WO2024157857A1 - ジャンパーチップ部品 - Google Patents

ジャンパーチップ部品 Download PDF

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Publication number
WO2024157857A1
WO2024157857A1 PCT/JP2024/001149 JP2024001149W WO2024157857A1 WO 2024157857 A1 WO2024157857 A1 WO 2024157857A1 JP 2024001149 W JP2024001149 W JP 2024001149W WO 2024157857 A1 WO2024157857 A1 WO 2024157857A1
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WIPO (PCT)
Prior art keywords
electrode
plating layer
surface electrode
protective film
jumper chip
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Ceased
Application number
PCT/JP2024/001149
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English (en)
French (fr)
Japanese (ja)
Inventor
流星 藤田
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2024573001A priority Critical patent/JPWO2024157857A1/ja
Publication of WO2024157857A1 publication Critical patent/WO2024157857A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/032—Housing; Enclosing; Embedding; Filling the housing or enclosure plural layers surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Definitions

  • This disclosure relates generally to jumper chip components, and more specifically to jumper chip components having upper electrodes.
  • Patent Document 1 discloses a jumper resistor.
  • the jumper resistor includes a substrate, a primary upper electrode layer, a secondary upper electrode layer, a protective layer, a Ni plating layer, and a solder plating layer.
  • the primary upper electrode layer is made of an Ag-based metal and is provided on the upper surface of the substrate.
  • the secondary upper electrode layer is made of an Au-based metal and is provided so as to cover the primary upper electrode layer.
  • the protective layer is made of a phenolic epoxy resin or the like and is provided on the upper surface of the secondary upper electrode layer.
  • the Ni plating layer is provided so as to cover the exposed parts of the secondary upper electrode layer that are not covered by the protective layer.
  • the solder plating layer is provided so as to cover the Ni plating layer.
  • a secondary upper surface electrode (first upper surface electrode) is formed by firing on top of a primary upper surface electrode, which may result in an alloy layer being generated due to interdiffusion between the primary upper surface electrode and the secondary upper surface electrode, resulting in an increased electrical resistance value.
  • a jumper chip component includes a substrate, an upper electrode, a protective film, and a plating layer.
  • the substrate is electrically insulating.
  • the upper electrode contains Au.
  • the upper electrode is formed on the upper surface of the substrate.
  • the protective film is formed on the upper surface of the upper electrode so as to expose an end of the upper electrode in a predetermined direction.
  • the plating layer is formed so as to cover the end of the upper electrode and the end of the protective film in the predetermined direction.
  • the jumper chip component according to the above aspect of the present disclosure can prevent the electrical resistance value from increasing.
  • a jumper chip component includes a substrate, a first top electrode, a second top electrode, a protective film, a third top electrode, and a plating layer.
  • the substrate is electrically insulating.
  • the first top electrode contains Ag.
  • the first top electrode is formed on the top surface of the substrate.
  • the second top electrode contains Au.
  • the second top electrode is formed on the top surface of the first top electrode.
  • the protective film is formed on the top surface of the second top electrode so as to expose an end of the second top electrode in a predetermined direction.
  • the third top electrode is formed of a resin Ag paste.
  • the third top electrode is formed on the top surface of the second top electrode so as to cover the end of the second top electrode.
  • the plating layer is formed so as to cover the third top electrode and the end of the protective film in the predetermined direction.
  • the jumper chip component according to the above aspect of the present disclosure can prevent solder erosion.
  • FIG. 1 is a cross-sectional view of a jumper chip part according to a first embodiment.
  • FIG. 2 is a cross-sectional view of a jumper chip part according to the second embodiment.
  • FIG. 3 is a cross-sectional view of a jumper chip part according to the third embodiment.
  • orthogonal does not only mean a state in which the angle between two things is strictly 90 degrees, but also includes a state in which two things intersect within a certain range of difference. In other words, the angle between two orthogonal things is within a certain range of difference from 90 degrees (for example, 10 degrees or less). In other words, in this disclosure, “orthogonal” includes cases in which the angle between two things is 80 degrees or more and 100 degrees or less. Similarly, in this disclosure, “parallel” includes not only a state in which two things do not strictly intersect, but also a state in which two things are lined up within a certain range of difference.
  • parallel includes a state in which one thing is inclined at an angle of 10 degrees or less relative to the other.
  • parallel includes a case in which the angle between one thing and the other is -10 degrees or more and 10 degrees or less.
  • the jumper chip component 1 of the first embodiment includes a substrate 2, an upper electrode (first upper electrode 4), a protective film (second protective film 82), and a pair of plating layers 9.
  • Substrate 2 is electrically insulating.
  • the first upper electrode 4 contains Au (gold).
  • the first upper electrode 4 is formed on the upper surface 21 of the substrate 2.
  • the second protective film 82 is formed on the upper surface 41 of the first upper surface electrode 4.
  • the second protective film 82 is formed so as to expose the end 41a of the first upper surface electrode 4 in a predetermined direction.
  • the plating layer 9 is formed to cover the end 41a of the first upper electrode 4 and the end 82a in a predetermined direction of the second protective film 82.
  • cover includes not only directly covering a certain component, but also indirectly covering the certain component via another component.
  • the Au-based first upper surface electrode 4 is formed directly on the upper surface 21 of the substrate 2, and no Ag (silver)-based upper surface electrode is formed between the first upper surface electrode 4 and the substrate 2. Therefore, according to the jumper chip component 1 of embodiment 1, an alloy layer is not generated due to interdiffusion between the Au-based first upper surface electrode 4 and the Ag-based upper surface electrode, so that an increase in the electrical resistance value of the jumper chip component 1 can be suppressed. In addition, because the first upper surface electrode 4 is Au-based, the sulfurization resistance performance of the jumper chip component 1 can be ensured.
  • the jumper chip component 1 is mounted on, for example, a printed circuit board. More specifically, the jumper chip component 1 is configured so that it can be joined to a conductor pattern formed on the printed circuit board.
  • the electrical resistance value of the jumper chip component 1 is, for example, several m ⁇ to several tens of m ⁇ .
  • the overall shape of the jumper chip component 1 in the first embodiment is a rectangular parallelepiped.
  • the axis along the longitudinal direction of the long jumper chip component 1 is the "X-axis”
  • the axis along the thickness direction is the "Z-axis”.
  • the axis along the short side direction of the jumper chip component 1 is the "Y-axis”.
  • the direction along the X-axis may be called the "predetermined direction”.
  • the direction along the Z-axis may be simply called the “vertical direction”, the positive side of the Z-axis may be called the “upward direction”, and the negative side of the Z-axis may be called the “downward direction”.
  • the predetermined direction may be the direction along the short side direction (Y-axis) of the jumper chip component 1.
  • the predetermined direction is the direction along the direction of the current flowing through the jumper chip component 1 when the jumper chip component 1 is mounted on a printed circuit board.
  • the X-axis, Y-axis, and Z-axis are all imaginary axes, and the arrows indicating "X", "Y", and “Z” in the drawings are merely shown for the purpose of explanation and have no physical substance. Furthermore, these directions are not shown with the intention of limiting the direction in which the jumper chip component 1 is used.
  • the jumper chip component 1 comprises a substrate 2, an upper electrode (first upper electrode 4), a pair of end electrodes 6, a pair of lower electrodes 7, a first protective film 81, a second protective film 82, and a pair of plating layers 9.
  • the substrate 2 has electrical insulation properties.
  • the substrate 2 is, for example, a ceramic substrate.
  • the shape of the substrate 2 is a rectangular parallelepiped that is flat in the Z-axis direction and elongated in the X-axis direction.
  • the substrate 2 has an upper surface 21, a pair of side surfaces 22, and a lower surface 23.
  • the lower surface 23 is the surface that faces the printed circuit board when the jumper chip component 1 is mounted on the printed circuit board.
  • One of the pair of side surfaces 22 is the side surface on the first end 20a side in a specified direction of the substrate 2, and the other of the pair of side surfaces 22 is the side surface on the second end 20b side in a specified direction of the substrate 2.
  • the normal to the upper surface 21 and the normal to the lower surface 23 are along the Z axis (parallel to the Z axis).
  • the normal to the pair of side surfaces 22 is along the X axis.
  • the first upper surface electrode 4 is in the form of a rectangular sheet, and is provided directly on the upper surface 21 of the substrate 2.
  • the first upper surface electrode 4 can be formed thinly by, for example, printing and firing a conductive paste mainly composed of Au or the like.
  • the first upper surface electrode 4 is formed on the upper surface 21 of the substrate 2, from the first end 20a to the second end 20b of the substrate 2.
  • the first upper surface electrode 4 has approximately the same shape and area as the upper surface 21 of the substrate 2 when viewed along the Z axis. In short, the first upper surface electrode 4 is formed so as to cover approximately the entire upper surface 21 of the substrate 2.
  • the sulfur resistance of the jumper chip component 1 can be improved.
  • the first protective film 81 covers a part of the upper surface 41 of the first upper surface electrode 4. More specifically, the first protective film 81 is formed on the upper surface 41 of the first upper surface electrode 4 so as to expose a pair of ends 41a in a predetermined direction of the first upper surface electrode 4 and a peripheral region 41c of the ends 41a.
  • the peripheral region 41c is a region of the upper surface 41 of the first upper surface electrode 4 that is connected to the ends 41a and surrounds the ends 41a.
  • the first protective film 81 can be formed, for example, by printing and firing a glass paste.
  • the second protective film 82 covers a part of the upper surface 41 of the first upper surface electrode 4 and the first protective film 81. More specifically, the second protective film 82 covers the peripheral region 41c of the end portion 41a of the first upper surface electrode 4 and the first protective film 81. In other words, the second protective film 82 is formed on the upper surface 41 of the first upper surface electrode 4 so as to expose the end portion 41a of the first upper surface electrode 4.
  • the second protective film 82 can be formed, for example, by printing and baking an epoxy resin paste.
  • the second protective film 82 protective film
  • the determination of the front and back here does not only include a determination of the front and back made by a human visual inspection, but also an automatic determination of the front and back made by identifying an appearance image obtained by photographing the jumper chip component 1 using a production management system.
  • the lower electrode 7 is a rectangular sheet-like electrode, and is provided directly on the lower surface 23 of the substrate 2.
  • the lower electrode 7 can be formed thinly by printing and baking a conductive paste mainly composed of Ag or the like.
  • the lower electrode 7 may be formed by applying and hardening a resin Ag paste.
  • the resin Ag paste is a paste made by kneading resin and Ag powder.
  • One of the pair of lower electrodes 7 is formed on the first end 20a side of the substrate 2, and the other of the pair of lower electrodes 7 is formed on the second end 20b side of the substrate 2.
  • a part of the lower electrode 7 overlaps the end 41a of the first upper electrode 4, and a part of the lower electrode 7 overlaps the second protective film 82.
  • the pair of end electrodes 6 are formed in a one-to-one correspondence with the pair of side surfaces 22 of the substrate 2.
  • the end electrodes 6 are provided directly on the side surfaces 22 of the substrate 2 so as to electrically connect the end portions 41a of the first upper surface electrodes 4 and the lower surface electrodes 7.
  • the end electrode 6 has a substantially U-shaped cross section taken along the XZ plane.
  • the end surface electrodes 6 can be formed thinly by, for example, printing and firing a conductive paste whose main component is Ag or the like.
  • the end surface electrodes 6 may also be formed by applying and hardening a resin Ag paste.
  • the stress resistance performance of the jumper chip component 1 after the jumper chip component 1 is mounted on a printed circuit board is improved.
  • the adhesion strength of the first plating layer 91 to the first upper electrode 4 and the lower electrode 7 is also improved.
  • the pair of plating layers 9 are formed to correspond one-to-one to the pair of side surfaces 22 of the substrate 2.
  • Each of the pair of plating layers 9 has a first plating layer 91 and a second plating layer 92.
  • the number of current paths increases, and the electrical resistance value of the jumper chip component 1 can be prevented from increasing.
  • the first plating layer 91 contains Ni (nickel) and is conductive.
  • the first plating layer 91 is a thin film layer.
  • the first plating layer 91 corresponds to a nickel plating layer.
  • the first plating layer 91 is formed so as to cover the end electrode 6, the lower electrode 7, the end 41a of the first upper electrode 4, and the end 82a of the second protective film 82.
  • the first plating layer 91 of the first embodiment is formed so as to cover substantially the entire outer surfaces of the end electrode 6, the lower electrode 7, and the end 41a of the first upper electrode 4.
  • the second plating layer 92 contains Sn (tin) and has electrical conductivity.
  • the second plating layer 92 is a thin film layer.
  • the second plating layer 92 corresponds to a tin plating layer.
  • the second plating layer 92 is formed so as to cover the first plating layer 91.
  • the second plating layer 92 of the first embodiment is formed so as to cover substantially the entire outer surface of the first plating layer 91.
  • the jumper chip component 1 is illustrated as having a shape that is elongated in one direction (X-axis).
  • the shape of the jumper chip component 1 is not particularly limited, and may be, for example, a square shape when viewed along the thickness direction (Z-axis).
  • the jumper chip component 1 has the first plating layer 91 and the second plating layer 92 as the plating layer 9.
  • the jumper chip component 1 may have, for example, only the second plating layer 92 as the plating layer 9.
  • the second plating layer 92 is formed so as to cover substantially the entire outer surfaces of the end electrode 6, the lower electrode 7, the end 41a of the first upper electrode 4, and the end 82a of the second protective film 82.
  • the jumper chip component 1 of embodiment 2 further includes a pair of second upper surface electrodes 5.
  • the pair of second upper electrodes 5 are formed to correspond one-to-one with the pair of ends 41a of the first upper electrode 4.
  • the second upper electrode 5 is formed on the upper surface 41 of the first upper electrode 4 so as to cover the ends 41a of the first upper electrode 4. That is, the second upper electrode 5 is formed between the ends 41a of the first upper electrode 4 and the first plating layer 91 in the Z-axis direction, which is the thickness direction of the substrate 2.
  • the second upper electrode 5 is formed by applying and hardening a resin Ag paste.
  • the end 41a of the Au-based first upper electrode 4 is covered by the second upper electrode 5 formed from a resin Ag paste, so that the occurrence of solder erosion caused by contact between the end 41a of the first upper electrode 4 and the plating layer 9 can be suppressed.
  • the pair of second upper electrodes 5 are formed on the upper surface of the second protective film 82 so as to cover a pair of ends 82a in a predetermined direction of the second protective film 82. In other words, a part of the second upper electrode 5 is formed so as to cover the ends 82a of the second protective film 82.
  • the second upper surface electrode 5 has approximately the same shape and area as the end 41a of the first upper surface electrode 4 when viewed along the Z axis. However, since the second upper surface electrode 5 covers the end 82a of the second protective film 82, the second upper surface electrode 5 has a slightly larger area than the end 41a of the first upper surface electrode 4 when viewed along the Z axis.
  • the first plating layer 91 of the second embodiment is formed so as to cover the end electrode 6, the lower electrode 7, the second upper electrode 5, and the end 82a of the second protective film 82.
  • the first plating layer 91 of the second embodiment is formed so as to cover substantially the entire outer surfaces of the end electrode 6, the lower electrode 7, and the second upper electrode 5.
  • the second plating layer 92 in the second embodiment is formed so as to cover the first plating layer 91.
  • the second plating layer 92 in the second embodiment is formed so as to cover substantially the entire outer surface of the first plating layer 91.
  • a portion of the second upper electrode 5 in the second embodiment is joined to the end 82a of the second protective film 82. Because the second upper electrode 5 and the end 82a of the second protective film 82 are joined, it is possible to prevent the second plating layer 92 covering the second upper electrode 5 from contacting the end 41a of the first upper electrode 4 through the boundary between the first plating layer 91 and the second protective film 82 and the boundary between the second upper electrode 5 and the second protective film 82. In other words, because the second upper electrode 5 and the end 82a of the second protective film 82 are joined, it is possible to further prevent the occurrence of solder erosion caused by contact between the end 41a of the first upper electrode 4 and the second plating layer 92 (plating layer 9).
  • the second protective film 82 in the second embodiment is formed, for example, by printing and baking an epoxy resin paste.
  • an epoxy resin paste By forming the second protective film 82 from an epoxy resin, it is possible to ensure the adhesion (separation strength) of the joint between the second protective film 82 and the second upper electrode 5 formed from a resin Ag paste.
  • the jumper chip component (1) comprises a substrate (2), an upper surface electrode (first upper surface electrode 4), a protective film (second protective film 82), and a plating layer (9).
  • the substrate (2) is electrically insulating.
  • the upper surface electrode contains Au.
  • the upper surface electrode is formed on the upper surface of the substrate (2).
  • the protective film is formed on the upper surface (41) of the upper surface electrode so as to expose an end (41a) of the upper surface electrode in a predetermined direction.
  • the plating layer (9) is formed so as to cover the end (41a) of the upper surface electrode and the end (82a) of the protective film in a predetermined direction.
  • the Au-based top electrode (first top electrode 4) is formed directly on the top surface (41) of the substrate (2), and no Ag (silver)-based top electrode (second top electrode 5) is formed between the top electrode and the substrate (2). Therefore, an alloy layer due to interdiffusion between the Au-based top electrode and the Ag-based top electrode is not generated, so that an increase in the electrical resistance value of the jumper chip component (1) can be suppressed.
  • the top electrode is Au-based, the sulfurization resistance performance of the jumper chip component (1) can be ensured.
  • the jumper chip component (1) according to the second aspect is the same as the first aspect, but further includes a second upper surface electrode (5).
  • the second upper surface electrode (5) is formed of a resin Ag paste.
  • the second upper surface electrode (5) is formed on the upper surface (41) of the first upper surface electrode (4) so as to cover the end (41a) of the first upper surface electrode (4), which is the upper surface electrode.
  • the second upper surface electrode (5) is formed between the first upper surface electrode (4) and the plating layer (9).
  • the end (41a) of the Au-based first upper electrode (4) is covered with the second upper electrode (5) formed from a resin Ag paste, so that the occurrence of solder erosion due to contact between the end (41a) of the first upper electrode (4) and the plating layer (9) can be suppressed.
  • a portion of the second upper electrode (5) is joined to the end (82a) of the protective film (second protective film 82).
  • the occurrence of solder erosion due to contact between the end (41a) of the first upper electrode (4) and the plating layer (9) can be further suppressed.
  • the protective film (second protective film 82) is formed of an epoxy resin.
  • the protective film (second protective film 82) is made of epoxy resin, so that the adhesion (separation strength) of the joint between the protective film and the second upper electrode (5) made of resin Ag paste can be ensured.
  • the jumper chip component (1) according to the fifth aspect further includes a bottom electrode (7) and an end electrode (6) in any of the first to fourth aspects.
  • the bottom electrode (7) is formed on the bottom surface (23) of the substrate (2).
  • the end electrode (6) electrically connects the top electrode (first top electrode 4) and the bottom electrode (7).
  • the jumper chip component (1) has end electrodes (6), which improves the stress resistance of the jumper chip component (1) after it is mounted on a printed circuit board.
  • the adhesion strength of the plating layer to the upper electrode (first upper electrode 4) and the lower electrode (7) is also improved.
  • the plating layer (9) has a first plating layer (91) and a second plating layer (92).
  • the first plating layer (91) contains Ni.
  • the first plating layer (91) is formed so as to cover the end (41a) of the top electrode (first top electrode 4) and the end (82a) of the protective film (second protective film 82).
  • the second plating layer (92) contains Sn.
  • the second plating layer (92) is formed so as to cover the first plating layer (91).
  • the jumper chip component (1) by providing the jumper chip component (1) with the first plating layer (91) and the second plating layer (92), the number of current paths increases, and it is possible to prevent the electrical resistance value of the jumper chip component (1) from increasing.
  • the configurations other than the first aspect are not essential to the jumper chip component (1) and may be omitted as appropriate.
  • the jumper chip component 101 of this embodiment includes a substrate 102, a first upper surface electrode 103, a second upper surface electrode 104, a pair of third upper surface electrodes 105, a protective film (second protective film 182), and a pair of plating layers 109.
  • the substrate 102 is electrically insulating.
  • the first upper electrode 103 contains Ag (silver).
  • the first upper electrode 103 is formed on the upper surface 121 of the substrate 102.
  • the second upper surface electrode 104 contains Au (gold).
  • the second upper surface electrode 104 is formed on the upper surface 131 of the first upper surface electrode 103.
  • the second protective film 182 is formed on the upper surface 141 of the second upper surface electrode 104.
  • the second protective film 182 is formed so as to expose the end portion 141a of the second upper surface electrode 104 in a predetermined direction.
  • the third upper surface electrode 105 is formed from a resin Ag paste.
  • the third upper surface electrode 105 is formed on the upper surface 141 of the second upper surface electrode 104.
  • the third upper surface electrode 105 is formed so as to cover the end portion 141a of the second upper surface electrode 104.
  • the plating layer 109 is formed to cover the third upper electrode 105 and the end 182a in a predetermined direction of the second protective film 182.
  • cover includes not only directly covering a certain component, but also indirectly covering the certain component via another component.
  • the end 141a of the Au-based second upper electrode 104 is covered with the third upper electrode 105 formed from a resin Ag paste, so that the occurrence of solder erosion caused by contact between the end 141a of the second upper electrode 104 and the plating layer 109 can be suppressed.
  • the jumper chip component 101 is mounted on, for example, a printed circuit board. More specifically, the jumper chip component 101 is configured so that it can be joined to a conductor pattern formed on the printed circuit board.
  • the electrical resistance value of the jumper chip component 101 is, for example, several m ⁇ to several tens of m ⁇ .
  • the overall shape of the jumper chip component 101 in this embodiment is a rectangular parallelepiped.
  • the axis along the longitudinal direction of the long jumper chip component 101 is the "X-axis”
  • the axis along the thickness direction is the "Z-axis”.
  • the axis along the short side direction of the jumper chip component 101 is the "Y-axis”.
  • the direction along the X-axis may be called the "predetermined direction”.
  • the predetermined direction may be the direction along the short side direction (Y-axis) of the jumper chip component 101.
  • the predetermined direction is the direction along the direction of the current flowing through the jumper chip component 101 when the jumper chip component 101 is mounted on a printed circuit board.
  • the X-axis, Y-axis, and Z-axis are all imaginary axes, and the arrows indicating "X", "Y", and “Z” in the drawings are merely shown for the purpose of explanation and have no physical substance. Furthermore, these directions are not shown with the intention of limiting the direction in which the jumper chip component 101 is used.
  • the jumper chip component 101 comprises a substrate 102, a first upper surface electrode 103, a second upper surface electrode 104, a pair of third upper surface electrodes 105, a pair of end surface electrodes 106, a pair of lower surface electrodes 107, a first protective film 181, a second protective film 182, and a pair of plating layers 109.
  • the substrate 102 has electrical insulation properties.
  • the substrate 102 is, for example, a ceramic substrate.
  • the shape of the substrate 102 is a rectangular parallelepiped that is flat in the Z-axis direction and elongated in the X-axis direction.
  • the substrate 102 has an upper surface 121, a pair of side surfaces 122, and a lower surface 123.
  • the lower surface 123 is the surface that faces the printed circuit board when the jumper chip component 101 is mounted on the printed circuit board.
  • One of the pair of side surfaces 122 is the side surface on the first end 120a side in a predetermined direction of the substrate 102, and the other of the pair of side surfaces 122 is the side surface on the second end 120b side in a predetermined direction of the substrate 102.
  • the normal to the upper surface 121 and the normal to the lower surface 123 are along the Z axis (parallel to the Z axis).
  • the normal to the pair of side surfaces 122 is along the X axis.
  • the first upper surface electrode 103 is a rectangular sheet-like electrode, and is provided directly on the upper surface 121 of the substrate 102.
  • the first upper surface electrode 103 may be formed thinly by, for example, printing and baking a conductive paste mainly composed of Ag or the like.
  • the first upper surface electrode 103 may be formed by applying and hardening a resin Ag paste.
  • the first upper surface electrode 103 is formed on the upper surface 121 of the substrate 102, from the first end 120a to the second end 120b of the substrate 102.
  • the first upper surface electrode 103 has approximately the same shape and area as the upper surface 121 of the substrate 102 when viewed along the Z axis. In short, the first upper surface electrode 103 is formed so as to cover approximately the entire upper surface 121 of the substrate 102.
  • the thickness of the second top surface electrode 104 containing Au can be made thinner than when the jumper chip component 101 does not have the first top surface electrode 103.
  • the manufacturing cost of the jumper chip component 101 can be reduced.
  • the second upper surface electrode 104 is a rectangular sheet-like electrode, and is provided directly on the upper surface 131 of the first upper surface electrode 103.
  • the second upper surface electrode 104 can be formed thinly by printing and baking a conductive paste mainly composed of Au or the like.
  • the second upper surface electrode 104 is formed on the upper surface 131 of the first upper surface electrode 103 from the first end to the second end in a predetermined direction.
  • the second upper surface electrode 104 has approximately the same shape and area as the upper surface 131 of the first upper surface electrode 103 when viewed along the Z axis. In short, the second upper surface electrode 104 is formed so as to cover approximately the entire upper surface 131 of the first upper surface electrode 103.
  • the sulfur resistance of the jumper chip component 101 can be improved.
  • the first protective film 181 covers a part of the upper surface 141 of the second upper surface electrode 104. More specifically, the first protective film 181 is formed on the upper surface 141 of the second upper surface electrode 104 so as to expose a pair of ends 141a in a predetermined direction of the second upper surface electrode 104 and a peripheral region 141c of the ends 141a.
  • the peripheral region 141c is a region of the upper surface 141 of the first upper surface electrode 104 that is connected to the ends 141a and surrounds the ends 141a.
  • the first protective film 181 can be formed, for example, by printing and firing a glass paste.
  • the second protective film 182 covers a part of the upper surface 141 of the second upper surface electrode 104 and the first protective film 181. More specifically, the second protective film 182 covers the peripheral region 141c of the end portion 141a of the second upper surface electrode 104 and the first protective film 181. In other words, the second protective film 182 is formed on the upper surface 141 of the second upper surface electrode 104 so as to expose the end portion 141a of the second upper surface electrode 104.
  • the second protective film 182 can be formed, for example, by printing and baking an epoxy resin paste.
  • the second protective film 182 is made of epoxy resin, which ensures a good adhesion (separation strength) at the joint between the second protective film 182 and the third upper electrode 105, which is made of resin Ag paste.
  • the determination of the front or back referred to here includes not only a determination of the front or back made by a human eye, but also an automatic determination of the front or back made by identifying an appearance image obtained by capturing an image of the jumper chip component 101 using a production management system.
  • the pair of third upper surface electrodes 105 are formed to correspond one-to-one with the pair of ends 141a of the second upper surface electrode 104.
  • the third upper surface electrode 105 is formed on the upper surface 141 of the second upper surface electrode 104 so as to cover the ends 141a of the second upper surface electrode 104.
  • the third upper surface electrode 105 is formed by applying and hardening a resin Ag paste.
  • the pair of third upper electrodes 105 are formed on the upper surface of the second protective film 182 so as to cover a pair of ends 182a of the second protective film 182 in a predetermined direction. That is, a part of the third upper electrode 105 is formed so as to cover the ends 182a of the second protective film 182. A part of the third upper electrode 105 is joined to the ends 182a of the second protective film 182.
  • the third upper electrode 105 and the ends 182a of the second protective film 182 are joined, it is possible to prevent the second plating layer 192, which covers the third upper electrode 105, from contacting the ends 141a of the second upper electrode 104 through the boundary between the first plating layer 191 and the second protective film 182, which will be described later, and the boundary between the third upper electrode 105 and the second protective film 182.
  • the third upper surface electrode 105 and the end 182a of the second protective film 182 it is possible to further suppress the occurrence of solder erosion caused by contact between the end 141a of the second upper surface electrode 104 and the second plating layer 192 (plating layer 109).
  • the third upper surface electrode 105 has approximately the same shape and area as the end 141a of the second upper surface electrode 104 when viewed along the Z axis. However, because the third upper surface electrode 105 covers the end 182a of the second protective film 182, the third upper surface electrode 105 has a slightly larger area than the end 141a of the second upper surface electrode 104 when viewed along the Z axis.
  • a pair of lower electrodes 107 are formed on the lower surface 123 of the substrate 102.
  • the lower electrode 107 is a rectangular sheet-like electrode, and is provided directly on the lower surface 123 of the substrate 102.
  • the lower electrode 107 can be formed thinly by printing and baking a conductive paste mainly composed of Ag or the like.
  • the lower electrode 107 may be formed by applying and hardening a resin Ag paste.
  • One of the pair of lower electrodes 107 is formed on the first end 120a side of the substrate 102, and the other of the pair of lower electrodes 107 is formed on the second end 120b side of the substrate 102.
  • a portion of the lower electrode 107 overlaps with the third upper electrode 105, and a portion of the lower electrode 107 overlaps with the second protective film 182.
  • the pair of end electrodes 106 are formed to correspond one-to-one with the pair of side surfaces 122 of the substrate 102.
  • the end electrodes 106 are provided directly on the side surfaces 122 of the substrate 102 so as to electrically connect the third upper electrode 105 and the lower electrode 107.
  • the cross section of the end electrode 106 taken along the XZ plane has a substantially U-shaped shape.
  • the end surface electrodes 106 can be formed thinly by, for example, printing and firing a conductive paste whose main component is Ag or the like.
  • the end surface electrodes 106 may also be formed by applying and hardening a resin Ag paste.
  • the stress resistance performance of the jumper chip component 101 after the jumper chip component 101 is mounted on a printed circuit board is improved.
  • the adhesion strength of the first plating layer 191 to the third upper electrode 105 and the lower electrode 107 is also improved.
  • the pair of plating layers 109 are formed to correspond one-to-one to the pair of side surfaces 122 of the substrate 102.
  • Each of the pair of plating layers 109 has a first plating layer 191 and a second plating layer 192.
  • the jumper chip component 101 By providing the jumper chip component 101 with the plating layer 109, the number of current paths increases, and the electrical resistance value of the jumper chip component 101 can be prevented from increasing.
  • the first plating layer 191 contains Ni (nickel) and is conductive.
  • the first plating layer 191 is a thin film layer.
  • the first plating layer 191 corresponds to a nickel plating layer.
  • the first plating layer 191 is formed so as to cover the end electrode 106, the lower electrode 107, the third upper electrode 105, and the end 182a of the second protective film 182.
  • the first plating layer 191 of this embodiment is formed so as to cover substantially the entire outer surfaces of the end electrode 106, the lower electrode 107, and the third upper electrode 105.
  • the second plating layer 192 contains Sn (tin) and has electrical conductivity.
  • the second plating layer 192 is a thin film layer.
  • the second plating layer 192 corresponds to a tin plating layer.
  • the second plating layer 192 is formed so as to cover the first plating layer 191.
  • the second plating layer 192 of this embodiment is formed so as to cover substantially the entire outer surface of the first plating layer 191.
  • the jumper chip component 101 has an elongated shape in one direction (X-axis).
  • the shape of the jumper chip component 101 is not particularly limited, and may be, for example, a square shape when viewed along the thickness direction (Z-axis).
  • the jumper chip component 101 has the first plating layer 191 and the second plating layer 192 as the plating layer 109.
  • the jumper chip component 101 may have only the second plating layer 192 as the plating layer 109, for example.
  • the second plating layer 192 is formed so as to cover substantially the entire outer surface of the end electrode 106, the lower electrode 107, the third upper electrode 105, and the end 182a of the second protective film 182.
  • the jumper chip component (101) includes a substrate (102), a first upper surface electrode (103), a second upper surface electrode (104), a protective film (second protective film 182), a third upper surface electrode (105), and a plating layer (109).
  • the substrate (102) has electrical insulation.
  • the first upper surface electrode (103) contains Ag.
  • the first upper surface electrode (103) is formed on the upper surface (121) of the substrate (102).
  • the second upper surface electrode (104) contains Au.
  • the second upper surface electrode (104) is formed on the upper surface (131) of the first upper surface electrode (103).
  • the protective film is formed on the upper surface (141) of the second upper surface electrode (104) so as to expose the end (141a) in a predetermined direction of the second upper surface electrode (104).
  • the third upper surface electrode (105) is formed of a resin Ag paste.
  • the third upper surface electrode (105) is formed on the upper surface (141) of the second upper surface electrode (104) so as to cover the end portion (141a) of the second upper surface electrode (104).
  • the plating layer (109) is formed so as to cover the third upper surface electrode (105) and the end portion (182a) in a predetermined direction of the protective film.
  • the end (141a) of the Au-based second upper electrode (104) is covered with the third upper electrode (105) formed from a resin Ag paste, so that it is possible to suppress the occurrence of solder erosion caused by contact between the end (141a) of the second upper electrode (104) and the plating layer (109).
  • a portion of the third upper electrode (105) is joined to the end (182a) of the protective film (second protective film 182).
  • the protective film is formed of an epoxy resin.
  • the jumper chip component (101) according to the tenth aspect is any one of the seventh to ninth aspects, and further includes a bottom electrode (107) and an end electrode (106).
  • the bottom electrode (107) is formed on the bottom surface (123) of the substrate (102).
  • the end electrode (106) electrically connects the third top electrode (105) and the bottom electrode (107).
  • the stress resistance of the jumper chip component (101) is improved after the jumper chip component (101) is mounted on the printed circuit board.
  • the plating layer (109) has a first plating layer (191) and a second plating layer (192).
  • the first plating layer (191) contains Ni.
  • the first plating layer (191) is formed so as to cover the third upper surface electrode (105) and the end (182a) of the protective film (second protective film 182).
  • the second plating layer (192) contains Sn.
  • the second plating layer (192) is formed so as to cover the first plating layer (191).
  • This embodiment prevents the number of current paths from increasing and the electrical resistance of the jumper chip component (101) from increasing.
  • the configurations other than the seventh aspect are not essential to the jumper chip component (101) and may be omitted as appropriate.
  • Jumper chip component 2 Substrate 21 Top surface 23 Bottom surface 4 First top surface electrode (top surface electrode) 41 Upper surface 41a End portion 5 Second upper surface electrode 6 End surface electrode 7 Lower surface electrode 82 Second protective film (protective film) 82a End 9 Plating layer 91 First plating layer 92 Second plating layer 101 Jumper chip component 102 Substrate 121 Top surface 123 Bottom surface 103 First top surface electrode 131 Top surface 104 Second top surface electrode 141 Top surface 141a End 105 Third top surface electrode 106 End surface electrode 107 Bottom surface electrode 182 Second protective film (protective film) 182a End 109 Plating layer 191 First plating layer 192 Second plating layer

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Resistors (AREA)
PCT/JP2024/001149 2023-01-25 2024-01-17 ジャンパーチップ部品 Ceased WO2024157857A1 (ja)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831603A (ja) * 1994-07-18 1996-02-02 Matsushita Electric Ind Co Ltd 角形薄膜チップ抵抗器およびその製造方法
JP2000156304A (ja) * 1998-11-19 2000-06-06 Matsushita Electric Ind Co Ltd ジャンパー抵抗器
JP2009194128A (ja) * 2008-02-14 2009-08-27 Panasonic Corp チップ形ジャンパーおよびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831603A (ja) * 1994-07-18 1996-02-02 Matsushita Electric Ind Co Ltd 角形薄膜チップ抵抗器およびその製造方法
JP2000156304A (ja) * 1998-11-19 2000-06-06 Matsushita Electric Ind Co Ltd ジャンパー抵抗器
JP2009194128A (ja) * 2008-02-14 2009-08-27 Panasonic Corp チップ形ジャンパーおよびその製造方法

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