CA967110A - Acidic copper electrolytes including selenium compound with sulphonic acid group - Google Patents

Acidic copper electrolytes including selenium compound with sulphonic acid group

Info

Publication number
CA967110A
CA967110A CA126,465A CA126465A CA967110A CA 967110 A CA967110 A CA 967110A CA 126465 A CA126465 A CA 126465A CA 967110 A CA967110 A CA 967110A
Authority
CA
Canada
Prior art keywords
acid group
sulphonic acid
selenium compound
acidic copper
electrolytes including
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA126,465A
Other languages
English (en)
Other versions
CA126465S (en
Inventor
Wolfgang Clauss
Hans-Gunther Todt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Application granted granted Critical
Publication of CA967110A publication Critical patent/CA967110A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Conductive Materials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CA126,465A 1970-10-29 1971-10-29 Acidic copper electrolytes including selenium compound with sulphonic acid group Expired CA967110A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2053860A DE2053860C3 (de) 1970-10-29 1970-10-29 Saures wäßriges Bad zur galvanischen Abscheidung glänzender Kupferüberzüge

Publications (1)

Publication Number Publication Date
CA967110A true CA967110A (en) 1975-05-06

Family

ID=5786940

Family Applications (1)

Application Number Title Priority Date Filing Date
CA126,465A Expired CA967110A (en) 1970-10-29 1971-10-29 Acidic copper electrolytes including selenium compound with sulphonic acid group

Country Status (18)

Country Link
US (1) US3767539A (enrdf_load_stackoverflow)
JP (1) JPS5126893B1 (enrdf_load_stackoverflow)
AT (1) AT307844B (enrdf_load_stackoverflow)
AU (1) AU450638B2 (enrdf_load_stackoverflow)
BE (1) BE774697A (enrdf_load_stackoverflow)
BR (1) BR7107116D0 (enrdf_load_stackoverflow)
CA (1) CA967110A (enrdf_load_stackoverflow)
CH (1) CH563466A5 (enrdf_load_stackoverflow)
DE (1) DE2053860C3 (enrdf_load_stackoverflow)
ES (1) ES395741A1 (enrdf_load_stackoverflow)
FR (1) FR2111926B1 (enrdf_load_stackoverflow)
GB (1) GB1372850A (enrdf_load_stackoverflow)
IE (1) IE35774B1 (enrdf_load_stackoverflow)
NL (1) NL169353C (enrdf_load_stackoverflow)
SE (1) SE364737B (enrdf_load_stackoverflow)
SU (1) SU452107A3 (enrdf_load_stackoverflow)
YU (1) YU34721B (enrdf_load_stackoverflow)
ZA (1) ZA716879B (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4417956A (en) * 1980-07-17 1983-11-29 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4540473A (en) * 1983-11-22 1985-09-10 International Business Machines Corporation Copper plating bath having increased plating rate, and method
US6024857A (en) * 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
KR100659544B1 (ko) * 1999-11-12 2006-12-19 에바라 유지라이토 코포레이션 리미티드 비아 필링 방법
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE322956B (enrdf_load_stackoverflow) * 1966-08-20 1970-04-20 Schering Ag
US3492135A (en) * 1967-02-01 1970-01-27 Schering Ag Stabilized bath for deposition of copper by chemical reduction
BE759316A (fr) * 1969-12-30 1971-04-30 Parker Ste Continentale Composition et procede pour former un depot de cuivre sur des surfaces de metaux ferreux

Also Published As

Publication number Publication date
NL169353B (nl) 1982-02-01
SU452107A3 (ru) 1974-11-30
YU250971A (en) 1979-04-30
NL169353C (nl) 1982-07-01
ES395741A1 (es) 1974-09-16
NL7114979A (enrdf_load_stackoverflow) 1972-05-03
CH563466A5 (enrdf_load_stackoverflow) 1975-06-30
US3767539A (en) 1973-10-23
BR7107116D0 (pt) 1973-03-29
AU3473471A (en) 1973-05-03
AT307844B (de) 1973-06-12
JPS5126893B1 (enrdf_load_stackoverflow) 1976-08-09
IE35774B1 (en) 1976-05-12
BE774697A (fr) 1972-05-02
DE2053860A1 (de) 1972-06-08
GB1372850A (en) 1974-11-06
DE2053860C3 (de) 1980-11-06
IE35774L (en) 1972-04-29
DE2053860B2 (de) 1980-03-13
FR2111926A1 (enrdf_load_stackoverflow) 1972-06-09
AU450638B2 (en) 1974-07-18
ZA716879B (en) 1972-06-28
FR2111926B1 (enrdf_load_stackoverflow) 1974-10-11
YU34721B (en) 1979-12-31
SE364737B (enrdf_load_stackoverflow) 1974-03-04

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