YU34721B - Process for low-voltage electroplating of bright, ductile copper coatings on metal surfaces - Google Patents

Process for low-voltage electroplating of bright, ductile copper coatings on metal surfaces

Info

Publication number
YU34721B
YU34721B YU2509/71A YU250971A YU34721B YU 34721 B YU34721 B YU 34721B YU 2509/71 A YU2509/71 A YU 2509/71A YU 250971 A YU250971 A YU 250971A YU 34721 B YU34721 B YU 34721B
Authority
YU
Yugoslavia
Prior art keywords
bright
low
metal surfaces
copper coatings
ductile copper
Prior art date
Application number
YU2509/71A
Other languages
English (en)
Other versions
YU250971A (en
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of YU250971A publication Critical patent/YU250971A/xx
Publication of YU34721B publication Critical patent/YU34721B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Conductive Materials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
YU2509/71A 1970-10-29 1971-10-04 Process for low-voltage electroplating of bright, ductile copper coatings on metal surfaces YU34721B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2053860A DE2053860C3 (de) 1970-10-29 1970-10-29 Saures wäßriges Bad zur galvanischen Abscheidung glänzender Kupferüberzüge

Publications (2)

Publication Number Publication Date
YU250971A YU250971A (en) 1979-04-30
YU34721B true YU34721B (en) 1979-12-31

Family

ID=5786940

Family Applications (1)

Application Number Title Priority Date Filing Date
YU2509/71A YU34721B (en) 1970-10-29 1971-10-04 Process for low-voltage electroplating of bright, ductile copper coatings on metal surfaces

Country Status (18)

Country Link
US (1) US3767539A (enrdf_load_stackoverflow)
JP (1) JPS5126893B1 (enrdf_load_stackoverflow)
AT (1) AT307844B (enrdf_load_stackoverflow)
AU (1) AU450638B2 (enrdf_load_stackoverflow)
BE (1) BE774697A (enrdf_load_stackoverflow)
BR (1) BR7107116D0 (enrdf_load_stackoverflow)
CA (1) CA967110A (enrdf_load_stackoverflow)
CH (1) CH563466A5 (enrdf_load_stackoverflow)
DE (1) DE2053860C3 (enrdf_load_stackoverflow)
ES (1) ES395741A1 (enrdf_load_stackoverflow)
FR (1) FR2111926B1 (enrdf_load_stackoverflow)
GB (1) GB1372850A (enrdf_load_stackoverflow)
IE (1) IE35774B1 (enrdf_load_stackoverflow)
NL (1) NL169353C (enrdf_load_stackoverflow)
SE (1) SE364737B (enrdf_load_stackoverflow)
SU (1) SU452107A3 (enrdf_load_stackoverflow)
YU (1) YU34721B (enrdf_load_stackoverflow)
ZA (1) ZA716879B (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4417956A (en) * 1980-07-17 1983-11-29 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4540473A (en) * 1983-11-22 1985-09-10 International Business Machines Corporation Copper plating bath having increased plating rate, and method
US6024857A (en) * 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
KR100659544B1 (ko) * 1999-11-12 2006-12-19 에바라 유지라이토 코포레이션 리미티드 비아 필링 방법
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE322956B (enrdf_load_stackoverflow) * 1966-08-20 1970-04-20 Schering Ag
US3492135A (en) * 1967-02-01 1970-01-27 Schering Ag Stabilized bath for deposition of copper by chemical reduction
BE759316A (fr) * 1969-12-30 1971-04-30 Parker Ste Continentale Composition et procede pour former un depot de cuivre sur des surfaces de metaux ferreux

Also Published As

Publication number Publication date
CH563466A5 (enrdf_load_stackoverflow) 1975-06-30
SU452107A3 (ru) 1974-11-30
US3767539A (en) 1973-10-23
IE35774L (en) 1972-04-29
NL169353B (nl) 1982-02-01
YU250971A (en) 1979-04-30
DE2053860A1 (de) 1972-06-08
AT307844B (de) 1973-06-12
NL7114979A (enrdf_load_stackoverflow) 1972-05-03
DE2053860C3 (de) 1980-11-06
JPS5126893B1 (enrdf_load_stackoverflow) 1976-08-09
IE35774B1 (en) 1976-05-12
ZA716879B (en) 1972-06-28
FR2111926B1 (enrdf_load_stackoverflow) 1974-10-11
SE364737B (enrdf_load_stackoverflow) 1974-03-04
DE2053860B2 (de) 1980-03-13
AU3473471A (en) 1973-05-03
NL169353C (nl) 1982-07-01
CA967110A (en) 1975-05-06
BE774697A (fr) 1972-05-02
AU450638B2 (en) 1974-07-18
FR2111926A1 (enrdf_load_stackoverflow) 1972-06-09
ES395741A1 (es) 1974-09-16
GB1372850A (en) 1974-11-06
BR7107116D0 (pt) 1973-03-29

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