CN106425121A - Method for laser cutting of printed circuit board (PCB) - Google Patents
Method for laser cutting of printed circuit board (PCB) Download PDFInfo
- Publication number
- CN106425121A CN106425121A CN201611099499.1A CN201611099499A CN106425121A CN 106425121 A CN106425121 A CN 106425121A CN 201611099499 A CN201611099499 A CN 201611099499A CN 106425121 A CN106425121 A CN 106425121A
- Authority
- CN
- China
- Prior art keywords
- laser
- pcb board
- cutting
- laser cutting
- single lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a method for laser cutting of a printed circuit board (PCB). Laser is adopted to cut at least two single lines on the surface of the PCB, and the two single lines are cut repeatedly alternately to form a kerf. The method for laser cutting of the PCB can improve a smoke discharge effect, a cutting effect and yield.
Description
Technical field
The present invention relates to cut field, specifically a kind of pcb board laser cutting method.
Background technology
Pcb board divides plate to have machinery point plate, laser to divide plate two kinds of techniques at present.Machinery point plate belongs to contact processing, can be right
Converted productss produce cutting force, and converted productss performance is had a certain impact, and jagged can need after cutting to do later stage process.Cut
Slot is wider, it is impossible to full increasingly compact Product processing demand.And laser divides plate typically to make using ultraviolet or green (light) laser
For lasing light emitter, the mode of a cutting pattern Multiple-Scan is reaching the purpose of cut-out pcb board.Due to repeatedly adding in a place
Labour union causes the carbonization of material cutting position to black, and multi-layer sheet can cause short circuit, affects the performance of product even to scrap.Solution is cut
Cut position carbonization nigrescence always laser and divide technical barrier in plate technique.
Content of the invention
It is an object of the invention to provide a kind of pcb board laser cutting method, the method can improve smoke discharging effect and
Cutting effect, improves yields.
The specific technical scheme of the present invention is：A kind of pcb board laser cutting method, is cut on pcb board surface using laser
At least two single lines are cut out, and alternating repeats cutting on two single lines and forms joint-cutting.
In above-mentioned pcb board laser cutting method, the spacing between two adjacent single lines is 0.001mm-0.15mm.
In above-mentioned pcb board laser cutting method, the quantity of described single line is 2,3 or 4.
In above-mentioned pcb board laser cutting method, described laser is 355nm Ultra-Violet Laser, 1064nm laser or CO2
Laser.
In above-mentioned pcb board laser cutting method, the width of described joint-cutting is less than 0.2mm.
In above-mentioned pcb board laser cutting method, described method is specially：Fixed laser emitter, by pcb board material
Cutting pel offset setting back and forth repeatedly value, make laser cut out at least two single lines on pcb board surface, and alternately two
Repeat cutting on bar single line and form joint-cutting.
Compared with prior art, the beneficial effects of the present invention is：
Compared with the cutting technique of like product in current industry, the present invention is cut by repeating alternately cutting single line formation
Seam, substantially improves smoke discharging effect and cutting effect, improves yields, meet the technological requirement of accurate cutting.The present invention
There is obviously advantage currently for 355nm Ultra-Violet Laser cutting pcb board, can be generalized to 1064nm cut in the future,
With CO2 cut field.
Description of the drawings
Fig. 1 cuts the pcb board of gained for the pcb board of the common cutting of the embodiment of the present invention 1 and using the method for the present invention
Structural representation；
Fig. 2 is the operation chart of the cutting method of the embodiment of the present invention 1.
Specific embodiment
With reference to specific embodiment, technical scheme is described in further detail, but do not constitute right
Any restriction of the present invention.
Embodiment 1
As illustrated in fig. 1 and 2, in Fig. 1, A is the schematic diagram of the figure of common cutting, schemes the PROCESS FOR TREATMENT that B is by the present invention
There is the pcb board of two single lines 1 afterwards.
A kind of pcb board laser cutting method, cuts out at least two single lines 1 using laser on 4 surface of pcb board, and replaces
Repeat cutting on two single lines 1 and form joint-cutting 2.
Specifically, as Fig. 2, fixed laser emitter 3, by the cutting pel of pcb board material 4 offset setting back and forth repeatedly
Value, makes laser cut out at least two single lines 1 on 4 surface of pcb board, and alternating repeats cutting on two single lines 1 and forms joint-cutting
2.
The width of joint-cutting 2 is less than 0.2mm, can such as be 0.1mm, 0.15mm, 0.08mm etc., exist some in joint-cutting 2
Bar single line 1, the spacing of single line 1 is that 0.001mm-0.15mm, the live width of single line 1 is very narrow, 1 spacing of single line according to single line quantity come
Determine, such as 1 quantity of single line is many, then 1 spacing of single line is just little, and 1 quantity of single line is few, then 1 spacing of single line is just big.In the present embodiment
In, width of slit is that 0.15mm, single line quantity is 3, and single line spacing is set to 0.03mm i.e., and above-mentioned default deviant is
0.03mm.
The laser for being adopted in the present embodiment is 355nm Ultra-Violet Laser.In actual applications, 1064nm can also be adopted
Laser or CO2Laser.
4 yields of pcb board height prepared by the present embodiment, improves smoke discharging effect and cutting accuracy.
Above-described be only presently preferred embodiments of the present invention, all made in the range of the spirit and principles in the present invention appoint
What modification, equivalent and improvement etc., should be included within the scope of the present invention.
Claims (6)
1. a kind of pcb board laser cutting method, it is characterised in that at least two single lines are cut out on pcb board surface using laser,
And alternating repeats cutting on two single lines and forms joint-cutting.
2. pcb board laser cutting method according to claim 1, it is characterised in that between two adjacent single lines
Away from for 0.001mm-0.15mm.
3. pcb board laser cutting method according to claim 1, it is characterised in that the quantity of described single line is 2,3
Bar or 4.
4. pcb board laser cutting method according to claim 1, it is characterised in that described laser is that 355nm is ultraviolet to swash
Light, 532nm green glow, 1064nm laser or CO2Laser.
5. pcb board laser cutting method according to claim 1, it is characterised in that the width of described joint-cutting is less than
0.2mm.
6. pcb board laser cutting method according to claim 1, it is characterised in that described method is specially：Fixing sharp
Optical transmitting set, the value of the cutting pel of pcb board material offset setting back and forth repeatedly makes laser cut out at least on pcb board surface
Two single lines, and alternately repeating cutting on two single lines forms joint-cutting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611099499.1A CN106425121A (en) | 2016-12-02 | 2016-12-02 | Method for laser cutting of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611099499.1A CN106425121A (en) | 2016-12-02 | 2016-12-02 | Method for laser cutting of printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106425121A true CN106425121A (en) | 2017-02-22 |
Family
ID=58223275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611099499.1A Pending CN106425121A (en) | 2016-12-02 | 2016-12-02 | Method for laser cutting of printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106425121A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114074227A (en) * | 2020-08-14 | 2022-02-22 | 大族激光科技产业集团股份有限公司 | Laser cutting method and laser cutting system for vibrating diaphragm |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103182608A (en) * | 2013-04-03 | 2013-07-03 | 深圳市大族激光科技股份有限公司 | Processing method of PCB (Printed Circuit Board) open cover |
| CN104317464A (en) * | 2014-10-24 | 2015-01-28 | 深圳爱商精密电子有限公司 | Laser engraving method for capacitive touch screen |
| JP2015020226A (en) * | 2013-07-17 | 2015-02-02 | 株式会社ディスコ | Cutting blade tip shape detection method |
| CN105472891A (en) * | 2015-12-31 | 2016-04-06 | 武汉凌云光电科技有限责任公司 | Method for carrying out rigid circuit board cutting by laser |
| CN105479016A (en) * | 2015-12-30 | 2016-04-13 | 大族激光科技产业集团股份有限公司 | Laser cutting method for PCB containing copper layer |
| US20160338204A1 (en) * | 2014-01-20 | 2016-11-17 | Smart Wave Technologies Corp. | Methods of Laser Trace Post Processing and Depaneling of Assembled Printed Circuit |
-
2016
- 2016-12-02 CN CN201611099499.1A patent/CN106425121A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103182608A (en) * | 2013-04-03 | 2013-07-03 | 深圳市大族激光科技股份有限公司 | Processing method of PCB (Printed Circuit Board) open cover |
| JP2015020226A (en) * | 2013-07-17 | 2015-02-02 | 株式会社ディスコ | Cutting blade tip shape detection method |
| US20160338204A1 (en) * | 2014-01-20 | 2016-11-17 | Smart Wave Technologies Corp. | Methods of Laser Trace Post Processing and Depaneling of Assembled Printed Circuit |
| CN104317464A (en) * | 2014-10-24 | 2015-01-28 | 深圳爱商精密电子有限公司 | Laser engraving method for capacitive touch screen |
| CN105479016A (en) * | 2015-12-30 | 2016-04-13 | 大族激光科技产业集团股份有限公司 | Laser cutting method for PCB containing copper layer |
| CN105472891A (en) * | 2015-12-31 | 2016-04-06 | 武汉凌云光电科技有限责任公司 | Method for carrying out rigid circuit board cutting by laser |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114074227A (en) * | 2020-08-14 | 2022-02-22 | 大族激光科技产业集团股份有限公司 | Laser cutting method and laser cutting system for vibrating diaphragm |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170222 |