ZA827350B - Process for the production of circuit boards having both rigid and flexible regions - Google Patents

Process for the production of circuit boards having both rigid and flexible regions

Info

Publication number
ZA827350B
ZA827350B ZA827350A ZA827350A ZA827350B ZA 827350 B ZA827350 B ZA 827350B ZA 827350 A ZA827350 A ZA 827350A ZA 827350 A ZA827350 A ZA 827350A ZA 827350 B ZA827350 B ZA 827350B
Authority
ZA
South Africa
Prior art keywords
rigid
production
circuit boards
flexible regions
regions
Prior art date
Application number
ZA827350A
Inventor
Eduard Grasser
Heinz Hecktor
Herbert Hoeger
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ZA827350B publication Critical patent/ZA827350B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
ZA827350A 1981-10-08 1982-10-07 Process for the production of circuit boards having both rigid and flexible regions ZA827350B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3140061A DE3140061C1 (en) 1981-10-08 1981-10-08 Method of producing printed circuit boards having rigid and flexible regions

Publications (1)

Publication Number Publication Date
ZA827350B true ZA827350B (en) 1983-08-31

Family

ID=6143707

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA827350A ZA827350B (en) 1981-10-08 1982-10-07 Process for the production of circuit boards having both rigid and flexible regions

Country Status (2)

Country Link
DE (1) DE3140061C1 (en)
ZA (1) ZA827350B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3535773C1 (en) * 1985-10-07 1987-04-23 Messerschmitt Boelkow Blohm Method for producing rigid-flexible multilayer circuits
JPH02237197A (en) * 1989-03-10 1990-09-19 Hitachi Ltd Multilayer circuit board and manufacture and use thereof
JP2676112B2 (en) * 1989-05-01 1997-11-12 イビデン株式会社 Manufacturing method of electronic component mounting board
EP0408773B1 (en) * 1989-07-15 1993-07-07 Firma Carl Freudenberg Process for the production of circuit boards or inner layers of circuit boards containing rigid and flexible parts
CN103491730A (en) * 2013-07-25 2014-01-01 博罗县精汇电子科技有限公司 Shape manufacturing method of soft and hard combined circuit board
CN105472891A (en) * 2015-12-31 2016-04-06 武汉凌云光电科技有限责任公司 Method for carrying out rigid circuit board cutting by laser

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2657212C3 (en) * 1976-12-17 1982-09-02 Schoeller & Co Elektronik Gmbh, 3552 Wetter Process for the production of rigid and flexible areas having printed circuit boards

Also Published As

Publication number Publication date
DE3140061C1 (en) 1983-02-03

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