CN118053795B - 一种科研型湿法刻蚀全自动化系统及机台 - Google Patents

一种科研型湿法刻蚀全自动化系统及机台 Download PDF

Info

Publication number
CN118053795B
CN118053795B CN202410452002.8A CN202410452002A CN118053795B CN 118053795 B CN118053795 B CN 118053795B CN 202410452002 A CN202410452002 A CN 202410452002A CN 118053795 B CN118053795 B CN 118053795B
Authority
CN
China
Prior art keywords
liquid medicine
liquid
module
etching
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202410452002.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN118053795A (zh
Inventor
李艺杰
曾祥军
李季
王呢娜
冯雪蒙
徐巍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Kong University Of Science And Technology Guangzhou
Original Assignee
Hong Kong University Of Science And Technology Guangzhou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Kong University Of Science And Technology Guangzhou filed Critical Hong Kong University Of Science And Technology Guangzhou
Priority to CN202410452002.8A priority Critical patent/CN118053795B/zh
Publication of CN118053795A publication Critical patent/CN118053795A/zh
Application granted granted Critical
Publication of CN118053795B publication Critical patent/CN118053795B/zh
Priority to US19/082,602 priority patent/US12482676B2/en
Priority to JP2025043570A priority patent/JP7754559B1/ja
Priority to PCT/CN2025/084053 priority patent/WO2025218445A1/zh
Priority to EP25165498.4A priority patent/EP4636814A2/en
Priority to IL320253A priority patent/IL320253B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B25J9/1697—Vision controlled systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Weting (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • ing And Chemical Polishing (AREA)
CN202410452002.8A 2024-04-16 2024-04-16 一种科研型湿法刻蚀全自动化系统及机台 Active CN118053795B (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN202410452002.8A CN118053795B (zh) 2024-04-16 2024-04-16 一种科研型湿法刻蚀全自动化系统及机台
US19/082,602 US12482676B2 (en) 2024-04-16 2025-03-18 Research wet etching fully automatic system and machine
JP2025043570A JP7754559B1 (ja) 2024-04-16 2025-03-18 科学研究用ウェットエッチング全自動化システム及び機台
PCT/CN2025/084053 WO2025218445A1 (zh) 2024-04-16 2025-03-21 一种科研型湿法刻蚀全自动化系统及机台
EP25165498.4A EP4636814A2 (en) 2024-04-16 2025-03-23 Research wet etching fully automatic system and machine
IL320253A IL320253B2 (en) 2024-04-16 2025-04-10 Automated wet etching system and machine for scientific research

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202410452002.8A CN118053795B (zh) 2024-04-16 2024-04-16 一种科研型湿法刻蚀全自动化系统及机台

Publications (2)

Publication Number Publication Date
CN118053795A CN118053795A (zh) 2024-05-17
CN118053795B true CN118053795B (zh) 2024-07-12

Family

ID=91050468

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202410452002.8A Active CN118053795B (zh) 2024-04-16 2024-04-16 一种科研型湿法刻蚀全自动化系统及机台

Country Status (6)

Country Link
US (1) US12482676B2 (enExample)
EP (1) EP4636814A2 (enExample)
JP (1) JP7754559B1 (enExample)
CN (1) CN118053795B (enExample)
IL (1) IL320253B2 (enExample)
WO (1) WO2025218445A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118053795B (zh) * 2024-04-16 2024-07-12 香港科技大学(广州) 一种科研型湿法刻蚀全自动化系统及机台
CN118824908B (zh) * 2024-09-19 2024-12-27 香港科技大学(广州) 科研用黑灯湿法实验室

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060075086A (ko) * 2004-12-28 2006-07-04 동부일렉트로닉스 주식회사 습식 세정 시스템
CN109935543A (zh) * 2017-12-18 2019-06-25 上海微电子装备（集团）股份有限公司 片盒自动运输设备及运输方法
CN115206833A (zh) * 2021-04-01 2022-10-18 东京毅力科创株式会社 基片液处理装置和基片液处理方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6514355B1 (en) * 1999-02-08 2003-02-04 International Business Machines Corporation Method and apparatus for recovery of semiconductor wafers from a chemical tank
JP4033689B2 (ja) * 2002-03-01 2008-01-16 東京エレクトロン株式会社 液処理装置および液処理方法
US20030194877A1 (en) * 2002-04-16 2003-10-16 Applied Materials, Inc. Integrated etch, rinse and dry, and anneal method and system
US7039499B1 (en) * 2002-08-02 2006-05-02 Seminet Inc. Robotic storage buffer system for substrate carrier pods
JP2007294606A (ja) * 2006-04-24 2007-11-08 Etsujo Kagi Kofun Yugenkoshi パネルのエッチング製作プロセスの方法及びその装置
JP4308865B2 (ja) * 2007-03-30 2009-08-05 Ｏｋｉセミコンダクタ株式会社 半導体素子の製造方法、及び半導体素子の製造装置
JP2011009247A (ja) * 2009-06-23 2011-01-13 Sharp Corp 太陽電池の製造方法及び湿式エッチング装置
KR101095192B1 (ko) * 2011-02-11 2011-12-16 강은광 습식 장치의 불순물 감지 시스템 및 방법
JP6100486B2 (ja) 2012-08-17 2017-03-22 株式会社プレテック 浸漬式の洗浄装置
JP6095295B2 (ja) 2012-08-17 2017-03-15 株式会社プレテック スピンテーブルを用いた洗浄装置
CN105225981A (zh) * 2014-05-30 2016-01-06 盛美半导体设备（上海）有限公司 一种半导体基板的刻蚀装置和方法
JP2016111053A (ja) 2014-12-02 2016-06-20 国立研究開発法人産業技術総合研究所 シリンジを用いた処理液供給装置およびウェット処理装置
CN108470693B (zh) * 2018-03-15 2019-03-01 福建省福联集成电路有限公司 一种蚀刻装置控制方法和系统
JP7202138B2 (ja) * 2018-10-22 2023-01-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7412990B2 (ja) * 2019-12-04 2024-01-15 東京エレクトロン株式会社 基板処理装置、および基板処理方法
CN214313143U (zh) * 2021-02-08 2021-09-28 淄博绿能芯创电子科技有限公司 多功能酸洗台装置
WO2023162464A1 (ja) 2022-02-24 2023-08-31 国立研究開発法人産業技術総合研究所 ウェットプロセス装置
CN118053795B (zh) * 2024-04-16 2024-07-12 香港科技大学(广州) 一种科研型湿法刻蚀全自动化系统及机台

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060075086A (ko) * 2004-12-28 2006-07-04 동부일렉트로닉스 주식회사 습식 세정 시스템
CN109935543A (zh) * 2017-12-18 2019-06-25 上海微电子装备（集团）股份有限公司 片盒自动运输设备及运输方法
CN115206833A (zh) * 2021-04-01 2022-10-18 东京毅力科创株式会社 基片液处理装置和基片液处理方法

Also Published As

Publication number Publication date
CN118053795A (zh) 2024-05-17
IL320253A (enExample) 2025-05-01
EP4636814A2 (en) 2025-10-22
US12482676B2 (en) 2025-11-25
JP2025162980A (ja) 2025-10-28
US20250323067A1 (en) 2025-10-16
JP7754559B1 (ja) 2025-10-15
IL320253B1 (en) 2025-06-01
WO2025218445A1 (zh) 2025-10-23
IL320253B2 (en) 2025-10-01

Similar Documents

Publication Publication Date Title
CN118053795B (zh) 一种科研型湿法刻蚀全自动化系统及机台
KR102626378B1 (ko) 드럼 용기용 자동 커플링 시스템
US7744700B2 (en) Aqueous tube cleaning apparatus and method
JP5645796B2 (ja) 液処理装置及び液処理方法
CN210628335U (zh) 硅片清洗设备
CN112103217B (zh) 半导体离心旋转清洗机
CN110694991A (zh) 晶圆清洗装置
CN211100448U (zh) 一种硅片清洗设备
CN118045820A (zh) 一种石英管清洗槽、清洗机及清洗方法
CN218251870U (zh) 清洗装置
CN221612437U (zh) 一种盐块取样装置
CN208373661U (zh) 污染部件清洗设备
CN118512946B (zh) 一种离心管自动化综合处理装置
CN213546270U (zh) 半导体离心旋转清洗机
CN218133725U (zh) 一种硅片清洗转送装置
CN210628258U (zh) 硅片清洗设备
CN216297333U (zh) 样品瓶清洗装置
CN222883508U (zh) 一种试剂放置组件、湿法机台与自动换液系统
US6294028B1 (en) Mercury process gold ballbond removal apparatus
CN112945629A (zh) 电子级化学品采样系统和方法
CN220072727U (zh) 一种试管自动清洗装置
CN218167950U (zh) 一种半导体清洗装置
CN217941156U (zh) 一种新型全自动电子级化学品桶配件清洗设备
CN221133322U (zh) 一种清洗干燥机构
CN221657354U (zh) 清洗设备

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant