ZA73328B - Electroless copper plating - Google Patents

Electroless copper plating

Info

Publication number
ZA73328B
ZA73328B ZA730328A ZA73328A ZA73328B ZA 73328 B ZA73328 B ZA 73328B ZA 730328 A ZA730328 A ZA 730328A ZA 73328 A ZA73328 A ZA 73328A ZA 73328 B ZA73328 B ZA 73328B
Authority
ZA
South Africa
Prior art keywords
copper plating
electroless copper
electroless
plating
copper
Prior art date
Application number
ZA730328A
Other languages
English (en)
Inventor
M Gilano
Original Assignee
Cynachem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cynachem Corp filed Critical Cynachem Corp
Publication of ZA73328B publication Critical patent/ZA73328B/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
ZA730328A 1972-01-17 1973-01-16 Electroless copper plating ZA73328B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21845972A 1972-01-17 1972-01-17

Publications (1)

Publication Number Publication Date
ZA73328B true ZA73328B (en) 1973-10-31

Family

ID=22815208

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA730328A ZA73328B (en) 1972-01-17 1973-01-16 Electroless copper plating

Country Status (23)

Country Link
US (1) US3790392A (fr)
JP (1) JPS5519983B2 (fr)
AT (1) AT320372B (fr)
AU (1) AU464729B2 (fr)
BE (1) BE794048A (fr)
CH (1) CH599981A5 (fr)
DD (1) DD107490A5 (fr)
DE (1) DE2300748C3 (fr)
DK (1) DK143948C (fr)
ES (1) ES410652A1 (fr)
FI (1) FI54500C (fr)
FR (1) FR2168364B1 (fr)
GB (1) GB1414896A (fr)
HK (1) HK65076A (fr)
IL (1) IL41331A (fr)
IT (1) IT980460B (fr)
LU (1) LU66834A1 (fr)
NL (1) NL177330C (fr)
NO (1) NO135188C (fr)
PL (1) PL94000B1 (fr)
RO (1) RO69172A (fr)
SE (1) SE387664B (fr)
ZA (1) ZA73328B (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL164906C (nl) * 1975-08-19 1981-02-16 Philips Nv Werkwijze voor de bereiding van een waterig alkalische verkoperbad.
JPS60159328U (ja) * 1984-03-31 1985-10-23 株式会社 高津製作所 ドレン警報器付油量計
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
EP2639335B1 (fr) * 2012-03-14 2015-09-16 Atotech Deutschland GmbH Bain de placage alcalin pour dépôt anélectrolytique d'alliages de cobalt
CN103225092A (zh) * 2013-05-22 2013-07-31 南通鑫平制衣有限公司 一种塑料镀铜
JP6176841B2 (ja) * 2013-07-19 2017-08-09 ローム・アンド・ハース電子材料株式会社 無電解銅めっき液
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1192021B (de) * 1963-01-12 1965-04-29 Dehydag Gmbh Galvanische Baeder
US3457089A (en) * 1967-04-07 1969-07-22 Shipley Co Electroless copperplating
US3635758A (en) * 1969-08-04 1972-01-18 Photocircuits Corp Electroless metal deposition

Also Published As

Publication number Publication date
CH599981A5 (fr) 1978-06-15
DK143948B (da) 1981-11-02
IL41331A (en) 1975-11-25
NL177330C (nl) 1985-09-02
JPS5519983B2 (fr) 1980-05-30
GB1414896A (en) 1975-11-19
BE794048A (fr) 1973-07-16
FI54500B (fi) 1978-08-31
ES410652A1 (es) 1976-01-01
DE2300748B2 (de) 1975-03-13
FR2168364B1 (fr) 1975-03-28
IT980460B (it) 1974-09-30
NL7300599A (fr) 1973-07-19
JPS4999934A (fr) 1974-09-20
US3790392A (en) 1974-02-05
AT320372B (de) 1975-02-10
LU66834A1 (fr) 1973-03-19
PL94000B1 (fr) 1977-07-30
DE2300748C3 (de) 1975-10-30
AU464729B2 (en) 1975-09-04
NO135188B (fr) 1976-11-15
FR2168364A1 (fr) 1973-08-31
DK143948C (da) 1982-04-19
SE387664B (sv) 1976-09-13
HK65076A (en) 1976-10-22
FI54500C (fi) 1978-12-11
DD107490A5 (fr) 1974-08-05
DE2300748A1 (de) 1973-07-26
NO135188C (fr) 1977-02-23
AU5076873A (en) 1974-07-11
NL177330B (nl) 1985-04-01
RO69172A (fr) 1980-01-15
IL41331A0 (en) 1973-03-30

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