Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
  • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
  • B25J11/00—Manipulators not otherwise provided for
  • B25J11/0095—Manipulators transporting wafers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
  • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
  • B25J9/00—Programme-controlled manipulators
  • B25J9/16—Programme controls
  • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
  • B25J9/1697—Vision controlled systems
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67017—Apparatus for fluid treatment
  • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
  • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
  • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67017—Apparatus for fluid treatment
  • H01L21/67063—Apparatus for fluid treatment for etching
  • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
  • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67017—Apparatus for fluid treatment
  • H01L21/67063—Apparatus for fluid treatment for etching
  • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
  • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67242—Apparatus for monitoring, sorting or marking
  • H01L21/67248—Temperature monitoring
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67242—Apparatus for monitoring, sorting or marking
  • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67242—Apparatus for monitoring, sorting or marking
  • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
  • H01L21/67706—Mechanical details, e.g. roller, belt
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
  • H01L21/6773—Conveying cassettes, containers or carriers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
  • H01L21/67742—Mechanical parts of transfer devices
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

• the present application relates to the field of semiconductor cleaning and etching technology, and in particular to a scientific research-type organic wet process station.
• the equipment is large in size, which will occupy the clean room space of the scientific research site and waste resources;
• the purpose of this application is to provide a fully automated scientific research wet etching system and machine to meet the scientific research needs of universities and improve scientific research efficiency and process stability.
• the present application provides a fully automated scientific wet etching system, including a machine system, an etching system, a feeding system, a robot system, and a control system;
• the machine system is used to provide a miniaturized machine room including installation space and working space;
• the etching system includes a plurality of liquid medicine modules arranged in an arc in the miniaturized machine chamber;
• the liquid medicine module includes a liquid medicine tank and a liquid supply mechanism
• the liquid supply mechanism is used to supply liquid to the liquid tank according to a preset liquid supply strategy and control the etching environment in the liquid tank;
• the feeding system is used to transport the workpiece into the working space and close the working space after the transport is completed;
• the robot system includes a robot module and a vision module communicatively connected to the robot module;
• the robot module is configured at the top of the working space, and is used to grab the workpiece according to the image information fed back by the vision module and place the workpiece into the chemical solution tank to complete etching according to a preset etching strategy;
• the control system is in communication with the machine system, the feeding system, the robot system and the etching system, and is used to realize automated etching operations according to user instructions.
• the robot module is further configured to grab a cleaning tool and perform a cleaning action based on the image information fed back by the vision module.
• the robot module is also capable of performing at least one of a telescopic motion, a rotational motion, and a shaking motion.
• timing system further comprising a timing system
• the timing system is used to obtain the operating time information of the machine system, the feeding system, and the robot system and feed back the operating time information to the control system so that the control system can control the machine system, the feeding system, the robot system, and the etching system according to a preset time strategy.
• it also includes a human-computer interaction system and a monitoring system;
• the human-computer interaction system is communicatively connected with the control system
• the monitoring system is used to respectively obtain operating data of the machine system, the robot system, the etching system, and the feeding system, and to issue an alarm when the operating data exceeds a threshold;
• the monitoring system is also used to perform real-time monitoring of the machine system, the robot system, the etching system and the feeding system according to a preset monitoring strategy.
• the liquid supply mechanism includes a liquid supply module and an etching environment module;
• the liquid supply module is used to supply the liquid medicine in the small-capacity liquid medicine tank to the liquid medicine tank;
• the etching environment module includes at least one of a heating module, a bubbling module, an ultrasonic vibration module, a cleaning module, a spray module and a circulating filtration module;
• the liquid medicine tank is provided with an overflow recovery module.
• the present application also discloses a scientific research wet etching fully automated machine, comprising a machine body and a scientific research wet etching fully automated system;
• the scientific research wet etching fully automated system is configured on the machine body, including a machine system, an etching system, a feeding system, a robot system and a control system;
• the machine system is used to provide a miniaturized machine room including installation space and working space;
• the etching system includes a plurality of liquid medicine modules arranged in an arc in the miniaturized machine chamber;
• the liquid medicine module includes a liquid medicine tank and a liquid supply mechanism
• the liquid supply mechanism is used to supply liquid to the liquid tank according to a preset liquid supply strategy and control the etching environment in the liquid tank;
• the feeding system is used to transport the workpiece into the working space and close the working space after the transport is completed;
• the robot system includes a robot module and a vision module communicatively connected to the robot module;
• the robot module is configured at the top of the working space, and is used to grab the workpiece according to the image information fed back by the vision module and place the workpiece into the chemical solution tank to complete etching according to a preset etching strategy;
• the control system is in communication with the machine system, the feeding system, the robot system and the etching system, and is used to realize automated etching operations according to user instructions.
• the robot module is further configured to grab a cleaning tool and perform a cleaning action based on the image information fed back by the vision module.
• the robot module is also capable of performing at least one of a telescopic motion, a rotational motion, and a shaking motion.
• timing system further comprising a timing system
• the timing system is used to obtain the operating time information of the machine system, the feeding system, and the robot system and feed back the information to the control system so that the control system can control the machine system, the feeding system, the robot system, and the etching system according to a preset time strategy.
• it also includes a human-computer interaction system and a monitoring system;
• the human-computer interaction system is communicatively connected with the control system
• the monitoring system is used to respectively obtain operating data of the machine system, the robot system, the etching system, and the feeding system, and to issue an alarm when the operating data exceeds a threshold;
• the monitoring system is also used to perform real-time monitoring of the machine system, the robot system, the etching system and the feeding system according to a preset monitoring strategy.
• the liquid supply mechanism includes a liquid supply module and an etching environment module;
• the liquid supply module is used to supply the liquid medicine in the small-capacity liquid medicine tank to the liquid medicine tank;
• the etching environment module includes at least one of a heating module, a bubbling module, an ultrasonic vibration module, a cleaning module, a spray module and a circulating filtration module;
• the liquid medicine tank is provided with an overflow recovery module.
• the robotic module is a collaborative robot.
• the miniaturized machine chamber is provided in the machine body
• a supporting partition is provided in the miniaturized machine room
• the supporting partition divides the miniaturized machine room into an upper chamber and a lower chamber
• the upper chamber forms a working space.
• a plurality of said liquid medicine modules are circumferentially arranged in said lower chamber;
• the supporting partition is provided with a first avoidance opening which is connected to the liquid medicine tanks in each of the liquid medicine modules in a one-to-one correspondence.
• an electric control room and a raw liquid room for storing a small-capacity liquid medicine tank are provided in the space below the miniaturized machine room in the machine body.
• the machine system further includes a fan filter unit
• the machine body is provided with an exhaust port and an air supply port connected to the upper chamber;
• the fan filter unit is installed on the machine body and connected to the air supply port.
• a spray cleaning device is further installed on the machine body;
• the spray cleaning device includes a spray assembly and a spray moving device
• the spray moving device is installed in the upper chamber and connected to the spray assembly to drive the spray assembly to move;
• the support partition is provided with a plurality of first drainage holes
• the lower chamber is provided with a main drainage pipe communicating with the outside of the machine body.
• a water collecting portion is provided in the middle of the supporting partition
• the water collecting portion is provided with a second drainage hole.
• a support cylinder connected to the support partition is provided in the middle of the lower chamber
• a control chamber is provided in the support cylinder
• the second drainage hole is connected to the control chamber
• a branch drainage pipe connected to the second drainage hole is provided in the control chamber;
• One end of the branch drain pipe away from the second drain hole extends out of the supporting cylinder.
• it further includes a basket stand for holding workpieces
• the end of the robot module is connected to a flower basket clamping mechanism for grabbing the flower basket stand.
• the turnbuckle clamp mechanism includes a clamping drive assembly and two clamping jaw members;
• the clamping drive assembly is connected to the two clamping jaws and is used to drive the two clamping jaws to open and close so as to clamp the flower basket stand;
• the clamping drive assembly is sheathed with an explosion-proof and corrosion-resistant protective cover.
• the flower basket stand includes two fixing plates
• the two fixing plates are arranged in parallel and spaced apart, and are fixedly connected by a plurality of connecting rods;
• a holding cavity for holding workpieces is formed between each of the connecting rods and the two fixing plates;
• a handle block is fixedly connected at the top position between the two fixing plates;
• Guide slots are provided on both sides of the handle block
• the clamping surfaces of the two clamping jaws are provided with positioning protrusions that are clamped into the guide slots;
• each clamping claw is provided with a limiting flange which can contact and abut against the bottom of the handle block.
• the flower basket stand includes a bottom plate and two fixing plates;
• the two fixing plates are arranged in parallel and spaced apart on the top of the fixing plate;
• a handle block is fixedly connected at the top position between the two fixing plates;
• Guide slots are provided on both sides of the handle block
• the clamping surfaces of the two clamping jaws are provided with positioning protrusions that are clamped into the guide slots;
• each of the clamping jaws is provided with a limiting flange that can contact and abut against the bottom of the handle block;
• a plurality of limiting rods are fixed on the bottom plate between the two fixing plates;
• a holding cavity for holding workpieces is formed between the adjacent limiting rods and the bottom plate.
• positioning blocks are fixed on the opposite sides of the two fixing plates;
• a pressing block for pressing a workpiece is movably inserted between the two positioning blocks.
• the liquid supply mechanism includes a liquid supply device and a liquid discharge device for forming a liquid supply module
• the liquid delivery device includes a liquid pump tube and a liquid medicine pump;
• One end of the pump liquid pipe is connected to the medicine liquid tank, and the other end is connected to the small-capacity medicine liquid tank;
• the liquid medicine pump is installed on the pump pipe and is used to pump the liquid medicine in the small-capacity liquid medicine tank into the liquid medicine tank according to a preset liquid supply strategy;
• the drainage device includes a drainage pipe and a drainage valve
• the drainage pipe is connected to the medicine tank;
• the drain valve is connected to the drain pipe and is used to control the flow of the drain pipe according to a preset liquid supply strategy
• the liquid medicine tank is provided with a liquid level sensor for detecting the liquid level of the liquid medicine.
• the liquid medicine tank is provided with a liquid medicine chamber and an overflow chamber for forming an overflow module
• the liquid medicine chamber is used to accommodate the liquid medicine supplied by the liquid supply mechanism and for the workpiece to be placed therein;
• the overflow chamber is used to receive the liquid medicine overflowing from the liquid medicine chamber;
• the pump pipe and the discharge pipe are connected to the liquid medicine chamber.
• the liquid medicine tank includes an inner tank body
• the top opening of the inner tank forms an immersion inlet
• the internal space of the inner tank forms the liquid medicine chamber
• a connecting flange is provided on the outer peripheral surface of the inner tank body
• the edge of the top surface of the connecting flange is connected to the side wall;
• the overflow chamber is formed between the side wall, the top surface of the connecting flange and the outer peripheral surface of the inner tank body.
• the liquid supply mechanism further comprises a heating device for forming a heating module
• the heating device is used to heat the liquid medicine in the liquid medicine chamber according to a preset liquid supply strategy.
• the medicine liquid tank further includes an outer tank body
• the bottom of the inner tank body extends into the outer tank body, and the connecting flange is connected to the outer tank body, so that a heating chamber is enclosed by the connecting flange, the outer tank body and the inner tank body;
• the outer tank body is provided with a medium input pipe and a medium output pipe communicating with the heating chamber;
• the heating device is installed in the heating chamber and is used for heating the heat conduction heater in the heating chamber.
• the liquid supply mechanism further comprises a circulation device for forming a circulation filtration module or a circulation spraying device for forming a spraying module;
• the circulation device is used to extract the liquid medicine in the liquid medicine chamber according to a preset liquid supply strategy and return it to the liquid medicine chamber after filtering;
• the circulating spraying device is used to extract the liquid medicine in the liquid medicine chamber according to a preset liquid supply strategy, and return it to the liquid medicine chamber in a spraying manner after filtering.
• the etching system further comprises a cleaning device for forming a cleaning module
• the cleaning device is used to clean the workpiece in the liquid medicine chamber.
• the liquid supply mechanism further comprises a bubbling device for forming a bubbling module
• the bubbling device is used to bubble the liquid medicine in the liquid medicine chamber according to a preset liquid supply strategy.
• the etching system further comprises an etching switch cover device
• the etching switch cover device is used to control the opening and closing of the immersion inlet of the liquid medicine chamber.
• the feeding system includes a conveying device, a first feeding switch cover device;
• the conveying device is used to convey the workpiece from the preparation position outside the machine body to the loading position in the miniaturized machine room;
• the machine body is provided with a loading port connected to the miniaturized machine chamber and for the conveyed workpiece to pass through;
• the first feeding switch cover device is used to control the opening and closing of the feeding port.
• the feeding system further comprises a second feeding switch cover device
• the conveying device is installed in the lower chamber and includes a first feeding mechanism and a second feeding mechanism;
• the supporting partition is provided with a second avoidance opening for the workpiece to enter the upper chamber
• the first feeding mechanism is used to transport the workpiece from the preparation position to the transfer position in the lower chamber;
• the second feeding mechanism is used to transport the workpiece from the transfer position to the loading position in the upper chamber
• the second feeding switch cover device is used to control the opening and closing of the second avoidance opening.
• the liquid medicine module and the robot module are integrated and configured in the working space of a miniaturized machine room.
• the robot module is assembled on the top, while multiple liquid medicine modules are arranged in an arc shape. This optimizes the overall arrangement structure, realizes a miniaturized design, reduces the clean room space occupied in scientific research sites, and reduces installation and maintenance costs.
• the etching system that can independently supply liquid and control the etching environment is integrated into the machine system. Compared with the enterprise-level centralized liquid supply design, it can effectively achieve size reduction, realize miniaturization design, and be compatible with small-size workpiece experiments, thereby reducing liquid consumption and the use of expensive chemicals, greatly saving scientific research costs, and having richer functions.
• the robot module is combined with a feeding system that can automatically transport materials and an etching system that can automatically provide liquid medicine to achieve overall automated control, completely replacing manual operation. This allows precise control of process parameters, ensures process stability, and greatly improves scientific research efficiency. Furthermore, there is no need for manual access to tools and consumables, and no need for manual contact with hazardous chemicals, effectively protecting the health and safety of personnel.
• FIG1 is a perspective view of a fully automated wet etching machine for scientific research provided in this application;
• FIG2 is a cross-sectional view of a fully automated wet etching machine for scientific research provided in this application;
• FIG3 is a first partial schematic diagram of a fully automated scientific wet etching machine provided in this application.
• FIG4 is a second partial schematic diagram of a scientific research-type fully automated wet etching machine provided in this application.
• FIG5 is a first partial cross-sectional view of a scientific research-type fully automated wet etching machine provided in this application;
• FIG6 is a perspective view of the coordination between the clamping mechanism and the basket frame of a fully automated wet etching machine for scientific research provided in this application;
• FIG7 is an exploded diagram of the coordination between the clamping mechanism and the basket frame of a fully automated wet etching machine for scientific research provided in this application;
• FIG8 is a perspective view of a liquid medicine tank with a heating device design of a fully automated wet etching machine for scientific research provided in this application;
• FIG9 is a cross-sectional view of a liquid medicine tank with a heating device design of a fully automated wet etching machine for scientific research provided in this application;
• FIG10 is a perspective view of a liquid tank with a heating device design without a tank cover of a fully automated scientific wet etching machine provided in this application;
• FIG11 is a perspective view of a liquid tank without a heating device and without a tank cover of a fully automated scientific wet etching machine provided in this application;
• FIG12 is a cross-sectional view of a liquid tank without a heating device design of a fully automated wet etching machine for scientific research provided in this application;
• FIG13 is a schematic diagram of a partial structure of a fully automated scientific wet etching machine with a conveying device provided in this application;
• FIG14 is a schematic structural diagram of a conveying device of a fully automated wet etching machine for scientific research provided in this application;
• FIG15 is a system block diagram of a fully automated wet etching system for scientific research provided by the present application.
• Control system 2. Robot system; 21. Robot module; 22. Vision module; 3. Etching system; 31. Chemical solution module; 32. Liquid supply mechanism; 33. Liquid supply module; 34. Etching environment module 4. Feeding system; 5. Human-computer interaction system; 6. Timing system; 7. Monitoring system; 8. Machine system; 9. Cleaning system; 100, machine body; 101, supporting partition; 102, first avoidance; 103, first drainage hole; 104, water collection part; 105. Second drain hole; 106. Fan filter unit; 107. Explosion-proof lighting device; 108. Spray movement device; 109. Spray assembly; 110. Support cylinder; 111. Electric control cantilever; 112. Air pressure gauge; 113. Temperature gauge; 114. Raw liquid chamber; 115.
• the terms “installed,” “connected,” and “connected” should be understood in a broad sense. For example, they can refer to fixed connections, replaceable connections, or integral connections. They can also refer to mechanical connections or electrical connections. They can also refer to direct connections or indirect connections through an intermediate medium. They can also refer to internal connections between two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.
• It includes a machine system 8, an etching system 3, a feeding system 4, a robot system 2 and a control system 1.
• the machine system 8 is used to provide a miniaturized machine room including an installation space and an operating space. It should be noted that “miniaturized machine room” is a specific term and does not limit how small the machine room can be.
• the etching system 3 includes a plurality of liquid medicine modules 31 arranged in an arc manner in the miniaturized machine room; the liquid medicine module 31 includes a liquid medicine tank 301 and a liquid supply mechanism 32; the liquid supply mechanism 32 is used to supply liquid to the liquid medicine tank 301 according to a preset liquid supply strategy and control the etching environment in the liquid medicine tank 301.
• the conventional single-row parallel arrangement is improved to an arc arrangement, and more preferably a circular arrangement is adopted, which can save space and make the operation trajectory of the robot module 21 more flexible.
• the feeding system 4 is used to realize automatic transportation of workpieces.
• the robot system 2 includes a robot module 21 and a vision module 22 that is communicatively connected to the robot module 21; the robot module 21 is configured at the top of the working space, and is used to grab the workpiece according to the image information fed back by the vision module 22 and place the workpiece into the liquid tank 301 according to a preset etching strategy to complete etching.
• the control system 1 is in communication with the machine system 8 , the feeding system 4 , the robot system 2 and the etching system 3 , and is used to implement automated etching operations according to user instructions.
• the liquid medicine module 31 and the robot module 21 are integrated and configured in the workspace of a miniaturized machine room.
• the robot module 21 is assembled from the top, while the multiple liquid medicine modules 31 are arranged in an arc. This optimizes the overall layout structure and achieves a miniaturized design, reducing the cleanroom space occupied by scientific research sites and lowering installation and maintenance costs. (Maintaining Class 100 cleanliness and equipment environment requirements in cleanrooms requires numerous measures (such as circulating air, temperature control, micro-vibration protection, and ultrapure water), which results in high operating and maintenance costs. Therefore, saving cleanroom space can significantly reduce installation and maintenance costs.)
• the etching system 3 that can independently supply liquid and control the etching environment is integrated into the machine system 8. Compared with the enterprise-level centralized liquid supply design, it can effectively achieve size reduction and miniaturization design, and is compatible with small-size workpiece experiments (such as 1cm-2cm small workpieces), thereby reducing the consumption of liquid medicine and the use of expensive chemicals, greatly saving scientific research costs, and having richer functions.
• the robot module 21 is further configured to grab a cleaning tool and perform a cleaning action based on the image information fed back by the vision module 22. It is understood that:
• Robot module 21 is designed to perform cleaning operations. Specifically, vision module 22 captures images of the interior of the machine room and identifies the locations of dirt within the images. Robot module 21 then grabs cleaning tools and cleans the affected areas. By adding visual recognition capabilities to robot module 21, it can perform targeted cleaning operations within the work area. Combined with vision module 22, robot module 21 not only performs cleaning tasks but also supports extended functions such as work surface organization, in conjunction with 6S management, improving work efficiency.
• a dedicated cleaning system 9 may be provided to perform cleaning operations.
• the cleaning system 9 may include at least one of a purge cleaning device and a spray cleaning device.
• the robot module 21 is designed to be able to perform the following actions: grabbing a workpiece for sampling, placing the workpiece into the liquid tank 301 (setting out), and moving the workpiece (transferring).
• the robot module 21 is also capable of performing at least one of a telescopic action, a rotation action, and a shaking action. It is understood that:
• the robot module 21 has a telescopic function, that is, it is equipped with a telescopic mechanism or module that can perform telescopic actions, so that the overall telescopic length can be adjusted as needed, thereby making the robot module 21 have a wider coverage range to adapt to different work scenarios and operation requirements.
• Robot module 21 has a shaking function, that is, it is equipped with a shaking mechanism or module that can perform a shaking action. This allows robot module 21 to simulate the shaking of a human hand to implement etching strategies such as shaking and vibrating the workpiece or material, thereby meeting specific process requirements. Specifically, robot module 21 can shake the solution tank 301 or the workpiece at a set frequency and amplitude within a specified time to promote mixing or reaction.
• Robot module 21 has a rotation function, that is, it is equipped with a rotation mechanism or module that can perform a rotational action, implementing an etching strategy operation that rotates the workpiece in the solution tank 301 to complete a specific process step or task. Specifically, robot module 21 can rotate the solution tank 301 or the workpiece at a set speed and direction within a specified time to achieve stirring and mixing.
• a timing system 6 is further included; the timing system 6 is used to obtain operating time information of the tool system 8, the feeding system 4, and the robot system 2, and to provide feedback to the control system 1, so that the control system 1 can control the tool system 8, the feeding system 4, the robot system 2, and the etching system 3 according to a preset time strategy.
• the timing system 6 enables the robot module 21 and the liquid supply mechanism 32 to perform operations at preset time intervals, such as timed addition of liquid or timed sampling, to achieve stable control of process parameters and time.
• it also includes a human-computer interaction system 5 and a monitoring system 7;
• the human-computer interaction system 5 is communicatively connected with the control system 1 to enable human-computer interaction between the operator and each system module; for example, it is convenient for the operator to issue various execution instructions to each system module to control the execution actions, functions, etc. of each system module, or to obtain various operating data of each system module.
• the monitoring system 7 is used to respectively obtain the operating data of the machine system 8, the robot system 2, the etching system 3 and the feeding system 4, and to issue an alarm when the operating data exceeds a threshold; the monitoring system 7 is also used to perform real-time monitoring of the machine system 8, the robot system 2, the etching system 3 and the feeding system 4 according to a preset monitoring strategy.
• the liquid supply mechanism 32 includes a liquid supply module 33 and an etching environment module 34 .
• the liquid supply module 33 is used to supply the liquid medicine in the small-capacity liquid medicine tank 600 to the liquid medicine tank 301, and has liquid supply, liquid distribution, and liquid level control functions.
• small-capacity liquid medicine tank is a specific term and does not limit the size of the tank.
• the miniaturized design achieved by the overall structural optimization of this application naturally also requires the size of the connected small-capacity liquid medicine tank 600.
• the use of a small-capacity and small-volume liquid medicine tank further saves liquid medicine.
• the etching environment module 34 includes at least one of a heating module, a bubbling module, an ultrasonic vibration module, a cleaning module, a spray module, and a circulating filtration module; it can be understood that:
• the chemical bath 301 has heating, bubbling, ultrasonic vibration, cleaning, spraying, and circulating filtration functions.
• Etching environment control based on these functions can, for example, create an etching environment by heating to a preset temperature while circulating, filtering, and spraying, bubbling while circulating, bubbling while ultrasonically vibrating, or spraying while feeding liquid and bubbling simultaneously.
• This strategy can be implemented by the liquid supply mechanism 32 in cooperation with the human-computer interaction system 5, the timing system 6, and the like.
• the liquid medicine tank 301 is provided with an overflow recovery module to provide an overflow function.
• the above-designed fully automated scientific research wet etching system has the advantages of intelligence and miniaturization. It can be flexibly applied to various scientific research scenarios, improving scientific research efficiency, saving scientific research resources, ensuring the safety of personnel and equipment, and also has very good commercial value and economic benefits.
• the embodiment of the present application also discloses a scientific research type wet etching fully automated machine, which is constructed based on the scientific research type wet etching fully automated system designed above.
• an embodiment of a fully automated wet etching machine for scientific research includes:
• It includes a machine body 100 and a fully automated scientific wet etching system.
• the fully automated scientific wet etching system is configured on a machine body, including a machine system 8, an etching system 3, a feeding system 4, a robot system 2, and a control system 1.
• the machine system 8 is used to provide a miniaturized machine room including installation space and operation space.
• the etching system 3 includes a plurality of liquid modules 31 arranged in an arc manner in a miniaturized machine room; the liquid module 31 includes a liquid tank 301 and a liquid supply mechanism 32; the liquid supply mechanism 32 is used to supply liquid to the liquid tank 301 according to a preset liquid supply strategy and control the etching environment in the liquid tank 301.
• the feeding system 4 is used to transport the workpiece 500 into the working space and close the working space after the transport is completed.
• the robot system 2 includes a robot module 21 and a vision module 22 that is communicatively connected to the robot module 21; the robot module 21 is configured at the top of the working space, and is used to grab the workpiece based on the image information fed back by the vision module 22 and place the workpiece into the solution tank 301 according to the preset etching strategy to complete the etching.
• the control system 1 is in communication with the machine system 8 , the feeding system 4 , the robot system 2 and the etching system 3 , and is used to realize automated etching operations according to user instructions.
• the automated liquid supply mechanism 32 is used to create an etching environment in the liquid tank according to the preset liquid supply strategy.
• the automated robot module 21 is then used to flexibly simulate manual operation to complete etching according to the preset etching strategy, thereby achieving flexible process changes to meet flexible and changeable scientific research scenarios.
• the bottom of the machine body 100 is equipped with a pulley device and a fixing device, along with an anti-corrosion base, which allows for height adjustment and locking. It can be fixed to the ground to prevent shaking and vibration caused by the operation of the robot module 21.
• a pulley device and a fixing device along with an anti-corrosion base, which allows for height adjustment and locking. It can be fixed to the ground to prevent shaking and vibration caused by the operation of the robot module 21.
• different machine bodies 100 can be used for different processes.
• Each machine body 100 has a reserved, removable etching system 3 to enhance operational flexibility.
• Example 1 of a scientific research-type wet etching fully automated machine provided in the embodiments of the present application.
• Example 2 of a scientific research-type wet etching fully automated machine provided in the embodiments of the present application. Please refer to Figures 1 to 15 for details.
• the robot module 21 is designed to be able to perform the following actions: grabbing a workpiece for sampling; placing a workpiece into the liquid tank 301 for sampling; and moving and transporting the workpiece; and can also perform at least one of a telescopic action, a rotational action, and a shaking action. It is understood that:
• the robot module 21 has a telescopic function, that is, it is equipped with a telescopic mechanism or module that can perform telescopic actions, so that the overall telescopic length can be adjusted as needed, thereby making the robot module 21 have a wider coverage range to adapt to different work scenarios and operation requirements.
• Robot module 21 has a shaking function, that is, it is equipped with a shaking mechanism or module that can perform a shaking action. This allows robot module 21 to simulate the shaking of a human hand to implement etching strategies such as shaking and vibrating the workpiece or material, thereby meeting specific process requirements. Specifically, robot module 21 can shake the solution tank 301 or the workpiece at a set frequency and amplitude within a specified time to promote mixing or reaction.
• Robot module 21 has a rotation function, that is, it is equipped with a rotation mechanism or module that can perform a rotational action, implementing an etching strategy operation that rotates the workpiece in the solution tank 301 to complete a specific process step or task. Specifically, robot module 21 can rotate the solution tank 301 or the workpiece at a set speed and direction within a specified time to achieve stirring and mixing.
• robot module 21 Because the operating environment of robot module 21 involves flammable and explosive hazardous materials such as acids, alkalis, and organic substances, the robot module 21 must be sufficiently explosion-proof and corrosion-resistant. To enhance safety and explosion-proof design, explosion-proof materials and devices can be used in the structure and electrical system of robot module 21 to ensure that fires or explosions will not occur in flammable and explosive environments. To enhance corrosion resistance, corrosion-resistant materials or special coatings can be used on the outer shell and key components of robot module 21 to prevent damage from corrosive substances such as acids and alkalis.
• the robot module 21 of the present application is designed to have the functions of grabbing the workpiece 500 (sampling), placing the workpiece 500 into the liquid tank 301 (layout), and moving the workpiece 500 (transfer). There are two ways to design sampling and laying out:
• the first method is to take samples by extracting the basket 205 containing the workpieces 500.
• the basket 205 is adaptively designed according to the size of the workpieces 500 to be tested, so as to meet the requirements of holding small-sized workpieces 500.
• the second method involves directly grabbing the workpiece 500 from the fixture for sampling.
• This method has the following features: 1. It utilizes a two-sided gripping mechanism to ensure no impact on the workpiece 500 surface, and can securely and flexibly grip 1-2 cm square pieces. 2. It controls force with an accuracy of 0.01 N to prevent breakage. 3. It enables both placement and transfer of samples.
• the robot module 21 is automatically controlled by the control system 1 to control the positioning accuracy and transmission speed of the layout, effectively solve process problems such as glue coating uniformity, temperature change, corrosion time control, etc., and improve process stability.
• the robot module 21 can also be designed with a cleaning function to clean the working area inside the machine body 100:
• the robot module 21 grabs the cleaning tool and cleans the upper chamber according to a preset cleaning trajectory. Specifically, it can grab the cleaning tool with dust-free paper/cloth to simulate the wiping action of human hands for cleaning.
• the robot module 21 can be configured with the ability to suck the cleaning tool.
• Vision Module 22 captures images of the interior of the machine room and identifies the locations of dirt within the images. Robot Module 21 then grabs cleaning tools and cleans the affected areas. By adding visual recognition capabilities to Robot Module 21, Robot Module 21 can perform targeted cleaning operations within the work area. This combination of Robot Module 21 and Vision Module 22 not only performs cleaning tasks but also supports extended functions such as work surface organization, in conjunction with 6S management, improving work efficiency.
• the setting of the vision module also makes the interconnection between the robot module 21 and the feeding system 4 and the etching system 3 more accurate, realizes highly intelligent operation, and improves production efficiency and precision.
• the robot module 21 in the cleaning control mode 1 or 2 can also be an independently added robot module dedicated to cleaning, realizing a dual robot module design.
• a timing system 6 is further included.
• the timing system 6 is used to obtain the operating time of the robot module 21 and control the operation of the robot module 21 according to a preset operating time strategy. It is understood that the timing system 6 enables the robot module 21 and the liquid supply mechanism to operate at preset time intervals, such as timed addition of liquid medicine or timed sampling, thereby achieving stable control of process parameters and time.
• a dedicated cleaning system 9 can be added.
• the cleaning system 9 is arranged on the machine body 100 and is used to clean the inside of the machine room.
• the cleaning system 9 includes at least one of a purge cleaning device and a spray cleaning device, and specifically implements, for example, nitrogen purge cleaning, spray cleaning, etc.
• it also includes a human-computer interaction system 5 and a monitoring system 7;
• the human-computer interaction system 5 is communicatively connected with the control system 1 to enable human-computer interaction between the operator and each system module; for example, it is convenient for the operator to issue various execution instructions to each system module to control the execution actions, functions, etc. of each system module, or to obtain various operating data of each system module.
• the human-machine interaction system 5 of the present application includes an electric control cantilever 111 fixed on a machine body 100 , and/or a remote control terminal, etc.
• the monitoring system 7 is used to respectively obtain the operating data of the machine system 8, the robot system 2, the etching system 3 and the feeding system 4, and to issue an alarm when the operating data exceeds a threshold; the monitoring system 7 is also used to perform real-time monitoring of the machine system 8, the robot system 2, the etching system 3 and the feeding system 4 according to a preset monitoring strategy.
• the monitoring system 7 is composed of various sensors, such as a temperature sensor for detecting the temperature of the liquid in the liquid tank 301, a level sensor for detecting the amount of liquid in the liquid tank 301, and an air pressure sensor for detecting the air pressure in the working area of the machine room. As shown in Figure 1, a wind pressure gauge 112 and a temperature gauge 113 can be configured on the front of the machine body 100.
• the liquid supply mechanism 32 includes a liquid supply module 33 and an etching environment module 34 .
• the liquid supply module 33 is used to supply the liquid medicine in the small-capacity liquid medicine tank 600 to the liquid medicine tank 301, and has liquid supply, liquid distribution, and liquid level control functions.
• small-capacity liquid medicine tank is a specific term and does not limit the size of the tank.
• the miniaturized design achieved by the overall structural optimization of this application naturally requires that the connected small-capacity liquid medicine tank 600 is also small in size.
• the use of a small-capacity, small-volume liquid medicine tank further saves liquid medicine.
• the etching environment module 34 includes at least one of a heating module, a bubbling module, an ultrasonic vibration module, a cleaning module, a spray module, and a circulating filtration module; it can be understood that:
• the chemical bath 301 has heating, bubbling, ultrasonic vibration, cleaning, spraying, and circulating filtration functions.
• Etching environment control based on these functions can, for example, create an etching environment by heating to a preset temperature while circulating, filtering, and spraying, bubbling while circulating, bubbling while ultrasonically vibrating, or spraying while feeding liquid and bubbling simultaneously.
• This strategy can be implemented by the liquid supply mechanism 32 in cooperation with the human-computer interaction system 5, the timing system 6, and the like.
• the liquid medicine tank 301 is provided with an overflow recovery module to provide an overflow function.
• the robot module 21 recognizes the size and position of the workpiece 500 through the vision module 22 , it moves to the corresponding position and grabs the workpiece 500 , and then places the workpiece 500 into the corresponding liquid medicine tank 301 .
• the robot module 21 can shake or rotate the workpiece 500 in the liquid medicine tank 301 at preset intervals under the control of the timing system 6, and detect the fragmentation through feedback from the vision module 22 or other sensor modules.
• This application can interconnect the robot module 21 with the automation function module on the machine body 100 to achieve human-machine interconnection and high intelligence. Specifically, the following functions can be achieved:
• the robot module 21 interacts with personnel in real-time, exchanging data and transmitting commands. Personnel can monitor the operating status of the robot module 21 and the machine body 100 through a monitoring system 7 comprised of a computer or mobile device, and view experimental data and results in real time.
• the robot module 21 can communicate with personnel and conduct operations through a human-machine interaction system 5 comprised of voice or touchscreen interfaces.
• the robot module 21 can be responsible for various operations, such as sampling, adding liquid, stirring, heating, etc. Equipped with sensors and a vision module 22, the robot module 21 can monitor and identify the experimental environment and the status of the workpiece 500, thereby automatically adjusting and making decisions.
• the robot module 21 can automatically analyze experimental data and make corresponding decisions based on pre-set processes and algorithms. For example, it can automatically adjust reaction conditions and dosage based on real-time parameters such as temperature and drug concentration to achieve the optimal reaction effect.
• the robot module 21 can monitor the operating status of the entire wet bench through the monitoring system 7, promptly detecting and reporting potential faults. When a fault occurs, the robot module 21 can automatically stop operation and provide a preliminary analysis of the cause of the fault and recommended repair methods.
• the robot module 21 is a multi-axis collaborative robot, specifically a six-axis collaborative robot.
• Traditional modular robots or industrial robots although they have a strong load capacity and a large operating range, are not flexible and intelligent enough in terms of movement, running trajectory, operating logic and function compared with collaborative robots, and cannot adapt to flexible and changeable scientific research scenarios.
• Industrial robot modules are usually pre-programmed with motion trajectories, and the movements and operating logic are relatively fixed, and can only complete predetermined simple repetitive tasks.
• Collaborative robots perceive the surrounding environment in real time through sensors through human-computer interaction, and make autonomous decisions and adjust movement trajectories and movements according to task changes and actual conditions. They have higher flexibility and adaptability and can accomplish more complex tasks. For this reason, the robot module 21 of this application is designed as a collaborative robot.
• the preset etching strategy can be summarized as a strategy for the time/state change of the workpiece 500 in the created etching environment, for example:
• Immersion time strategy can be continuous immersion within a certain time range, or immersion at certain time intervals. This strategy can be implemented by the robot module 21 in cooperation with the telescopic mechanism and the timing system 6.
• the static state strategy can be a specific state change within a certain time range.
• the workpiece 500 is shaken at a set frequency or rotated at a set speed at regular intervals during the static process.
• This strategy can be implemented by the robot module 21 with the cooperation of the timing system 6, the shaking mechanism, and the rotating mechanism.
• control strategy is not limited to the above, and those skilled in the art can change the control strategy according to actual process requirements without limitation.
• a supporting partition 101 is provided in the miniaturized machine chamber, and the supporting partition 101 divides the miniaturized machine chamber into an upper chamber and a lower chamber.
• the robot module 21 is installed on the top of the upper chamber. This design is beautiful and saves space.
• the supporting partition 101 is provided with first escape openings 102 that are connected to each of the drug solution tanks 301 in a one-to-one correspondence.
• liquid medicine tanks 301 can be reduced, thereby reducing the size of the equipment, making it more convenient for users to use, and improving equipment utilization. Based on the design of reducing the equipment size, the capacity of the liquid medicine tank 301 can be reduced, which can greatly save the amount of liquid medicine used compared to an enterprise-level wet bench design.
• an electrical control room 115 and a raw liquid room 114 for storing a small-capacity liquid medicine tank 600 as shown in FIG2 may be provided in the space below the miniaturized machine room within the machine body 100.
• the controller of the robot module 21, the controller of the conveying device 402, and the controller of the etching system 3 are all centrally installed in the electrical control room 115, and all electrical appliances and circuits that may come into contact with liquid medicine mist are subjected to PFA anti-corrosion isolation treatment.
• the machine system 8 further includes a fan filter unit 106 /FFU, and the fan filter unit 106 is equipped with a high-efficiency filtering device.
• the fan filter unit 106 can be split into two units and arranged at intervals.
• the machine body 100 is provided with an exhaust port and an air supply port connected to the upper chamber.
• the fan filter unit 106 is installed on the machine body 100 and connected to the air supply port. The fan filter unit 106 is used to ensure that the control quality of the operating area of the robot module 21 meets the cleanliness level 100 requirements.
• a nitrogen gun and a pure water gun are respectively provided on the left and right sides of the front of the upper chamber.
• the water gun is designed to drip running water, which is convenient for cleaning the fragile workpiece 500.
• an automatic fire extinguishing system is also designed: the automatic fire extinguishing system is equipped with sensors such as smoke sensors, temperature sensors, and open flame sensors, and the automatic fire extinguishing system is designed to have the ability to work under power outages.
• the machine system 8 further includes an explosion-proof lighting device 107 .
• the explosion-proof lighting device 107 is installed on the machine body 100 and is used to illuminate the upper chamber.
• the machine body 100 is provided with an observation window 117 for observing the upper chamber, so as to facilitate observation of the operation of the robot module 21.
• the machine body 100 is provided with an automatic upper and lower safety door, and the automatic upper and lower safety door is equipped with an incorrect operation alarm device to ensure personnel safety.
• a spray cleaning device is designed as an example, as shown in Figure 4, which specifically includes a spray assembly 109 and a spray moving device 108; the spray moving device 108 is installed in the upper chamber and is connected to the spray assembly 109, which is used to drive the spray assembly 109 to move.
• the spray moving device 108 can be two sets, specifically linear displacement modules, symmetrically arranged at the edge positions of the support partition 101 on both sides, and their respective driving ends are respectively connected to the spray assembly 109, driving the spray assembly 109 to reciprocate above the support partition 101.
• the spray assembly 109 is a spray pipe with a plurality of nozzles arrayed thereon, which cleans the work surface on the support partition 101 by spraying water.
• a plurality of first drainage holes 103 are provided on the support partition 101, and a main drainage pipe connected to the outside of the machine body 100 is provided in the lower chamber. The dirty water discharged into the lower chamber through the first drainage holes 103 is then discharged from the machine body 100 through the main drainage pipe.
• a water collecting portion 104 is provided in the middle of the support baffle 101 to collect the accumulated water and then drain it through a second drainage hole 105 provided in the water collecting portion 104.
• the support baffle 101 can be designed to have a certain slope from all sides toward the center, or to have a certain slope at a single position, to achieve a better collection and drainage effect, without limitation.
• a support cylinder 110 connected to the support partition 101 is provided in the middle of the lower chamber, and an independent control chamber is provided in the support cylinder 110.
• the support cylinder 110 of this design can also support and reinforce the support partition 101.
• the second drainage hole 105 is designed to be connected to the control chamber.
• a branch drainage pipe connected to the second drainage hole 105 is provided in the control chamber.
• the branch drainage pipe extends out of the support cylinder 110 at one end away from the second drainage hole 105, and can specifically extend directly out of the machine body 100.
• a flower basket clamping mechanism 204 for grasping the flower basket rack 205 is connected to the end of the robot module 21 .
• a flower basket rack 205 for holding the workpiece 500 is also included, and the flower basket clamping mechanism 204 is used to grasp/release the flower basket rack 205 .
• the design of the flower basket clamp mechanism 204 specifically includes a clamping drive assembly 201 and two clamping members 202 .
• the clamping drive assembly 201 is connected to the two clamping members 202 to drive the two clamping members 202 to open and close to clamp the flower basket stand 205 .
• the present application provides an explosion-proof and corrosion-resistant protective cover 203 on the outside of the clamping drive assembly 201 .
• the basket rack 205 of the present application is designed for the storage needs of small-sized workpieces 500, and the design specifications are suitable for, for example, 4/6 inch workpieces 500 and 1 cm-2 cm square loose piece workpieces 500.
• the flower basket stand 205 specifically includes two fixing plates 206 .
• the two fixed plates 206 are arranged in parallel and spaced apart, and are fixedly connected by multiple connecting rods 207.
• Each connecting rod 207 and the two fixed plates 206 form a holding cavity for holding the workpiece 500; the workpiece 500 can enter from the two fixed plates 206 and then be placed in the enclosed holding cavity, and be fixed by utilizing the limiting function of the fixed plates 206 and the connecting rods 207.
• the bottom of the clamping claw member 202 is provided with a limiting flange 213 that can contact and abut the bottom of the handle block 210.
• the limiting flange 213 can support and clamp the handle block 210 to prevent it from falling.
• the flower basket stand 205 includes a bottom plate and two fixing plates 206 as shown in FIG. 6 and FIG. 7 .
• Two fixed plates 206 are arranged parallel and spaced apart on top of each other.
• a handle block 210 is fixedly connected to the top between the two fixed plates 206.
• Guide slots 211 are provided on both sides of the handle block 210.
• the clamping surfaces of the two clamping jaws 202 are provided with positioning protrusions 212 that engage with the guide slots 211.
• the bottoms of the clamping jaws 202 are each provided with a limiting flange 213 that contacts and abuts the bottom of the handle block 210.
• a plurality of limiting rods are fixed to the base plate between the two fixed plates 206. Adjacent limiting rods and the base plate define a receiving cavity for the workpiece 500.
• This design differs from the aforementioned 4/6-inch design in the formation of the base plate and the receiving cavity. Persons skilled in the art can modify the design as needed without limitation.
• positioning blocks 209 are fixed on the opposite side surfaces of the two fixed plates 206.
• the positioning block 209 structure can be L-shaped, and a pressure block 208 for pressing the workpiece 500 is movably inserted between the two positioning blocks 209.
• Notches are provided on both sides of the pressure block 208 for the vertical block portion of the positioning block 209 to movably pass through, and the horizontal block portion of the positioning block 209 can play a limiting role to prevent the installed pressure block 208 from sliding down out of the positioning block 209.
• the pressure block 208 is movable and adjustable, and can be flexibly adjusted according to the size of the workpiece 500 placed, so as to achieve the effect of pressing workpieces 500 of various sizes, prevent the workpiece 500 from floating up and falling when immersed in the liquid medicine, and ensure the stability and safety of small-sized workpieces 500 in the flower basket rack 205.
• the positioning block 209 can be designed to be adjustable in the upper and lower mounting positions, which can make the application range of the pressing block 208 wider.
• both the connecting rod 207 and the limiting rod are provided with a slot 214 for the workpiece 500 to be inserted into.
• the liquid supply mechanism 32 is designed to include a liquid delivery device and a liquid discharge device for forming a liquid supply module 33 .
• the liquid delivery device includes a liquid pump tube and a liquid medicine pump.
• the pump tube is connected to the drug tank 301, and the other end is connected to the small-capacity drug tank 600.
• the drug tube is designed as a small bottle.
• the drug pump is installed on the pump tube and is used to pump the drug liquid in the small-capacity drug tank 600 into the drug tank 301 according to a preset liquid supply strategy.
• the drug pump directly pumps the drug liquid from the small-capacity drug tank 600 into the drug tank 301.
• Each small-capacity drug tank 600 corresponds to a pump tube, and each pump tube corresponds to a drug pump.
• a small-capacity drug tank 600 can supply liquid to multiple drug tanks 301.
• the drain device includes a drain pipe and a drain valve 310 , and the drain pipe is connected to the medicine tank 301 .
• the drain valve 310 is connected to the drain pipe and is used to control the flow of the drain pipe according to a preset liquid supply strategy
• the liquid tank 301 is provided with a liquid level sensor for detecting the liquid level of the liquid. This design can realize dynamic changes in the liquid level and adjust the liquid level according to the etching requirements of different workpieces.
• the above-mentioned liquid medicine pump can specifically be a pneumatic diaphragm pump, which is a small flow pump.
• the pumping time can be greatly shortened and the residual waste of liquid medicine in the pipeline can be reduced.
• a centralized liquid supply port can be reserved for use in batch preparation.
• each chemical tank 301 corresponds to multiple small-capacity chemical tanks 600 containing different chemical solutions, enabling direct mixing within the chemical tank 301.
• a separate mixing tank can be added.
• the small-capacity chemical tanks 600 are designed as small-capacity bottles, further conserving chemical solutions through their small capacity and volume.
• the liquid medicine tank 301 is designed to include a liquid medicine chamber 305 and an overflow chamber 306 for forming an overflow module.
• the liquid medicine chamber 305 is used to accommodate the liquid medicine supplied by the liquid supply mechanism 32 and to allow the workpiece 500 to be placed therein, while the overflow chamber 306 is used to receive the liquid medicine overflowing from the liquid medicine chamber 305 .
• the overflow chamber 306 is provided with an overflow recovery port 307.
• the liquid chamber 305 is provided with a liquid inlet 308 connected to a pump liquid pipe, and a liquid outlet 309 connected to a liquid discharge pipe.
• the liquid discharge valve 310 may be a quick discharge valve.
• the aforementioned liquid level sensor for detecting the liquid level is disposed within the liquid chamber 305. This liquid level sensor enables automatic liquid level control, saving liquid and protecting equipment safety. Before placing a flower basket 205 containing workpieces 500 of varying sizes, the liquid level can be set to different heights based on the size of the workpieces 500 and the flower basket 205. The liquid level in the liquid chamber 305 is then monitored in real time by the liquid level sensor and fed back to the control system 1.
• the control system 1 controls the amount of liquid pumped or the degree of opening and closing of the liquid discharge valve 310 to maintain the liquid level within the set range, achieving precise and stable liquid level control.
• the drug solution tank 301 specifically includes an inner tank body 302 .
• the liquid supply mechanism 32 further includes a heating device 312 for forming a heating module.
• the heating device 312 is used to heat the liquid in the liquid chamber 305 according to a preset liquid supply strategy. Not all liquid tanks 301 are necessarily equipped with the heating device 312.
• the heating device 312 can be flexibly configured as needed. For example, if the liquid in some liquid tanks 301 does not require heating during the experiment, the heating device 312 may not be configured.
• the heating device 312 can be designed for direct heating or water bath heating.
• the water bath heating design is safer.
• the liquid medicine tank 301 further includes an outer tank body.
• the bottom of the inner tank body 302 extends into the outer tank body, and the connecting flange 303 is connected to the outer tank body, so that a heating chamber 311 is formed between the connecting flange 303, the outer tank body and the inner tank body 302.
• the outer tank body is provided with a medium input pipe and a medium output pipe connected to the heating chamber 311.
• the heating device 312 is installed in the heating chamber 311 and is used to heat the heat conduction heating in the heating chamber 311.
• the heat conduction medium can be conventional water or heat conduction oil, and there is no specific limitation.
• the heating device 312 can be an electric heating tube or an electric heating wire.
• a temperature sensor can be set in the heating chamber 311 to detect the temperature of the heat conduction medium and feed it back to the control system 1, so that the control system 1 can accurately control the heating temperature of the liquid chamber 305 by controlling the power of the heating device 312.
• the liquid supply mechanism 32 further includes a circulation device for forming a circulation filtration module or a circulation spraying device for forming a spraying module.
• the circulation device is used to extract the liquid medicine in the liquid medicine chamber 305 according to a preset liquid supply strategy and return it to the liquid medicine chamber 305 after filtration.
• the circulation spraying device is used to extract the liquid medicine in the liquid medicine chamber 305 according to a preset liquid supply strategy and return it to the liquid medicine chamber 305 in a spraying manner after filtration.
• the circulation device can specifically include a circulation pump, a circulation delivery pipe, and a filter device.
• the input end of the circulation pump is connected to the filter and is connected to one side of the liquid medicine chamber 305 through the circulation delivery pipe.
• the output end of the circulation pump is connected to the other side of the liquid medicine chamber 305 through the circulation delivery pipe.
• the circulating spray device is different from the circulating device in that it performs reflux in the form of spraying.
• the circulating spray device may specifically include a circulating pump, a circulating delivery pipe, a spray head and a filtering device.
• one end of the pump liquid pipe can also be connected to the nozzle to realize the spray function, that is, the liquid is fed in a spraying manner.
• the liquid supply mechanism 32 further includes a bubbling device for forming a bubbling module, and the bubbling device is used to bubble the liquid medicine in the liquid medicine chamber 305 according to a preset liquid supply strategy to achieve the bubbling function of the liquid medicine tank 301.
• the etching system 3 further includes a cleaning device 315, which is used to clean the workpiece 500 in the chemical solution chamber 305.
• the cleaning device 315 can be designed as two, specifically a spray pipe design.
• the two cleaning devices 315 can be symmetrically installed on the chemical solution tank 301 as shown in Figure 10 and arranged toward the chemical solution chamber 305.
• One of the cleaning devices 315 can be connected to a nitrogen tank via a sprayer, while the other cleaning device 315 can be connected to a pure water tank via a sprayer.
• the etching system 3 further includes an etching switch cover device, which is used to control the opening and closing of the immersion inlet of the liquid medicine chamber 305.
• the etching switch cover device is designed to include an etching end cover 313 and a switch driver 314.
• One side of the etching end cover 313 is hinged to one side of the inner tank body 302 via a rotating shaft, and the switch driver 314 is installed on the liquid medicine tank 301 and connected to the rotating shaft, and is used to drive the rotating shaft to rotate, thereby controlling the opening and closing of the etching end cover 313.
• the design of the etching switch cover device can improve data accuracy and ensure personnel safety.
• the design of the automatically controlled etching switch cover device can improve operational efficiency and reduce the direct contact between operators and harmful substances.
• the etching switch cover device can be interconnected with the control system 1.
• the control system 1 For example, when the monitoring system 7 detects an abnormality in the equipment, the etching switch cover device is controlled to close the liquid tank 301.
• the switch driver 314 can be designed as a pneumatic telescopic cylinder, which drives the rotating shaft to rotate through a connecting rod mechanism. According to process and safety requirements, the timing and frequency of automatically opening and closing the etching end cover 313 can be set, thereby improving the reliability, efficiency and safety of scientific research experiments.
• the liquid supply mechanism 32 further includes an ultrasonic instrument for vibrating the liquid chamber 305 according to a preset liquid supply strategy.
• the etching system 3 listed in this application has the functions of spraying, circulating filtration spraying, heating, circulating filtration, automatic liquid preparation, vibration, bubbling, overflow, etc., which can be configured on the corresponding liquid tank 301 according to process requirements.
• the 301 chemical tank for acetone/IPA/EKC can be equipped with spraying, circulating filtration spraying, heating, and circulating filtration functions, and the tank structure material can be SUS316L; taking the design of the 301 chemical tank for DIW as an example, it can be equipped with circulating filtration spraying, bubbling, overflow, and quick discharge, and the tank structure material can be NPP.
• the preset liquid supply strategy it can specifically be an etching environment + liquid supply strategy, for example:
• the liquid supply strategy can be a liquid supply quantity control strategy or a liquid distribution control strategy.
• the etching environment strategy can be to create a circulation filtration spray while heating at a preset temperature, or to bubbling while circulating filtration, or to perform ultrasonic vibration while bubbling, or to bubbling while liquid is injected and sprayed, etc.
• the execution of this strategy can be realized by the liquid supply mechanism 32 with the cooperation of the human-computer interaction system 5, the timing system 6, etc.
• the feeding system 4 is designed to include a conveying device 402 and a first feeding switch cover device 401 .
• the conveying device 402 is used to transport the workpiece 500 from the preparation position outside the machine body 100 to the loading position in the machine room; as shown in Figure 1, the preparation position outside the machine body 100 is provided with a loading platform 116 for placing the workpiece 500 to be tested or the flower basket rack 205 containing the workpiece 500.
• the machine body 100 is provided with a loading port that connects to the machine chamber and allows the workpiece 500 to pass through.
• a first feed opening and closing device 401 is used to control the opening and closing of the loading port.
• the first feed opening and closing device 401 includes a baffle 404 and a plate driver 403.
• the baffle 404 can be slidably mounted on the machine body 100 to block the loading port.
• the plate driver 403 can be a telescopic cylinder connected to the baffle 404, driving the baffle 404 to move telescopically to achieve opening and closing control.
• the loading port is opened before loading and closed after loading is completed.
• the feeding system 4 further includes a second feeding switch cover device.
• the conveying device 402 can be specifically installed in the lower chamber.
• the lower chamber can also be designed with an independent installation chamber for installing the conveying device 402.
• the conveying device 402 includes a first feeding mechanism 405 and a second feeding mechanism 406 .
• a second escape opening is provided on the supporting partition 101 for the workpiece 500 to enter the upper chamber, and the second escape opening is connected to the installation chamber.
• the first feeding mechanism 405 is used to transport the workpiece 500 from the preparation position to the transfer position in the lower chamber
• the second feeding mechanism 406 is used to transport the workpiece 500 from the transfer position to the loading position in the upper chamber.
• the first feeding mechanism 405 can be a horizontal displacement mechanism
• the second feeding mechanism 406 can be a vertical displacement mechanism.
• the driving end of the first feeding mechanism 405 is connected to a first support 407, which is provided with a positioning groove for fixing the flower basket 205.
• the positioning groove is also provided with an escape notch 408.
• the driving end of the second feeding mechanism 406 is connected to a second support 409, which can pass through the escape notch 408 to lift the flower basket 205 from the first support 407 for further transportation to the loading position.
• the second feed opening and closing cover device is used to control the opening and closing of the second avoidance opening.
• the design and composition of the second feed opening and closing cover device can refer to the design and composition of the first feed opening and closing cover, and the details are not repeated here.
• the fully automated design can accurately control the amount of liquid medicine used, reduce the amount of reagents used, reduce scientific research costs, and improve resource utilization efficiency. It can also automatically monitor and adjust experimental conditions, reduce the risk of experimental failure, and reduce the waste of experimental consumables, thereby reducing resource waste.
• the equipment is optimized and miniaturized, compatible with small-size workpiece experiments, which not only reduces floor space and saves installation and maintenance costs, but also greatly reduces liquid medicine consumption, saving scientific research costs.
• This fully automated machine has a wide range of applications, filling the gap in existing technology for wet-process equipment and processes in the scientific research field. It can be used in various university laboratories and research institutions to meet scientific research needs, and will have a positive and far-reaching impact on the development of semiconductor research. Moreover, the intelligent and automated nature of this fully automated machine will attract user demand and is expected to achieve significant success in the market. In addition, the commissioning of this fully automated machine will promote the development of related industrial chains, promote the upgrading and innovation of related technologies and equipment, and provide a significant boost to economic progress.

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