CN105472891A - Method for carrying out rigid circuit board cutting by laser - Google Patents
Method for carrying out rigid circuit board cutting by laser Download PDFInfo
- Publication number
- CN105472891A CN105472891A CN201511028226.3A CN201511028226A CN105472891A CN 105472891 A CN105472891 A CN 105472891A CN 201511028226 A CN201511028226 A CN 201511028226A CN 105472891 A CN105472891 A CN 105472891A
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- CN
- China
- Prior art keywords
- circuit board
- cutting
- laser
- hard circuit
- connecting bridge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of rigid circuit board processing, in particular to a method for carrying out rigid circuit board cutting by a laser. The method comprises the following steps: cutting connecting bridges on the rigid circuit board by the laser in a plurality of layers; and sequentially cutting the plurality of connecting bridges in one layer, and then returning to sequentially cut the plurality of connecting bridges in the next layer until all connecting bridges on the whole rigid circuit board are cut. Layered cutting is carried out on the rigid circuit board aiming at the material and thickness characteristics of the rigid circuit board; and cutting is carried out after a notch is fully cooled every time, so that heat accumulation is effectively prevented; carbonization and blackening of the notches are avoided; and the method has the advantages of being high in quality, free of a damage, clean and economical.
Description
Technical field
The present invention relates to hard circuit board processing technique field, be specifically related to a kind of method utilizing laser to carry out the cutting of hard circuit board.
Background technology
Circuit board can be described as printed substrate or printed circuit board (PCB), and English name is (PrintedCircuitBoard) PCB.Circuit board is using epoxy resin fiberglass cloth laminate sheet material as circuit board plate material, coated with Copper Foil as substrate, forms circuit, be finally arranged on circuit substrate by welding by various components and parts by technology such as exposure etchings.Due to the small light of circuit board, in order to save material and scale standardization production, generally the circuit board of several pieces little can be connected by connecting bridge and be merged into a large circuit board and be aided with frame, be called for short " jigsaw ", easy to setup in mass production like this and components and parts welding; After the complete circuit of cloth and components and parts, need connecting bridge to cut off this jigsaw is split, obtain the finished circuit board required for us.
Traditional circuit board dividing cutting uses the mechanical system such as dedicated tool or punching press to realize.Mechanical circuit plate cutting processing because of tool contact circuit board, therefore can produce certain extruding and cutting force to circuit board, causes the deformation damage of circuit board and plate to carry the damage of components and parts; And adopt cutter cutting can produce a large amount of dust to cause the pollution of environment and the change of circuit board electric property, need to increase cleaning process to circuit board.Simultaneously in order to give tool sharpening slot milling, often reserving larger gap between circuit board dividing, causing waste of material to a certain degree.
Laser cutting well can avoid these shortcomings of machining, but because laser processing partial operation temperature is very high, repeatedly reciprocating cutting causes thermal accumlation continuously, the phenomenon of carbonization can be there is in cut out portion circuit board material, cut sides can be turned black, even have carbon dust to drop, cutting effect can exist bad.
Summary of the invention
For solving the problems of the technologies described above, the invention provides one and can prevent otch from going out carbonization blackout, what cutting effect was good utilizes laser to carry out the method for hard circuit board cutting.
Technical solution of the present invention is: a kind of method utilizing laser to carry out the cutting of hard circuit board, laser is utilized to cut point multilayer of the connecting bridge on hard circuit board, after multiple described connecting bridge has cut one deck successively, return again and lower one deck cutting is carried out successively to multiple connecting bridge, until the cutting of multiple connecting bridge is complete.
Further, continue to cut all the other connecting bridges on hard circuit board after multiple described connecting bridge cutting.
Further, what multiple described connecting bridge had cut one deck successively is not less than a connecting bridge otch cooling required time total time.
Further, after multiple described connecting bridge has cut one or more layers successively, laser spot is displaced downwardly to lower one deck cut point surface and continues cutting.
Further, the degree of depth of described laser cutting one deck is between 0.001-0.2mm.
Further, described connecting bridge otch cooling time is between 0.1s-1s.
Further, described laser is pulse laser, and its wavelength is 260-550nm.
Further, the pulsewidth of described laser is 1-15ns or 1-1000ps.
Further, described laser repetition rate is 1-50KHz.
Further, the scan line speed of described laser spot is 5-2000mm/s.
Beneficial effect of the present invention: carry out circuit board cutting based on pulse laser, avoids the defect that mechanical contact machining faces, and ensures the electric property of PCB, reduces the pollution in processing and waste of material.For the material of hard circuit board own and thickness property, Slice by slice cutting is carried out to hard circuit board, all cut again after otch fully cools during each cutting, effectively prevent thermal accumlation, avoid otch carbonization blackout, there is high-quality, not damaged, clean advantage of saving.The pulse laser that selection wavelength is 260-550nm, pulsewidth is 1-15ns or 1-1000ps, repetition rate is 1-50KHz, focus scanning linear velocity is 5-2000mm/s carries out circuit board cutting, further ensures the quality of cutting.While an otch carries out cooling, all the other connecting bridges are cut, improve the efficiency of cutting.Avoid the phenomenon of laser processing partial carbonization simultaneously.
Accompanying drawing explanation
Fig. 1 is flow process chart of the present invention;
Fig. 2 is hard circuit board distribution schematic diagram;
The end view of Fig. 3 hard circuit board connecting bridge Slice by slice cutting;
In figure: 1-connecting bridge, 2-daughter board.
Embodiment
In order to make content of the present invention more easily be clearly understood, below according to instantiation of the present invention also by reference to the accompanying drawings, the present invention is further detailed explanation.
As shown in Figure 2, the motherboard of hard circuit board is divided into multiple daughter board 2, and daughter board 2 is connected by multiple connecting bridge 1 with between frame, between daughter board 2.
Before processing, first to the otch of circuit board cutting processing carry out machined parameters optimization, laser cut be optimized cooling time, determine circulated layered cutting times m according to the thickness of hard circuit board and material.
Otch for circuit board cutting processing carries out the optimization of machined parameters: set suitable scan rate of vibrating mirror, laser power and frequency, when making laser scanning cut out certain depth (one deck), otch does not have carbide to occur or only has the carbide of minute quantity, laser can run-down also can scan n time (n<10), in order to raise the efficiency, reject the redirect time of galvanometer, scanning direction can be same direction also can be shuttle-scanning.The present embodiment selects the pulse laser of wavelength between 260-550nm, the nanosecond laser of pulse laser can be pulsewidth be 1-15ns, also can be p laser second of 1-1000ps, laser repetition rate be 1-50KHz, and laser spot scans linear velocity selects 5-2000mm/s.
Laser cut is optimized cooling time: select suitable t cooling time, make otch after laser cutting one deck, after the t time cools, otch is again through laser cutting one deck, notch depth deepens, and otch does not have carbide to occur or only has the carbide of minute quantity.The span of t is generally between 0.1s-1s, different according to material, also can choose the longer time.
As shown in Figure 1, the step of the present invention's processing is:
As shown in Figure 3, utilize laser to divide m layer to cut to the connecting bridge on hard circuit board, after multiple connecting bridge has cut one deck successively, then return lower one deck cutting is carried out successively to multiple connecting bridge, circulation cutting, until all connecting bridge cuttings on whole hard circuit board are complete.The thickness of hard circuit board is generally between 0.2-2mm, and the hard circuit board of the present embodiment cutting 0.6mm, each depth of cut is 0.015mm, and cycle-index is 40 times.If circuit board is thicker, can after single or circulation for several times, suitable moves down laser spot, makes laser spot be in cut point place all the time, ensures crudy and consistency.
Wherein, the connecting bridge quantity k carrying out successively cutting determines according to a connecting bridge otch cooling required time t,
The above, be only the specific embodiment of the present invention, it should be pointed out that any those of ordinary skill in the art are in the technical scope disclosed by the present invention, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (10)
1. the method utilizing laser to carry out the cutting of hard circuit board, it is characterized in that: utilize laser to cut point multilayer of the connecting bridge on hard circuit board, after multiple described connecting bridge has cut one deck successively, return again and lower one deck cutting is carried out successively to multiple connecting bridge, until the cutting of multiple connecting bridge is complete.
2. utilize laser to carry out the method for hard circuit board cutting as claimed in claim 1, it is characterized in that: continue to cut all the other connecting bridges on hard circuit board after multiple described connecting bridge cutting.
3. utilize laser to carry out the method for hard circuit board cutting as claimed in claim 1, it is characterized in that: what multiple described connecting bridge had cut one deck successively is not less than a connecting bridge otch cooling required time total time.
4. utilize laser to carry out the method for hard circuit board cutting as claimed in claim 1, it is characterized in that: after multiple described connecting bridge has cut one or more layers successively, laser spot is displaced downwardly to lower one deck cut point surface and continues cutting.
5. utilize laser to carry out the method for hard circuit board cutting as claimed in claim 1, it is characterized in that: the degree of depth of described laser cutting one deck is between 0.001-0.2mm.
6. utilize laser to carry out the method for hard circuit board cutting as claimed in claim 1, it is characterized in that: described connecting bridge otch cooling time is between 0.1s-1s.
7. utilize laser to carry out the method for hard circuit board cutting as claimed in claim 1, it is characterized in that: described laser is pulse laser, its wavelength is 260-550nm.
8. utilize laser to carry out the method for hard circuit board cutting as claimed in claim 1, it is characterized in that: the pulsewidth of described laser is 1-15ns or 1-1000ps.
9. utilize laser to carry out the method for hard circuit board cutting as claimed in claim 1, it is characterized in that: described laser repetition rate is 1-50KHz.
10. as the laser that utilizes in claim 1-9 as described in any one carries out the method for hard circuit board cutting, it is characterized in that: the scan line speed of described laser spot is 5-2000mm/s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511028226.3A CN105472891A (en) | 2015-12-31 | 2015-12-31 | Method for carrying out rigid circuit board cutting by laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511028226.3A CN105472891A (en) | 2015-12-31 | 2015-12-31 | Method for carrying out rigid circuit board cutting by laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105472891A true CN105472891A (en) | 2016-04-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511028226.3A Pending CN105472891A (en) | 2015-12-31 | 2015-12-31 | Method for carrying out rigid circuit board cutting by laser |
Country Status (1)
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106425121A (en) * | 2016-12-02 | 2017-02-22 | 光达（深圳）精密设备有限公司 | Method for laser cutting of printed circuit board (PCB) |
| CN106583943A (en) * | 2016-12-08 | 2017-04-26 | 四川荷斐斯通用设备制造有限公司 | Laser micro-connecting cutting technology |
| CN106604548A (en) * | 2016-11-28 | 2017-04-26 | 深圳崇达多层线路板有限公司 | Method for preventing carbonized electric leakage caused by cutting gold finger lead wire by laser |
| CN107645841A (en) * | 2017-11-02 | 2018-01-30 | 惠州市特创电子科技有限公司 | Micro carving machine and its cutting method |
| CN109089381A (en) * | 2018-09-29 | 2018-12-25 | 珠海杰赛科技有限公司 | A kind of contour processing method of microsize pcb board |
| CN116493777A (en) * | 2023-05-12 | 2023-07-28 | 济南奥镭数控设备有限公司 | Numerical control cutting machine remote control system based on intelligent operation |
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|---|---|---|---|---|
| DE3140061C1 (en) * | 1981-10-08 | 1983-02-03 | Siemens AG, 1000 Berlin und 8000 München | Method of producing printed circuit boards having rigid and flexible regions |
| US20080116166A1 (en) * | 2006-11-17 | 2008-05-22 | Foxconn Advanced Technology Inc. | Method for manufacturing multilayer flexible printed circuit board |
| CN101249590A (en) * | 2008-02-29 | 2008-08-27 | 深圳市大族激光科技股份有限公司 | Ultraviolet laser cutting machine tool |
| CN101365297A (en) * | 2007-08-10 | 2009-02-11 | 富葵精密组件(深圳)有限公司 | Circuit board cutting method |
| CN101386112A (en) * | 2007-09-13 | 2009-03-18 | 张立国 | Laser cutting method based on inner carving |
-
2015
- 2015-12-31 CN CN201511028226.3A patent/CN105472891A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3140061C1 (en) * | 1981-10-08 | 1983-02-03 | Siemens AG, 1000 Berlin und 8000 München | Method of producing printed circuit boards having rigid and flexible regions |
| US20080116166A1 (en) * | 2006-11-17 | 2008-05-22 | Foxconn Advanced Technology Inc. | Method for manufacturing multilayer flexible printed circuit board |
| CN101365297A (en) * | 2007-08-10 | 2009-02-11 | 富葵精密组件(深圳)有限公司 | Circuit board cutting method |
| CN101386112A (en) * | 2007-09-13 | 2009-03-18 | 张立国 | Laser cutting method based on inner carving |
| CN101249590A (en) * | 2008-02-29 | 2008-08-27 | 深圳市大族激光科技股份有限公司 | Ultraviolet laser cutting machine tool |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604548A (en) * | 2016-11-28 | 2017-04-26 | 深圳崇达多层线路板有限公司 | Method for preventing carbonized electric leakage caused by cutting gold finger lead wire by laser |
| CN106604548B (en) * | 2016-11-28 | 2019-10-22 | 深圳崇达多层线路板有限公司 | The method for preventing laser cutting gold finger lead from carbonization being caused to leak electricity |
| CN106425121A (en) * | 2016-12-02 | 2017-02-22 | 光达（深圳）精密设备有限公司 | Method for laser cutting of printed circuit board (PCB) |
| CN106583943A (en) * | 2016-12-08 | 2017-04-26 | 四川荷斐斯通用设备制造有限公司 | Laser micro-connecting cutting technology |
| CN107645841A (en) * | 2017-11-02 | 2018-01-30 | 惠州市特创电子科技有限公司 | Micro carving machine and its cutting method |
| CN109089381A (en) * | 2018-09-29 | 2018-12-25 | 珠海杰赛科技有限公司 | A kind of contour processing method of microsize pcb board |
| CN109089381B (en) * | 2018-09-29 | 2021-04-16 | 珠海杰赛科技有限公司 | Appearance processing method of micro-size PCB |
| CN116493777A (en) * | 2023-05-12 | 2023-07-28 | 济南奥镭数控设备有限公司 | Numerical control cutting machine remote control system based on intelligent operation |
| CN116493777B (en) * | 2023-05-12 | 2024-03-29 | 济南奥镭数控设备有限公司 | Numerical control cutting machine remote control system based on intelligent operation |
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Application publication date: 20160406 |