ZA200102837B - Impact-resistant epoxide resin compositions. - Google Patents
Impact-resistant epoxide resin compositions. Download PDFInfo
- Publication number
- ZA200102837B ZA200102837B ZA200102837A ZA200102837A ZA200102837B ZA 200102837 B ZA200102837 B ZA 200102837B ZA 200102837 A ZA200102837 A ZA 200102837A ZA 200102837 A ZA200102837 A ZA 200102837A ZA 200102837 B ZA200102837 B ZA 200102837B
- Authority
- ZA
- South Africa
- Prior art keywords
- composition
- component
- dianhydride
- compositions
- adhesive
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims description 68
- 229920000647 polyepoxide Polymers 0.000 title claims description 59
- 239000003822 epoxy resin Substances 0.000 title claims description 49
- 230000001070 adhesive effect Effects 0.000 claims description 60
- 239000000853 adhesive Substances 0.000 claims description 55
- -1 benzenetricarboxylic anhydride Chemical class 0.000 claims description 25
- 229920001577 copolymer Polymers 0.000 claims description 24
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 23
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 16
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 235000013824 polyphenols Nutrition 0.000 claims description 15
- 230000009477 glass transition Effects 0.000 claims description 13
- 150000008442 polyphenolic compounds Chemical class 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- 239000000178 monomer Substances 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 10
- 239000007859 condensation product Substances 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 10
- 239000003981 vehicle Substances 0.000 claims description 10
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 claims description 9
- 238000010276 construction Methods 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 9
- 229920000768 polyamine Polymers 0.000 claims description 8
- 239000007795 chemical reaction product Substances 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 6
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 125000003277 amino group Chemical group 0.000 claims description 5
- 150000004985 diamines Chemical class 0.000 claims description 5
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 5
- 239000004849 latent hardener Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 150000007513 acids Chemical class 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- 238000009833 condensation Methods 0.000 claims description 4
- 230000005494 condensation Effects 0.000 claims description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 4
- 150000002357 guanidines Chemical class 0.000 claims description 4
- 229920001451 polypropylene glycol Polymers 0.000 claims description 4
- 238000000518 rheometry Methods 0.000 claims description 4
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 4
- 239000003085 diluting agent Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 2
- XLXVRIOQCHHBTC-UHFFFAOYSA-N 2,2-bis(phenoxycarbonyl)propanedioic acid Chemical compound C=1C=CC=CC=1OC(=O)C(C(O)=O)(C(=O)O)C(=O)OC1=CC=CC=C1 XLXVRIOQCHHBTC-UHFFFAOYSA-N 0.000 claims description 2
- MILSYCKGLDDVLM-UHFFFAOYSA-N 2-phenylpropan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)C1=CC=CC=C1 MILSYCKGLDDVLM-UHFFFAOYSA-N 0.000 claims description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 2
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 claims description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 2
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims description 2
- YOURXVGYNVXQKT-UHFFFAOYSA-N oxacycloundecane-2,11-dione Chemical compound O=C1CCCCCCCCC(=O)O1 YOURXVGYNVXQKT-UHFFFAOYSA-N 0.000 claims description 2
- ZJHUBLNWMCWUOV-UHFFFAOYSA-N oxocane-2,8-dione Chemical compound O=C1CCCCCC(=O)O1 ZJHUBLNWMCWUOV-UHFFFAOYSA-N 0.000 claims description 2
- RMIBXGXWMDCYEK-UHFFFAOYSA-N oxonane-2,9-dione Chemical compound O=C1CCCCCCC(=O)O1 RMIBXGXWMDCYEK-UHFFFAOYSA-N 0.000 claims description 2
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 claims description 2
- 239000004014 plasticizer Substances 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 238000004382 potting Methods 0.000 claims description 2
- 239000003381 stabilizer Substances 0.000 claims description 2
- 239000000080 wetting agent Substances 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 claims 1
- 239000002202 Polyethylene glycol Substances 0.000 claims 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims 1
- HAMNKKUPIHEESI-UHFFFAOYSA-N aminoguanidine Chemical class NNC(N)=N HAMNKKUPIHEESI-UHFFFAOYSA-N 0.000 claims 1
- 150000004984 aromatic diamines Chemical class 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 125000002897 diene group Chemical group 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 150000002825 nitriles Chemical class 0.000 claims 1
- 229920000058 polyacrylate Polymers 0.000 claims 1
- QROGIFZRVHSFLM-UHFFFAOYSA-N prop-1-enylbenzene Chemical compound CC=CC1=CC=CC=C1 QROGIFZRVHSFLM-UHFFFAOYSA-N 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 21
- 238000006243 chemical reaction Methods 0.000 description 17
- 239000004593 Epoxy Substances 0.000 description 11
- 239000004848 polyfunctional curative Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000004831 Hot glue Substances 0.000 description 9
- 238000001723 curing Methods 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 229920001515 polyalkylene glycol Polymers 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 239000004823 Reactive adhesive Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 150000008064 anhydrides Chemical class 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- 229920013646 Hycar Polymers 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 235000013877 carbamide Nutrition 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 150000001993 dienes Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002118 epoxides Chemical class 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 150000002170 ethers Chemical class 0.000 description 3
- 239000012943 hotmelt Substances 0.000 description 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 235000014593 oils and fats Nutrition 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 150000003672 ureas Chemical class 0.000 description 3
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical class NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 2
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical class NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- XXOYNJXVWVNOOJ-UHFFFAOYSA-N fenuron Chemical compound CN(C)C(=O)NC1=CC=CC=C1 XXOYNJXVWVNOOJ-UHFFFAOYSA-N 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- CHJJGSNFBQVOTG-UHFFFAOYSA-N methylguanidine Chemical compound CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 2
- BMLIZLVNXIYGCK-UHFFFAOYSA-N monuron Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C=C1 BMLIZLVNXIYGCK-UHFFFAOYSA-N 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- JFINOWIINSTUNY-UHFFFAOYSA-N pyrrolidin-3-ylmethanesulfonamide Chemical compound NS(=O)(=O)CC1CCNC1 JFINOWIINSTUNY-UHFFFAOYSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910052882 wollastonite Inorganic materials 0.000 description 2
- 239000010456 wollastonite Substances 0.000 description 2
- NQOFYFRKWDXGJP-UHFFFAOYSA-N 1,1,2-trimethylguanidine Chemical compound CN=C(N)N(C)C NQOFYFRKWDXGJP-UHFFFAOYSA-N 0.000 description 1
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 1
- UTCOUOISVRSLSH-UHFFFAOYSA-N 1,2-Anthracenediol Chemical class C1=CC=CC2=CC3=C(O)C(O)=CC=C3C=C21 UTCOUOISVRSLSH-UHFFFAOYSA-N 0.000 description 1
- LINDOXZENKYESA-UHFFFAOYSA-N 1,2-dimethylguanidine Chemical compound CNC(N)=NC LINDOXZENKYESA-UHFFFAOYSA-N 0.000 description 1
- DMYOHQBLOZMDLP-UHFFFAOYSA-N 1-[2-(2-hydroxy-3-piperidin-1-ylpropoxy)phenyl]-3-phenylpropan-1-one Chemical compound C1CCCCN1CC(O)COC1=CC=CC=C1C(=O)CCC1=CC=CC=C1 DMYOHQBLOZMDLP-UHFFFAOYSA-N 0.000 description 1
- MCMFEZDRQOJKMN-UHFFFAOYSA-N 1-butylimidazole Chemical compound CCCCN1C=CN=C1 MCMFEZDRQOJKMN-UHFFFAOYSA-N 0.000 description 1
- LLVWLCAZSOLOTF-UHFFFAOYSA-N 1-methyl-4-[1,4,4-tris(4-methylphenyl)buta-1,3-dienyl]benzene Chemical compound C1=CC(C)=CC=C1C(C=1C=CC(C)=CC=1)=CC=C(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 LLVWLCAZSOLOTF-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- NBNGHXWJFSMASY-UHFFFAOYSA-N 2,3,4-tris(dimethylamino)phenol Chemical compound CN(C)C1=CC=C(O)C(N(C)C)=C1N(C)C NBNGHXWJFSMASY-UHFFFAOYSA-N 0.000 description 1
- JPSKCQCQZUGWNM-UHFFFAOYSA-N 2,7-Oxepanedione Chemical compound O=C1CCCCC(=O)O1 JPSKCQCQZUGWNM-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- QFRHTANKIYQYLO-UHFFFAOYSA-N 2-ethyl-2-methylimidazole Chemical compound CCC1(C)N=CC=N1 QFRHTANKIYQYLO-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000006596 Alder-ene reaction Methods 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000005510 Diuron Substances 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Chemical class 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-N Salicylic acid Natural products OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 229920001079 Thiokol (polymer) Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 125000002015 acyclic group Chemical group 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 150000003973 alkyl amines Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- HHSPVTKDOHQBKF-UHFFFAOYSA-J calcium;magnesium;dicarbonate Chemical class [Mg+2].[Ca+2].[O-]C([O-])=O.[O-]C([O-])=O HHSPVTKDOHQBKF-UHFFFAOYSA-J 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical group 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229910001919 chlorite Inorganic materials 0.000 description 1
- 229910052619 chlorite group Inorganic materials 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- GKIPXFAANLTWBM-UHFFFAOYSA-N epibromohydrin Chemical compound BrCC1CO1 GKIPXFAANLTWBM-UHFFFAOYSA-N 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003733 fiber-reinforced composite Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical compound O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000003949 imides Chemical group 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 150000007965 phenolic acids Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 150000003053 piperidines Chemical class 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
- C08G59/4253—Rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/52—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyamides (AREA)
- Graft Or Block Polymers (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19845607A DE19845607A1 (de) | 1998-10-06 | 1998-10-06 | Schlagfeste Epoxidharz-Zusammensetzungen |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA200102837B true ZA200102837B (en) | 2002-07-05 |
Family
ID=7883307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA200102837A ZA200102837B (en) | 1998-10-06 | 2001-04-05 | Impact-resistant epoxide resin compositions. |
Country Status (18)
Country | Link |
---|---|
EP (1) | EP1123348B1 (cs) |
JP (1) | JP2002526618A (cs) |
KR (1) | KR20010086403A (cs) |
CN (1) | CN1328588A (cs) |
AR (1) | AR022677A1 (cs) |
AT (1) | ATE314425T1 (cs) |
AU (1) | AU6197299A (cs) |
BR (1) | BR9915911A (cs) |
CA (1) | CA2346634A1 (cs) |
CZ (1) | CZ20011222A3 (cs) |
DE (2) | DE19845607A1 (cs) |
ES (1) | ES2255761T3 (cs) |
HU (1) | HUP0104052A2 (cs) |
PL (1) | PL347571A1 (cs) |
SK (1) | SK4562001A3 (cs) |
TR (1) | TR200100964T2 (cs) |
WO (1) | WO2000020483A2 (cs) |
ZA (1) | ZA200102837B (cs) |
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JP3765731B2 (ja) * | 2000-04-10 | 2006-04-12 | 住友ベークライト株式会社 | ダイアタッチペースト及び半導体装置 |
DE50102330D1 (de) | 2000-04-10 | 2004-06-24 | Henkel Kgaa | Schlagfeste epoxidharz-zusammensetzungen |
DE10062009A1 (de) * | 2000-12-13 | 2002-07-04 | Henkel Teroson Gmbh | Mehrschichtige Sandwich-Materialien mit organischen Zwischenschichten auf Epoxidbasis |
US6787579B2 (en) | 2001-05-02 | 2004-09-07 | L&L Products, Inc. | Two-component (epoxy/amine) structural foam-in-place material |
US6682818B2 (en) | 2001-08-24 | 2004-01-27 | L&L Products, Inc. | Paintable material |
US6887914B2 (en) | 2001-09-07 | 2005-05-03 | L&L Products, Inc. | Structural hot melt material and methods |
US6793274B2 (en) * | 2001-11-14 | 2004-09-21 | L&L Products, Inc. | Automotive rail/frame energy management system |
US20030192643A1 (en) | 2002-03-15 | 2003-10-16 | Rainer Schoenfeld | Epoxy adhesive having improved impact resistance |
KR100523594B1 (ko) * | 2002-10-24 | 2005-10-24 | 주식회사 엘지화학 | 에폭시/열가소성 수지 블렌드 조성물 |
KR100588301B1 (ko) * | 2002-10-24 | 2006-06-09 | 주식회사 엘지화학 | 에폭시/열가소성 수지 블렌드 조성물 |
EP1457509B1 (de) * | 2003-03-11 | 2006-06-28 | hanse chemie AG | Polymere Epoxidharz-Zusammensetzung |
DE10312815A1 (de) | 2003-03-22 | 2004-10-07 | Henkel Kgaa | Verfahren zum Kontaminationstoleranten Kleben von Fügeteilen |
DE10357355A1 (de) * | 2003-12-09 | 2005-07-14 | Henkel Kgaa | 2 K Klebstoffe für den Fahrzeugbau |
FR2866895B1 (fr) * | 2004-02-27 | 2007-08-10 | Michelin Soc Tech | Utilisation d'une colle pour assembler un organe et une roue, ensemble d'un organe et d'une roue, organe et roue |
DE602004004501T3 (de) * | 2004-03-12 | 2015-05-28 | Dow Global Technologies Inc. | Epoxidharz Klebstoffzusammensetzung |
US8070994B2 (en) | 2004-06-18 | 2011-12-06 | Zephyros, Inc. | Panel structure |
JP4820615B2 (ja) | 2004-10-19 | 2011-11-24 | 日東電工株式会社 | 基板処理装置の除塵用基板及びそれを用いた除塵方法 |
EP1868176A4 (en) * | 2005-04-07 | 2009-12-16 | Nitto Denko Corp | SHOCK ABSORPTION SHEET FOR A FLAT DISPLAY, MANUFACTURING PROCESS THEREFOR AND FLAT DISPLAY |
DE102005018671B4 (de) * | 2005-04-21 | 2008-10-09 | Henkel Ag & Co. Kgaa | Schlagzähe Epoxidharz-Zusammensetzungen |
EP1728825B2 (en) | 2005-06-02 | 2013-10-23 | Dow Global Technologies LLC | Toughened structural epoxy adhesive |
ES2335531T3 (es) * | 2005-07-15 | 2010-03-29 | Huntsman Advanced Materials (Switzerland) Gmbh | Composicion de tenacidad a la fractura aumentada. |
US8475694B2 (en) | 2005-10-25 | 2013-07-02 | Zephyros, Inc. | Shaped expandable material |
CN101517029B (zh) * | 2006-07-31 | 2013-10-16 | 汉高股份及两合公司 | 可固化的环氧树脂-基粘合剂组合物 |
EP2076578A4 (en) | 2006-10-06 | 2011-01-19 | Henkel Ag & Co Kgaa | POWDER-RESISTANT EPOXY-BASED PUMP-BASED ADHESIVES |
EP1972646A1 (de) | 2007-03-20 | 2008-09-24 | Sika Technology AG | Epoxidgruppen terminierte Polymer, deren Zusammensetzungen und deren Verwendung als Schlagzähigkeitsmodifikatoren |
JP2008303372A (ja) * | 2007-05-09 | 2008-12-18 | Jfe Chemical Corp | 非対称構造を有するポリイミド前駆体、ポリイミドおよびそれらの製造方法 |
EP2062928A1 (de) * | 2007-11-21 | 2009-05-27 | Sika Technology AG | Schlagzähigkeitsverbesserer für Epoxidharzzusammensetzungen |
DE102007059183A1 (de) | 2007-12-06 | 2009-06-10 | Henkel Ag & Co. Kgaa | Verfahren zur Verstärkung, Dämmung, Dämpfung und/oder Abdichtung von Hohlbauteilen |
GB0806434D0 (en) | 2008-04-09 | 2008-05-14 | Zephyros Inc | Improvements in or relating to structural adhesives |
EP2110397A1 (de) | 2008-04-16 | 2009-10-21 | Sika Technology AG | Auf amphiphilen Block-Copolymer basierendes Polyurethan-Polymer und dessen Verwendung als Schlagzähigkeitsmodifikator |
ATE548405T1 (de) | 2008-04-30 | 2012-03-15 | Sika Technology Ag | Aktivator für epoxidharzzusammensetzungen |
EP2113525A1 (de) | 2008-04-30 | 2009-11-04 | Sika Technology AG | Aktivator für Epoxidharzzusammensetzungen |
EP2128182A1 (de) | 2008-05-28 | 2009-12-02 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzung enthaltend einen Beschleuniger mit Heteroatomen |
JP2009286868A (ja) * | 2008-05-28 | 2009-12-10 | Jfe Chemical Corp | 線状ポリイミド前駆体、線状ポリイミド、その熱硬化物、製造方法、接着剤および銅張積層板 |
DE502008000478D1 (de) | 2008-07-17 | 2010-05-06 | Sika Technology Ag | Haftvermittlerverbindungen für beölten Stahl |
EP2145924A1 (de) * | 2008-07-18 | 2010-01-20 | Sika Technology AG | Auf amphiphilen Block-Copolymer basierende Reaktionsprodukte und deren Verwendung als Schlagzähigkeitsmodifikator |
EP2161274B1 (de) | 2008-08-27 | 2010-05-19 | Sika Technology AG | Silan-/Harnstoff-Verbindung als hitzeaktivierbarer Härter für Epoxidharzzusammensetzungen |
ATE483751T1 (de) | 2008-10-31 | 2010-10-15 | Sika Technology Ag | Hitzehärtende epoxidharzzusammensetzungen einsetzbar als rohbauklebstoff oder strukturschaum |
WO2010071107A1 (ja) * | 2008-12-15 | 2010-06-24 | 宇部興産株式会社 | 熱硬化性変性ポリイミド樹脂組成物 |
WO2010110069A1 (ja) * | 2009-03-23 | 2010-09-30 | 日立化成工業株式会社 | ダイボンディング用樹脂ペースト、それを用いた半導体装置の製造方法、及び半導体装置 |
JP2012529555A (ja) * | 2009-06-12 | 2012-11-22 | トリリオン サイエンス インク | エポキシ組成物用潜在性硬化剤 |
GB0916205D0 (en) | 2009-09-15 | 2009-10-28 | Zephyros Inc | Improvements in or relating to cavity filling |
KR20120112447A (ko) | 2009-11-05 | 2012-10-11 | 다우 글로벌 테크놀로지스 엘엘씨 | 케톡심으로 캠핑된 탄성중합체성 강인화제를 함유하는 구조용 에폭시 수지 접착제 |
DE102009054999A1 (de) | 2009-12-18 | 2011-06-22 | Henkel AG & Co. KGaA, 40589 | Verbundbauteil |
JP2013521163A (ja) | 2010-03-04 | 2013-06-10 | ゼフィロス インコーポレイテッド | 構造複合積層品 |
GB201016530D0 (en) | 2010-09-30 | 2010-11-17 | Zephyros Inc | Improvements in or relating to adhesives |
EP2436712A1 (de) | 2010-10-01 | 2012-04-04 | Sika Technology AG | Schlagzähigkeitsmodifikatoren für Epoxidharzzusammensetzungen |
JP6049705B2 (ja) * | 2011-05-19 | 2016-12-21 | ダウ グローバル テクノロジーズ エルエルシー | 新規な構造用接着剤及びその使用 |
CN103732647B (zh) | 2011-08-22 | 2017-08-11 | 陶氏环球技术有限责任公司 | 增韧剂和增韧的环氧粘合剂 |
EP2562210A1 (en) | 2011-08-24 | 2013-02-27 | Henkel Italia S.p.A. | Indicator for cure of two-component- epoxy adhesives |
US20150051315A1 (en) * | 2012-02-17 | 2015-02-19 | Huntsman Advanced Materials Americas Llc | Mixture of Benzoxazine, Epoxy and Anhydride |
US10577522B2 (en) | 2013-07-26 | 2020-03-03 | Zephyros, Inc. | Thermosetting adhesive films including a fibrous carrier |
GB201412706D0 (en) * | 2014-07-17 | 2014-09-03 | Knauf Insulation And Knauf Insulation Ltd | Improved binder compositions and uses thereof |
GB201417985D0 (en) | 2014-10-10 | 2014-11-26 | Zephyros Inc | Improvements in or relating to structural adhesives |
DE102014226826A1 (de) | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Epoxidharz-Zusammensetzung |
CN110205068B (zh) * | 2018-02-28 | 2021-12-31 | 旭化成株式会社 | 热固化性粘接剂 |
CN111154442B (zh) * | 2020-01-13 | 2022-05-24 | 王凤艳 | 一种环保耐高温改性环氧树脂胶粘剂及其制备方法 |
KR102454213B1 (ko) * | 2021-03-19 | 2022-10-14 | 한국화학연구원 | 산 무수물기반 에폭시 화합물, 이를 포함하는 에폭시 접착제 조성물 및 이로부터 제조된 경화물 |
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US4820779A (en) * | 1986-07-01 | 1989-04-11 | National Starch And Chemical Corporation | Adduct of a carbinol-containing polyimide oligomer terminated with epoxide-reactive groups and a polyepoxide |
EP0308664B1 (de) * | 1987-08-26 | 1991-08-28 | Ciba-Geigy Ag | Modifizierte Epoxidharze |
EP0309190A3 (en) * | 1987-09-22 | 1990-10-17 | National Starch And Chemical Investment Holding Corporation | Polyimide coating compositions |
US4842188A (en) * | 1988-07-28 | 1989-06-27 | Elopak Systems A.G. | Two-piece flat top container |
DE59008553D1 (de) * | 1989-01-20 | 1995-04-06 | Ciba Geigy Ag | Härtbare Epoxidharz-Stoffgemische enthaltend einen Thermoplast mit phenolischen Endgruppen. |
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-
1998
- 1998-10-06 DE DE19845607A patent/DE19845607A1/de not_active Withdrawn
-
1999
- 1999-09-25 WO PCT/EP1999/007143 patent/WO2000020483A2/de active IP Right Grant
- 1999-09-25 AU AU61972/99A patent/AU6197299A/en not_active Abandoned
- 1999-09-25 KR KR1020017004288A patent/KR20010086403A/ko not_active Application Discontinuation
- 1999-09-25 JP JP2000574591A patent/JP2002526618A/ja active Pending
- 1999-09-25 CN CN99811801A patent/CN1328588A/zh active Pending
- 1999-09-25 PL PL99347571A patent/PL347571A1/xx unknown
- 1999-09-25 AT AT99948868T patent/ATE314425T1/de not_active IP Right Cessation
- 1999-09-25 EP EP99948868A patent/EP1123348B1/de not_active Expired - Lifetime
- 1999-09-25 ES ES99948868T patent/ES2255761T3/es not_active Expired - Lifetime
- 1999-09-25 DE DE59912991T patent/DE59912991D1/de not_active Expired - Fee Related
- 1999-09-25 CZ CZ20011222A patent/CZ20011222A3/cs unknown
- 1999-09-25 CA CA002346634A patent/CA2346634A1/en not_active Abandoned
- 1999-09-25 BR BR9915911-2A patent/BR9915911A/pt not_active IP Right Cessation
- 1999-09-25 SK SK456-2001A patent/SK4562001A3/sk unknown
- 1999-09-25 TR TR2001/00964T patent/TR200100964T2/xx unknown
- 1999-09-25 HU HU0104052A patent/HUP0104052A2/hu unknown
- 1999-10-06 AR ARP990105057A patent/AR022677A1/es unknown
-
2001
- 2001-04-05 ZA ZA200102837A patent/ZA200102837B/en unknown
Also Published As
Publication number | Publication date |
---|---|
AR022677A1 (es) | 2002-09-04 |
CA2346634A1 (en) | 2000-04-13 |
TR200100964T2 (tr) | 2002-10-21 |
WO2000020483A3 (de) | 2000-07-13 |
EP1123348A2 (de) | 2001-08-16 |
WO2000020483A2 (de) | 2000-04-13 |
KR20010086403A (ko) | 2001-09-10 |
CN1328588A (zh) | 2001-12-26 |
DE59912991D1 (de) | 2006-02-02 |
DE19845607A1 (de) | 2000-04-20 |
JP2002526618A (ja) | 2002-08-20 |
SK4562001A3 (en) | 2001-10-08 |
ES2255761T3 (es) | 2006-07-01 |
AU6197299A (en) | 2000-04-26 |
PL347571A1 (en) | 2002-04-08 |
ATE314425T1 (de) | 2006-01-15 |
CZ20011222A3 (cs) | 2001-08-15 |
BR9915911A (pt) | 2001-08-14 |
HUP0104052A2 (hu) | 2002-02-28 |
EP1123348B1 (de) | 2005-12-28 |
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