WO2024255763A1 - 一种封装组件及其组装方法和摄像模组 - Google Patents

一种封装组件及其组装方法和摄像模组 Download PDF

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Publication number
WO2024255763A1
WO2024255763A1 PCT/CN2024/098696 CN2024098696W WO2024255763A1 WO 2024255763 A1 WO2024255763 A1 WO 2024255763A1 CN 2024098696 W CN2024098696 W CN 2024098696W WO 2024255763 A1 WO2024255763 A1 WO 2024255763A1
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WIPO (PCT)
Prior art keywords
circuit board
chip
pad
glue
solder ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2024/098696
Other languages
English (en)
French (fr)
Inventor
栾仲禹
俞杰
刘丽
鲍迹
陆锡松
李新雷
周智熠
刘佳乐
陈方琦
王铭轩
陈佳炜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202310713292.2A external-priority patent/CN119208396A/zh
Priority claimed from CN202310714337.8A external-priority patent/CN119208397A/zh
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN202480032093.8A priority Critical patent/CN121176174A/zh
Publication of WO2024255763A1 publication Critical patent/WO2024255763A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Definitions

  • the present application relates to the technical field of camera modules, and further to a packaging component and an assembly method thereof, and a camera module assembled from the packaging component.
  • the camera module is one of the indispensable components of smart electronic devices, including but not limited to smart phones, cameras, computer equipment, wearable devices, etc. With the continuous development and popularization of various smart devices, the requirements for camera modules are getting higher and higher.
  • the camera module is mainly composed of an optical lens and a chip packaging component.
  • the height of the optical lens is currently difficult to optimize, so the thinness of the camera module mainly depends on the size of the chip packaging component.
  • the size of the imaging surface of the chip is increasing rapidly, but at the same time, it is necessary to cater to the trend of thinning and lightening of smart devices. Even if the chip size increases, the height size of the overall camera module is still limited. Furthermore, how to reduce the height and size of the chip packaging component when the chip size increases is an important problem that needs to be solved at present.
  • the camera module is an optical electronic device. Its chip packaging assembly not only needs to consider the stability of the chip circuit conduction, but also needs to ensure the stability of its structure. After the chip and the circuit board structure are connected, the stability of the connection between the chip and the circuit board must also be ensured. The chip and circuit board packaging assembly needs to undergo multiple reliability tests during the manufacturing process. If the packaging assembly structure between the chip and the circuit board is unstable, the chip will fall off the circuit board during the reliability test, thereby destroying the stability of its packaging assembly structure. How to structurally ensure the stability of the connection between the chip and the circuit board is also one of the issues that need to be considered at present.
  • the present application provides a chip and circuit board packaging component structure, which can effectively solve some and/or most of the above problems while achieving miniaturization of the overall structure of the packaging component.
  • One purpose of the present application is to provide a packaging component and its assembly method and a camera module, which have a simple structure, can ensure the miniaturization of the overall packaging component while realizing its assembly in the camera module, and can realize the lightness and thinness of the camera module structure.
  • Another object of the present invention is to provide a packaging component, an assembly method thereof and a camera module, which forms a conductive bonding area between the chip and the circuit board by bonding the gold ball fixed on the chip pad to the solder ball on the circuit board pad, thereby connecting the circuit board to the photosensitive chip.
  • Another object of the present application is to provide a packaging component, an assembly method thereof and a camera module, which arranges a circuit board pad on the back of the circuit board, and arranges a solder ball on the circuit board pad using a steel screen printing process, so that the solder ball can be fixed on the circuit board pad to ensure stable conduction with the chip.
  • Another object of the present application is to provide a packaging component, an assembly method thereof and a camera module, which coats glue on the circuit board pad so that the glue covers the solder ball to avoid oxidation of the solder ball and facilitate the melting of the solder ball and the gold ball.
  • Another object of the present application is to provide a packaging component, an assembly method thereof and a camera module, which can further extend the conductive circuit of the chip to facilitate conductive connection with the circuit board by setting a chip pad on the front side of the chip and setting a gold ball on the chip pad so that the gold ball is conductively connected to the chip pad.
  • Another object of the present application is to provide a packaging component, an assembly method thereof and a camera module, which fills glue in the gap inside the conductive bonding area formed by the circuit board and the chip to make the connection between the chip and the circuit board more stable, prevent the chip from falling off the circuit board, and improve the reliability of the packaging component.
  • Another object of the present application is to provide a packaging component and an assembly method thereof and a camera module, wherein a through hole is opened on a circuit board, the chip is arranged on the circuit board and the effective area of the chip corresponds to the through hole of the circuit board, and the chip The effective area surface of the sheet is lower than the front surface of the circuit board, which can effectively reduce the height of the packaging component.
  • Another object of the present application is to provide a packaging component, an assembly method thereof and a camera module, which fixes the chip on the circuit board, mainly fixes the chip on the back of the circuit board, so that the effective area of the chip is completely exposed in the through hole of the circuit board to ensure that the chip can receive most of the external light.
  • Another object of the present application is to provide a packaging component, an assembly method thereof and a camera module, which can effectively prevent the electronic components from falling off by arranging electronic components on the circuit board, fixing the electronic components on the circuit board by a molding process, and molding the electronic components inside the circuit board.
  • Another object of the present application is to provide a packaging component, an assembly method thereof and a camera module, which form a molded part on the circuit board using a molding process. While covering the electronic components, the molded part can form a color filter mounting position on its upper surface, thereby ensuring the accuracy of color filter installation.
  • Another object of the present application is to provide a packaging component, an assembly method thereof and a camera module, which may also include a back molding portion formed on the back side of the circuit board, there is a gap between the back molding portion and the chip, and the back molding portion can further strengthen the structural strength of the packaging component.
  • Another object of the present application is to provide a packaging component, an assembly method thereof and a camera module, which forms a chip anti-shake structure by setting the packaging component on a driving component, and combines the chip anti-shake structure with an optical lens to obtain a camera module structure with a large-stroke chip anti-shake.
  • a packaging component includes a circuit board and a chip, wherein the circuit board has a through hole, and the chip is arranged corresponding to the through hole of the circuit board:
  • the circuit board has a plurality of circuit board pads, at least one solder ball is arranged on each of the circuit board pads, the chip has a plurality of chip pads, at least one gold ball is arranged on the chip pad, the chip pad corresponds to the circuit board pad, and at least one gold ball is melted with at least one solder ball to form a conductive bonding area to conduct the circuit board and the chip;
  • the gold ball and the solder ball are fixed by thermal compression bonding.
  • the glue contains flux and covers the solder balls to slow down oxidation of the solder balls.
  • the glue connects the circuit board and the chip and completely fills the gaps between the conductive bonding areas where the gold balls and the solder balls are melted.
  • the glue is arranged around the through hole of the circuit board and covers the solder pad of the circuit board, wherein the glue has a glue width, and the solder ball is arranged on the side of the midline of the glue width close to the through hole of the circuit board, so that the glue can cover the solder ball inside it.
  • the glue thickness is greater than the solder ball height, and the glue thickness is greater than or equal to 20 ⁇ m.
  • an ink structure is provided on the circuit board, and the ink is respectively provided on both sides close to and away from the circuit board through hole, wherein the ink is protrudingly provided on the circuit board pad and forms a groove, and the circuit board pad is at least partially accommodated in the groove.
  • the solder ball is disposed on the pad of the circuit board, and the solder ball covers at least 80% of the area of the pad of the circuit board, so that the solder ball is accommodated in the groove formed by the ink structure.
  • the gold ball on the chip pad has a protrusion, wherein the protrusion extends into the interior of the solder ball on the circuit board pad to increase the contact area between the solder ball and the gold ball.
  • the circuit board pads are arranged corresponding to the chip pads, wherein the center distance between at least some adjacent circuit board pads is less than 150 ⁇ m.
  • the package body further has a molding portion, which is integrally formed on the circuit board, wherein the molding portion includes a front molding portion and a back molding portion formed on the front and back sides of the circuit board.
  • the back molding part is arranged on the back side of the circuit board, and the back molding part can be used to strengthen the strength of the circuit board, wherein the lower surface of the back molding part is lower than the back side of the chip.
  • the front molding portion is arranged in a ring shape around the through hole of the circuit board, and the front side of the circuit board provided with the circuit board pad is covered by the front molding portion.
  • a camera module is also provided, characterized in that it includes:
  • the lens motor is arranged on the upper surface of the packaging component so that external light can reach the inside of the packaging component through the lens motor.
  • a method for assembling a packaging component comprising the steps of:
  • a providing a circuit board, wherein a plurality of circuit board pads are provided on one surface of the circuit board, and at least one solder ball is implanted into the circuit board pad;
  • b providing a chip, wherein a plurality of chip pads are provided on the chip, and at least one gold ball is implanted into the chip pad;
  • the glue in step c contains flux, and the glue is applied to the circuit board pad and covers the solder ball.
  • the glue thickness is greater than the solder ball height.
  • the step d specifically includes the steps of: fixing the solder balls of the circuit board pad and the gold balls of the chip pad by thermal compression bonding, so that at least one of the solder balls and at least one of the gold balls melt to form a conductive bonding area, and at the same time, the glue is filled in the gap of the conductive bonding area.
  • the temperature of hot-press bonding of the solder ball and the gold ball is controlled, and the bonding process is step-wise heated with a first bonding temperature and a second bonding temperature, wherein the first bonding temperature is used for a relatively short time, and the second bonding temperature heating time is more than 5 times the first bonding temperature heating time, so that the glue can fill the conductive bonding area between the chip and the circuit board.
  • the step d specifically includes: forming a protrusion on the gold ball of the chip pad, aligning it with the solder ball of the circuit board pad and extending the protrusion of the gold ball into the solder ball of the circuit board pad to enhance the The contact area between the solder ball and the gold ball.
  • the step a specifically includes the steps of: depositing solder paste on the circuit board pad by means of steel screen printing, forming the solder paste into solder balls by means of reflow soldering and implanting them into the circuit board pad.
  • step a specifically includes: protrudingly setting an ink structure on the circuit board and forming a groove, so that the circuit board pad is at least partially accommodated in the groove, and the solder ball covers at least 80% of the area of the circuit board pad, so that the solder ball can be accommodated in the groove formed by the ink structure on the circuit board.
  • step a also includes step a1: integrally forming a circuit board front molding portion on the front side of the circuit board, and integrally forming a circuit board back molding portion on the back side of the circuit board, so that the circuit board back molding portion is arranged on the outside of the circuit board pad.
  • the step a further includes step a2: a through hole is formed on the circuit board, the through hole passes through a central area of the circuit board, and the front molding portion of the circuit board is arranged in a ring shape around the through hole.
  • step e installing the color filter on the color filter installation position on the front molding portion of the circuit board to filter out stray light.
  • a camera module is also provided, characterized in that it includes:
  • the packaging component is manufactured by the packaging component assembly method described above, wherein the lens motor is arranged on the upper surface of the packaging component so that external light can reach the inside of the packaging component through the lens motor.
  • FIG1 is a schematic diagram of a common packaging component structure in the prior art of this application.
  • FIG2 is a schematic diagram of a specific embodiment of a packaging component structure provided by the present application.
  • FIG3 is a schematic diagram of another specific embodiment of the packaging component structure provided by the present application.
  • FIG4 is a partial schematic diagram of the connection between the circuit board and the chip in the packaging assembly structure provided by the present application.
  • FIG5 is another partial schematic diagram of the circuit board and the chip being connected in the packaging assembly structure provided by the present application.
  • FIG6 is a schematic diagram of the structure of the stencil-printed solder ball process on the circuit board in the present application.
  • FIG7 is a schematic diagram of the back structure of the circuit board in this application.
  • FIG8A is a partial schematic diagram of the assembly process of the packaging component in the present application.
  • FIG8B is a partial schematic diagram of the packaging assembly assembly process in the present application, wherein FIG8A and FIG8B show the complete steps of assembling the entire packaging assembly;
  • FIG9 is a partial schematic diagram of solder balls and glue on the back of a circuit board in the present application.
  • FIG10 is a partial schematic diagram of the ink structure on the back of the circuit board in the present application.
  • FIG. 11 is a schematic diagram of the structure of a camera module assembled using this packaging component structure in the present application.
  • the terms “set”, “install”, “connect”, and “connect” should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, a contact connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two elements.
  • the specific meanings of the above terms in this application can be understood according to specific circumstances.
  • the photosensitive chip can convert external light signals into electrical signals. It is one of the indispensable components in the camera module.
  • the chip is set on the upper surface of the circuit board, and the chip and the circuit board are connected by the WB (wire bonding) process to ensure the normal operation of the chip.
  • the chip size has also increased accordingly, and the size of the corresponding circuit board where the chip is set will also increase.
  • the stacking of the chip and the circuit board up and down results in a large size in the height direction, which does not conform to the current trend of the development of lightweight camera module structures.
  • the present application provides a chip packaging assembly 10.
  • the size of the chip is increased accordingly, and the size of the corresponding circuit board connected to the chip also needs to be increased.
  • the structure of the circuit board and the chip is also improved accordingly.
  • the chip size is greater than/or equal to 1/1.7 inches.
  • the chip 301 includes an effective area 321 and an ineffective area 322, wherein the effective area 321 is located in the middle of the chip 301, and the ineffective area 322 is located at the edge of the chip 301.
  • the size of the circuit board 201 is larger than that of the chip 301.
  • a corresponding through hole 213 is provided in the middle of the circuit board 201.
  • the size of the circuit board through hole 213 is larger than or equal to the size of the effective area 321 of the chip 301, that is, the effective area 321 of the chip is exposed in the through hole 213 formed in the circuit board 201, and the ineffective area 322 of the chip 301 is connected to the circuit board 201.
  • the circuit board 201 and the chip 301 need to be connected, and the end surface of the circuit board 201 in contact with the chip 301 is defined as the circuit board back 212, and the end surface of the circuit board 201 away from the chip 301 is defined as the circuit board front 211.
  • the circuit board through hole 213 passes through the circuit board front 211 and the circuit board back 212, and the circuit board pad 221 is arranged on the circuit board back 212 around the circuit board through hole 213.
  • the circuit board pad 221 can be arranged on at least one side of the through hole 213, or according to the need for conduction, the circuit board pad 221 can be arranged on all four sides of the through hole 213, and no specific limitation is made here.
  • an end surface of the chip 301 in contact with the circuit board 201 is defined as a chip front side 311, and an end surface of the chip 301 away from the circuit board 201 is defined as a chip back side 312, wherein the chip solder pad 331 is disposed on the chip front side 311, and the chip solder pad 331 is disposed in the non-effective area 322 of the chip.
  • the circuit board pad 221 is adapted to the chip pad 331, that is, the circuit board pad 221 on the back side 212 of the circuit board and the chip pad 331 on the front side 311 of the chip are in a one-to-one correspondence, so that the circuit board 201 and the chip 301 are connected.
  • the direct contact between the circuit board pad 221 and the chip pad 331 cannot guarantee stable conduction between the two.
  • other methods need to be adopted to ensure stable conduction between the chip 301 and the circuit board 201.
  • the present application also provides a method for conducting the chip 301 with the circuit board 201, as shown in FIG4 and FIG5, in a specific embodiment, when the chip 301 is disposed in the through hole 213 of the circuit board 201, the circuit board pad 221 on the back side 212 of the circuit board contacts the chip pad 331 on the front side 311 of the chip.
  • materials with good conductivity such as copper, gold, etc. are preferably selected.
  • the gold ball 332 is preferably used to conduct the chip 301 and the circuit board 201.
  • the gold ball 332 is implanted on the chip pad 331 so that one end of the gold ball 332 contacts the chip 301, and the other end of the gold ball 332 contacts the circuit board pad 221, and the gold ball 332 is used as an intermediate medium for the circuit board 201 and the chip 301 to conduct, so that the chip 301 and the circuit board 201 are conducted.
  • the gold ball 332 has good electrical conductivity, so that the chip 301 is connected to the circuit board 201
  • the circuit board pad 221 is generally set to metal copper, and copper and gold are not fusible, so that the chip 301 It is easy to fall off from the circuit board 201.
  • a method for stably conducting the chip 301 and the circuit board 201 is provided.
  • a SN-AU (tin-gold) compound is used for conduction, a solder ball 222 is set on the circuit board pad 221, and the gold ball 332 is implanted on the chip pad 331, so that the solder ball 222 on the circuit board 201 is in contact with the gold ball 332 on the chip 301, so as to effectively ensure the circuit conduction between the circuit board 201 and the chip 301.
  • the gold ball 332 on the chip 301 is melted with the solder ball 222 on the circuit board 201, and the tin-gold compound layer 223 is formed at the position where the gold ball 332 contacts the solder ball 222.
  • the tin-gold compound layer 223 is a compound formed by gold and tin under heating conditions, and can be bonded with the solder ball 222 on the circuit board pad 221 and the gold ball 332 on the chip pad 331 to ensure the stability of the connection between the chip 301 and the circuit board 201.
  • the chip 301 and the circuit board 201 are connected to form a conductive bonding area, and a plurality of tin-gold compound layers 223 can be formed in the conductive bonding area.
  • An intermediate material layer is formed at the connection between the solder ball 222 and the gold ball 332 to assist the solder ball 222 and the gold ball 332 to fuse, thereby preventing the gold ball 332 and the solder ball 222 from being difficult to fuse due to different chemical properties, thereby causing the chip 301 to fall off the circuit board 201 .
  • the material of the chip pad 331 is generally gold, so when the gold ball 332 is implanted on the chip pad 331, the gold ball 332 and the chip pad 331 are well melted.
  • the gold ball 332 has a protrusion, and the direction of the protrusion is toward the direction of the circuit board pad 221, wherein the protrusion of the gold ball 332 on the chip 301 extends into the solder ball 222 of the circuit board pad 221 to increase the contact area between the solder ball 222 and the gold ball 332.
  • soldering flux In order to fuse the solder ball 222 on the circuit board with the gold ball 332 on the chip, a corresponding soldering flux is provided in the middle position where the two are in contact. Rosin can be selected as the soldering flux. Its main function is to prevent the solder ball from being oxidized when the tin powder is melted into the solder ball, so that the solder ball 222 on the circuit board pad 221 and the gold ball 332 on the chip pad 331 can be better melted, and the stability of the electrical conduction between the circuit board 201 and the chip 301 can be ensured.
  • the gold ball 332 is implanted on the chip pad 331 so that it is melted with the solder ball 222 disposed on the circuit board pad 221, but the contact area between the solder ball 222 and the gold ball 332 is In the subsequent reliability process, the chip 301 is easy to fall off from the circuit board 201, which does not meet the reliability requirements.
  • the gap between the solder ball 222 on the circuit board 201 and the gold ball 332 on the chip 301 is filled with glue 232 at the connection between the circuit board 201 and the chip 301.
  • the glue 232 connects the circuit board 201 and the chip 301.
  • the glue 232 completely fills the gap between the conductive bonding area where the plurality of gold balls 332 and the solder ball 222 are melted.
  • the range of the complete filling refers to the filling range of the glue in the gap of the conductive bonding area is more than 80%.
  • the height of the glue 232 is greater than the height of the solder ball 222, so that the solder ball 222 is covered inside the glue 232 to prevent the solder ball 222 from contacting with the external air, so as to avoid the solder ball 222 from being oxidized.
  • the glue 232 contains flux to fully melt the solder ball 222 and the gold ball 332. Meanwhile, the circuit board 201 and the chip 3012 are in full contact with the glue 232. Due to the viscosity of the glue 232 itself, the stability of the connection between the circuit board 201 and the chip 301 is enhanced.
  • the simulation model can measure that the thrust that the bonding area between the chip 301 and the circuit board 201 can withstand is about 0.7kg, which does not meet the reliability requirements.
  • the bonding force of the glue 232 is used to enhance the stability of the connection between the circuit board 201 and the chip 301, so that the thrust that the bonding area between the chip 301 and the circuit board 201 can withstand is increased to 2.7kg, meeting the reliability requirements of the camera module packaging component 10 design.
  • glue 232 is provided in the area where the chip 301 is bonded to the circuit board 201.
  • the specific model of the glue 232 can be selected according to the actual design, and no corresponding restrictions are made here.
  • the setting method of the glue 232 in the present application can adopt a glue drawing process.
  • the glue 232 is provided around the circuit board through hole 213 and covers the circuit board pad 221, wherein the glue 232 has a glue drawing width, and the solder ball 222 is provided on the side of the midline of the glue drawing width close to the circuit board through hole 213, so that the glue 232 can cover the solder ball 222 inside.
  • the specific glue drawing width refers to the width area when the glue 232 is applied to the circuit board 201, generally referring to the glue width in the direction extending from the circuit board through hole 213 to the outer edge of the circuit board.
  • the needle diameter of the glue selected in this application is 0.01mm, and the width of the glue is less than or equal to 20 ⁇ m.
  • the glue 232 will be trapped in the process of sudden temperature rise, resulting in insufficient bonding area between the chip 301 and the circuit board 201.
  • the temperature of the gold ball hot pressing bonding is to step-up the bonding process with a first bonding temperature and a second bonding temperature, wherein the first bonding temperature is a relatively low temperature in the temperature range of 100°C-200°C, and the heating time is relatively short, so that the glue 232 reduces bubbles and increases the bonding area between the glue 232 and the circuit board 201 and the chip 301, thereby increasing the bonding force, and the second bonding temperature range is between 200°C-300°C, and the heating time is more than 5 times the heating time of the first bonding temperature, so that the glue can fill the conductive bonding area between the chip and the circuit board, so that the glue 232 can completely cover the bonding area between the chip and the circuit board.
  • the chip 301 and the circuit board 201 each have pads, especially the chip pad 331, which is relatively small (usually not clearly visible to the naked eye, but can be seen with the help of corresponding instruments).
  • the chip pad 331 is relatively small (usually not clearly visible to the naked eye, but can be seen with the help of corresponding instruments).
  • some special processes are required, such as laser ball, laser ball, steel screen printing + reflow soldering or steel screen printing, etc.
  • the steel screen printing process can be used to implant the gold ball 332 on the chip pad 331, so that the chip 301 and the circuit board 201 are connected to ensure the normal operation of the chip 301.
  • the circuit board pad 221 also needs to be provided with a corresponding solder ball 222, and the gold ball 332 on the chip is melted with the solder ball 222 on the circuit board 201, so that the circuit board 201 and the chip 301 are connected. Since the size of the circuit board pad 221 is also small, a special process is also required to implant the solder ball 222 on the circuit board 201. Specifically, in the present application, it is necessary to provide a corresponding solder ball 222 on the circuit board pad 221, and the solder ball 222 is in contact with the circuit board pad 221 as much as possible to ensure the stability of the connection of the solder ball 222 on the circuit board 201.
  • the steel mesh printing process is selected in the present application, that is, the printing direction of the steel mesh 90 is consistent with the arrangement direction of the circuit board pad 221, which can reduce the occurrence of tin-linking/tin-short phenomenon.
  • the circuit board 201 is provided with an ink structure 231, and the ink structure 231 is respectively provided on both sides close to the circuit board through hole 213 and away from the circuit board through hole 213, wherein the ink is protrudingly provided on the circuit board pad 221 and forms a groove, and the circuit board pad 221 is at least partially accommodated in the groove.
  • the chip 301 is fixed on the back of the circuit board 201, and in order to accurately identify the center of the circuit board 201, so that the chip 301 is accurately installed on the circuit board 201, in another feasible embodiment, a corresponding ink layer is also provided on the back 212 of the circuit board, so that the center of the circuit board 201 can be identified, so that the center of the chip 301 installed on the circuit board 201 is consistent with the center of the circuit board 201.
  • the opening of the steel mesh 90 can be designed with a diameter of 70 ⁇ m and a thickness of 30 ⁇ m.
  • the corresponding design can be made according to the size of the actual product, as long as it is ensured that there is no phenomenon such as bridging tin/insufficient tin.
  • the design of the steel mesh 90 needs to meet certain requirements.
  • the pores of the steel mesh 90 can be a rectangular parallelepiped structure. The specific size parameters of the steel mesh 90 can be determined according to the actual product structure, and no corresponding description is given here.
  • the main material of the circuit board pad 221 is gold
  • the main material of the solder ball 222 implanted on the circuit board is tin. Since tin and gold are two materials with different characteristics, the two materials will cause their performance to be unstable as the external environment changes. For example, the solder ball 222 is easily oxidized when exposed to the air for a long time. In order to improve this situation, in the present application, a flux is added to the solder paste so that the solder ball 222 and the circuit board pad 221 can be better melted. Among them, the main component of the flux is rosin, which prevents the solder ball 222 from being oxidized when the tin powder is melted into the solder ball.
  • the flux is directly added to the solder paste, and the solder paste is melted into the solder ball 222 using a reflow soldering process. It is worth mentioning that the glue also contains flux, and the glue is applied to the circuit board pad 221 and covers the solder ball 222, so that the solder ball 222 can also be prevented from being oxidized.
  • the circuit board 201 needs to be heated, and the material of the circuit board 201 itself will deform due to the change in temperature, resulting in inaccurate center positioning of the circuit board 201 during the subsequent assembly of the circuit board 201 and the chip 301, causing deviation in the position where the chip 301 is installed on the circuit board 201, and the circuit board pad 221 and the chip pad 331 cannot be aligned one by one, resulting in unstable conduction between the circuit board 201 and the chip 301.
  • Increasing the amount of copper used in the circuit board 201 can reduce the deformation of the circuit board 201 during the conduction process due to the relatively stable characteristics of metal copper and its expansion and contraction under the influence of temperature, so as to improve the accuracy of the installation of the chip 301 on the circuit board 201.
  • increasing the copper content of the circuit board 201 can also reduce the deformation of the circuit board through hole 213.
  • the tin ball 222 is mainly set on the circuit board pad 221 by using the steel mesh printing process.
  • the gap between the circuit board pads 221 in this solution is less than 40 ⁇ m, so the conventional printing process will cause problems such as bridging.
  • the tin ball 222 is set on the circuit board pad 221 by the steel mesh printing process.
  • the specific size of the steel mesh 90 (the specific size of the steel mesh 90 can be referred to above The description in the text) also requires that a solder resist be provided between the pads 221 of the circuit board, wherein the width of the solder resist is greater than or equal to the width of the gap between two adjacent pads on the circuit board.
  • the solder resist provided between the pads 221 of the circuit board is incompatible with the solder paste itself, and the solder resist between the pads 221 of the circuit board can be eliminated by subsequent heating or other special processes, thereby avoiding problems such as bridging of the solder between the pads 221 of the circuit board.
  • the above scheme can effectively reduce the area of the bonding area between the chip and the circuit board, and improve the bonding conduction accuracy, so as to meet the miniaturization requirements of the package component 10.
  • the coverage area of the solder ball 222 accounts for more than 80% of the area of the circuit board pad 221, so as to increase the contact area between the solder ball 222 and the circuit board pad 221, and reduce the possibility of the solder ball 222 falling off the circuit board pad 221. It can be understood that the amount of tin set on the circuit board pad 221 and the transfer rate of the solder paste are limited by the size of the steel mesh 90. Based on this problem, the size of the circuit board pad 221 should also be restricted accordingly.
  • the maximum length of the circuit board pad 221 is 75 ⁇ m, and the preferred diameter of the solder ball 222 is greater than or equal to 60 ⁇ m, so as to meet the melting requirements of the solder ball 222 and the circuit board pad 221.
  • the solder ball 222 is set on the circuit board pad 221, and the gold ball 332 is set on the chip pad 331.
  • the gold ball 332 on the chip 301 is melted with the solder ball 222 on the circuit board 201, so as to conduct the circuit between the circuit board 201 and the chip 301.
  • the present application also provides a packaging component 10 structure after the chip 301 is connected to the circuit board 201, as shown in Figures 3 and 4, wherein the packaging component 10 further includes a molding part 501, a color filter 601 and a plurality of electronic components 401.
  • the packaging component 10 further includes a molding part 501, a color filter 601 and a plurality of electronic components 401.
  • a corresponding molding part 501 is arranged on the front side 211 of the circuit board and the back side 212 of the circuit board to enhance the strength of the circuit board 201.
  • the electronic components 401 and the like can be arranged on the front side 211 of the circuit board and/or the back side 212 of the circuit board, and the electronic components 401 can be covered inside the molding part 501.
  • the color filter 601 is arranged directly above the chip 301, wherein the color filter 601 covers the chip effective area 321 to filter out stray light.
  • the molding part 501 can form a color filter mounting position 531, and the color filter mounting position 531 is arranged on the upper end surface of the molding part 501, wherein when the color filter 601 is arranged on the color filter mounting position 531, the color filter 601 covers the chip effective area 321.
  • the circuit board 201 has a through hole 213 in the middle
  • the chip 301 is arranged on the circuit board 201 and the effective area 321 of the chip 301 corresponds to the circuit board through hole 213, wherein the circuit board pad 221 is arranged on the back side 212 of the circuit board, and the circuit board pad 221 is arranged around the circuit board through hole 213.
  • the chip pad 331 is arranged on the back side 212 of the circuit board.
  • the chip non-active area 322 is located on the front side 311 of the chip.
  • the chip pad 331 corresponds to the circuit board pad 221 one by one, so that the chip 301 and the circuit board 201 are connected, wherein the specific connection method between the chip 301 and the circuit board 201 has been described in detail in the previous text and will not be repeated here.
  • glue 232 is set in the bonding area between the circuit board 201 and the chip 301 to prevent the chip 301 from falling off the circuit board 201.
  • the part of the back side 212 of the circuit board formed by the molding process can be called a circuit board back side molding part 512, and the circuit board back side molding part 512 is arranged around the circuit board through hole 213, and the circuit board back side molding part 512 has a certain size limit.
  • the bottom surface of the circuit board back side molding part 512 can be arranged to be flush with the chip back side 312 to form a corresponding protective effect on the chip 301.
  • first mounting area 214 between the inner edge of the circuit board back molding 512 and the edge of the through hole fixed to the back 212 of the circuit board, and there is a first gap 215 between the inner edge of the circuit board back molding 512 and the outer edge of the chip 301 fixed to the back 212 of the circuit board, that is, the distance between the circuit board back molding 512 and the edge of the chip 301.
  • At least part of the first mounting area 214 corresponding to the front 211 of the circuit board is covered by the front molding 511, so as to better provide a flat mounting surface for bonding and conduction.
  • the first mounting area 214 is used for applying glue, and the first gap width is ⁇ 0.4mm.
  • the first gap 215 is mainly used for subsequently coating glue 232 on the bonding area between the circuit board 201 and the chip 301.
  • the chip 301 When the chip 301 is fixed on the circuit board 201 by a bonding method, it can better accommodate the overflowed glue 232, and also can reduce the collision or extrusion of the back molding part 512 and/or the circuit board 201 on the chip 301 during the subsequent baking or collision process of the packaging component 10.
  • the molded portion 501 disposed on the front side 211 of the circuit board may be referred to as the circuit board front side molded portion 511.
  • the circuit board front side molded portion 511 is disposed on the circuit board front side 211, wherein the electronic components 401 are arranged on the circuit board front side 211.
  • the electronic components 401 may be disposed around the periphery of the circuit board through hole 213.
  • the circuit board front side molded portion 511 may wrap the electronic components 401 inside thereof to provide corresponding protection for the electronic components 401, while improving the flatness of the packaging assembly 10.
  • the circuit board front side molded portion 511 may form a color filter mounting position 531 around the circuit board through hole 213.
  • the color filter mounting position 531 is disposed around the circuit board through hole 213.
  • the upper surface of the color filter mounting position 531 is lower than the upper surface of the front molding portion 511 of the circuit board, that is, a step portion is formed around the through hole 213 of the circuit board.
  • the step portion may include a first step portion 521 and a second step portion 522.
  • the upper surface of the first step portion 521 may be used to support components such as a motor or an optical lens, and the second step portion 522 may be used as a color filter mounting position 531, which is mainly used to mount the color filter 601.
  • the surface of the first step portion 521 is higher than the surface of the second step portion 522.
  • the first step portion 521 covers the electronic component 401, and the second step portion 522 may be used as the color filter mounting position 531.
  • the height of the second step portion 522 may be 0.1 mm.
  • the color filter 601 is mounted on the color filter mounting position 531, so that the color filter 601 can be placed directly above the chip 301.
  • the upper surface of the color filter 601 mounted on the color filter mounting position 531 is lower than the upper surface of the first step portion 521.
  • the upper surface of the color filter 601 mounted on the color filter mounting position 531 is flush with the upper surface of the first step portion 521.
  • the upper surface of the color filter 601 can be lower than the upper surface of the first step portion 521. This arrangement can reduce the height of the packaging component 10 and also provide a corresponding protective effect on the color filter.
  • the structure of the package assembly 10 formed in the present application is provided with a through hole 213 in the middle of the circuit board 201, the circuit board pad 221 is provided on the back 212 of the circuit board, the chip 301 is provided on the back 212 of the circuit board and is connected with the circuit board 201 to ensure the normal operation of the chip 301. Further, in order to prevent the chip 301 from falling off from the back 212 of the circuit board, glue 232 is provided in the bonding area between the circuit board 201 and the chip 301, so as to increase the stability of the connection between the circuit board 201 and the chip 301.
  • corresponding molding parts 501 are provided on the front 211 of the circuit board and the back 212 of the circuit board, respectively, and the molding part 501 covers the electronic component 401 therein, so as to form a protective effect on the electronic component 401.
  • the electronic component 401 is arranged on the front side 211 of the circuit board, and the front side molding part 511 of the circuit board covers the electronic component 401 inside.
  • the front side molding part 511 of the circuit board forms the color filter mounting position 531 around the through hole 213 of the circuit board, and the color filter 601 can be mounted on the color filter mounting position 531.
  • the orthographic projection of the color filter 601 coincides with the effective area 321 on the chip 301, so as to play a corresponding filtering role on the light reaching the chip 301.
  • the structure of the package assembly 10 formed by the above method can not only ensure the stability of the line conduction connection between the chip 301 and the circuit board 201, but also realize the miniaturization of the overall package assembly 10 structure.
  • the present application also provides an assembly method of the packaging component 10, as shown in FIG. 8A and FIG. 8B, comprising the steps of: a: A circuit board 201 is provided, and a plurality of circuit board pads 221 are provided on one side of the circuit board 201, and at least one solder ball 222 is implanted into the circuit board pad 221; b: a chip 301 is provided, and a plurality of chip pads 331 are provided on the chip 301, and at least one gold ball 332 is implanted into the chip pad 331; c: glue 232 is applied to the solder ball 222 of the circuit board pad 221; d: the chip pad 331 is aligned with the circuit board pad 221, and the solder ball 222 of the circuit board pad 221 and the gold ball 332 of the chip pad 331 are bonded and fixed to conduct the circuit board 201 and the chip 301.
  • step b and step c are not in order, that is, step b can be performed first and then step c, or step
  • solder balls 222 after a plurality of solder balls 222 are implanted into the circuit board pad 221, glue 232 is first applied to the solder balls 222, and then the gold balls 332 are implanted into the chip pad 331, and then the chip pad 331 is aligned with the circuit board pad 221, and the solder balls 222 and the gold balls 332 are bonded and fixed to conduct the circuit board 201 and the chip 301.
  • the gold balls 332 are first implanted into the chip pad 331, and then glue 232 is applied to the solder balls 222, and then the chip pad 331 is aligned with the circuit board pad 221, and the solder balls 222 and the gold balls 332 are bonded and fixed to conduct the circuit board 201 and the chip 301.
  • the gold ball 332 is implanted into the chip pad 331 and the glue 232 is applied to the solder ball 222 simultaneously, and/or the gold ball 332 is implanted into the chip pad 331 and the solder ball 222 is implanted into the circuit board pad 221 simultaneously, and then the chip pad 331 and the circuit board pad 221 are aligned, and the solder ball 222 and the gold ball 332 are bonded and fixed to connect the circuit board 201 and the chip 301, thereby shortening the working time and improving the assembly efficiency.
  • the glue 232 in step c contains flux
  • the glue 232 is applied to the circuit board pad 221 and covers the solder ball 222
  • the solder ball 222 is encapsulated in the glue 232
  • the flux in the glue 232 can prevent the solder ball 222 from being oxidized due to long-term exposure to the air, and is conducive to the melting of the solder ball 222 and the gold ball 332.
  • step c specifically includes the steps of: applying the glue 232 eccentrically to the pad 221 of the circuit board through the glue painting process, so that the solder ball 222 is located on the side of the center line of the glue painting width close to the center of the circuit board 201, and when the circuit board 201 and the chip 301 are assembled, the glue 232 is squeezed and overflows.
  • the center line of the glue painting of the glue 232 is closer to the outside of the circuit board 201 than the solder ball 222, combined with the ink 231 arranged near the side of the through hole 213 of the circuit board, the risk of the glue 232 overflowing and contaminating the effective area 321 of the chip 301 is reduced, and the glue 232 is caused to overflow to the outside of the chip 301.
  • the thickness of the glue 232 is greater than the height of the solder ball 222, so that the glue 232 can fill the solder ball 222 with the glue.
  • the ball 222 covers the inside thereof, so as to prevent the solder ball 222 from being oxidized, and is conducive to the solder ball 222 and the gold ball 332 being bonded to form a tin-gold compound 223 , thereby conducting the circuit board 201 and the chip 301 .
  • the step d specifically includes the steps of: fixing the solder ball 222 of the circuit board pad 221 and the gold ball 332 of the chip pad 331 by means of thermocompression bonding, so that at least one of the solder balls 222 and at least one of the gold balls 332 are melted to form a conductive bonding area, and at the same time, the glue 232 is filled in the gap of the conductive bonding area, so as to bond the circuit board 201 and the chip 301, increase the ability of the package component 10 to withstand external forces, reduce the risk of the chip 301 falling off, and improve the reliability of the package component 10.
  • the flux in the glue 232 helps the solder ball 222 and the gold ball 332 to melt, and prevents the solder ball 222 from oxidizing, so as to improve the conductivity of the circuit board 201 and the chip 301. It is worth mentioning that during the thermocompression bonding process, the glue 232 can reduce the fluidity of the tin, which helps to avoid the phenomenon of bridging.
  • the temperature of the hot-press bonding of the solder ball 222 and the gold ball 332 is controlled, and the bonding process is stepped up with the first bonding temperature and the second bonding temperature, wherein the first bonding temperature is used for a relatively short time, and the second bonding temperature heating time is more than 5 times the first bonding temperature heating time.
  • the first bonding temperature is 100-200°C
  • the duration is no more than 1s, so as to reduce the generation of bubbles in the glue 232, increase the bonding area of the glue 232 with the circuit board 201 and the chip 301, so that the glue 232 fills the conductive bonding area between the chip 301 and the circuit board 201 to increase the bonding force
  • the second bonding temperature is 200°C-300°C
  • the duration is 5s-30s, so as to strengthen the curing of the glue 232, so as to reliably bond the circuit board 201 and the chip 301, and improve the reliability of the package component 10.
  • step d specifically includes: forming a protrusion on the gold ball 332 of the chip pad 331, aligning it with the solder ball 222 of the circuit board pad 221, and extending the protrusion of the gold ball 332 into the solder ball 222 of the circuit board pad 221 to increase the contact area between the solder ball 222 and the gold ball 332, improve the reaction rate of the solder ball 222, so that the solder ball 222 and the gold ball 332 are reliably bonded, and the conductivity between the circuit board 201 and the chip 301 is improved.
  • step a specifically includes the steps of: depositing solder paste on the circuit board pad 221 by means of stencil printing, that is, making the printing direction of the stencil 90 consistent with the arrangement direction of the circuit board pad 221, thereby reducing the phenomenon of bridging tin and insufficient tin. Forming the solder paste into the solder ball 222 by means of reflow soldering and implanting it into the circuit board pad 221, thereby preventing the solder ball 222 from being oxidized and reducing the bending and deformation of the circuit board 201.
  • step a specifically includes: protrudingly setting an ink structure 231 on the circuit board 201
  • a groove is formed on the circuit board pad 221 so that the circuit board pad 221 is at least partially accommodated in the groove, and the solder ball 222 covers at least 80% of the area of the circuit board pad, so that the solder ball 222 is accommodated in the groove formed by the ink structure 231 on the circuit board 201.
  • the ink structure 231 is arranged on both sides of the circuit board pad 221 close to the circuit board through hole 213 and away from the circuit board through hole 213.
  • the steel mesh 90 is arranged on the circuit board 201, and the ink structure 231 is located between the steel mesh 90 and the circuit board 201, so that there is a gap between the steel mesh 90 and the circuit board 201.
  • the thickness of the ink structure 231 is less than 15 ⁇ m, so as to prevent the solder ball 222 from overflowing from the gap between the steel mesh 90 and the circuit board 201 to avoid solder joints.
  • the step a also includes step a1: integrally forming a circuit board front molding part 511 on the front of the circuit board 201, the circuit board front molding part 511 covers the electronic components 401 arranged on the front of the circuit board 211, which is conducive to improving the flatness of the package assembly 10, and integrally forming a circuit board back molding part 512 on the back of the circuit board 201, so that the circuit board back molding part 512 is arranged on the outside of the circuit board pad 221, so as to provide the middle position of the back of the circuit board 212 for installing the chip 301.
  • molding the circuit board front molding part 511 and the circuit board back molding part 512 separately is conducive to reducing the difficulty of molding, avoiding defects such as under-injection in the molding flow channel cavity, and improving the flatness of the package assembly 10.
  • the step a also includes step a2: a through hole 213 is formed on the circuit board 201, the through hole 213 runs through the central area of the circuit board 201, and the front molding part 511 of the circuit board is arranged in an annular manner around the through hole.
  • the size of the through hole 213 is larger than the size of the effective area 321 of the chip 301, so that the effective area 321 is completely exposed in the through hole 213, and the farther the inner edge of the through hole 213 is from the effective area 321 of the chip 301, the more conducive it is to reduce the risk of stray light and improve the imaging quality.
  • the through hole 213 is formed on the circuit board 201 by laser cutting, and ultrasonic cleaning is performed before bonding to reduce the cutting dust remaining in the through hole 213.
  • the assembly method of the packaging component 10 further includes step e: installing the color filter 601 on the color filter installation position 531 on the front molding portion 511 of the circuit board to filter out stray light and improve imaging quality.
  • the present application also provides an anti-shake camera module 1 assembled using the packaging component 10 structure, as shown in FIG11 , specifically, the anti-shake camera module 1 includes a packaging component 10, a chip driver, an optical lens 80, etc. Specifically, the chip driver is arranged on the packaging component 10, and the optical lens 80 is arranged just above the packaging component 10. The light from the outside reaches the package component 10 through the optical lens 80. Furthermore, the package component 10 structure in the present application, due to the combination of the front molding part 511 and the back molding part 512, can bond the chip 301 to the circuit board 201 through a molding process, effectively reducing the volume and weight of the package component 10. Specifically, the weight of the package component 10 in the present application can be controlled at about 0.266g.
  • the weight of the package component 10 can be reduced by about 13%.
  • the driving force provided by the chip driver remains unchanged, so that the camera module 1 using the package component 10 structure can significantly improve the adjustable stroke of the chip 301.
  • the package component 10 structure provided in this solution can not only meet the requirements of large chip movement stroke, but also has certain advantages in the miniaturization of the overall structure. It is a chip anti-shake direction that is currently commonly selected in the industry.
  • the camera module 1 may also include a lens motor 70, which is disposed on the optical lens 80, wherein the lens motor 70 is mainly used to drive the optical lens 80 to move, wherein the lens motor 70 can drive the optical lens 80 to move along the direction of the optical axis, i.e., the Z-axis direction, to achieve focusing during the shooting process of the camera module 1.
  • a lens motor 70 which is disposed on the optical lens 80, wherein the lens motor 70 is mainly used to drive the optical lens 80 to move, wherein the lens motor 70 can drive the optical lens 80 to move along the direction of the optical axis, i.e., the Z-axis direction, to achieve focusing during the shooting process of the camera module 1.
  • the chip driver can drive the chip 301 to move in a plane perpendicular to the optical axis, i.e., in the X/Y direction
  • the lens motor 70 can drive the optical lens 80 to move along the Z-axis direction (i.e., the direction of the optical axis), and the imaging quality of the camera module 1 can be effectively improved through the cooperation between the optical lens 80 and the chip 301.
  • the lens motor 70 can drive the optical lens 80 to move along the direction of the optical axis, that is, the Z-axis direction, and can also drive the optical lens 80 to move in the plane perpendicular to the optical axis, that is, the X/Y direction, wherein the chip driver can also drive the chip 301 to move along the X/Y direction, and the optical lens 80 and the chip 301 cooperate with each other to achieve anti-shake of a larger stroke of the camera module 1.
  • the lens motor 70 in the camera module 1 can select a shrapnel structure, and the optical lens 80 is arranged inside the lens motor 70 to drive the optical lens 80 to move.
  • the lens motor 70 may include structures such as a magnet 704, a coil 703, a shrapnel, a lens carrier 702 and a base 705, wherein the optical lens 80 is fixed on the lens carrier 702, the coil 703 structure is fixed on the lens carrier 702, the magnet 704 is arranged around the coil 703, and the shrapnel is arranged between the base 705 and the lens carrier 702.
  • the lens motor 70 also includes a motor housing 701, and the motor housing 701 covers the other components constituting the lens motor 70 therein to form a corresponding protective effect on the components of the lens motor 70.
  • the magnet 704 can be arranged inside the motor housing 701 and around the coil 703 on the lens carrier 702 to achieve better cooperation between the magnet 704 and the coil 703.
  • the packaging component 10 structure provided in the present application can be arranged on the lower surface of the base 705 of the lens motor 70, wherein the lower surface of the base 705 of the lens motor 70 is fixed to the upper surface of the packaging component 10 in the present application.
  • the upper surface of the packaging component 10 is located on the first step portion 521 of the front molding portion 511, and the front molding portion 511 adopts a molding process so that its upper surface maintains a certain flatness, which is conducive to fixing the first step portion 521 of the front molding portion 511 and the base 705 of the lens motor 70 together.
  • the lens motor 70 can be fixed to the packaging component 10 by gluing or other fixing methods, and the motor housing 701 covers the outside of the packaging component 10 to play a corresponding protective role on the packaging component 10.
  • the packaging component 10 structure adopted in this solution has the advantages of miniaturization and lightness. Setting it at the bottom of the lens motor 70 can significantly reduce the height of the camera module 1 and meet the requirements of miniaturization of the camera module 1.
  • the camera module 1 provided in the present application and provided with the packaging component 10 structure has the optical axis of the optical lens 80 provided on the lens motor 70 consistent with the center of the chip 301 on the packaging component 10 structure, so that the chip 301 can receive the light entering the optical lens 80.
  • the lens motor 70 can drive the optical lens 80 to perform position correction, so that as much light as possible passing through the optical lens 80 reaches the chip 301 of the packaging component 10.
  • the packaging component 10 structure provided in the present solution the size of the chip 301 can be increased to about 1/1.7 inches.

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Abstract

本发明公开了一种封装组件及其组装方法和摄像模组。封装组件的组装方法包括步骤：a：提供一线路板，线路板一侧表面设有多个线路板焊盘，将至少一锡球植入线路板焊盘；b：提供一芯片，芯片上设有多个芯片焊盘，将至少一金球植入芯片焊盘；c：将胶水涂覆至线路板焊盘的锡球上；d：将芯片焊盘和线路板焊盘相对应，键合固定线路板焊盘的锡球与芯片焊盘的金球，以导通线路板和芯片。通过在金球和锡球形成的熔融区域填充胶水，使得此封装组件具有导通性良好、总体质量轻以及尺寸小等优势，可将此封装组件应用于芯片防抖等摄像模组结构中，可有效的提升芯片防抖调整的精度。

Description

一种封装组件及其组装方法和摄像模组 技术领域
本申请涉及摄像模组技术领域，更进一步，涉及封装组件及其组装方法以及由封装组件组装而成的摄像模组。
背景技术
摄像模组是智能电子设备不可或缺的部件之一，举例但不限于智能手机、相机、电脑设备、可穿戴设备等。而随着各种智能设备的不断发展与普及，对摄像模组的要求也越来越高。
近些年，智能电子设备产生突飞猛进的发展，日益趋向轻薄化，而摄像模组要适应其发展，也越来越要求多功能化、轻薄化、小型化，以使得电子设备可以做的越来越薄，且满足设备对于摄像模组的成像要求。因此摄像模组生产厂商致力于设计、生产制造满足这些要求的摄像模组。
以智能手机为例，机体越来越轻薄化，所以要求摄像模组也要求逐步轻薄化。而摄像模组主要由光学镜头与芯片封装组件组合而成，光学镜头的高度目前难以再优化，故摄像模组的轻薄化主要取决于芯片封装组件的尺寸。而目前为了提升摄像模组的成像质量，芯片的成像表面的尺寸快速增加，但同时需迎合智能设备轻薄化的趋势，即使芯片尺寸增加，整体摄像模组的高度尺寸仍然受限，进一步，如何在芯片尺寸增加的情况下，降低芯片封装组件的高度和尺寸，是目前需要解决的重要问题。
摄像模组是一种光学电子器件，其芯片封装组件不仅需要考虑芯片线路导通的稳定性，还需要保证其结构的稳定性，将芯片与线路板结构导通后，也需要保证芯片和线路板连接的稳定性。芯片和线路板的封装组件在生产制造的过程中，需要经过多次可靠性试验，而芯片和线路板之间的封装组件结构不稳定，将会导致芯片在可靠性试验的过程中从线路板上脱落，从而破坏其封装组件结构的稳定性，如何在结构上保证芯片和线路板之间连接的稳定性，也是目前需要考虑的问题之一。
综上所述，在提供一种芯片和线路板封装结构可实现其封装组件结构的小型化时，同 时还需要考虑封装组件结构的稳定性和芯片导通问题，需要将电学、光学和结构等综合起来考虑，而现有技术中显然没有将这些因素结合考虑。
发明内容
针对上述问题，本申请提供一种芯片和线路板的封装组件结构，在实现封装组件整体结构小型化的同时，可以有效的解决上述的部分和/或大部分问题。
本申请的一个目的在于提供一种封装组件及其组装方法和摄像模组，其结构简单，得以保证整体封装组件小型化的同时，实现将其组装在摄像模组中，可实现摄像模组结构的轻薄化。
本发明的另一个目的在于提供一种封装组件及其组装方法和摄像模组，其通过将该芯片焊盘上固定的金球与该线路板焊盘上锡球相键合固定，在该芯片与该线路板之间形成一导通键合区，从而将该线路板与该感光芯片导通。
本申请的另一个目的在于提供一种封装组件及其组装方法和摄像模组，其通过在线路板背面设置线路板焊盘，在该线路板焊盘上利用钢网印刷工艺设置锡球，使得该锡球可固定在该线路板焊盘上，以保证与芯片的稳定导通。
本申请的另一个目的在于提供一种封装组件及其组装方法和摄像模组，其通过在该线路板焊盘上涂覆胶水，使得该胶水覆盖该锡球，以避免锡球氧化，有利于锡球与金球熔融。
本申请的另一个目的在于提供一种封装组件及其组装方法和摄像模组，其通过在芯片的正面设置芯片焊盘，在该芯片焊盘上设置金球，使得该金球与该芯片焊盘导通，可进一步延长该芯片的导通线路，以便于与该线路板导通。
本申请的另一个目的在于提供一种封装组件及其组装方法和摄像模组，其通过在该线路板与该芯片形成的导通键合区内部的空隙处填充胶水，使得该芯片与该线路板之间的连接更为稳固，避免该芯片从该线路板上脱落，以提升该封装组件的可靠性。
本申请的另一个目的在于提供一种封装组件及其组装方法和摄像模组，其通过在线路板上开设贯穿的通孔，该芯片被设置于该线路板并且该芯片的有效区对应该线路板通孔，该芯 片的有效区表面低于该线路板的正面，可以有效的降低该封装组件的高度。
本申请的另一个目的在于提供一种封装组件及其组装方法和摄像模组，其通过将该芯片固定在该线路板上，主要是将该芯片固定在该线路板的背面，使得该芯片的有效区完全暴露在该线路板的通孔中，以保证该芯片可接收到外部的大部分光线。
本申请的另一个目的在于提供一种封装组件及其组装方法和摄像模组，其通过在该线路板上设置电子元器件，在利用模塑工艺将该电子元器件固定在线路板上，同时将该电子元器件模塑在其内部，可有效防止电子元器件的脱落。
本申请的另一个目的在于提供一种封装组件及其组装方法和摄像模组，其通过在该线路板上利用模塑工艺形成一模塑部，该模塑部在覆盖该电子元器件的同时，可在其上表面形成一滤色片安装位，可保证滤色片安装的精度。
本申请的另一个目的在于提供一种封装组件及其组装方法和摄像模组，其还可包括形成在线路板背面的一背面模塑部，该背面模塑部与该芯片之间存在一间隙，同时该背面模塑部可进一步将强该封装组件的结构强度。
本申请的另一个目的在于提供一种封装组件及其组装方法和摄像模组，其通过将该封装组件设置在一驱动组件上，形成一芯片防抖结构，将该芯片防抖结构与光学镜头相组合，可得到一具有大行程芯片防抖的摄像模组结构。
为达到以上目的，本发明采用的技术方案为：
一种封装组件，包括一线路板、一芯片，所述线路板上具有一贯穿的通孔，所述芯片被设置对应所述线路板通孔：
所述线路板上具有多个线路板焊盘，至少一锡球被设置于各个所述线路板焊盘，所述芯片上具有多个芯片焊盘，至少一金球被设置于所述芯片焊盘，所述芯片焊盘与所述线路板焊盘对应，同时至少一所述金球与至少一所述锡球相熔融以形成一导通键合区，以导通所述线路板与所述芯片；
多个所述金球与所述锡球相熔融的导通键合区之间存在间隙，所述间隙填充有胶水。
在一种具体的实施例中，通过热压键合的方式，使得所述金球与所述锡球固定。
在一中具体的实施例中，所述胶水含有助焊剂并覆盖所述锡球，以减缓锡球氧化。
在一中具体的实施例中，所述胶水连接所述线路板和芯片并完整填充在多个所述金球与所述锡球相熔融的导通键合区之间的间隙。
在一种具体的实施例中，所述胶水设置于所述线路板通孔周围并覆盖所述线路板焊盘，其中，所述胶水具有一画胶宽度，所述锡球设置于所述画胶宽度中线的靠近线路板通孔一侧，以使得所述胶水可将所述锡球覆盖在其内部。
在一种具体的实施例中，所述胶水厚度大于所述锡球高度，所述胶水厚度大于等于20μm。
在一种具体的实施例中，所述线路板上设置有油墨结构，所述油墨分别设置于靠近所述线路板通孔远离所述线路板通孔的两侧，其中，所述油墨突出设置于所述线路板焊盘并形成一凹槽，所述线路板焊盘至少部分被容纳在所述凹槽内。
在一种具体的实施例中，所述锡球被设置在所述线路板焊盘，所述锡球至少覆盖所述线路板焊盘80％的面积，以使得所述锡球被容纳在所述油墨结构形成的凹槽内。
在一种具体的实施例中，所述芯片焊盘上的所述金球具有一突出部，其中，所述突出部延伸入所述线路板焊盘上的所述锡球内部，以提升所述锡球与所述金球的接触面积。
在一种具体的实施例中，所述线路板焊盘与所述芯片焊盘对应设置，其中，至少部分相邻的线路板焊盘中心距离小于150μm。
在一种具体的实施例中，所述封装体还具有一模塑部，所述模塑部被一体成型于所述线路板上，其中，所述模塑部包括一正面模塑部和一背面模塑部形成于所述线路板的正面和背面。
在一种具体的实施例中，所述背面模塑部被设置在所述线路板的背面，所述背面模塑部可用于加强所述线路板的强度，其中，所述背面模塑部的下表面低于所述芯片的背面。
在一种具体的实施例中，所述正面模塑部环形所述线路板通孔设置，设置有所述线路板焊盘的线路板正面被所述正面模塑部所覆盖。
在一种具体的实施例中，还提供一种摄像模组，其特征在于，包括：
镜头马达；和
前面所述的封装组件，其中所述镜头马达被设置于所述封装组件的上表面，以使得外界光线可通过所述镜头马达到达所述封装组件内部。
一种封装组件的组装方法，其包括步骤：
a：提供一线路板，所述线路板一侧表面设有多个线路板焊盘，将至少一锡球植入所述线路板焊盘；
b：提供一芯片，所述芯片上设有多个芯片焊盘，将至少一金球植入所述芯片焊盘；
c：将胶水涂覆至所述线路板焊盘的锡球上；
d：将所述芯片焊盘和所述线路板焊盘相对应，键合固定所述线路板焊盘的锡球与所述芯片焊盘的金球，以导通所述线路板和所述芯片。。
在一种具体的实施例中，所述步骤c中的胶水含有助焊剂，所述胶水涂覆于所述线路板焊盘并覆盖所述锡球。
在一种具体的实施例中，所述步骤c具体包括步骤：通过画胶工艺将所述胶水涂覆于所述线路板焊盘，使得所述锡球位于所述画胶宽度中线的靠近所述线路板中心的一侧，以使得所述胶水将所述锡球覆盖在其内部。
在一种具体的实施例中，所述胶水厚度大于所述锡球高度。
在一种具体的实施例中，所述步骤d具体包括步骤：通过热压键合的方式固定所述线路板焊盘的锡球和所述芯片焊盘的金球，使得至少一所述锡球和至少一所述金球相熔融以形成一导通键合区，同时所述胶水填充于所述导通键合区的间隙中。
在一种具体的实施例中，控制所述锡球和所述金球热压键合的温度，以第一键合温度和第二键合温度对键合过程阶梯升温，其中第一键合温度采用相对较少时长，第二键合温度加热时长为第一键合温度加热时长的5倍以上，得以使所述胶水充满所述芯片与所述线路板之间的导通键合区中。
在一种具体的实施例中，所述步骤d具体包括：将所述芯片焊盘的金球形成一突出部，对准所述线路板焊盘的锡球并将所述金球的突出部延伸入所述线路板焊盘的锡球内部，以提升 所述锡球与所述金球的接触面积。
在一种具体的实施例中，所述步骤a具体包括步骤：通过钢网印刷的方式将锡膏沉积于所述线路板焊盘，通过回流焊的方式将锡膏形成所述锡球并植入所述线路板焊盘。
在一种具体的实施例中，所述步骤a具体包括：突出地设置油墨结构于所述线路板上并形成凹槽，使得所述线路板焊盘至少部分容纳于所述凹槽内，所述锡球至少覆盖所述线路板焊盘80％的面积，得以将所述锡球容纳于所述线路板上油墨结构形成的凹槽内。
在一种具体的实施例中，所述步骤a还包括步骤a1：将一线路板正面模塑部一体成型于所述线路板的正面，将一线路板背面模塑部一体成型于所述线路板的背面，使得所述线路板背面模塑部设置于所述线路板焊盘的外侧。
在一种具体的实施例中，所述步骤a还包括步骤a2：在所述线路板上开设通孔，所述通孔贯穿所述线路板中心区域，所述线路板正面模塑部环形地围绕所述通孔设置。
在一种具体的实施例中，其进一步包括步骤e：将所述滤色片安装于所述线路板正面模塑部上的滤色片安装位，得以滤除杂光。
在一种具体的实施例中，还提供一种摄像模组，其特征在于，包括：
镜头马达；和
前面所述的封装组件的组装方法制得的封装组件，其中所述镜头马达被设置于所述封装组件的上表面，以使得外界光线可通过所述镜头马达到达所述封装组件内部。
附图说明
通过结合附图对本申请实施例进行更详细的描述，本申请的上述以及其他目的、特征和优势将变得更加明显。附图用来提供对本申请实施例的进一步理解，并且构成说明书的一部分，与本申请实施例一起用于解释本申请，并不构成对本申请的限制。在附图中，相同的参考标号通常代表相同部件或步骤。
图1为本申请现有技术常见的封装组件结构示意图；
图2为本申请提供的封装组件结构的一种具体实施例示意图；
图3为本申请提供的封装组件结构的另一种具体实施例示意图；
图4为本申请提供的封装组件结构中线路板与芯片导通的一局部示意图；
图5为本申请提供的封装组件结构中线路板与该芯片导通的另一局部示意图；
图6为本申请中该线路板上利用该钢网印刷锡球工艺的结构示意图；
图7为本申请中线路板的背面结构示意图；
图8A为本申请中此封装组件组装过程的部分示意图；
图8B为本申请中此封装组件组装过程的部分示意图，其中，图8A和图8B示出了整个封装组件组装的完整步骤；
图9为本申请中线路板背面锡球和胶水的一局部示意图；
图10为本申请中线路板背面油墨结构的一局部示意图；
图11为本申请中利用此封装组件结构组装而成的摄像模组的结构示意图。
具体实施方式
下面，结合具体实施方式，对本发明做进一步描述，需要说明的是，在不相冲突的前提下，以下描述的各实施例之间或各技术特征之间可以任意组合形成新的实施例。
下面，结合具体实施方式，对本申请做进一步描述，需要说明的是，在不相冲突的前提下，以下描述的各实施例之间或各技术特征之间可以任意组合形成新的实施例。
在本申请的描述中，需要说明的是，对于方位词，如有术语“中心”、“横向”、“纵向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示方位和位置关系为基于附图所示的方位或位置关系，仅是为了便于叙述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定方位构造和操作，不能理解为限制本申请的具体保护范围。
需要说明的是，本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别 类似的对象，而不必用于描述特定的顺序或先后次序。
本申请的说明书和权利要求书中的术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
在本申请的描述中，还需要说明的是，除非另有明确的规定和限定，术语“设置”、“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以是接触连接或通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
感光芯片作为摄像模组中最重要的电子元器件可以将外界的光线信号转变成电信号，是摄像模组中不可或缺的元件之一。通常情况下，芯片被设置在线路板的上表面，利用WB(wire bonding)工艺将芯片和线路板之间进行导通，以保证芯片的正常工作。但是随着对摄像模组成像质量要求的提高，芯片尺寸也相应的增加，对应的设置芯片的线路板的尺寸也会增加。同时，芯片和线路板上下堆叠导致高度方向的尺寸较大，也不符合目前摄像模组结构发展轻薄化的趋势。
本申请提供一种芯片的封装组件10，为了提升摄像模组的成像质量，芯片的尺寸相应的增加，对应的与芯片连接的线路板的尺寸也需要增加，为了降低该芯片和该线路板封装后的尺寸，对该线路板和该芯片的结构也进行相应的改进。具体的，本申请中，该芯片尺寸大于/或等于1/1.7英寸，如图2至图3所示，该芯片301包括一有效区321和一非有效区322，其中，该有效区321位于该芯片301的中间位置，该非有效区322位于该芯片301的边缘位置。该线路板201的尺寸大于该芯片301的尺寸，进一步的，该线路板201的中间设置有相应的通孔213，该线路板通孔213的尺寸大于等于该芯片301的该有效区321的尺寸，即该芯片的有效区321暴露在该线路板201形成的该通孔213中，该芯片301的该非有效区322与该线路板201相连接。
具体的，该线路板201与该芯片301之间需要进行线路导通，将该线路板201与该芯片301接触的一端面定义为线路板背面212，将该线路板201远离该芯片301的一端面定义为线路板正面211。本申请中，该线路板通孔213贯穿该线路板正面211与该线路板背面212，该线路板焊盘221围绕该线路板通孔213设置在该线路板背面212。其中，该线路板焊盘221可设置在该通孔213的至少一个侧边上，或者根据导通的需要，该通孔213的四个侧边上都可设置该线路板焊盘221，此处不做具体的限制。进一步的，将该芯片301与该线路板201接触的一端面定义为芯片正面311，将该芯片301与该线路板201远离的一端面定义为芯片背面312，其中，该芯片焊盘331被设置在该芯片正面311，该芯片焊盘331被设置在该芯片的非有效区322。
当该芯片301设置在该线路板的通孔213中时，该芯片有效区321暴露在该线路板通孔213中。进一步的，在该线路板背面212与该芯片非有效区322相接触的部分，使得该线路板焊盘221与该芯片焊盘331相适配，即该线路板背面212上的该线路板焊盘221与该芯片正面311上的该芯片焊盘331为一一对应关系，使得该线路板201与该芯片301之间得以导通。该线路板焊盘221与该芯片焊盘331直接接触并不能保证两者之间可以稳定的导通，为了进一步的保证该芯片301与该线路板201之间导通的稳定性，还需要采用其他的方式来保证该芯片301和该线路板201之间稳定导通。
本申请还提供一种该芯片301与该线路板201之间的导通的方法，如图4和图5所示，在一种具体的实施例中，该芯片301设置在该线路板201的该通孔213中时，该线路板背面212的该线路板焊盘221与该芯片正面311的该芯片焊盘331相接触。为了保证该芯片301与该线路板201之间导电的效率，优先选择导电性良好的材料如铜、金等，在本申请中，优先利用金球332导通该芯片301和该线路板201。具体的，将该金球332植入到该芯片焊盘331上，使得该金球332的一端与该芯片301相接触，该金球332的另一端与该线路板焊盘221相接触，以该金球332作为该线路板201与该芯片301导通的中间介质，以使得该芯片301与该线路板201导通。
进一步的，该金球332虽然具有良好的导电性能，使得该芯片301与该线路板201导通，但是该线路板焊盘221一般设置为金属铜，而铜与金之间不具有熔融性，使得该芯片301 易从该线路板201上脱落。为了使得该芯片301与该线路板201之间良好的导通，且连接稳定。本申请中，提供一种可使得该芯片301与该线路板201稳定导通的方式。具体的使用一种SN-AU(锡-金)化合物进行导通，在该线路板焊盘221上设置锡球222，在该芯片焊盘331上植入该金球332，使得该线路板201上的锡球222与该芯片301上的金球332相接触，得以有效保证该线路板201与该芯片301之间的电路导通。
具体的，该芯片301上的该金球332与该线路板201上的该锡球222相熔融，在该金球332与该锡球222相接触的位置，形成该锡金化合物层223，该锡金化合物层223是在受热条件下金和锡形成的化合物，得以与该线路板焊盘221上的该锡球222与该芯片焊盘331上的该金球332相互粘合，以保证该芯片301和该线路板201连接的稳定性。在一种具体的实施例中，该线路板焊盘221上的该锡球222与该芯片焊盘331上的该金球332相熔融后，使得该芯片301与该线路板201相导通形成一导通键合区，该导通键合区内可形成多个该锡金化合物层223。该锡球222与该金球332相连接处形成一中间物质层，以辅助该锡球222与该金球332相熔融，避免该金球332与该锡球222由于化学性质不同难以融合，从而导致该芯片301从该线路板201上脱落。
更进一步的，为了使得该芯片301与该线路板201之间的连接更为稳定，需要进一步的提高该芯片301上该金球332与该线路板201上该锡球222的接触面积，该芯片焊盘331的材料一般为金，故在该芯片焊盘331上植入该金球332时，该金球332与该芯片焊盘331之间得以良好的熔融。具体的，该金球332具有一突出部，该突出部的方向朝向该线路板焊盘221的方向，其中，该芯片301上该金球332的突出部延伸到该线路板焊盘221的该锡球222内，以增大该锡球222与该金球332之间的接触面积。为了使得该线路板上该锡球222与该芯片上该金球332相融合，在两者接触的中间位置设置有相应的助焊剂，可选择松香作为助焊剂，其主要作用是当锡粉熔融成锡球时，得以防止锡球氧化的，使得该线路板焊盘221上的该锡球222与该芯片焊盘331上的该金球332更好的熔融，同时也保证该线路板201与该芯片301之间导电的稳定性。
在本申请中，如图4和图5所示，通过在芯片焊盘331上植入该金球332，使得其与设置在该线路板焊盘221上的该锡球222相熔融，但是该锡球222和该金球332接触的面积有 限，在后续的可靠性过程中，该芯片301容易从该线路板201上脱落，不满足可靠性的要求。为了进一步增强该线路板201与该芯片301之间连接的稳定性，在该线路板201与该芯片301连接处利用胶水232填充该线路板201上该锡球222和该芯片301上该金球332的间隙，该胶水232连接该线路板201和该芯片301，在部分可选实施例中，该胶水232完整填充在多个所述金球332与所述锡球222相熔融的导通键合区之间的间隙，该完整填充的范围是指胶水在该导通键合区的间隙的填充范围在80％以上。其中，该胶水232的高度大于该锡球222的高度，以使得该锡球222被覆盖在该胶水232内部，以防止该锡球222与外部空气接触，得以避免该锡球222被氧化。该胶水232中添加有助焊剂，以使得该锡球222与该金球332充分熔融，同时该线路板201和该芯片3012与胶水232充分接触，由于胶水232自身的粘性，得以增强该线路板201与该芯片301之间连接的稳定性。
在一种具体的示例中，如只利用该线路板201上的锡球222与该芯片上301的金球332相熔融，虽然可有效的导通该芯片301，但是通过仿真模型可测出该芯片301与该线路板201之间键合区可承受的推力大概为0.7kg，不满足可靠性的要求。而本申请中，通过在该芯片301与该线路板201的键合区增加胶水232，利用胶水232的粘接力增强该线路板201与该芯片301之间连接的稳定性，可使得该芯片301与该线路板201之间键合区可承受的推力增加到2.7kg，满足摄像模组封装组件10设计的可靠性要求。
进一步的，在该芯片301与该线路板201键合的区域设置胶水232，该胶水232的具体型号可以根据实际设计进行选择，此处不做相应的限制，本申请中的胶水232设置方式，可采用画胶工艺。该胶水232设置于该线路板通孔213周围并覆盖该线路板焊盘221，其中，该胶水232具有一画胶宽度，该锡球222设置于该画胶宽度中线的靠近该线路板通孔213一侧，以使得该胶水232可将该锡球222覆盖在其内部。具体的该画胶宽度是指该胶水232涂覆于该线路板201时的宽度区域，一般是指自该线路板通孔213向线路板外边缘延伸方向上的胶水宽度。具体的，由于该线路板201和该芯片301连接处的空间位置有限，本申请中选择的画胶的针头直径为0.01mm，画胶的宽度小于等于20μm，同时在胶水232固定的过程中，如果对温度不进行相应的控制，将会使得胶水232在温度骤升过程中困气，导致该芯片301与该线路板201之间的粘接面积不足。故还需要对温度进行控制即满足键合阶梯升温，控制所述锡球和所 述金球热压键合的温度，以第一键合温度和第二键合温度对键合过程阶梯升温，其中该第一键合温度为相对较低温度，温度范围在100℃-200℃之间，加热时长相对较少，以使得胶水232减少气泡，增加该胶水232与该线路板201和该芯片301之间的结合面积，从而增加结合力，该第二键合温度范围在200℃-300℃之间，加热时长为第一键合温度加热时长的5倍以上，得以使所述胶水充满所述芯片与所述线路板之间的导通键合区中，以使得胶水232可完全覆盖该芯片与该线路板之间的键合区。
具体的，在该芯片301与该线路板201上，其本身各自存在焊盘，尤其是芯片焊盘331，其尺寸较小(一般肉眼看不清楚，借助相应的仪器可看出)，在芯片焊盘331上植入该金球332，需要采用一些特殊的工艺，如激光值球、拼版激光值球、钢网印刷+回流焊或者钢网印刷等。进一步的，在本申请中，可采用该钢网印刷的工艺将该金球332植入到该芯片焊盘331上，使得该芯片301与该线路板201进行导通，以保证该芯片301的正常工作。
进一步的，该线路板焊盘221上也需要设置相应的锡球222，该芯片上的该金球332与该线路板201上的该锡球222相熔融，使得该线路板201与该芯片301导通，由于该线路板焊盘221的尺寸也较小，故在该线路板201上植入该锡球222也需要采用特殊的工艺。具体的，在本申请中，需要在该线路板焊盘221上设置相应的锡球222，且该锡球222与该线路板焊盘221尽可能多的接触，以保证该锡球222在该线路板201上连接的稳定性。优选的，为了使得该锡球222在该线路板焊盘221上接触良好，本申请中选择使用该钢网印刷工艺，即使得该钢网90的印刷方向与该线路板焊盘221排列的方向一致，可减少出现连锡/少锡现象。
具体的，该线路板201上设置有油墨结构231，该油墨结构231分别设置于靠近该线路板通孔213和远离该线路板通孔213的两侧，其中，该油墨突出设置于该线路板焊盘221并形成一凹槽，该线路板焊盘221至少部分被容纳在该凹槽内。进一步的，在本方案中，该芯片301被固定在该线路板201的背面，为了准确的识别该线路板201的中心，使得该芯片301准确安装在该线路板201上，在另一种可行的实施例中，在该线路板背面212上也设置相应的油墨层，得以识别该线路板201的中心，以使得安装在该线路板201上的该芯片301的中心与该线路板201的中心保持一致。
具体的，为了与本申请中的该线路板201的尺寸相匹配，如图6所示，该钢网90开孔可按70μm直径，30μm厚度设计，在其他方案中，可根据实际产品的尺寸进行相应的设计，只要保证不出现连锡/少锡等现象即可。其中，为了避免锡膏与该钢网90表面的粘结力对该锡球222与该线路板201连接形成阻力作用，影响锡膏的转移量，该钢网90的设计需要满足一定的要求，如在本申请中，该钢网90孔隙可以为长方体结构，具体的该钢网90尺寸参数，可根据实际的产品结构确定，此处不做相应的说明。
在本申请中，该线路板焊盘221的主要材料为金，该线路板上植入的锡球222其主要材料为锡，由于锡和金为特性不同的两种材料，这两种材料会随着外界环境的变化从而导致其性能不稳定，如该锡球222长时间暴露在空气中容易氧化。为了改善此种情况，本申请中在锡膏中加入助焊剂，使得该锡球222与该线路板焊盘221可更好的熔融，其中，助焊剂的主要成分是松香，作用是锡粉熔融成锡球时防止该锡球222被氧化，该助焊剂被直接添加在锡膏里内，该锡膏被融化成该锡球222时采用回流焊工艺。值得一提的是，胶水中也含有助焊剂，将该胶水涂覆于该线路板焊盘221，并覆盖该锡球222，也得以避免该锡球222氧化。
进一步的，如图7所示，在该线路板焊盘221和该芯片301导通的过程中，需要对该线路板201进行加热，而该线路板201本身构成的材料会由于温度的变化发生变形，导致在后续该线路板201与该芯片301组装的过程中，对该线路板201的中心定位不准确，使得该芯片301在该线路板201上安装的位置出现偏差，该线路板焊盘221与该芯片焊盘331无法一一对准，导致该线路板201与该芯片301之间的导通不稳定。在该线路板201中增加铜的使用量，由于金属铜的特性比较稳定，在温度的影响下其涨缩量也比较小，得以减小该线路板201在导通过程中产生的变形量，以提高该芯片301在该线路板201上安装的精度。同时，提高该线路板201的含铜量，也得以减少该线路板通孔213的变形量。
本申请中，如图6和图7所示，主要是利用钢网印刷工艺将该锡球222设置在该线路板焊盘221上，相比于常规的方案(各焊盘之间具有一阻焊胶，该阻焊胶的间隙大于150μm)，为了减小线路板201部分所占的尺寸，本方案中该线路板焊盘221之间的间隙小于40μm，故采用常规的印刷工艺将会出现连锡等问题。本方案中通过钢网印刷工艺将该锡球222设置在该线路板焊盘221上，除了对该钢网90的尺寸设计进行限制外(具体的该钢网90尺寸可参考上 文中的描述)，还需要在该线路板焊盘221之间设置阻焊胶，其中该阻焊胶的宽度大于等于该线路板上相邻的两个焊盘之间的间隙的宽度。进一步的，被设置在该线路板焊盘221之间的阻焊胶，其与锡膏本身不相容，后续通过加热或者其他特殊工艺，可消除该线路板焊盘221之间的阻焊胶，得以避免该线路板焊盘221之间出现连锡等问题。通过上述方案可以有效减少芯片与线路板键合区域的面积，提升键合导通精度，以满足该封装组件10小型化的要求。
在一种具体的示例中，该锡球222覆盖面积占该线路板焊盘221的面积大于80％，以增大该锡球222与该线路板焊盘221的接触面积，同时降低该锡球222从该线路板焊盘221脱落的可能性。可以理解的是，设置在该线路板焊盘221上的锡量以及锡膏的转移率受限于该钢网90的尺寸。基于此问题，对该线路板焊盘221的尺寸也要做相应的限制，在本方案中提供的该芯片301的尺寸下，该线路板焊盘221的长度最大为75μm，该锡球222的优选直径大于等于60μm，得以满足该锡球222与该线路板焊盘221熔融的要求。通过上述钢网印刷的工艺，将该锡球222设置在该线路板焊盘221上，该金球332被设置在该芯片焊盘331上，利用该芯片301上的该金球332与该线路板201上的该锡球222相熔融，从而将该线路板201与该芯片301进行线路导通。
本申请还提供一种该芯片301与该线路板201导通后的封装组件10结构，如图3和图4所示，其中，该封装组件10还包括一模塑部501、一滤色片601和多个电子元器件401，该线路板201与该芯片301电导通后，在该线路板正面211与该线路板背面212设置相应的模塑部501以增强该线路板201的强度。该电子元器件401等可以设置在该线路板正面211和/或该线路板背面212，该电子元器件401可被包覆在该模塑部501的内部，该滤色片601被设置在该芯片301的正上方，其中，该滤色片601遮盖该芯片有效区321，以滤除杂光。在一种具体的实施例中，该模塑部501可形成一滤色片安装位531，该滤色片安装位531设置在该模塑部501的上端面，其中，当该滤色片601被设置在该滤色片安装位531上时，该滤色片601覆盖该芯片有效区321。
进一步的，该线路板201的中间具有一贯穿的通孔213，该芯片301设置于该线路板201并且该芯片301的有效区321对应该线路板通孔213，其中，该线路板焊盘221被设置在该线路板背面212，该线路板焊盘221围绕该线路板通孔213设置。该芯片焊盘331设置在该 芯片非有效区322且位于该芯片正面311。将该芯片301设置在该线路板201背面时，该芯片焊盘331与该线路板焊盘221一一对应，从而将该芯片301与该线路板201之间进行导通，其中，该芯片301与该线路板201之间具体的导通方式，前文中已经做过详细的描述，此处不再赘述。在一种具体的实施例中，该芯片301与该线路板201导通后，为了保证整体结构的稳定性，在该线路板201与该芯片301的键合区设置胶水232，以防止该芯片301从该线路板201上脱落。
具体的，在该线路板背面212除芯片与该线路板键合区域外，线路板背面212的其他区域可利用模塑工艺，对该线路板背面212进行相应的包覆，以增强该线路板背面212的强度。其中，可将线路板背面212利用模塑工艺形成的部分称为线路板背面模塑部512，该线路板背面模塑部512围绕该线路板通孔213设置，该线路板背面模塑部512具有一定的尺寸限制。进一步的，该线路板背面模塑部512的底面可设置为与该芯片背面312齐平，以对该芯片301形成相应的保护作用。在一种具体的示例中，该线路板背面模塑部512的内侧边缘与固定在该线路板背面212的通孔边缘之间存在一第一安装区域214，该线路板背面模塑部512的内侧边缘与固定在该线路板背面212的该芯片301的外侧边缘之间存在一第一间隙215，即该线路板背面模塑部512与该芯片301边缘之间的距离。其中，至少部分该第一安装区域214的对应的该线路板正面211被正面模塑部511所覆盖，以便于更好的提供一平整安装表面以便于键合导通。同时，该第一安装区域214用于进行画胶，该第一间隙宽度≤0.4mm，该第一间隙215主要用于后续在该线路板201与该芯片301的键合区涂覆胶水232时，在采用键合方式使得该芯片301被固定在该线路板201时更好地容纳溢出的该胶水232，同时也可以减少后续封装组件10在烘烤或碰撞过程中该背面模塑部512和/或该线路板201对该芯片301产生碰撞或挤压。
本申请中，可将设置在该线路板正面211的该模塑部501称为线路板正面模塑部511，该线路板正面模塑部511设置在该线路板正面211，其中，该电子元器件401被排布在该线路板正面211，在一种具体的实施例中，该电子元器件401可围绕该线路板通孔213的周边设置。进一步的，该线路板正面模塑部511可将该电子元器件401包覆在其内部，以对该电子元器件401形成相应的保护作用，同时提高该封装组件10的平整度。该线路板正面模塑部511围绕该线路板通孔213可形成一滤色片安装位531，该滤色片安装位531围绕该线路板通孔213设 置，其中，该滤色片安装位531的上表面低于该线路板正面模塑部511的上表面，即在该线路板通孔213的周边形成一台阶部。
进一步的，该台阶部可包括第一台阶部521和第二台阶部522，该第一台阶部521的上表面可用于承靠马达或光学镜头等元器件，该第二台阶部522可作为滤色片安装位531，其主要用于安装该滤色片601。具体的，该第一台阶部521的表面高于该第二台阶部522的表面，该第一台阶部521包覆该电子元器件401，该第二台阶部522可作为该滤色片安装位531，该第二台阶部522的高度可以为0.1mm，将该滤色片601安装在该滤色片安装位531上，使得该滤色片601可置于该芯片301的正上方。其中，安装在该滤色片安装位531上的该滤色片601的上表面低于该第一台阶部521的上表面，在另一种实施例中，安装在该滤色片安装位531上的该滤色片601的上表面与该第一台阶部521的上表面齐平。优选的，在具体的实施例中，可使得该滤色片601的上表面低于该第一台阶部521的上表面，此种设置方式在降低该封装组件10高度的同时，还可以对该滤色片形成相应的保护作用。
本申请中所形成的封装组件10结构，如图2、图3所示，通过在该线路板201的中间设置一贯穿的通孔213，在该线路板背面212设置该线路板焊盘221，将该芯片301设置在该线路板背面212并与该线路板201进行导通，以保证该芯片301的正常工作。进一步的，为了防止该芯片301从该线路板背面212脱落，在该线路板201与该芯片301的键合区设置胶水232，得以增加该线路板201与该芯片301之间连接的稳定性。为了增强该线路板201与该芯片301导通后整体结构的强度，在该线路板正面211和该线路板背面212分别设置相应的模塑部501，该模塑部501将该电子元器件401包覆在其中，得以对该电子元器件401形成保护作用。其中，该电子元器件401设置在该线路板正面211，该线路板正面模塑部511将该电子元器件401包覆在其内部。该线路板正面模塑部511围绕该线路板通孔213形成该滤色片安装位531，可将该滤色片601安装在该滤色片安装位531上，此时该滤色片601的正投影与该芯片301上的有效区321重合，以对到达该芯片301上的光线起到相应的过滤作用。通过上述方法形成的该封装组件10结构，不仅得以保证该芯片301与该线路板201之间线路导通连接的稳定性，还得以实现整体封装组件10结构的小型化。
本申请还提供一种该封装组件10的组装方法，如图8A和图8B所示，包括步骤：a： 提供一线路板201，该线路板201一侧表面设有多个线路板焊盘221，将至少一锡球222植入该线路板焊盘221；b：提供一芯片301，该芯片301上设有多个芯片焊盘331，将至少一金球332植入该芯片焊盘331；c：将胶水232涂覆至该线路板焊盘221的锡球222上；d：将该芯片焊盘331和该线路板焊盘221相对应，键合固定该线路板焊盘221的锡球222与该芯片焊盘331的金球332，以导通该线路板201和该芯片301。其中，步骤b和步骤c不分先后，也就是说，可以先进行步骤b再进行步骤c，或先进性步骤c再进行步骤c，也可以步骤b和步骤c同时进行。
可以理解的是，在一些实施例中，将多个锡球222植入该线路板焊盘221后，先在该锡球222上涂覆胶水232，后将该金球332植入该芯片焊盘331，再将该芯片焊盘331和该线路板焊盘221相对应，键合固定该锡球222与该金球332，以导通该线路板201和该芯片301。在另一些实施例中，将多个锡球222植入该线路板焊盘221后，先将该金球332植入该芯片焊盘331，后在该锡球222上涂覆胶水232，再将该芯片焊盘331和该线路板焊盘221相对应，键合固定该锡球222与所金球332，以导通该线路板201和该芯片301。在另一些实施例中，将该金球332植入该芯片焊盘331与将胶水232涂覆于所锡球222同时进行，和/或将该金球332植入所芯片焊盘331与将该锡球222植入该线路板焊盘221同时进行，再将所芯片焊盘331和该线路板焊盘221相对应，键合固定该锡球222与该金球332，以导通该线路板201和该芯片301，得以缩短工时，提高组装效率。
特别地，在本申请实施例中，该步骤c中的胶水232含有助焊剂，该胶水232涂覆于该线路板焊盘221并覆盖该锡球222，该锡球222包覆于所胶水232中，该胶水232中的助焊剂得以避免该锡球222长时间暴露于空气中而氧化，且有利于该锡球222与该金球332相熔融。
进一步的，如图9所示，该步骤c具体包括步骤：通过画胶工艺将该胶水232偏心地涂覆于所线路板焊盘221，使得该锡球222位于该画胶宽度中线的靠近该线路板201中心的一侧，当该线路板201与该芯片301组装时该胶水232受挤压外溢，由于该胶水232的画胶中心线相对于锡球222更靠近该线路板201的外侧，结合设置于靠近该线路板通孔213侧的油墨231，降低该胶水232内溢导致污染该芯片301的有效区321的风险，促使该胶水232向芯片301外侧溢出。值得一提的是，该胶水232厚度大于该锡球222高度，以使该胶水232将该锡 球222覆盖在其内部，得以避免锡球222氧化，有利于该锡球222与该金球332键合形成锡金化合物223，导通该线路板201和该芯片301。
进一步的，该步骤d具体包括步骤：通过热压键合的方式固定该线路板焊盘221的锡球222和该芯片焊盘331的金球332，使得至少一该锡球222和至少一该金球332相熔融以形成一导通键合区，同时该胶水232填充于该导通键合区的间隙中，得以粘接该线路板201与该芯片301，增大该封装组件10承受外力的能力，减小该芯片301脱落的风险，提高该封装组件10的可靠性。可以理解的是，该胶水232中的助焊剂有助于该锡球222和该金球332相熔融，且得以避免该锡球222氧化，以提高该线路板201与该芯片301的导通性。值得一提的是，在热压键合的过程中，该胶水232得以减小锡的流动性，有助于避免出现连锡现象。
特别地，控制该锡球222和该金球332热压键合的温度，以第一键合温度和第二键合温度对键合过程阶梯升温，其中第一键合温度采用相对较少时长，第二键合温度加热时长为第一键合温度加热时长的5倍以上。具体的，第一键合温度为100-200℃，持续时间不大于1s，以减少该胶水232中气泡的产生，增大该胶水232与该线路板201和该芯片301的粘接面积，使得该胶水232充满该芯片301与该线路板201之间的导通键合区中增加结合力，第二键合温度为200℃-300℃，持续时间为5s-30s，得以加强胶水232固化，以可靠粘接该线路板201与该芯片301，提高封装组件10的可靠性。
进一步的，该步骤d具体包括：将该芯片焊盘331的金球332形成一突出部，对准该线路板焊盘221的锡球222，并将该金球332的突出部伸入该线路板焊盘221的锡球222内部，以增大该锡球222与该金球332的接触面积，提高该锡球222的反应率，使得该锡球222与该金球332可靠键合，提高该线路板201与该芯片301的导通性。
特别的，该步骤a具体包括步骤：通过钢网印刷的方式将锡膏沉积于该线路板焊盘221，即使得该钢网90的印刷方向与该线路板焊盘221的排列方向一致，得以减少连锡、少锡的现象。通过回流焊的方式将锡膏形成该锡球222并植入该线路板焊盘221，得以避免该锡球222氧化，同时得以减少线路板201的弯曲和变形。
具体的，如图10所示，该步骤a具体包括：突出地设置油墨结构231于该线路板201 上并形成凹槽，使得该线路板焊盘221至少部分容纳于该凹槽内，该锡球222至少覆盖该线路板焊盘80％的面积，得以使该锡球222容纳于该线路板201上油墨结构231形成的凹槽内。其中，该油墨结构231设置于线路板焊盘221靠近线路板通孔213和远离该线路板通孔213的两侧，可以理解的是，该钢网90设置于该线路板201上，该油墨结构231位于该钢网90与该线路板201之间，使得该钢网90与该线路板201之间存在间隙，该油墨结构231的厚度小于15μm，得以阻挡该锡球222的锡珠从该钢网90和该线路板201之间的间隙外溢，以避免连锡。
进一步的，该步骤a还包括步骤a1：将一线路板正面模塑部511一体成型于所线路板201的正面，该线路板正面模塑部511覆盖设置于该线路板正面211的电子元器件401，有利于提高该封装组件10的平整度，将一线路板背面模塑部512一体成型于该线路板201的背面，使得该线路板背面模塑部512设置于该线路板焊盘221的外侧，得以提供该线路板背面212的中间位置以安装该芯片301。值得一提的是，相较于同时一次成型该线路板正面模塑部511和该线路板背面模塑部512，将该线路板正面模塑部511与该线路板背面模塑部512分别进行模塑成型，有利于降低模塑的难度，避免模塑流道腔体内出现欠注等缺陷，得以提高该封装组件10的平整度。
该步骤a还包括步骤a2：在该线路板201上开设通孔213，该通孔213贯穿该线路板201的中心区域，该线路板正面模塑部511环形地围绕该通孔设置。可以理解的是，该通孔213的尺寸大于该芯片301的有效区321的尺寸，使得该有效区321完全暴露于该通孔213中，该通孔213内边距离该芯片301的有效区321的距离越远，越有利于降低杂光风险，得以提高成像质量。优选的，通过激光切割的方式在该线路板201上开设通孔213，并在键合前进行超声波清洗，得以减少该通孔213内别残留的切割粉尘。
进一步的，该封装组件10的组装方法还进一步包括步骤e：将该滤色601片安装于该线路板正面模塑部511上的滤色片安装位531，得以滤除杂光，提高成像质量。
本申请还提供一种利用该封装组件10结构组装而成的防抖摄像模组1，如图11所示，具体的，该防抖摄像模组1包括一封装组件10、一芯片驱动件、一光学镜头80等，具体的，该芯片驱动件被设置在该封装组件10上，该光学镜头80设置在该封装组件10的正上方，外 界的光线经由该光学镜头80到达该封装组件10。进一步的，本申请中封装组件10结构，由于采用正面模塑部511和背面模塑部512相结合的设置方式，得以将该芯片301与该线路板201通过模塑工艺进行粘接，有效降低该封装组件10的体积和重量。具体的，本申请中的封装组件10重量可控制在0.266g左右，相比于常规的COB(chip of board)封装方式，该封装组件10的重量可降低13％左右，在现有的摄像模组的尺寸下，该芯片驱动件提供的驱动力不变的情况下，得以使利用该封装组件10结构的该摄像模组1，其该芯片301可调整的行程显著提升。在现有的摄像模组发展小型化的趋势下，本方案中提供的封装组件10结构不仅可以满足芯片移动大行程的要求，还在整体结构的小型化上具有一定的优势，是目前行业内普遍可选的一个芯片防抖的方向。
更进一步的，如图11所示，该摄像模组1还可包括一镜头马达70，该镜头马达70设置在光学镜头80上，其中，该镜头马达70主要用于驱动该光学镜头80移动，其中，该镜头马达70可驱动该光学镜头80沿着光轴的方向，即Z轴方向移动，以实现该摄像模组1拍摄过程中的对焦。在一种具体的实施例中，可通过该芯片驱动件驱动该芯片301在垂直光轴的平面内，即X/Y方向移动，通过该镜头马达70驱动该光学镜头80沿着Z轴的方向移动(即光轴的方向)，通过该光学镜头80和该芯片301的相互配合，可以有效提升该摄像模组1的成像质量。在另一种具体的实施例中，该镜头马达70可驱动该光学镜头80沿着光轴的方向，即Z轴方向移动外，还可以驱动该光学镜头80在垂直光轴的平面内，即X/Y方向移动，其中，该芯片驱动件也可驱动该芯片301沿着X/Y方向移动，该光学镜头80与该芯片301相互配合可实现该摄像模组1更大行程的防抖。
具体的，该摄像模组1中的该镜头马达70可选择弹片式结构，将该光学镜头80设置在该镜头马达70内部，以驱动该光学镜头80移动。在一种具体的实施例中，该镜头马达70可包括磁铁704、线圈703、弹片、镜头载体702和基座705等结构，其中，该光学镜头80固定在该镜头载体702上，该镜头载体702上固定有该线圈703结构，该磁铁704环绕该线圈703设置，该弹片设置于该基座705与该镜头载体702之间。进一步的，该镜头马达70还包括一马达外壳701，该马达外壳701将组成该镜头马达70的其他元件包覆在其内部，以对该镜头马达70的部件形成相应的保护作用。为了更好地利用该镜头马达70的内部空间，该磁铁 704可被设置在该马达外壳701的内部，围绕该镜头载体702上的该线圈703设置，以使得该磁铁704与该线圈703之间更好的配合。
进一步的，如图11所示，本申请中提供的该封装组件10结构，可被设置在该镜头马达70的该基座705的下表面，其中，该镜头马达70的该基座705的下表面与本申请中该封装组件10的上表面固定。具体的，该封装组件10的上表面位于该正面模塑部511的第一台阶部521上，该正面模塑部511采用模塑工艺使得其上表面保持一定的平整度，有利于将该正面模塑部511的该第一台阶部521与该镜头马达70的该基座705固定在一起。如可采用胶水粘接或其他固定方式，使得该镜头马达70与该封装组件10相固定，该马达外壳701覆盖在该封装组件10的外部，以对该封装组件10起到相应的保护作用。本方案中采用的封装组件10结构，具有小型化、轻便等优势，将其设置在该镜头马达70的底部，可显著降低该摄像模组1的高度，满足该摄像模组1封装小型化的要求。
如图11所示，具体的，本申请中提供的设置有此封装组件10结构的该摄像模组1，其设置在该镜头马达70上的该光学镜头80的光轴与该封装组件10结构上的该芯片301的中心保持一致，以使得该芯片301得以接收进入该光学镜头80的光线。在该摄像模组1成像的过程中，根据预先设定的程序，该镜头马达70可驱动该光学镜头80进行位置矫正，以使得通过该光学镜头80的光线尽可能多的到达该封装组件10的该芯片301上。进一步的，利用本方案中提供的该封装组件10结构，该芯片301的尺寸可以增加到1/1.7英寸左右，利用上述提供的封装方式以及导通方式，在提升该摄像模组成像质量的同时，得以有效的保证其整体结构的小型化，迎合摄像模组发展小型化的趋势。
以上描述了本发明的基本原理、主要特征和本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是本发明的原理，在不脱离本发明精神和范围的前提下本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明的范围内。本发明要求的保护范围由所附的权利要求书及其等同物界定。

Claims (26)

  1. 一种封装组件，包括一线路板、一芯片，所述线路板上具有一贯穿的通孔，所述芯片被设置对应所述线路板通孔，其特征在于：
    所述线路板上具有多个线路板焊盘，至少一锡球被设置于各个所述线路板焊盘，所述芯片上具有多个芯片焊盘，至少一金球被设置于所述芯片焊盘，所述芯片焊盘与所述线路板焊盘对应，同时至少一所述金球与至少一所述锡球相熔融以形成一导通键合区，以导通所述线路板与所述芯片；
    多个所述金球与所述锡球相熔融的导通键合区之间存在间隙，所述间隙填充有胶水。
  2. 根据权利要求1所述的封装组件，其特征在于，所述胶水含有助焊剂并覆盖所述锡球。
  3. 根据权利要求2所述的封装组件，其特征在于，所述胶水连接所述线路板和芯片并完整填充在多个所述金球与所述锡球相熔融的导通键合区之间的间隙。
  4. 根据权利要求2所述的封装组件，其特征在于，所述胶水设置于所述线路板通孔周围并覆盖所述线路板焊盘，其中，所述胶水具有一画胶宽度，所述锡球设置于所述画胶宽度中线的靠近线路板通孔一侧，以使得所述胶水可将所述锡球覆盖在其内部。
  5. 根据权利要求4所述的封装组件，其特征在于，所述胶水厚度大于所述锡球高度，所述胶水厚度大于等于20μm。
  6. 根据权利要求1所述的封装组件，其特征在于，所述线路板上设置有油墨结构，所述油墨分别设置于靠近所述线路板通孔远离所述线路板通孔的两侧，其中，所述油墨突出设置于所述线路板焊盘并形成一凹槽，所述线路板焊盘至少部分被容纳在所述凹槽内。
  7. 根据权利要求6所述的封装组件，其特征在于，所述锡球被设置在所述线路板焊盘，所述锡球至少覆盖所述线路板焊盘80％的面积，以使得所述锡球被容纳在所述油墨结构形成的凹槽内。
  8. 根据权利要求1所述的封装组件，其特征在于，所述芯片焊盘上的所述金球具有一突出部，其中，所述突出部延伸入所述线路板焊盘上的所述锡球内部，以提升所述锡球与所述金 球的接触面积。
  9. 根据权利要求8所述的封装组件，其特征在于，所述线路板焊盘与所述芯片焊盘对应设置，其中，至少部分相邻的线路板焊盘中心距离小于150μm。
  10. 根据权利要求1所述的封装组件，其特征在于，所述封装体还具有一模塑部，所述模塑部被一体成型于所述线路板上，其中，所述模塑部包括一正面模塑部和一背面模塑部形成于所述线路板的正面和背面。
  11. 根据权利要求10所述的封装组件，其特征在于，所述背面模塑部被设置在所述线路板的背面，所述背面模塑部可用于加强所述线路板的强度，其中，所述背面模塑部的下表面低于所述芯片的背面。
  12. 根据权利要求11所述的封装组件，其特征在于，所述正面模塑部环形所述线路板通孔设置，设置有所述线路板焊盘的线路板正面被所述正面模塑部所覆盖。
  13. 一种摄像模组，其特征在于，包括：
    镜头马达；和
    根据权利要求1-12中任一所述的封装组件，其中所述镜头马达被设置于所述封装组件的上表面，以使得外界光线可通过所述镜头马达到达所述封装组件内部。
  14. 一种封装组件的组装方法，其特征在于，包括步骤：
    a：提供一线路板，所述线路板一侧表面设有多个线路板焊盘，将至少一锡球植入所述线路板焊盘；
    b：提供一芯片，所述芯片上设有多个芯片焊盘，将至少一金球植入所述芯片焊盘；
    c：将胶水涂覆至所述线路板焊盘的锡球上；
    d：将所述芯片焊盘和所述线路板焊盘相对应，键合固定所述线路板焊盘的锡球与所述芯片焊盘的金球，以导通所述线路板和所述芯片。
  15. 根据权利要求14所述的封装组件的组装方法，其特征在于，所述步骤c中的胶水含 有助焊剂，所述胶水涂覆于所述线路板焊盘并覆盖所述锡球。
  16. 根据权利要求14所述的封装组件的组装方法，其特征在于，所述步骤c具体包括步骤：通过画胶工艺将所述胶水涂覆于所述线路板焊盘，使得所述锡球位于所述画胶宽度中线的靠近所述线路板中心的一侧，以使得所述胶水将所述锡球覆盖在其内部。
  17. 根据权利要求16所述的封装组件的组装方法，其特征在于，所述胶水厚度大于所述锡球高度。
  18. 根据权利要求14所述的封装组件的组装方法，其特征在于，所述步骤d具体包括步骤：通过热压键合的方式固定所述线路板焊盘的锡球和所述芯片焊盘的金球，使得至少一所述锡球和至少一所述金球相熔融以形成一导通键合区，同时所述胶水填充于所述导通键合区的间隙中。
  19. 根据权利要求18所述的封装组件的组装方法，其特征在于，控制所述锡球和所述金球热压键合的温度，以第一键合温度和第二键合温度对键合过程阶梯升温，以使所述胶水充满所述芯片与所述线路板之间的导通键合区中。
  20. 根据权利要求18所述的封装组件的组装方法，其特征在于，所述步骤d具体包括：将所述芯片焊盘的金球形成一突出部，对准所述线路板焊盘的锡球并将所述金球的突出部延伸入所述线路板焊盘的锡球内部，以提升所述锡球与所述金球的接触面积。
  21. 根据权利要求14所述的封装组件的组装方法，其特征在于，所述步骤a具体包括步骤：通过钢网印刷的方式将锡膏沉积于所述线路板焊盘，通过回流焊的方式将锡膏形成所述锡球并植入所述线路板焊盘。
  22. 根据权利要求21所述的封装组件的组装方法，其特征在于，所述步骤a具体包括：突出地设置油墨结构于所述线路板上并形成凹槽，使得所述线路板焊盘至少部分容纳于所述凹槽内，所述锡球至少覆盖所述线路板焊盘80％的面积，得以将所述锡球容纳于所述线路板上油墨结构形成的凹槽内。
  23. 根据权利要求14～22中任一所述的封装组件的组装方法，其特征在于，所述步骤a 还包括步骤a1：将一线路板正面模塑部一体成型于所述线路板的正面，将一线路板背面模塑部一体成型于所述线路板的背面，使得所述线路板背面模塑部设置于所述线路板焊盘的外侧。
  24. 根据权利要求23所述的封装组件的组装方法，其特征在于，所述步骤a还包括步骤a2：在所述线路板上开设通孔，所述通孔贯穿所述线路板中心区域，所述线路板正面模塑部环形地围绕所述通孔设置。
  25. 根据权利要求24所述的封装组件的组装方法，其特征在于，其进一步包括步骤e：将滤色片安装于所述线路板正面模塑部上的滤色片安装位，得以滤除杂光。
  26. 一种摄像模组，其特征在于，包括：
    镜头马达；和
    根据权利要求14-25中任一所述的封装组件的组装方法制得的封装组件，其中所述镜头马达被设置于所述封装组件的上表面，以使得外界光线可通过所述镜头马达到达所述封装组件内部。
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