexible regions |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA827350B true ZA827350B (en) | 1983-08-31 |
Family
ID=6143707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA827350A ZA827350B (en) | 1981-10-08 | 1982-10-07 | Process for the production of circuit boards having both rigid and flexible regions |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE3140061C1 (en) |
ZA (1) | ZA827350B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3535773C1 (en) * | 1985-10-07 | 1987-04-23 | Messerschmitt Boelkow Blohm | Method for producing rigid-flexible multilayer circuits |
JPH02237197A (en) * | 1989-03-10 | 1990-09-19 | Hitachi Ltd | Multilayer circuit board and manufacture and use thereof |
JP2676112B2 (en) * | 1989-05-01 | 1997-11-12 | イビデン株式会社 | Manufacturing method of electronic component mounting board |
EP0408773B1 (en) * | 1989-07-15 | 1993-07-07 | Firma Carl Freudenberg | Process for the production of circuit boards or inner layers of circuit boards containing rigid and flexible parts |
CN103491730A (en) * | 2013-07-25 | 2014-01-01 | 博罗县精汇电子科技有限公司 | Shape manufacturing method of soft and hard combined circuit board |
CN105472891A (en) * | 2015-12-31 | 2016-04-06 | 武汉凌云光电科技有限责任公司 | Method for carrying out rigid circuit board cutting by laser |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2657212C3 (en) * | 1976-12-17 | 1982-09-02 | Schoeller & Co Elektronik Gmbh, 3552 Wetter | Process for the production of rigid and flexible areas having printed circuit boards |
-
1981
- 1981-10-08 DE DE3140061A patent/DE3140061C1/en not_active Expired
-
1982
- 1982-10-07 ZA ZA827350A patent/ZA827350B/en unknown
Also Published As
Publication number | Publication date |
---|---|
DE3140061C1 (en) | 1983-02-03 |
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