JPWO2024203810A1 - - Google Patents
Info
- Publication number
- JPWO2024203810A1 JPWO2024203810A1 JP2025510696A JP2025510696A JPWO2024203810A1 JP WO2024203810 A1 JPWO2024203810 A1 JP WO2024203810A1 JP 2025510696 A JP2025510696 A JP 2025510696A JP 2025510696 A JP2025510696 A JP 2025510696A JP WO2024203810 A1 JPWO2024203810 A1 JP WO2024203810A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
- H10W70/692—Ceramics or glasses
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023048443 | 2023-03-24 | ||
| PCT/JP2024/011214 WO2024203810A1 (ja) | 2023-03-24 | 2024-03-22 | 伝熱部材及び電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024203810A1 true JPWO2024203810A1 (https=) | 2024-10-03 |
| JPWO2024203810A5 JPWO2024203810A5 (https=) | 2025-12-12 |
Family
ID=92906213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025510696A Pending JPWO2024203810A1 (https=) | 2023-03-24 | 2024-03-22 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024203810A1 (https=) |
| WO (1) | WO2024203810A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025146813A1 (ja) * | 2024-01-04 | 2025-07-10 | 京セラ株式会社 | 伝熱部材および電子装置 |
| WO2025146815A1 (ja) * | 2024-01-04 | 2025-07-10 | 京セラ株式会社 | 伝熱部材および電子装置 |
| WO2025146814A1 (ja) * | 2024-01-04 | 2025-07-10 | 京セラ株式会社 | 伝熱部材および電子装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007142273A1 (ja) * | 2006-06-08 | 2007-12-13 | International Business Machines Corporation | 高熱伝導で柔軟なシート |
| JP2011258755A (ja) * | 2010-06-09 | 2011-12-22 | Denso Corp | 熱拡散体および発熱体の冷却装置 |
| JP5930604B2 (ja) * | 2011-05-12 | 2016-06-08 | 株式会社サーモグラフィティクス | 異方性熱伝導素子の製造方法 |
| JP6008117B2 (ja) * | 2012-02-15 | 2016-10-19 | パナソニックＩｐマネジメント株式会社 | グラファイト構造体およびそれを用いた電子デバイス |
| JP2021100006A (ja) * | 2018-03-28 | 2021-07-01 | 株式会社カネカ | 半導体パッケージ |
| JP7072051B2 (ja) * | 2018-03-28 | 2022-05-19 | 株式会社カネカ | 異方性グラファイト、異方性グラファイト複合体及びその製造方法 |
| JP7231921B2 (ja) * | 2018-12-31 | 2023-03-02 | 株式会社サーモグラフィティクス | 熱伝導構造体、熱拡散装置 |
| JP2021150358A (ja) | 2020-03-17 | 2021-09-27 | 三菱電機株式会社 | パワー半導体モジュールの実装構造 |
-
2024
- 2024-03-22 WO PCT/JP2024/011214 patent/WO2024203810A1/ja not_active Ceased
- 2024-03-22 JP JP2025510696A patent/JPWO2024203810A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024203810A1 (ja) | 2024-10-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250919 |