WO2024203810A1 - 伝熱部材及び電子装置 - Google Patents

伝熱部材及び電子装置 Download PDF

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Publication number
WO2024203810A1
WO2024203810A1 PCT/JP2024/011214 JP2024011214W WO2024203810A1 WO 2024203810 A1 WO2024203810 A1 WO 2024203810A1 JP 2024011214 W JP2024011214 W JP 2024011214W WO 2024203810 A1 WO2024203810 A1 WO 2024203810A1
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Prior art keywords
heat transfer
plate material
graphite
transfer member
graphite block
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PCT/JP2024/011214
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English (en)
French (fr)
Japanese (ja)
Inventor
隆志 宮本
士郎 祝
雅之 武
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Kyocera Corp
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Kyocera Corp
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Priority to JP2025510696A priority Critical patent/JPWO2024203810A1/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Definitions

  • This disclosure relates to a heat transfer member and an electronic device.
  • JP 2021-150358 A describes a technology that uses graphite as a heat transfer material.
  • the heat transfer member comprises: a graphite block having a first surface extending along a first direction, a second surface opposing the first surface, and a side surface located between the first surface and the second surface and extending along the second direction along which the first surface and the second surface oppose each other; A bonding material located on the first surface and the second surface; A first plate material fixed to the first surface via the bonding material; A second plate material fixed to the second surface via the bonding material; A protective layer covering the side surface,
  • the graphite block has a structure in which a plurality of graphenes are stacked in the first direction.
  • the electronic device comprises:
  • the heat transfer member includes a mounting portion on the first surface or the second surface, the mounting portion being an area where an electronic element is mounted; An electronic element mounted on the mounting portion; Equipped with.
  • FIG. 2 is a perspective view showing a heat transfer member according to the first embodiment of the present disclosure.
  • 1 is a perspective view showing a heat transfer member according to a first embodiment of the present disclosure, illustrating a configuration excluding a protective layer.
  • 1 is a perspective view showing a heat transfer member according to a first embodiment of the present disclosure, illustrating a configuration excluding a protective layer, a first plate member, and a second plate member.
  • 1B is a cross-sectional view taken along line AA in FIG. 1A.
  • FIG. 2 is a diagram illustrating the properties of a graphite block.
  • FIG. 2 is a cross-sectional view showing a first side of the graphite block.
  • FIG. 1 is a perspective view showing a heat transfer member according to a first embodiment of the present disclosure, illustrating a configuration excluding a protective layer.
  • 1 is a perspective view showing a heat transfer member according to a first embodiment of the present disclosure, illustrating a configuration excluding a protective
  • FIG. 4 is a cross-sectional view showing a second side of the graphite block.
  • FIG. 1 is a characteristic diagram illustrating the thermal expansion characteristics of a single graphite block as a sample.
  • FIG. 1 is a characteristic diagram illustrating the thermal expansion characteristics of oxygen-free copper as a sample.
  • FIG. 13 is a characteristic diagram illustrating the thermal expansion characteristics of a sample in which an oxygen-free copper plate is bonded to a graphite block.
  • FIG. 6B is a perspective view showing the sample of FIG. 6A.
  • FIG. 6C is a perspective view showing the sample of FIG. 6B.
  • FIG. 6D is a perspective view showing the sample of FIG. 6C.
  • 1A and 1B are diagrams illustrating an electronic device incorporating a heat transfer member.
  • FIG. 11A and 11B are diagrams illustrating another example of use of the heat transfer member.
  • FIG. 11 is a perspective view illustrating a heat transfer member according to a second embodiment of the present disclosure, showing a configuration excluding a protective layer.
  • FIG. 11 is a perspective view illustrating a heat transfer member according to a second embodiment of the present disclosure, showing a configuration excluding a protective layer, a first plate member, and a second plate member.
  • FIG. 2 is a cross-sectional view showing a portion where two graphite members are adjacent to each other.
  • FIG. 11 is a perspective view illustrating a heat transfer member according to a third embodiment of the present disclosure, showing a configuration excluding a protective layer.
  • FIG. 11 is a perspective view illustrating a heat transfer member according to a third embodiment of the present disclosure, showing a configuration excluding a protective layer.
  • FIG. 11 is a perspective view illustrating a heat transfer member according to a third embodiment of the present disclosure, showing a configuration excluding a protective layer, a first plate member, and a second plate member.
  • 1A to 1C are diagrams illustrating an example of a manufacturing method for a heat transfer member according to the present disclosure.
  • FIG. 1A to 1C are perspective views showing a heat transfer member according to a first embodiment of the present disclosure, in which Fig. 1A shows the heat transfer member, Fig. 1B shows a configuration excluding a protective layer, and Fig. 1C shows a configuration excluding the protective layer, the first plate material, and the second plate material.
  • Fig. 2 is a cross-sectional view taken along line A-A in Fig. 1A.
  • Fig. 3 is a diagram for explaining the properties of a graphite block.
  • the heat transfer member 100 has high thermal conductivity and is capable of quickly transferring heat received at the upper surface 101 to the lower surface 102.
  • the heat transfer member 100 may include a graphite block 110.
  • the graphite block 110 may have a first surface 111, a second surface 112 located on the opposite side of the first surface 111, and a side surface 113 located between the first surface 111 and the second surface 112.
  • the heat transfer member 100 may further include bonding materials 140 located on the first surface 111 and the second surface 112, a first plate material 120 fixed to the first surface 111 via the bonding material 140, a second plate material 130 fixed to the second surface 112 via the bonding material 140, and a protective layer 150 covering the side surface 113.
  • the graphite block 110 may have a structure in which a plurality of graphenes are stacked in the first direction A1.
  • the graphene may be a sheet-like substance in which a honeycomb structure formed by bonding carbon atoms spreads in a two-dimensional direction. Adjacent graphenes may be bonded to each other by intermolecular forces, which are van der Waals forces.
  • the surface of the graphite block 110 may have a surface where the graphene spreads in two dimensions and a surface where multiple graphene layers appear.
  • the surface where the graphene spreads in two dimensions is referred to as a "crystal surface”
  • the surface where the graphene layers appear is referred to as a "crystal layer surface.”
  • the "crystal surface” is represented by a honeycomb pattern
  • the “crystal layer surface” is represented by a striped pattern.
  • Graphite block 110 may have anisotropy in its brittleness. As an example of anisotropy in its brittleness, graphite block 110 may have a tendency to cleave along a plane in which graphene extends, i.e., a plane that intersects with first direction A1, as shown in FIG. 3. Cleavage means to break along a certain plane. FIG. 3 shows a state in which crack E1 has occurred due to cleavage.
  • the graphite block 110 may have a property in which the graphene located on the crystal plane is easily peeled off when stress is generated along the surface direction of the crystal plane. Furthermore, the graphite block 110 may have a property in which the edge portion E2 of the graphene (see Figures 4 and 5) is weak and easily breaks from the edge portion E2.
  • the graphite block 110 may be made of a specific material whose main component is pyrolytic graphite.
  • the main component may mean a volume ratio of 80% or more.
  • the pyrolytic graphite may be manufactured as follows. First, a resin material such as polyimide is carbonized and decomposed into hydrocarbon gas. Next, the decomposed hydrocarbon is vapor-deposited and laminated. After that, a pressurized annealing process is performed to manufacture the pyrolytic graphite.
  • the graphite block 110 may be of a single configuration.
  • the first plate material 120 and the second plate material 130 may be bonded to the first surface 111 and the second surface 112 of the graphite block 110, respectively.
  • the first surface 111 and the second surface 112 may be surfaces extending in the first direction A1.
  • the first plate material 120 and the second plate material 130 are bonded to the crystal layer surface. Therefore, the first plate material 120 and the second plate material 130 can reduce the application of a force to the graphite block 110 in a direction that causes it to cleave.
  • the graphene on the crystal plane is likely to peel off due to stress generated during bonding.
  • first plate material 120 and the second plate material 130 are bonded to the crystal plane, the graphene on the crystal plane is likely to peel off due to stress generated during bonding.
  • first plate material 120 and the second plate material 130 are bonded to the crystal plane, the graphene on the crystal plane is likely to peel off due to stress generated during bonding.
  • the first plate material 120 or the second plate material 130 will peel off together with the graphene on its surface.
  • the peeling of the graphene can be suppressed. Therefore, the toughness of the heat transfer member 100 can be improved.
  • FIG. 4 is a cross-sectional view showing a first side of the graphite block.
  • FIG. 5 is a cross-sectional view showing a second side of the graphite block.
  • FIG. 4 shows part C1 of FIG. 1A
  • FIG. 5 shows part C2 of FIG. 1A.
  • the side surface 113 of the graphite block 110 may be a surface extending in a direction intersecting the first direction A1.
  • the side surface 113 may include a first side surface 113a which is a crystal plane and a second side surface 113b which is a crystal layer plane.
  • the first side surface 113a which is a crystal plane may be a surface extending in two directions intersecting the first direction A1.
  • the two directions may be a second direction A2 and a third direction A3 which are perpendicular to the first direction A1 and perpendicular to each other.
  • the second side surface 113b which is a crystal layer plane may be a surface extending in the first direction A1 and the third direction A3.
  • the protective layer 150 may cover the side surface 113.
  • the first side surface 113a is a crystal plane where peeling of graphene is likely to occur, and edge portions E2 of the graphene that are likely to break may appear.
  • the second side surface 113b is where edge portions E2 of the graphene that are likely to break appear.
  • the graphite block 110 may be rectangular, with two faces located opposite each other being crystal faces, and the remaining four faces being crystal layer faces.
  • the first face 111 and the second face 112 to which the first plate material 120 and the second plate material 130 are joined may be the crystal layer face with the largest area among the four crystal layer faces, and the crystal layer face opposite to that face. This configuration can improve the stability of mounting the heat source to the heat transfer member 100.
  • a configuration may be adopted in which a plate material is positioned on two pairs of surfaces (i.e., four surfaces) of graphite block 110 via bonding material 140.
  • the remaining pair of surfaces i.e., two surfaces
  • the two pairs of surfaces on which the plate material is positioned via bonding material 140 may be crystal layer surfaces.
  • the pair of surfaces covered by protective layer 150 may be crystal surfaces.
  • the graphite block 110 may have a very high thermal conductivity in a direction along the crystal plane.
  • the thermal conductivity of the graphite block 110 in the second direction A2 and the third direction A3 may be 200 W/m ⁇ K or more, while the thermal conductivity in the first direction A1 may be a value lower than the thermal conductivity in the second direction A2 or the third direction A3, such as 7 W/m ⁇ K.
  • the thermal conductivity in the second direction A2 and the third direction A3 may be preferably 370 W/m ⁇ K or more, more preferably 450 W/m ⁇ K or more, and even more preferably 800 W/m ⁇ K or more.
  • the thermal conductivity of the graphite block 110 in the second direction A2 and the third direction A3 may be 1200 W/m ⁇ K or more, more specifically, about 1700 W/m ⁇ K.
  • the thermal conductivity of the first plate material 120 and the second plate material 130 may be highly isotropic compared to that of the graphite block 110. Furthermore, the thermal conductivity of the first plate material 120 and the second plate material 130 may be higher than the thermal conductivity of the graphite block 110 in the first direction A1. According to this configuration, when heat is applied to a part of the first plate material 120 from the outside of the heat transfer member 100, the heat is isotropically dispersed in the first plate material 120 and then conducted to the graphite block 110. Then, in the graphite block 110, the heat is quickly dispersed in the second direction A2 and the third direction A3, which have high thermal conductivity.
  • the heat is conducted to the second plate material 130 and is isotropically dispersed in the second plate material 130.
  • the heat can be dispersed over a wide range of the graphite block 110.
  • a wide area of the second plate 130 is thermally connected to the heat dissipation member, heat can be dissipated from a wide area of the second plate 130. Therefore, efficient heat transfer performance of the heat transfer member 100 can be achieved.
  • the thermal conductivity of the protective layer 150 may be highly isotropic compared to the graphite block 110.
  • the thermal conductivity of the protective layer 150 may be higher than the thermal conductivity of the graphite block 110 in the first direction A1. This configuration provides an effect of dispersing heat in the first direction A1 via the protective layer 150 at the second side surface 113b. Therefore, by adding this dispersion effect, a more efficient heat transfer performance of the heat transfer member 100 can be achieved.
  • the surface roughness of the first side surface 113a which is a crystal surface, may be smaller than the surface roughness of the first surface 111, which is a crystal layer surface.
  • the surface roughness of the first surface 111 may be 20 times or more, 10 times or more and less than 20 times, or 5 times or more and less than 10 times, of the surface roughness of the first side surface 113a.
  • the surface roughness means the arithmetic mean roughness Ra defined in JIS (Japanese Industrial Standards) _B_0601:2001.
  • the surface roughness can be measured after removing the protective layer 150 and the first plate material 120 from the heat transfer member 100.
  • the surface roughness of the second side surface 113b may be greater than the surface roughness of the first side surface 113a.
  • the surface roughness of the second side surface 113b may be 20 times or more, 10 times or more but less than 20 times, or 5 times or more but less than 10 times, that of the first side surface 113a.
  • the surface roughness refers to the arithmetic mean roughness Ra described above. The above surface roughness can be measured after removing the protective layer 150 from the heat transfer member 100.
  • the second side 113b includes relatively large irregularities due to the surface roughness.
  • the irregularities may be fine irregularities.
  • a part of the protective layer 150 is located within the recess F1 of the irregularities of the second side 113b. Therefore, an anchor effect is produced, and the adhesion of the protective layer 150 to the second side 113b can be improved. Therefore, peeling of the protective layer 150 from the graphite block 110 can be suppressed. Furthermore, by having the protective layer 150 located within the recess F1 of the irregularities, the thermal resistance between the protective layer 150 and the graphite block 110 can be reduced compared to a configuration in which a gap occurs in the recess F1.
  • the linear expansion coefficient of the graphite block 110 may be highly anisotropic in the first surface 111 and the second surface 112. Specifically, the linear expansion coefficient of the graphite block 110 may be 20 [10 ⁇ -6/K] or more in the first direction A1 and 0.050 [10 ⁇ -6/K] or less in the second direction A2 and the third direction A3. Furthermore, the linear expansion coefficient of the graphite block 110 may be 24 [10 ⁇ -6/K] or more in the first direction A1. Furthermore, the linear expansion coefficient of the graphite block 110 may be a value in the range of 27 [10 ⁇ -6/K] or less in the first direction A1.
  • the linear expansion coefficient of the graphite block 110 in the second direction A2 and the third direction A3 may be a negative value, specifically, may be -0.001 [10 ⁇ -6/K] or less.
  • the linear expansion coefficient of the graphite block 110 in the second direction A2 and the third direction A3 may be greater than or equal to -0.01 [10 ⁇ -6/K].
  • the linear expansion coefficient of the first plate material 120 may have a higher isotropy than that of the graphite block 110.
  • the linear expansion coefficient of the first plate material 120 may be smaller than that of the graphite block 110.
  • the linear expansion coefficient of the first plate material 120 may be larger than that of the graphite block 110.
  • the linear expansion coefficient of the first plate material 120 may be larger than that of the graphite block 110. The same applies to the second plate material 130.
  • the linear expansion coefficients of the first plate material 120 and the second plate material 130 may be, for example, 4.0 [10 ⁇ -6/K] or more and less than 20 [10 ⁇ -6/K], and may further be 6.0 [10 ⁇ -6/K] or more and less than 18 [10 ⁇ -6/K].
  • the first plate 120 and the second plate 130 may be made of a material having a linear expansion coefficient of 4.0 [10 ⁇ -6/K] or more and less than 20 [10 ⁇ -6/K], such as a metal material such as copper or stainless steel, or a ceramic material such as aluminum nitride, alumina, or zirconia.
  • the linear expansion coefficient of the graphite block 110 is 24 [10 ⁇ -6/K] or more in the first direction A1
  • a metal material with a linear expansion coefficient greater than that of copper, such as aluminum, may be used as the material for the first plate 120 and the second plate 130.
  • the linear expansion coefficients of the first plate material 120 and the second plate material 130 are compared with that of the graphite block 110 using the linear expansion coefficients measured by changing the temperature from 20°C to 100°C.
  • the linear expansion coefficients are measured using a measurement method specified in JIS according to the material. For example, if the first plate material 120 and the second plate material 130 are made of a metal material, the measurement method specified in JIS Z 2285:2003 is used. If the first plate material 120 and the second plate material 130 are made of a ceramic material, the measurement method specified in JIS R 1618:2002 is used.
  • the linear expansion coefficient of the graphite block 110 is measured using the measurement method specified in JIS R 1618:2002.
  • the above configuration allows the linear expansion coefficient of the upper surface 101 of the heat transfer member 100 to approach an isotropic value, compared to a configuration using only the graphite block 110. Therefore, when mounting components on the upper surface 101 of the heat transfer member 100, the reliability of the mounting can be improved. The same applies to the lower surface 102 of the heat transfer member 100.
  • Figures 6A to 6C are diagrams explaining the thermal expansion characteristics of the three samples, with Figure 6A being a characteristic diagram of the graphite block alone, Figure 6B being a characteristic diagram of oxygen-free copper, and Figure 6C being a characteristic diagram of a configuration in which an oxygen-free copper plate is joined to a graphite block.
  • Figures 7A to 7C are perspective views showing the three samples of Figures 6A to 6C, respectively.
  • the first sample 210 is a graphite block made of pyrolytic graphite.
  • the first sample 210 corresponds to the graphite block 110 of the first embodiment.
  • the top surface 211 of the first sample 210 corresponds to the first surface 111 of the graphite block 110 of the first embodiment.
  • the second sample 220 is an oxygen-free copper plate.
  • the third sample 230 is a member in which the first and second surfaces 111 and 112 of the graphite block 110, made of pyrolytic graphite, are joined to the first and second plates 120 and 130, made of oxygen-free copper, with a brazing material.
  • the top surface 231 of the third sample 230 corresponds to the top surface of the first plate 120.
  • the characteristic diagrams in Figures 6A to 6C are vector distribution diagrams showing the thermal expansion characteristics of the top surfaces 211, 221, and 231 of the three samples 210, 220, and 230.
  • the vectors in Figures 6A to 6C were obtained as follows. First, digital images of the top surfaces 211, 221, and 231 were obtained for each sample at two different temperature states. The digital images were obtained using a CCD (Charge Coupled Device) camera. The two different temperature states were a standard temperature state (e.g., 23°C) and a 100°C state. The temperature was adjusted by heaters arranged above and below the samples 210, 220, and 230. Through this process, two digital images were obtained for each sample at the standard temperature and at 100°C. Next, the two digital images for each sample were analyzed using an image correlation method to measure the displacement of the same point between the two digital images. The measured displacement is then represented by a vector.
  • CCD Charge Coupled Device
  • the linear expansion coefficient of the graphite block (210) is highly anisotropic.
  • the linear expansion coefficient of typical pyrolytic graphite in the first direction A1 is 25 [10 ⁇ -6/K], and the linear expansion coefficients in the second direction A2 and third direction A3 are -0.6 [10 ⁇ -6/K].
  • the linear expansion coefficient of the oxygen-free copper (220) was highly isotropic. As shown by comparing FIG. 6A and FIG. 6B, the linear expansion coefficient of the graphite block alone (210) in the first direction A1 was greater than the linear expansion coefficient of the oxygen-free copper (220) in the same direction. Furthermore, the linear expansion coefficient of the graphite block alone (210) in the second direction A2 was smaller than the linear expansion coefficient of the oxygen-free copper (220) in the same direction. The linear expansion coefficient of the oxygen-free copper (220) was 17.7 [10 ⁇ -6/K].
  • the linear expansion coefficient of the third sample 230 i.e., the graphite block 110 bonded to the first and second oxygen-free copper plates 120 and 130, was anisotropic. However, the linear expansion coefficient was closer to a high isotropic value than that of the graphite block alone (210). As shown by comparing FIG. 6A and FIG. 6C, the difference between the linear expansion coefficient in the first direction A1 and the linear expansion coefficient in the second direction A2 of the third sample 230 was smaller than the difference between the linear expansion coefficient in the first direction A1 and the linear expansion coefficient in the second direction A2 of the graphite block alone (210). This characteristic was obtained by suppressing the anisotropy of the graphite block 110 with the isotropy of the linear expansion coefficient of the first and second plates 120 and 130.
  • the heat transfer member 100 of this embodiment has a highly anisotropic graphite block 110.
  • the linear expansion coefficients of the upper surface 121 and the lower surface 131 can be made closer to isotropic values.
  • the mounting surface's linear expansion coefficient When mounting a component on any mounting surface, if the component has an isotropic linear expansion coefficient, it is desirable for the mounting surface's linear expansion coefficient to be close to isotropic as well. This is because if the thermal expansion characteristics of the mounting surface are highly anisotropic, stress anisotropy will occur at the joint between the mounting surface and the component, making it easy for the component and mounting surface to warp due to temperature changes. Alternatively, stress is difficult to disperse smoothly, making it easy for points of stress concentration to occur.
  • the coefficient of linear expansion of the upper surface 101 of the heat transfer member 100 of this embodiment is closer to an isotropic value than that of the graphite block 110 alone. Therefore, when mounting components on the upper surface 121 of the heat transfer member 100, the occurrence of warping due to temperature changes can be suppressed, and mounting can be achieved with reduced stress concentration. This improves the reliability of mounting.
  • the material of the first plate material 120 may be a copper-based metal or alloy such as oxygen-free copper. With this configuration, as shown in Fig. 6C, the anisotropy of the linear expansion coefficient on the upper surface 121 can be reduced. Furthermore, a high thermal conductivity of the first plate material 120 can be obtained, and more efficient heat transfer performance of the heat transfer member 100 can be achieved.
  • the first plate material 120 may be a metal with high thermal conductivity, such as aluminum.
  • the anisotropy of the thermal expansion characteristics can be reduced, as in the case of copper.
  • the high thermal conductivity allows the heat transfer member 100 to achieve efficient heat transfer performance. From the viewpoint of heat transfer, copper has better characteristics than aluminum.
  • the first plate material 120 may be ceramics such as alumina ceramics, silicon nitride ceramics, and aluminum nitride ceramics. In this configuration, the anisotropy of the thermal expansion characteristics can be reduced, as in the case of copper. Furthermore, by using ceramics, when insulation is required for the heat transfer member 100, this requirement can be met.
  • the material of the first plate material 120 may be alumina ceramics or silicon nitride ceramics. By using this material, high rigidity that resists the residual stress of the graphite block 110 can be obtained. Furthermore, the material of the first plate material 120 may be silicon nitride ceramics. By using this material, it is possible to impart high thermal conductivity properties to the first plate material 120 in addition to rigidity, and more efficient heat transfer performance of the heat transfer member 100 can be achieved.
  • the above-mentioned materials for the first plate material 120 can also be applied to the second plate material 130 in the same manner.
  • the second plate material 130 also exhibits the same effects as when the above-mentioned materials are applied to the first plate material 120.
  • the hardness of the first plate material 120 and the second plate material 130 may be higher than the hardness of the base 11. With this configuration, even if an external force is applied to the first plate material 120 and the second plate material 130, the external force is dispersed and acts on the graphite block 110. Therefore, it is possible to suppress the graphite block 110 from being broken inside the first plate material 120 and the second plate material 130.
  • Vickers hardness may be adopted.
  • the hardness of the graphite block 110 may be a Vickers hardness of 10 MPa or more and 40 MPa or less.
  • the hardness of the first plate material 120 and the second plate material 130 may be preferably 10 times or more, more preferably 20 times or more, of the hardness of the graphite block 110.
  • the hardness of the first plate material 120 and the second plate material 130 may preferably be 200 MPa or more in Vickers hardness, more preferably 500 MPa or more in Vickers hardness, and even more preferably 900 MPa or more in Vickers hardness.
  • the Vickers hardness of the first plate material 120 and the second plate material 130 can be measured using the measurement method specified in JIS_Z_2244:2009.
  • the Vickers hardness of the graphite block 110 is a value converted from the measurement result using a nanoindentation test with a load of 20 mN/10 seconds.
  • Examples of materials having a hardness 10 times or more than that of the graphite block 110 include various metal materials such as copper, aluminum, and stainless steel, and ceramic materials such as aluminum nitride, alumina, and zirconia. Examples of materials having a hardness 10 times or more than that of the graphite block 110 are not limited to metal materials and ceramic materials, and various materials such as resin materials may be used. In this disclosure, the Vickers hardness is shown as a value obtained by converting the unit HV into pressure.
  • the first plate material 120 may be joined to the first surface 111 via a bonding material 140.
  • the second plate material 130 may be joined to the second surface 112 via a bonding material 140.
  • the bonding material 140 may be a brazing material or solder.
  • the bonding material 140 may be configured to cover the bonding surfaces of the first plate material 120 and the second plate material 130 (i.e., clad) during the manufacturing stage of the heat transfer member 100. With this configuration, the bonding material after bonding can be made thinner. Therefore, the thermal resistance of the bonding material 140 can be reduced.
  • the bonding material 140 may be configured to be formed in a sheet shape during the manufacturing stage of the heat transfer member 100.
  • the sheet-shaped bonding material 140 may be sandwiched between the first plate material 120 and the graphite block 110, and then subjected to a brazing action by a heating process and a cooling process. The same applies to the second plate material 130 side.
  • the adhesion between the first plate material 120 and the graphite block 110 via the bonding material 140 can be improved.
  • the adhesion between the second plate material 130 and the graphite block 110 via the bonding material 140 can be improved.
  • the thermal resistance between the first plate material 120 and the graphite block 110, as well as the thermal resistance between the second plate material 130 and the graphite block 110 can be reduced compared to a configuration in which a gap is present.
  • the bonding material 140 may be called an intervening layer.
  • the bonding material 140 may be located only in a portion of the first surface 111 and in a portion of the second surface 112.
  • the area other than the area where the bonding material 140 is located may be filled with thermally conductive grease or the like as an intervening layer.
  • the protective layer 150 may be a plating layer or a resin film. By adopting a plating layer, the protective layer 150 having high thermal conductivity can be realized, which can contribute to efficient heat transfer performance of the heat transfer member 100. Furthermore, when the heat transfer member 100 is required to have electrical conductivity, the requirement can be met.
  • the protective layer 150 may cover the side surface 122 of the first plate material 120 (see FIG. 1B and FIG. 2) and the side surface 132 of the second plate material 130 (see FIG. 1B and FIG. 2).
  • the edges of the protective layer 150 are more likely to peel off than other parts.
  • the side surface 122 of the first plate material 120 and the side surface 132 of the second plate material 130 are more likely to adhere the protective layer 150 with higher strength than the side surface 113 of the graphite block 110.
  • the protective layer 150 covering a part of the first plate material 120 and the second plate material 130, the edge portion of the protective layer 150 is located on the surface of the first plate material 120 and the second plate material 130, and peeling of the protective layer 150 can be suppressed. Furthermore, the protective layer 150 is continuous from the surface of the first plate material 120 and the second plate material 130 to the side surface 113 of the graphite block 110. Therefore, peeling of the protective layer 150 can be suppressed, including the area of the side surface 113 of the graphite block 110.
  • the protective layer 150 may further cover a portion of the upper surface 121 of the first plate material 120.
  • the protective layer 150 may further cover a portion of the lower surface 131 of the second plate material 130.
  • the upper surface 121 of the first plate material 120 is the surface opposite to the surface facing the graphite block 110.
  • the lower surface 131 of the second plate material 130 is the surface opposite to the surface facing the graphite block 110. Even with this configuration, peeling of the protective layer 150 can be suppressed as described above.
  • the upper surface 101 of the heat transfer member 100 may correspond to the surface of the protective layer 150.
  • the upper surface 101 of the heat transfer member 100 may correspond to the upper surface 121 of the first plate 120.
  • the protective layer 150 covers the lower surface 131 of the second plate 130, the lower surface 102 of the heat transfer member 100 may correspond to the surface of the protective layer 150.
  • the protective layer 150 does not cover the lower surface 131 of the second plate 130, the lower surface 102 of the heat transfer member 100 may correspond to the lower surface 131 of the second plate 130.
  • the protective layer 150 may further cover all of the side surfaces 122 and top surface 121 of the first plate material 120, all of the side surfaces 113 of the graphite block 110, and all of the side surfaces 132 and bottom surface 131 of the second plate material 130.
  • Figures 1A and 2 show this configuration. With the above configuration, the edges of the protective layer 150 are reduced (e.g., eliminated), so peeling and damage of the protective layer 150 can be further suppressed. Furthermore, with this configuration, the complexity of the process of forming the protective layer 150 can be reduced.
  • a material with high thermal conductivity such as a metal plating layer, may be applied to the protective layer 150.
  • FIG. 8A is a diagram showing an electronic device incorporating a heat transfer member.
  • FIG. 8B is a diagram showing another example of the use of the heat transfer member.
  • the heat transfer member 100 may be substituted for the heat transfer members 100A and 100B of the second and third embodiments described below.
  • the heat transfer member 100 may have a mounting portion 160 on the first surface 111 (i.e., above the first surface 111 when the second surface 112 faces downward and the first surface 111 faces upward).
  • the mounting portion 160 may be a part of the upper surface 101 of the heat transfer member 100.
  • the heat transfer member 100 may have a mounting portion on the second surface 112 (i.e., above the second surface 112 when the first surface 111 faces downward and the second surface 112 faces upward).
  • the mounting portion may be a part of the lower surface 102 of the heat transfer member 100.
  • an electronic device 400 includes a heat transfer member 100 and an electronic element 410 located on a mounting portion 160 of the heat transfer member 100.
  • the electronic element 410 may be mounted on the mounting portion 160 via a bonding material 420 such as solder. With this configuration, heat from the electronic element 410 can be rapidly conducted to the second plate material 130 via the heat transfer member 100.
  • the electronic device 400 may be mounted on a module substrate 310 having a heat dissipation function to form an electronic module 300.
  • the lower surface 102 of the heat transfer member 100 may be mounted on the module substrate 310 via a bonding material 430 such as solder.
  • the lower surface 102 of the heat transfer member 100 may be thermally connected to a heat sink via the module substrate 310. With this configuration, the heat of the electronic element 410 can be rapidly conducted to the module substrate 310 and the heat sink via the heat transfer member 100, and released from the heat sink.
  • the heat transfer member 100 may be used in such a manner that the heat source 450 is disposed on the mounting portion 160 and the heat dissipation member 460 is disposed on the lower surface 102, as shown in FIG. 8B.
  • the heat source 450 may be in direct contact with the mounting portion 160, or may be thermally connected thereto via another heat transfer member.
  • the heat dissipation member 460 may be in direct contact with the lower surface 102, or may be thermally connected thereto via another heat transfer member. With the above configuration, the heat of the heat source 450 can be rapidly transferred to the heat dissipation member 460 via the heat transfer member 100, and a high heat dissipation effect of the heat source 450 can be obtained.
  • the heat source 450 can be any of a variety of objects, such as an electronic element, a heat pipe for exhausting heat, or a heater for heating.
  • the heat dissipation member 460 can be a module substrate with a heat dissipation function, or a heat sink with heat dissipation fins.
  • an object to be heated may be placed on the lower surface 102 of the heat transfer member 100.
  • the thermal variations in each part of the heater can be averaged out and heat can be transferred to the object to be heated.
  • FIG. 9A and 9B are perspective views showing a heat transfer member of the second embodiment.
  • Fig. 9A shows a configuration in which the protective layer has been removed
  • Fig. 9B shows a configuration in which the protective layer, the first plate material, and the second plate material have been removed.
  • Fig. 10 is a cross-sectional view showing a location where two graphite members are adjacent to each other in the heat transfer member 100A of the second embodiment.
  • the heat transfer member 100A of the second embodiment differs from that of the first embodiment in the configuration of the graphite block 110A, but the other configurations may be the same as those of the first embodiment. The differences will be described in detail below.
  • the graphite block 110A may include multiple graphite materials 110u.
  • the graphite material 110u refers to a structure that becomes a single piece when it is released from the bonding material that is attached to the surroundings.
  • the graphite block 110A is configured to include multiple graphite materials 110u, which allows the dimensions of the heat transfer member 100A to be increased, thereby increasing the design freedom of the heat transfer member 100A.
  • the number of the graphite materials 110u is not particularly limited, but may be five or less. By having five or less, the proportion of areas with low thermal conductivity inside the graphite block 110A can be reduced.
  • the areas with low thermal conductivity are the gap G1 that occurs between a pair of adjacent graphite materials 110u, or the bonding material 141 located in the gap G1 (see FIG. 10).
  • the plurality of graphite materials 110u may be arranged in parallel in the first direction A1 in which the graphene is stacked. More specifically, the graphite block 110A may include a first graphite material 110u1, a second graphite material 110u2 arranged in parallel in the first direction A1 with respect to the first graphite material 110u1, and a bonding material 141 located between the first graphite material 110u1 and the second graphite material 110u2 and bonding the first graphite material 110u1 and the second graphite material 110u2. A gap G1 is generated between the plurality of graphite materials 110u.
  • first direction A1 a direction of low thermal conductivity (i.e., first direction A1) can be generated throughout the graphite block 110A, as in embodiment 1. Therefore, when placing equipment or the like that should not be affected by heat to the side of the graphite block 110A, the effect of heat from the graphite block 110A on the equipment can be reduced by placing the equipment or the like in the direction of low thermal conductivity. This makes it possible to eliminate or simplify the insulation structure for reducing the effect of heat on the equipment.
  • the above-mentioned gap G1 may be an air gap.
  • a bonding material 141 may be located in at least a portion of the gap G1.
  • the bonding material 141 may almost fill the gap G1 (for example, it may be located in an area of 90% or more of the cross section).
  • the bonding material 141 may be a brazing material, a solder material, or a resin material.
  • the bonding material 141 may also be the same material as the bonding material 140 that bonds the first plate material 120 and the second plate material 130 to the graphite block 110A.
  • the direction in which adjacent pairs of the multiple graphite materials 110u face each other is not limited to the above direction.
  • the multiple graphite materials 110u may be arranged to face each other in a direction different from the direction in which the graphene is stacked (e.g., the second direction A2 or the third direction A3).
  • FIG. 11A and 11B are perspective views showing a heat transfer member of embodiment 3.
  • Fig. 11A shows a configuration in which the protective layer has been removed
  • Fig. 11B shows a configuration in which the protective layer, the first plate material, and the second plate material have been removed.
  • a heat transfer member 100B of embodiment 3 differs from embodiments 1 and 2 in the configuration of a graphite block 110B, but other configurations may be the same as those of embodiments 1 and 2. The differences will be described in detail below.
  • Graphite block 110B may include multiple graphite materials 110u. As shown in FIG. 11A, multiple graphite materials 110u may be arranged in parallel in the height direction (i.e., the direction from first plate material 120 to second plate material 130). This configuration allows the dimensions of heat transfer member 100A to be increased in the height direction (i.e., the direction from first plate material 120 to second plate material 130), increasing the design freedom of heat transfer member 100B.
  • the multiple graphite materials 110u When arranged in parallel in the height direction, the multiple graphite materials 110u may be arranged to face each other in any one direction along the crystal plane (i.e., the second direction A2, the third direction A3, etc., which have high thermal conductivity). This configuration allows for rapid conduction of heat from the first plate material 120 to the second plate material 130.
  • first direction A1 in which graphene is stacked and the second direction A2 and third direction A3 along the crystal plane may not coincide between the multiple graphite materials 110u.
  • a pair of adjacent graphite materials 110u are referred to as the first graphite material 110u and the second graphite material 110u.
  • the direction A1a in which graphene is stacked in the first graphite material 110u and the direction A1b in which graphene is stacked in the second graphite material 110u may be in a twisted relationship with each other.
  • the multiple graphite materials 110u may be joined via a joining material.
  • FIGS. 12A and 12B are diagrams illustrating an example of a method for manufacturing a heat transfer member.
  • the following describes a method for manufacturing the heat transfer member 100A of embodiment 2.
  • the method includes a graphite processing step J1, a graphite material combining and joining step J2, a cutting step J3, and a plating step J4.
  • a processing machine such as a wire saw is used to cut the graphite unit 501 to produce multiple graphite materials 501u.
  • the graphite unit 501 generally has two crystal faces, and the dimensions of the crystal faces are greater than the dimensions in the direction perpendicular to the crystal faces.
  • the cut graphite material 501u may be cut so that the minimum width of the crystal faces is smaller than the minimum width of the cut surface (i.e., the crystal layer surface).
  • the multiple graphite materials 501u are arranged in parallel in the orientation shown in embodiment 2. Furthermore, the first plate material 520 and the second plate material 530 are arranged on the multiple graphite materials 501u with a joining material sandwiched therebetween, and the joining material is applied by heating and cooling. At this stage, the first plate material 520 and the second plate material 530 are joined to the multiple graphite materials 501u, and the joining material may enter the gaps G1 (see FIG. 10) between the multiple graphite materials 501u, joining the multiple graphite materials 501u to each other.
  • the first plate material 520, the multiple graphite pieces 501u, and the second plate material 530 that are joined together are cut to the dimensions of the first plate material 120, the graphite block 110A, and the second plate material 130 of the heat transfer member 100A.
  • plating is applied to the outside of the structure cut in cutting process J3.
  • the plating is performed so as to cover at least the side surface 113 of graphite block 110A.
  • Plating may be performed on the entire surface including the outer surfaces of first plate material 120 and second plate material 130. This causes the plating layer to become protective layer 150.
  • the heat transfer member 100A is manufactured through the above steps J1 to J4.
  • the heat transfer member is not limited to the above-mentioned configuration.
  • the linear expansion coefficient of the first plate material and the second plate material may be greater than the linear expansion coefficient of the graphite block in both the first direction and the second direction.
  • a resin material such as ABS resin or polybutylene terephthalate (PBT) may be adopted.
  • PBT polybutylene terephthalate
  • the linear expansion coefficient of the graphite block 110 is less than 24 [10 ⁇ -6/K] in the first direction A1
  • a metal material having a linear expansion coefficient greater than that of copper, such as aluminum may be adopted as the material of the first plate material 120 and the second plate material 130. Even in this case, the same effect is achieved in that the configuration is the same as or similar to that of the above-mentioned embodiment.
  • the heat transfer member and electronic device of the present disclosure are not limited to the heat transfer members 100, 100A, and 100B and the electronic device 400 of the above embodiments.
  • the details shown in the embodiments can be modified as appropriate without departing from the spirit of the invention.
  • the heat transfer member is a graphite block having a first surface extending along a first direction, a second surface opposing the first surface, and a side surface located between the first surface and the second surface and extending along the second direction along which the first surface and the second surface oppose each other; A bonding material located on the first surface and the second surface; A first plate material fixed to the first surface via the bonding material; A second plate material fixed to the second surface via the bonding material; A protective layer covering the side surface,
  • the graphite block has a structure in which a plurality of graphenes are stacked in the first direction.
  • the heat transfer member of (1) above is the side surface includes a first side surface extending along a third direction intersecting the first direction and the second direction; The surface roughness of the first side surface is less than the surface roughness of the first surface.
  • the side surface includes a second side surface extending along the first direction, the second side surface has a concave-convex structure including a plurality of concave portions, A portion of the protective layer is located within the recess.
  • the graphite block is A first graphite material; and a second graphite material arranged in parallel with the first graphite material in the first direction; and a bonding material located between the first graphite material and the second graphite material, bonding the first graphite material and the second graphite material.
  • the protective layer covers the side surface as well as at least a portion of the first plate and at least a portion of the second plate.
  • the first plate material and the second plate material are made of metal.
  • the protective layer is a plating layer.
  • the electronic device further includes a mounting portion on the first surface or the second surface, which is an area on which an electronic element is mounted.
  • the electronic device is (9) A heat transfer member; An electronic element mounted on the mounting portion; Equipped with.
  • This disclosure can be used in heat transfer components and electronic devices.

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WO2025146815A1 (ja) * 2024-01-04 2025-07-10 京セラ株式会社 伝熱部材および電子装置
WO2025146814A1 (ja) * 2024-01-04 2025-07-10 京セラ株式会社 伝熱部材および電子装置

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