ZA200006624B - Method for electro copperplating substrates. - Google Patents

Method for electro copperplating substrates.

Info

Publication number
ZA200006624B
ZA200006624B ZA200006624A ZA200006624A ZA200006624B ZA 200006624 B ZA200006624 B ZA 200006624B ZA 200006624 A ZA200006624 A ZA 200006624A ZA 200006624 A ZA200006624 A ZA 200006624A ZA 200006624 B ZA200006624 B ZA 200006624B
Authority
ZA
South Africa
Prior art keywords
copper
substrates
copperplating
electro
separate
Prior art date
Application number
ZA200006624A
Other languages
English (en)
Inventor
Juergen Hupe
Walter Kronenberg
Eugen Breitkreuz
Ulrich Schmergel
Original Assignee
Blasberg Oberflaechentech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blasberg Oberflaechentech filed Critical Blasberg Oberflaechentech
Publication of ZA200006624B publication Critical patent/ZA200006624B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Optical Integrated Circuits (AREA)
  • ing And Chemical Polishing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
ZA200006624A 1998-05-16 2000-11-15 Method for electro copperplating substrates. ZA200006624B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19822076 1998-05-16

Publications (1)

Publication Number Publication Date
ZA200006624B true ZA200006624B (en) 2001-06-01

Family

ID=7868038

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA200006624A ZA200006624B (en) 1998-05-16 2000-11-15 Method for electro copperplating substrates.

Country Status (22)

Country Link
US (1) US6576111B1 (fr)
EP (1) EP1080252B1 (fr)
JP (1) JP2002515549A (fr)
KR (1) KR100545664B1 (fr)
CN (1) CN1170965C (fr)
AT (1) ATE221930T1 (fr)
AU (1) AU4261799A (fr)
CA (1) CA2331750A1 (fr)
DE (1) DE59902276D1 (fr)
DK (1) DK1080252T3 (fr)
HU (1) HUP0102016A3 (fr)
IL (1) IL139418A0 (fr)
IS (1) IS5703A (fr)
NO (1) NO20005777D0 (fr)
PL (1) PL344529A1 (fr)
RO (1) RO119838B1 (fr)
RU (1) RU2222643C2 (fr)
SK (1) SK16912000A3 (fr)
TR (1) TR200003368T2 (fr)
WO (1) WO1999060188A2 (fr)
YU (1) YU70900A (fr)
ZA (1) ZA200006624B (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3725083B2 (ja) * 2002-02-21 2005-12-07 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング メッキ設備における金属イオン供給源の有効保存を可能とする方法
US7776741B2 (en) 2008-08-18 2010-08-17 Novellus Systems, Inc. Process for through silicon via filing
US10472730B2 (en) 2009-10-12 2019-11-12 Novellus Systems, Inc. Electrolyte concentration control system for high rate electroplating
US9109295B2 (en) * 2009-10-12 2015-08-18 Novellus Systems, Inc. Electrolyte concentration control system for high rate electroplating
US20180142369A1 (en) * 2015-06-26 2018-05-24 Sumitimo Metal Mining Co., Ltd. Electrically conductive substrate
US10692735B2 (en) 2017-07-28 2020-06-23 Lam Research Corporation Electro-oxidative metal removal in through mask interconnect fabrication

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3483078D1 (de) * 1983-09-28 1990-10-04 Blasberg Oberflaechentech Saures galvanisches kupferbad und verfahren zu seiner herstellung.
JPS62112996A (ja) * 1985-11-11 1987-05-23 Mitsubishi Metal Corp 伝熱体
DE4001960A1 (de) * 1990-01-24 1991-07-25 Roland Schnetteler Verfahren zum elektrochemischen beschichten von stahlbaendern mit zink-nickellegierungen
JPH04320088A (ja) * 1991-04-18 1992-11-10 Cmk Corp プリント配線板の製造方法

Also Published As

Publication number Publication date
NO20005777L (no) 2000-11-15
US6576111B1 (en) 2003-06-10
ATE221930T1 (de) 2002-08-15
HUP0102016A2 (hu) 2001-09-28
AU4261799A (en) 1999-12-06
TR200003368T2 (tr) 2001-04-20
DE59902276D1 (de) 2002-09-12
KR100545664B1 (ko) 2006-01-24
CA2331750A1 (fr) 1999-11-25
CN1301313A (zh) 2001-06-27
WO1999060188A2 (fr) 1999-11-25
EP1080252A1 (fr) 2001-03-07
IL139418A0 (en) 2001-11-25
HUP0102016A3 (en) 2002-03-28
RO119838B1 (ro) 2005-04-29
CN1170965C (zh) 2004-10-13
EP1080252B1 (fr) 2002-08-07
WO1999060188A3 (fr) 2000-01-13
RU2222643C2 (ru) 2004-01-27
KR20010043597A (ko) 2001-05-25
YU70900A (sh) 2003-02-28
SK16912000A3 (sk) 2001-08-06
DK1080252T3 (da) 2003-01-06
NO20005777D0 (no) 2000-11-15
JP2002515549A (ja) 2002-05-28
IS5703A (is) 2000-11-02
PL344529A1 (en) 2001-11-05

Similar Documents

Publication Publication Date Title
EE200100059A (et) Leeliseline tsink-nikkel galvaanimisvann
AU2002256115A1 (en) Zinc/air cell
TW200513548A (en) Insoluble anode with an auxiliary electrode
ES8406570A1 (es) Catodo para la produccion electrolitica de hidrogeno
ATE269432T1 (de) Verfahren zur elektrochemischen herstellung von lithium
IL139418A0 (en) Method for electro copperplating substrates
DE50310295D1 (de) Druckelektrolyseur und verfahren zur abschaltung eines druckelektrolyseurs
ZA985883B (en) A process for the electrochemical treatment of concrete
ATE338151T1 (de) Verfahren und zelle zur elektrochemischen herstellung von alkalimetall aus alkalimetallamalgam
WO1999015714A3 (fr) Procede d'electrodeposition
SG152024A1 (en) Process for the protection of reinforcement in reinforced concrete
PL1702090T3 (pl) Urządzenie do powlekania cynkiem lub stopami cynku
PL327960A1 (en) Electrode for an method of electrochemically treating reinforced concrete
WO1999010564A3 (fr) Procede et dispositif pour reguler la concentration de substances dans des electrolytes
MXPA01013035A (es) Metodo y aparato para la electro-deposicion de metal.
WO2004014806A3 (fr) Systeme electrochimique combine pour le detartrage et l'elimination des bacteries legionella pneumophila dans des systemes d'alimentation en eau
WO2003093538A8 (fr) Reduction de consommation d'energie dans l'electroaffinage ou l'electroextraction de metal
DE69942669D1 (de) Submikrone metallisierung unter verwendung elektrochemischer beschichtung
GB2365421B (en) Method of electrochemical treatment of building material
JPS5357199A (en) Regenerating method for cation exchange membrane
GEP20012537B (en) Method of Production of Electrolytic Zinc
AU2920599A (en) Method for electrically regenerating contaminated rhodium solutions
JPS57101359A (en) Improvement of zinc-bromine battery
HUT52571A (en) Process for production on galvanic way of sliding surface of lead, tin, copper and politetrafluorethilene
ES2134724B1 (es) Equipo y procedimiento para llevar a cabo la extraccion electrolitica de metales en disolucion en una celda electrolitica.