IL320253B2 - Automated wet etching system and machine for scientific research - Google Patents

Automated wet etching system and machine for scientific research

Info

Publication number
IL320253B2
IL320253B2 IL320253A IL32025325A IL320253B2 IL 320253 B2 IL320253 B2 IL 320253B2 IL 320253 A IL320253 A IL 320253A IL 32025325 A IL32025325 A IL 32025325A IL 320253 B2 IL320253 B2 IL 320253B2
Authority
IL
Israel
Prior art keywords
chemical solution
chamber
module
machine
fully automatic
Prior art date
Application number
IL320253A
Other languages
English (en)
Hebrew (he)
Other versions
IL320253A (enExample
IL320253B1 (en
Inventor
Wei Xu
Yijie Li
Xiangjun Zeng
Ji Li
Nina Wang
Xuemeng Feng
Original Assignee
The Hong Kong Univ Of Science And Technology Guangzhou
Wei Xu
Yijie Li
Xiangjun Zeng
Ji Li
Nina Wang
Xuemeng Feng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Hong Kong Univ Of Science And Technology Guangzhou, Wei Xu, Yijie Li, Xiangjun Zeng, Ji Li, Nina Wang, Xuemeng Feng filed Critical The Hong Kong Univ Of Science And Technology Guangzhou
Publication of IL320253A publication Critical patent/IL320253A/en
Publication of IL320253B1 publication Critical patent/IL320253B1/en
Publication of IL320253B2 publication Critical patent/IL320253B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B25J9/1697—Vision controlled systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
IL320253A 2024-04-16 2025-04-10 Automated wet etching system and machine for scientific research IL320253B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202410452002.8A CN118053795B (zh) 2024-04-16 2024-04-16 一种科研型湿法刻蚀全自动化系统及机台

Publications (3)

Publication Number Publication Date
IL320253A IL320253A (enExample) 2025-05-01
IL320253B1 IL320253B1 (en) 2025-06-01
IL320253B2 true IL320253B2 (en) 2025-10-01

Family

ID=91050468

Family Applications (1)

Application Number Title Priority Date Filing Date
IL320253A IL320253B2 (en) 2024-04-16 2025-04-10 Automated wet etching system and machine for scientific research

Country Status (6)

Country Link
US (1) US12482676B2 (enExample)
EP (1) EP4636814A2 (enExample)
JP (1) JP7754559B1 (enExample)
CN (1) CN118053795B (enExample)
IL (1) IL320253B2 (enExample)
WO (1) WO2025218445A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118053795B (zh) * 2024-04-16 2024-07-12 香港科技大学(广州) 一种科研型湿法刻蚀全自动化系统及机台
CN118824908B (zh) * 2024-09-19 2024-12-27 香港科技大学(广州) 科研用黑灯湿法实验室

Family Cites Families (21)

* Cited by examiner, † Cited by third party
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US6514355B1 (en) * 1999-02-08 2003-02-04 International Business Machines Corporation Method and apparatus for recovery of semiconductor wafers from a chemical tank
JP4033689B2 (ja) * 2002-03-01 2008-01-16 東京エレクトロン株式会社 液処理装置および液処理方法
US20030194877A1 (en) * 2002-04-16 2003-10-16 Applied Materials, Inc. Integrated etch, rinse and dry, and anneal method and system
US7039499B1 (en) * 2002-08-02 2006-05-02 Seminet Inc. Robotic storage buffer system for substrate carrier pods
KR100632070B1 (ko) * 2004-12-28 2006-10-04 동부일렉트로닉스 주식회사 습식 세정 시스템
JP2007294606A (ja) * 2006-04-24 2007-11-08 Etsujo Kagi Kofun Yugenkoshi パネルのエッチング製作プロセスの方法及びその装置
JP4308865B2 (ja) * 2007-03-30 2009-08-05 Ｏｋｉセミコンダクタ株式会社 半導体素子の製造方法、及び半導体素子の製造装置
JP2011009247A (ja) * 2009-06-23 2011-01-13 Sharp Corp 太陽電池の製造方法及び湿式エッチング装置
KR101095192B1 (ko) * 2011-02-11 2011-12-16 강은광 습식 장치의 불순물 감지 시스템 및 방법
JP6100486B2 (ja) 2012-08-17 2017-03-22 株式会社プレテック 浸漬式の洗浄装置
JP6095295B2 (ja) 2012-08-17 2017-03-15 株式会社プレテック スピンテーブルを用いた洗浄装置
CN105225981A (zh) * 2014-05-30 2016-01-06 盛美半导体设备（上海）有限公司 一种半导体基板的刻蚀装置和方法
JP2016111053A (ja) 2014-12-02 2016-06-20 国立研究開発法人産業技術総合研究所 シリンジを用いた処理液供給装置およびウェット処理装置
CN109935543A (zh) * 2017-12-18 2019-06-25 上海微电子装备（集团）股份有限公司 片盒自动运输设备及运输方法
CN108470693B (zh) * 2018-03-15 2019-03-01 福建省福联集成电路有限公司 一种蚀刻装置控制方法和系统
JP7202138B2 (ja) * 2018-10-22 2023-01-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7412990B2 (ja) * 2019-12-04 2024-01-15 東京エレクトロン株式会社 基板処理装置、および基板処理方法
CN214313143U (zh) * 2021-02-08 2021-09-28 淄博绿能芯创电子科技有限公司 多功能酸洗台装置
JP7638765B2 (ja) 2021-04-01 2025-03-04 東京エレクトロン株式会社 基板液処理装置および基板液処理方法
WO2023162464A1 (ja) 2022-02-24 2023-08-31 国立研究開発法人産業技術総合研究所 ウェットプロセス装置
CN118053795B (zh) * 2024-04-16 2024-07-12 香港科技大学(广州) 一种科研型湿法刻蚀全自动化系统及机台

Also Published As

Publication number Publication date
CN118053795A (zh) 2024-05-17
CN118053795B (zh) 2024-07-12
IL320253A (enExample) 2025-05-01
EP4636814A2 (en) 2025-10-22
US12482676B2 (en) 2025-11-25
JP2025162980A (ja) 2025-10-28
US20250323067A1 (en) 2025-10-16
JP7754559B1 (ja) 2025-10-15
IL320253B1 (en) 2025-06-01
WO2025218445A1 (zh) 2025-10-23

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